CN216291558U

CN216291558U - Composite multilayer circuit board with heat radiation structure

Info

Publication number: CN216291558U
Application number: CN202122259020.9U
Authority: CN
Inventors: 刘胜贤; 唐瑞芳; 周国云; 方蕾
Original assignee: Putian Hanjiang Yd Pcb Co ltd
Current assignee: Putian Hanjiang Yd Pcb Co ltd
Priority date: 2021-09-17
Filing date: 2021-09-17
Publication date: 2022-04-12
Anticipated expiration: 2031-09-17

Abstract

The utility model discloses a composite multilayer circuit board with a heat dissipation structure, which comprises a circuit board main body, wherein the top of the circuit board main body is provided with the heat dissipation structure, the heat dissipation structure comprises a copper substrate arranged on the surface of the top of the circuit board main body, the surface of the top of the copper substrate is provided with a heat dissipation plate, heat conduction silica gel is arranged between the copper substrate and the heat dissipation plate, the surface of the top of the heat dissipation plate is uniformly provided with a plurality of integrated heat dissipation fins, the top of the copper substrate is symmetrically fixed with two L-shaped guide seats, and two ends of the heat dissipation plate are respectively embedded into the two L-shaped guide seats; through the heat radiation structure who sets up at the top of circuit board main part, can effectively promote the heat dispersion of circuit board main part, solved the not good problem of radiating effect in the former device to ensure the steady operation of this multilayer circuit board, heat dissipation plate among the heat radiation structure easily pulls down and clears up and maintain simultaneously, and it is convenient to have brought heat radiation structure's maintenance for follow-up operating personnel.

Description

Composite multilayer circuit board with heat radiation structure

Technical Field

The utility model belongs to the technical field of multilayer circuit boards, and particularly relates to a composite multilayer circuit board with a heat dissipation structure.

Background

The composite multilayer circuit board is a circuit board manufactured by compounding multilayer substrates, and mainly comprises a top base layer, an adhesive layer and a bottom base layer, wherein the top base layer and the bottom base layer are connected through the adhesive layer, and a plurality of electronic components are mounted on the top of the top base layer and are also the most important layer.

When the existing composite multilayer circuit board is used, the composite multilayer circuit board is not provided with any heat dissipation structure, so that the existing composite multilayer circuit board is poor in heat dissipation performance, is easy to break down due to high temperature after long-time operation, and is poor in bending resistance, so that the composite multilayer circuit board with the heat dissipation structure is provided.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a composite multilayer circuit board with a heat dissipation structure to solve the problems of the background art mentioned above.

In order to achieve the purpose, the utility model provides the following technical scheme: a composite multilayer circuit board with a heat dissipation structure comprises a circuit board main body, wherein the top of the circuit board main body is provided with the heat dissipation structure, the heat dissipation structure comprises a copper substrate arranged on the surface of the top of the circuit board main body, the top surface of the copper substrate is provided with a heat dissipation plate, heat-conducting silica gel is arranged between the copper substrate and the heat dissipation plate, the top surface of the heat dissipation plate is uniformly provided with a plurality of integrated heat dissipation fins, the top of the copper substrate is symmetrically fixed with two L-shaped guide seats, two ends of the heat dissipation plate are respectively embedded into the two L-shaped guide seats, the top of the circuit board main body is also provided with four limiting components, the limiting component comprises a base, a base sleeve and a clamping pin, the base is rotatably arranged at the top of the circuit board main body, and the base sleeve is sleeved on the surface of the base in a sliding manner, the clamping pins are fixed on the outer surface of the base sleeve, and one ends of the clamping pins are tightly attached to the heat dissipation plate.

Preferably, the inside of base has been seted up interior spout, and the inside of interior spout is provided with two interior poles and an interior slider, interior slider slip cap is established on two interior poles, every the one end of interior pole all is equipped with the innerspring for one side of interior slider, the bar slide has all been seted up to the both sides inner wall of interior spout, be fixed with two connecting blocks, and two between interior slider and the base cover the connecting block is in two bar slides respectively.

Preferably, the bottom surface of the clamping pin is provided with an integrated limiting head, the surface of the heat dissipation plate is provided with a limiting hole, and the limiting head is embedded into the inner side of the limiting hole.

Preferably, the circuit board main body comprises a top base layer, a bottom base layer, an adhesive layer and a reinforcing layer, wherein the adhesive layer is arranged between the top base layer and the bottom base layer, and the reinforcing layer is further arranged in the adhesive layer.

Preferably, the reinforcing layer includes side reinforcing plates and a center reinforcing plate, the inner side surface of the top base layer and the inner side surface of the bottom base layer are both provided with a plurality of side reinforcing plates, the center area of the bonding layer is uniformly provided with a plurality of center reinforcing plates, and a connecting structure is arranged between the center reinforcing plates and the side reinforcing plates.

Preferably, the connecting structure comprises positioning blocks fixed on the surfaces of two ends of the central reinforcing plate, positioning grooves are formed in two ends of the side reinforcing plates, the end part of the central reinforcing plate is located between the two symmetrical side reinforcing plates, and the positioning blocks are embedded into the positioning grooves.

Preferably, a rotating groove is formed in the base and below the inner sliding groove, a rotating block is arranged on the surface of the top of the circuit board main body, and the rotating block is located in the rotating groove.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the heat radiation structure who sets up at the top of circuit board main part, can effectively promote the heat dispersion of circuit board main part, solved the not good problem of radiating effect in the former device to ensure the steady operation of this multilayer circuit board, heat dissipation plate among the heat radiation structure easily pulls down and clears up and maintain simultaneously, and it is convenient to have brought heat radiation structure's maintenance for follow-up operating personnel.

2. The reinforcing layer is arranged in the circuit board main body, so that the bending resistance of the whole circuit board main body can be effectively improved, and the use stability of the circuit board main body is improved.

Drawings

FIG. 1 is a top view of the present invention;

FIG. 2 is an enlarged view of a portion of the area A of FIG. 1 in accordance with the present invention;

FIG. 3 is a side sectional view of the connection between the clip and the heat sink plate according to the present invention;

FIG. 4 is an enlarged view of a portion of the area B of FIG. 3 in accordance with the present invention;

FIG. 5 is a cross-sectional view of the circuit board body of the present invention;

in the figure: 1. a circuit board main body; 101. a top base layer; 102. an underlayer; 103. an adhesive layer; 104. a side reinforcing plate; 105. a central reinforcing plate; 2. a copper substrate; 3. a heat dissipation plate; 4. an L-shaped guide seat; 5. a base; 6. clamping a pin; 7. a base sleeve; 8. a limiting head; 9. a limiting hole; 10. an inner chute; 11. an inner rod; 12. an inner slide block; 13. an inner spring; 14. and (4) connecting the blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1 to 5, the present invention provides a technical solution: a composite multilayer circuit board with a heat dissipation structure comprises a circuit board main body 1, the top of the circuit board main body 1 is provided with the heat dissipation structure, the heat dissipation structure comprises a copper substrate 2 installed on the top surface of the circuit board main body 1, the top surface of the copper substrate 2 is provided with a heat dissipation plate 3, heat conduction silica gel is arranged between the copper substrate 2 and the heat dissipation plate 3, the top surface of the heat dissipation plate 3 is uniformly provided with a plurality of integrated heat dissipation fins, the heat dissipation plate 3 and the heat dissipation fins are both copper components and have good heat conduction characteristics, the top of the copper substrate 2 is symmetrically fixed with two L-shaped guide seats 4, the two ends of the heat dissipation plate 3 are respectively embedded into the two L-shaped guide seats 4, the top of the circuit board main body 1 is also provided with four limiting assemblies corresponding to the heat dissipation plate 3, each limiting assembly comprises a base 5, a base sleeve 7 and a clamping pin 6, the base 5 is rotatably arranged on the top of the circuit board main body 1, the base sleeve 7 is sleeved on the surface of the base 5 in a sliding manner, the clamping pin 6 is fixed on the outer surface of the base sleeve 7, one end of the clamping pin 6 is tightly attached to the heat dissipation plate 3, the inner sliding groove 10 is formed in the base 5, two inner rods 11 and one inner sliding block 12 are arranged in the inner sliding groove 10, the inner sliding block 12 is sleeved on the two inner rods 11 in a sliding manner, one end of each inner rod 11, opposite to one side of the inner sliding block 12, is sleeved with an inner spring 13, the inner walls of the two sides of the inner sliding groove 10 are respectively provided with a strip-shaped slideway, two connecting blocks 14 are fixed between the inner sliding block 12 and the base sleeve 7 and are respectively positioned in the two strip-shaped slideways, so that the heat dissipation plate 3 can be pressed on the top of the copper substrate 2 by the clamping pin 6, the surface of the bottom of the clamping pin 6 is provided with an integrated limiting head 8, the surface of the heat dissipation plate 3 is provided with a limiting hole 9 corresponding to the limiting head 8, and the limiting head 8 is embedded into the inner side of the limiting hole 9, so that the heat radiating plate 3 does not slip again after being mounted.

In this embodiment, preferably, the circuit board main body 1 includes a top base layer 101, a bottom base layer 102, a bonding layer 103 and a reinforcing layer, the bonding layer 103 is disposed between the top base layer 101 and the bottom base layer 102, and a reinforcing layer is further disposed in the bonding layer 103, the reinforcing layer includes a side reinforcing plate 104 and a central reinforcing plate 105, a plurality of side reinforcing plates 104 are disposed on both the inner side surface of the top base layer 101 and the inner side surface of the bottom base layer 102, a plurality of central reinforcing plates 105 are uniformly disposed in the central region of the bonding layer 103, so as to effectively improve the bending resistance of the circuit board main body 1, a connection structure is disposed between the central reinforcing plate 105 and the side reinforcing plates 104, the connection structure includes positioning blocks fixed on both end surfaces of the central reinforcing plate 105, positioning grooves corresponding to the positioning blocks are disposed at both ends of the side reinforcing plates 104, the end portions of the central reinforcing plate 105 are disposed between the two symmetrical side reinforcing plates 104, and the positioning blocks are embedded in the positioning grooves, so that the central reinforcing plate 105 and the side reinforcing plates 104 can be connected with each other, and further play a role in bending resistance.

In this embodiment, preferably, a rotation groove is formed in the base 5 below the inner sliding groove 10, a rotation block corresponding to the rotation groove is disposed on the top surface of the circuit board main body 1, and the rotation block is located in the rotation groove, so that the base 5 can smoothly rotate on the top of the circuit board main body 1.

The working principle and the using process of the utility model are as follows: when the heat dissipation plate 3 needs to be installed on the top of the copper substrate 2, the base 5 is rotated first to enable the clamping pins 6 not to block the installation of the heat dissipation plate 3, then heat-conducting silica gel is coated on the bottom surface of the heat dissipation plate 3 and the top surface of the copper substrate 2, then the two ends of the heat dissipation plate 3 are aligned with the L-shaped guide seats 4 and slide into the inner sides of the L-shaped guide seats 4, the heat dissipation plate 3 can slide to the top surface of the copper substrate 2, then the base sleeve 7 and the clamping pins 6 are pulled upwards to enable the connecting block 14 to drive the inner sliding block 12 to move and enable the inner spring 13 to be gradually compressed, then the base 5 is rotated to enable the clamping pins 6 to rotate to the top of the heat dissipation plate 3, at the moment, the clamping pins 6 and the base sleeve 7 are loosened to enable the inner sliding block 12 to be pushed back by the inner spring 13, and the base sleeve 7 and the clamping pins 6 are reset by the connecting block 14 to enable the limiting head 8 to be clamped into the inner sides of the limiting holes 9, the heat dissipation plate 3 is tightly pressed on the surface of the copper substrate 2, so that the heat dissipation plate 3 can be installed, heat generated in the subsequent operation of the circuit board main body 1 can be absorbed by the copper substrate 2 firstly, then the heat is transferred to the heat dissipation plate 3 through the heat conducting silica gel, and heat dissipation is carried out through the heat dissipation fins on the surface of the heat dissipation plate 3, so that the heat dissipation performance of the whole circuit board main body 1 is improved, the problem of poor heat dissipation effect in the original device is solved, when the heat dissipation plate 3 needs to be detached for cleaning in the subsequent process, only the clamping pins 6 need to be pulled up and the base 5 needs to be rotated, so that the clamping pins 6 do not limit the heat dissipation plate 3 any more, and then the heat dissipation plate 3 slides down from the top of the copper substrate 2;

meanwhile, under the action of the side reinforcing plates 104 and the central reinforcing plate 105, the central area of the circuit board main body 1 can be well reinforced and supported, so that the bending resistance of the whole circuit board main body 1 is improved, and the use stability of the circuit board main body 1 is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a compound multilayer circuit board with heat radiation structure, includes circuit board main part (1), its characterized in that: the heat dissipation structure is arranged at the top of the circuit board main body (1), the heat dissipation structure comprises a copper substrate (2) arranged on the top surface of the circuit board main body (1), a heat dissipation plate (3) is arranged on the top surface of the copper substrate (2), heat conduction silica gel is arranged between the copper substrate (2) and the heat dissipation plate (3), a plurality of integrated heat dissipation fins are uniformly arranged on the top surface of the heat dissipation plate (3), two L-shaped guide seats (4) are symmetrically fixed at the top of the copper substrate (2), two ends of the heat dissipation plate (3) are respectively embedded into the two L-shaped guide seats (4), four limiting components are further arranged at the top of the circuit board main body (1) and comprise a base (5), a base sleeve (7) and clamping feet (6), the base (5) is rotatably arranged at the top of the circuit board main body (1), and the base sleeve (7) is slidably sleeved on the surface of the base (5), the clamping pins (6) are fixed on the outer surface of the base sleeve (7), and one ends of the clamping pins (6) are tightly attached to the heat dissipation plate (3).

2. The composite multilayer circuit board with a heat dissipation structure of claim 1, wherein: inner chute (10) have been seted up to the inside of base (5), and the inside of inner chute (10) is provided with interior slider (12) of two interior poles (11) and one, interior slider (12) slip cap is established on two interior poles (11), every the one end of interior pole (11) all overlaps for one side of interior slider (12) is equipped with innerspring (13), the bar slide has all been seted up to the both sides inner wall of interior spout (10), be fixed with two connecting blocks (14) between interior slider (12) and base cover (7), and two connecting block (14) are in two bar slides respectively.

3. The composite multilayer circuit board with a heat dissipation structure of claim 1, wherein: the bottom surface of card foot (6) is equipped with the spacing head (8) of integral type, spacing hole (9) have been seted up on the surface of heating panel (3), spacing head (8) are embedded into the inboard in spacing hole (9).

4. The composite multilayer circuit board with a heat dissipation structure of claim 1, wherein: the circuit board main body (1) comprises a top base layer (101), a bottom base layer (102), an adhesive layer (103) and a reinforcing layer, wherein the adhesive layer (103) is arranged between the top base layer (101) and the bottom base layer (102), and the reinforcing layer is further arranged in the adhesive layer (103).

5. The composite multilayer circuit board with a heat dissipation structure of claim 4, wherein: the reinforcing layer comprises side reinforcing plates (104) and a central reinforcing plate (105), the inner side surface of the top base layer (101) and the inner side surface of the bottom base layer (102) are provided with the side reinforcing plates (104), the central area of the bonding layer (103) is uniformly provided with the central reinforcing plates (105), and a connecting structure is arranged between the central reinforcing plate (105) and the side reinforcing plates (104).

6. The composite multilayer circuit board with a heat dissipation structure of claim 5, wherein: the connecting structure comprises positioning blocks fixed on the surfaces of two ends of a central reinforcing plate (105), positioning grooves are formed in two ends of each side reinforcing plate (104), the end part of the central reinforcing plate (105) is located between the two symmetrical side reinforcing plates (104), and the positioning blocks are embedded into the positioning grooves.

7. The composite multilayer circuit board with a heat dissipation structure of claim 1, wherein: the inside of base (5) has seted up the swivelling chute for the below of interior spout (10), the top surface of circuit board main part (1) is equipped with rotatory piece, and rotatory piece is in the swivelling chute.