CN216507181U

CN216507181U - Heat-conducting silica gel composite heat-radiating aluminum nitride substrate

Info

Publication number: CN216507181U
Application number: CN202122806060.0U
Authority: CN
Inventors: 季荣梅; 曹小进; 陈佳伟; 何亚祥
Original assignee: Shenzhen Xinrongjin Insulation Materials Co ltd
Current assignee: Shenzhen Xinrongjin Insulation Materials Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-05-13
Anticipated expiration: 2031-11-16

Abstract

The utility model provides a heat-conducting silica gel composite heat-radiating aluminum nitride substrate, which relates to the technical field of aluminum nitride substrates and comprises an aluminum substrate body, wherein the aluminum substrate body comprises a substrate plate layer, the upper end of the substrate plate layer is provided with a limiting groove, the lower surface inside the limiting groove is provided with a heat-radiating groove, the middle of the lower surface inside the limiting groove is provided with a placing groove, a graphite heat-radiating fin is arranged inside the placing groove, the lower end of the graphite heat-radiating fin is respectively provided with a plurality of positioning and installing mechanisms, the lower end of the limiting groove is provided with a heat-conducting layer, and the upper end inside the limiting groove is provided with a copper foil. According to the utility model, the copper foil, the graphite radiating fins and the substrate plate layer are respectively connected with the positioning mounting machine through the heat conducting layer, so that the aluminum substrate body can be integrally formed without hot pressing, workers in the later period can conveniently detach and decompose the aluminum substrate body, the detachment difficulty of the aluminum substrate is reduced, and the recovery cost of the aluminum substrate body is also reduced.

Description

Heat-conducting silica gel composite heat-radiating aluminum nitride substrate

Technical Field

The utility model relates to the technical field of aluminum nitride substrates, in particular to a heat-conducting silica gel composite heat-dissipating aluminum nitride substrate.

Background

Along with the development of electronic information industry, the demand for the base plate is also bigger and bigger, and under general circumstances, the base plate is exactly the copper clad laminate, generally adopt aluminium base copper clad laminate when producing the copper clad laminate, and all form wholly through hot pressing work handle, compound heat-conducting plate, each part such as insulating layer when producing the aluminium base copper clad laminate, let it be difficult for separating, but when needing to retrieve aluminium base copper clad laminate in later stage, because aluminium base copper clad laminate inside forms wholly by the hot pressing work pressfitting, lead to the staff to be difficult to dismantle the decomposition to aluminium base copper clad laminate, cause the recovery cost of aluminium base copper clad laminate to improve.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a heat-conducting silica gel composite heat-radiating aluminum nitride substrate which can effectively solve the problems in the background art.

In order to realize the purpose, the utility model adopts the technical scheme that:

the aluminum nitride substrate with the heat-conducting silica gel composite heat dissipation function comprises an aluminum substrate body, wherein the aluminum substrate body comprises a substrate plate layer, a limiting groove is formed in the upper end of the substrate plate layer, a heat dissipation groove is formed in the inner lower surface of the limiting groove, a placement groove is formed in the middle of the inner lower surface of the limiting groove, a graphite heat dissipation sheet is arranged inside the placement groove, a plurality of positioning and installing mechanisms are respectively installed at the lower end of the graphite heat dissipation sheet, a heat conduction layer is installed at the lower end of the limiting groove, and a copper foil is installed at the upper end inside the limiting groove.

Preferably, the copper foil, the heat conducting layer, the graphite heat sink and the substrate plate layer are connected with each other.

Preferably, the radiating grooves are connected with the placing grooves, and one ends of the radiating grooves far away from the placing grooves penetrate through the substrate board layers respectively.

Preferably, each positioning and mounting mechanism comprises an arc-shaped sliding chute, each arc-shaped sliding chute is respectively arranged on the lower surface of the placing groove by taking the graphite radiating fin as an axis, and one side of each arc-shaped sliding chute is respectively provided with an inlet.

Preferably, the two ends of each arc-shaped sliding groove far away from one side of the inlet are respectively provided with a positioning rod, and the inside of each arc-shaped sliding groove is respectively and movably provided with a sliding block.

Preferably, two ends of the upper surface of each sliding block, which are far away from one side of the inlet, are respectively provided with a positioning groove, and each positioning groove is mutually clamped with the positioning rod.

Preferably, a connecting rod is fixedly mounted in the middle of the upper surface of each sliding block, the upper end of each connecting rod is connected with the lower surface of the graphite radiating fin, and each sliding block is movably mounted in the inlet.

Compared with the prior art, the utility model has the following beneficial effects:

(1) according to the utility model, the copper foil, the graphite radiating fins and the substrate plate layer are respectively connected with the positioning mounting machine through the heat conducting layer, so that the aluminum substrate body can be integrally formed without hot pressing, workers in the later period can conveniently detach and decompose the aluminum substrate body, the detachment difficulty of the aluminum substrate is reduced, and the recovery cost of the aluminum substrate body is also reduced.

(2) The heat conducting layer is made of heat conducting silica gel and used for connecting the copper foil, the graphite radiating fins and the substrate plate layer, so that heat generated by the copper foil is radiated through the heat conducting layer and the graphite radiating fins, the aluminum substrate body is kept at a stable temperature all the time in the using process, the aluminum substrate body is convenient to use, a composite radiating function is formed through the heat conducting layer, the graphite radiating fins and the radiating grooves, and the whole aluminum substrate body can be rapidly radiated.

Drawings

FIG. 1 is a schematic view of an overall structure of a heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to the present invention;

FIG. 2 is a schematic front view of a heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to the present invention;

FIG. 3 is a schematic top view of the heat-conductive silica gel composite heat-dissipating aluminum nitride substrate according to the present invention;

FIG. 4 is a schematic cross-sectional view taken along line A-A of the heat-conductive silica gel composite heat-dissipating aluminum nitride substrate of the present invention shown in FIG. 2;

FIG. 5 is a schematic cross-sectional view taken along line B-B in FIG. 3 of the heat-conductive silica gel composite heat-dissipating aluminum nitride substrate of the present invention;

fig. 6 is a schematic cross-sectional view of the heat-conductive silica gel composite heat-dissipating aluminum nitride substrate of fig. 2 at the position C-C.

In the figure: 1. an aluminum substrate body; 2. a substrate board layer; 201. a limiting groove; 3. a heat sink; 4. a placement groove; 5. a graphite heat sink; 6. a positioning and mounting mechanism; 601. an arc-shaped chute; 602. an inlet; 603. a slider; 604. a connecting rod; 605. positioning a rod; 606. positioning a groove; 7. a heat conductive layer; 8. copper foil.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

As shown in fig. 1 to 6, the heat-conducting silica gel composite heat-dissipating aluminum nitride substrate comprises an aluminum substrate body 1, wherein the aluminum substrate body 1 comprises a substrate plate layer 2, a limiting groove 201 is arranged at the upper end of the substrate plate layer 2, a heat-dissipating groove 3 is arranged at the inner lower surface of the limiting groove 201, a placing groove 4 is arranged in the middle of the inner lower surface of the limiting groove 201, a graphite heat-dissipating fin 5 is arranged inside the placing groove 4, a plurality of positioning and mounting mechanisms 6 are respectively arranged at the lower end of the graphite heat-dissipating fin 5, a heat-conducting layer 7 is arranged at the lower end of the limiting groove 201, and a copper foil 8 is arranged at the upper end inside the limiting groove 201.

When specifically setting up, interconnect between copper foil 8, heat-conducting layer 7, graphite fin 5 and the base plate layer 2, interconnect between radiating groove 3 and the standing groove 4, and the one end of radiating groove 3 that is kept away from standing groove 4 runs through base plate layer 2 respectively. The heat conduction layer 7 is made for heat conduction silica gel for connect copper foil 8 and graphite fin 5 and base plate layer 2, make the heat that copper foil 8 produced dispel the heat through heat conduction layer 7 and graphite fin 5, let aluminium base board body 1 remain stable temperature throughout the in-process of using, better make things convenient for it to use, and form compound heat dissipation function through heat conduction layer 7, graphite fin 5 and radiating groove 3, can be quick dispel the heat to aluminium base board body 1 wholly.

In a specific setting, each positioning and mounting mechanism 6 includes an arc-shaped chute 601, each arc-shaped chute 601 is respectively disposed on the lower surface of the placement groove 4 by taking the graphite heat sink 5 as an axis, and one side of each arc-shaped chute 601 is respectively provided with an inlet 602. Make graphite fin 5 need not to install in the inside of base plate layer 2 through glue through location installation mechanism 6, dismantle the change to graphite fin 5 when making things convenient for the later stage to retrieve aluminium base board body 1, resources are saved more.

When specifically setting up, locating lever 605 is installed respectively to the both ends of keeping away from every arc spout 601 of import 602 one side, and the inside of every arc spout 601 is movable mounting respectively has slider 603. The slider 603 enters into the inside of the arc-shaped sliding groove 601 through the inlet 602, and similarly, when the slider 603 needs to be taken out, the slider 603 can leave the inside of the arc-shaped sliding groove 601 through the inlet 602, so that the slider 603 and the graphite cooling fins 5 can be conveniently installed or disassembled by a worker.

When specifically setting up, keep away from every slider 603 upper surface both ends of import 602 one side and be equipped with constant head tank 606 respectively, every constant head tank 606 respectively with locating lever 605 between each other block with, respectively fixed mounting has connecting rod 604 in the middle of the upper surface of every slider 603, the upper end of every connecting rod 604 is interconnected with the lower surface of graphite fin 5 respectively, every slider 603 movable mounting is in the inside of import 602. After slider 603 entered into the inside of arc spout 601, through the staff to graphite fin 5's rotation, let graphite fin 5 drive slider 603 through connecting rod 604 and remove in the inside of arc spout 601, let make slider 603 drive constant head tank 606 and remove, make locating lever 605 card go into the inside of constant head tank 606 at last, fix a position slider 603, make the difficult automatic production of slider 603 remove, better fix a position the installation to graphite fin 5.

The working principle of the heat-conducting silica gel composite heat-dissipating aluminum nitride substrate is as follows:

during the use, at first the staff drives slider 603 through graphite fin 5, make slider 603 enter into the inside of arc spout 601 through import 602, then the staff rotates graphite fin 5, let graphite fin 5 drive slider 603 through connecting rod 604 and slide in the inside of arc spout 601, make locating lever 605 card go into the inside of constant head tank 606, fix a position slider 603 and graphite fin 5, at last the staff is being interconnected between copper foil 8 and graphite fin 5 and base plate layer 2 through heat-conducting layer 7, let copper foil 8's temperature pass through heat-conducting layer 7 and transmit graphite fin 5, then carry out quick heat dissipation to the temperature by graphite fin 5 and radiating groove 3.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. Compound radiating aluminium nitride base board of heat conduction silica gel, including aluminium base board body (1), its characterized in that: the aluminum substrate body (1) comprises a substrate plate layer (2), the upper end of the substrate plate layer (2) is provided with a limiting groove (201), the inner lower surface of the limiting groove (201) is provided with a heat dissipation groove (3), a placement groove (4) is arranged in the middle of the inner lower surface of the limiting groove (201), graphite cooling fins (5) are arranged inside the placement groove (4), a plurality of positioning installation mechanisms (6) are respectively installed at the lower ends of the graphite cooling fins (5), a heat conduction layer (7) is installed at the lower end of the limiting groove (201), and copper foils (8) are installed at the inner upper end of the limiting groove (201).

2. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 1, wherein: the copper foil (8), the heat conduction layer (7), the graphite radiating fin (5) and the substrate plate layer (2) are connected with each other.

3. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 1, wherein: the radiating grooves (3) are connected with the placing grooves (4) mutually, and one ends, far away from the placing grooves (4), of the radiating grooves (3) penetrate through the substrate plate layers (2) respectively.

4. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 1, wherein: each positioning and installing mechanism (6) comprises an arc-shaped sliding groove (601), each arc-shaped sliding groove (601) is respectively arranged on the lower surface of the placing groove (4) by taking the graphite radiating fins (5) as the axis, and one side of each arc-shaped sliding groove (601) is respectively provided with an inlet (602).

5. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 4, wherein: locating rods (605) are respectively installed at two ends of each arc-shaped sliding groove (601) far away from one side of the inlet (602), and a sliding block (603) is movably installed inside each arc-shaped sliding groove (601).

6. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 5, wherein: two ends of the upper surface of each sliding block (603) far away from one side of the inlet (602) are respectively provided with a positioning groove (606), and each positioning groove (606) is mutually clamped with a positioning rod (605).

7. The heat-conducting silica gel composite heat-dissipating aluminum nitride substrate according to claim 6, wherein: the middle of the upper surface of each sliding block (603) is fixedly provided with a connecting rod (604), the upper end of each connecting rod (604) is connected with the lower surface of the graphite radiating fin (5), and each sliding block (603) is movably arranged in the inlet (602).