CN210469653U - Intelligence audio amplifier mainboard radiator - Google Patents

Abstract

The utility model discloses an intelligence audio amplifier mainboard radiator, including heat dissipation aluminum plate, heat dissipation aluminum plate's center is equipped with and subtracts the heavy district, and its edge is equipped with a plurality of setting elements of being connected with the audio amplifier main part, has installed a plurality of damping cottons and a heat pipe on heat dissipation aluminum plate's the terminal surface, has installed a plurality of damping cottons and two heat conduction pieces on the heat pipe, and the side of heat conduction piece is equipped with one and sets firmly the piece of protecting against radiation on heat dissipation aluminum plate's the terminal surface. Compared with the prior art, the utility model discloses a flat heat pipe cooperates with the heat dissipation aluminum plate of large tracts of land, can be fast with heat conduction on the mainboard chip to great space within range, the heat conduction is fast, the radiating efficiency is high and the product is frivolous, it is cotton through setting up the damping bubble on heat dissipation aluminum plate board and heat pipe, can slow down the influence of the vibration of audio amplifier during operation to components and parts on the mainboard, prolong the life of mainboard, simultaneously through setting up different instruction districts on heat dissipation aluminum plate, be favorable to the equipment of product, it is high to have the yields, advantages such as production efficiency height.

Description

Intelligence audio amplifier mainboard radiator

Technical Field

The utility model belongs to the technical field of the radiator technique and specifically relates to an intelligence audio amplifier mainboard radiator.

Background

The radiator is mainly used as a radiating element applied to the field of various electronic components, when in use, the radiator is attached to a heating surface to radiate heat in a composite heat exchange mode, and the radiating effect is often limited by the size of a product space. In the current popular AR intelligent products, the chip or motherboard as the core component has a large heat generation amount, and an excellent heat sink and a stable structure are more required to exert its advantages. Therefore, how to ensure good heat dissipation performance and stable structure in increasingly thinner products is a direction of industry development.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to the problem that mentions in the above-mentioned background art, provide an intelligence audio amplifier mainboard radiator, including radiating piece and damping piece, the structure is frivolous, has good radiating effect and damping effect.

In order to solve the technical problem, the utility model discloses the technical scheme who takes as follows:

the utility model provides an intelligence audio amplifier mainboard radiator, includes heat dissipation aluminum plate, heat dissipation aluminum plate's center is equipped with subtracts the heavy district, heat dissipation aluminum plate's edge is equipped with a plurality of setting elements that are used for fixed radiator, heat dissipation aluminum plate's up end has installed the heat pipe with heat conduction to heat dissipation aluminum plate, the heat pipe side is equipped with a plurality of first damping cottons that are used for the damping, install a plurality of heat conduction blocks that match with the mainboard chip on the heat pipe, a plurality of radiation protection pieces have been installed in the side matching of heat conduction block, it is cotton still to install a plurality of second damping cottons that are used for the damping on the heat pipe.

Preferably, two first damping cottons are installed on the upper end face of the heat dissipation aluminum plate, three second damping cottons are installed on the upper end face of the heat conduction pipe, and a radiation-proof block is installed beside the heat conduction block.

Preferably, the end face of the heat-radiating aluminum plate is further provided with a plurality of convex hulls for assisting the positioning of the heat radiator and a plurality of hole grooves for avoiding the sound box structural member.

Preferably, the heat conduction pipe is a flat copper heat pipe, and the thickness of the heat conduction pipe is 1-2 times of that of the heat dissipation aluminum plate.

Preferably, the heat pipe is filled with a cold enzyme.

Preferably, the heat conducting block is a heat conducting copper block.

Compared with the prior art, the beneficial effects of the utility model reside in that: the flat heat pipe is matched with a large-area heat dissipation aluminum plate with light weight, so that heat on the mainboard chip is quickly conducted into a large space range, heat conduction is fast, heat dissipation efficiency is high, and the product is light and thin; the vibration damping foam is arranged on the heat dissipation aluminum plate and the heat conduction pipe, so that the influence of vibration of the sound box during working on components on the main board can be relieved, and the service life of the main board is prolonged; through the assembly indication area that sets up each spare part on heat dissipation aluminum plate, subsequent equipment and assembly process of being convenient for to improve the yields of production, promote production efficiency.

Drawings

FIG. 1 is a schematic perspective view of the present embodiment;

fig. 2 is a front view of the heat dissipating aluminum plate in the present embodiment.

In the figure: 1. a heat dissipation aluminum plate; 2. first vibration damping cotton; 3. a heat conducting pipe; 4. second damping cotton; 6. a heat conducting block; 7. a radiation protection block; 8. a weight reduction zone; 9. a convex hull; 10. a hole groove; 11. a positioning member.

Detailed Description

The present invention will be described in further detail with reference to fig. 1.

The embodiments described by referring to the drawings are exemplary and intended to be used for explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

As shown in fig. 1-2, an intelligent sound box mainboard radiator comprises a heat dissipation aluminum plate 1, a weight reduction area 8 is arranged at the center of the heat dissipation aluminum plate 1, a plurality of positioning pieces 11 for fixing the radiator are arranged at the edge of the heat dissipation aluminum plate, a heat conduction pipe 3 for conducting heat to the heat dissipation aluminum plate is arranged on the upper end face of the heat dissipation aluminum plate 1, a plurality of first vibration reduction cottons 2 for reducing vibration are arranged at the side of the heat conduction pipe 3, a plurality of heat conduction blocks 6 matched with a mainboard chip are arranged on the heat conduction pipe 3, a plurality of radiation protection blocks 7 are arranged at the side of the heat conduction blocks 6 in a matching manner, and a plurality of second vibration reduction cottons 4 for reducing.

Preferably, two first damping cottons 2 are installed on the upper end face of the heat dissipation aluminum plate 1, three second damping cottons 4 are installed on the upper end face of the heat conduction pipe 3, and a radiation-proof block 7 is installed beside the heat conduction block 6. In this embodiment, two square first vibration damping cottons 2 are installed on the heat dissipation aluminum plate 1, one square second vibration damping cotton 4 is installed beside the heat conduction block 6 on the heat conduction pipe 3, and two long and narrow second vibration damping cottons 4 are installed at two ends of the heat conduction pipe 3, so as to slow down the influence of vibration on important components on the main board and prolong the service life of the main board; a radiation-proof block 7 is arranged beside the heat-conducting block 6 to reduce the radiation influence on the periphery of the main plate.

Preferably, the end face of the aluminum heat dissipation plate 1 is further provided with a plurality of convex hulls 9 for assisting the positioning of the heat sink and a plurality of hole grooves 10 for avoiding the sound box structural member. In the embodiment, the aluminum plate formed by stamping is selected as the heat dissipation plate, the aluminum plate is light in weight and high in heat dissipation efficiency, the production process of stamping is simple, the yield is high, and the manufacturing cost of the heat dissipation aluminum plate 1 is low; the convex hull 9 can assist in placing the radiator on the structural member in the sound box quickly and accurately, which is helpful for improving the production efficiency of the sound box.

Preferably, the heat transfer pipe 3 is a flat copper heat pipe, and the thickness thereof is 1 to 2 times the thickness of the heat dissipation aluminum plate. Utilize the high characteristics of copper product thermal conductivity, can conduct the heat fast to heat dissipation aluminum plate 1 on, simultaneously, in limited space, the longitudinal dimension of radiator can further be compressed to the heat pipe 3 of platykurtic to be convenient for heat conduction piece 6 and second damping cotton 4, the installation and the fixing of two third damping cotton 5. In addition, in order to avoid damaging the internal structure of the heat pipe and fixing the heat pipe, the heat pipe needs to have a certain thickness.

In this embodiment, be limited by the heat dissipation needs of narrow space and mainboard, the aluminum product of having chooseed for use conventional thickness is as heat dissipation aluminum plate 1's raw and other materials, flat heat pipe has been chooseed for use as heat pipe 3, two heat conduction blocks 6 of hugging closely the mainboard chip have been installed on heat pipe 3, on the basis of the thickness and the cross section size of unable increase radiator, lay heat pipe 3 along heat dissipation aluminum plate 1's profile, extend its longitudinal dimension as far as possible, in order to increase heat conduction area, thermal conduction accelerates, the radiating efficiency is promoted. Meanwhile, in order to avoid damaging the internal structure of the heat pipe, the distance between the two flat surfaces of the heat pipe is preferably 1-2 times the thickness of the aluminum heat dissipating plate 1.

Preferably, the heat pipe is filled with a cold enzyme. The cold enzyme is used as a medium, so that the excellent heat conduction and heat dissipation performance of the heat pipe can be fully exerted, and the heat dissipation efficiency of the heat radiator is further improved.

Preferably, the heat conducting block is a heat conducting copper block. The copper block has high heat conductivity, and can quickly conduct heat of the chip on the main plate to the heat conduction pipe and the heat dissipation aluminum plate below.

The utility model discloses a use method as follows:

taking a heat-radiating aluminum plate 1, fixing a heat-conducting pipe 3, an anti-radiation block 7, first vibration-damping cotton 2 and second vibration-damping cotton 4 on the heat-radiating aluminum plate in sequence, fixing a heat-conducting pipe 6 on the heat-conducting pipe 3, and finishing the assembly of the radiator; then the hole groove 10 is kept away from the structural member in the sound box, the positioning member 11 is placed in the fixed area in the sound box, the convex hull 9 is matched and fixed with the positioning member in the sound box, and then the fastening screw penetrates through the positioning member 11 to fix the radiator and the sound box together.

The above is not intended to limit the technical scope of the present invention, and all changes and modifications equivalent to any modification made to the above embodiments according to the technical spirit of the present invention are still within the scope of the technical solution of the present invention.

Claims (6)

1. The utility model provides an intelligence audio amplifier mainboard radiator, its characterized in that, including heat dissipation aluminum plate, heat dissipation aluminum plate's center is equipped with subtracts the heavy district, heat dissipation aluminum plate's edge is equipped with a plurality of setting elements that are used for fixed radiator, heat dissipation aluminum plate's up end has been installed and has been conducted the heat pipe to heat dissipation aluminum plate with the heat, the heat pipe side is equipped with a plurality of first damping cottons that are used for the damping, install a plurality of heat conduction pieces that match with the mainboard chip on the heat pipe, a plurality of radiation protection pieces have been installed in the side matching of heat conduction piece, it is cotton still to install a plurality of second damping that are used for the damping.

2. The radiator according to claim 1, wherein two first damping cottons are disposed on the upper end surface of the heat dissipation aluminum plate, three second damping cottons are disposed on the upper end surface of the heat conduction pipe, and a radiation-proof block is disposed beside the heat conduction block.

3. The radiator according to claim 2, wherein the end surface of the aluminum heat-dissipating plate is further provided with a plurality of convex hulls for assisting in positioning the radiator and a plurality of holes for avoiding the structural member of the sound box.

4. The radiator according to claim 3, wherein the heat pipe is a flat copper heat pipe, and the thickness of the heat pipe is 1-2 times the thickness of the heat dissipation aluminum plate.

5. The radiator of claim 3, wherein the interior of the heat conducting pipe is filled with a cooling enzyme.

6. The smart sound box motherboard heat sink of claim 4, wherein the heat conducting block is a heat conducting copper block.

Images