CN210053731U - High-speed heat conduction radiator based on copper-aluminum paster - Google Patents
High-speed heat conduction radiator based on copper-aluminum paster Download PDFInfo
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- CN210053731U CN210053731U CN201920239932.XU CN201920239932U CN210053731U CN 210053731 U CN210053731 U CN 210053731U CN 201920239932 U CN201920239932 U CN 201920239932U CN 210053731 U CN210053731 U CN 210053731U
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- copper
- heat conduction
- heat
- heat dissipation
- aluminum
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Abstract
The utility model relates to the technical field of radiators, in particular to a high-speed heat conduction radiator based on copper-aluminum patches, which comprises a base and radiating fins attached to the surface of the base, wherein the base comprises a heat conduction copper plate for guiding heat and a radiating aluminum plate integrally connected with the heat conduction copper plate, the radiating aluminum plate and the heat conduction copper plate are integrated by metallurgical bonding, the radiating aluminum plate is provided with a plurality of connecting grooves which are communicated to the heat conduction copper plate, and the radiating fins are attached to the connecting grooves; the utility model discloses a heat conduction heat dissipation is realized to the base that copper aluminium metallurgy combined, with the fin laminating on the base, can realize high-speed, efficient radiating effect, compare traditional pure aluminium radiator radiating effect and can improve at double, the radiating effect is good.
Description
Technical Field
The utility model relates to a radiator technical field especially relates to a high-speed heat conduction radiator based on copper aluminium paster.
Background
The electronic product can produce a large amount of heat when working, if not in time distribute away these heats, light leads to the dead halt, heavy probably burns out the electronic product, and the radiator is used for the radiating for the electronic product. The heat sink plays a decisive role in stable operation of the electronic product.
The heat sink can be divided into air-cooling, heat pipe and water-cooling according to its heat dissipation method, wherein the air-cooling heat sink reduces the temperature of the electronic product by heat exchange between the heat sink and the surrounding air, and generally includes a heat dissipation substrate and heat dissipation fins mounted on the heat dissipation substrate. The radiator in the prior art generally adopts pure aluminium or pure copper material machine-shaping structure, because pure aluminium material heat conductivility is not as good as pure copper material, and pure copper material overall cost is higher, leads to whole inconvenient use, and the radiator that ordinary copper aluminium combines generally can't reach best heat conduction and heat dissipation cooperation in the in-service use to need to improve above the structure to the radiator that copper aluminium combines, in order to strengthen the whole radiating effect of radiator.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an adopt the base that copper aluminium metallurgy combined to realize heat conduction heat dissipation, with the fin laminating on the base, can realize high-speed, efficient radiating effect, compare traditional pure aluminium radiator radiating effect and can improve at double, the high-speed heat conduction radiator based on copper aluminium paster that the radiating effect is good.
The utility model adopts the technical proposal that: the utility model provides a high-speed heat conduction radiator based on copper aluminium paster, includes the base, laminates in the fin on base surface, the base is including being used for deriving thermal heat conduction copper, the heat dissipation aluminum plate that links to each other with heat conduction copper an organic whole, heat dissipation aluminum plate adopts the metallurgical bonding to form integratively with heat conduction copper, heat dissipation aluminum plate has seted up a plurality of spread grooves, the spread groove communicates to heat conduction copper, the fin is laminated in the spread groove.
The further improvement of the scheme is that the surface of the heat-radiating aluminum plate is provided with heat-radiating grooves at intervals with the connecting grooves.
The further improvement to the above scheme is that one side of the heat conduction copper plate, which deviates from the heat dissipation aluminum plate, is a flat surface.
The further improvement of the scheme is that the radiating fin comprises a copper sheet base material and radiating aluminum sheets integrally formed on two sides of the copper sheet base material.
The further improvement of the scheme is that the copper sheet substrate and the heat dissipation aluminum sheet are connected into a whole through metallurgical bonding.
The further improvement of the scheme is that the copper sheet base material extends downwards to be attached to the connecting groove.
The utility model has the advantages that:
the base is arranged, so that the mounting, the connection and the use are convenient, meanwhile, the stable heat conduction can be ensured after the mounting position is attached, the heat dissipation effect is improved, and the use is convenient, practical and reliable; the base is composed of a heat-conducting copper plate and a heat-radiating aluminum plate, the heat-conducting copper plate and the heat-radiating aluminum plate are integrated through metallurgical bonding, and the metallurgical bonding refers to bonding formed by mutual diffusion of atoms between interfaces of two pieces of metal. The combination is in a connection state or formed under the action of temperature or pressure (or under the combined action of temperature and pressure), and has strong integration, high use strength and good heat conduction and heat dissipation effects; the radiating aluminum plate is provided with the connecting groove, and the radiating fins are arranged to be attached to the connecting groove, so that heat can be conducted out through the connecting groove and radiated through the radiating fins, the radiating effect can be further improved, the radiating effect is good, and the radiating efficiency is high; the spread groove communicates to the heat conduction copper, and the fin is laminated with the spread groove, can further improve heat conduction and radiating effect.
The utility model discloses in, the heat conduction heat dissipation is realized to the base that adopts the metallurgical combination of copper aluminium, with the fin laminating on the base, can realize high-speed, efficient radiating effect, compares traditional pure aluminium radiator radiating effect and can improve at double, and the radiating effect is good.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Description of reference numerals: the heat sink comprises a heat sink 100, a base 110, a heat conducting copper plate 111, a heat dissipating aluminum plate 112, a connecting groove 113, a heat dissipating groove 114, a heat dissipating fin 120, a copper sheet substrate 121, and a heat dissipating aluminum sheet 122.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a high-speed heat conduction radiator 100 based on copper-aluminum patch, including base 110, laminate in the fin 120 on base 110 surface, base 110 is including being used for deriving thermal heat conduction copper 111, the heat dissipation aluminum plate 112 that links to each other with heat conduction copper 111 an organic whole, heat dissipation aluminum plate 112 adopts the metallurgical bonding to form integratively with heat conduction copper 111, heat dissipation aluminum plate 112 has seted up a plurality of connecting grooves 113, connecting groove 113 communicates to heat conduction copper 111, fin 120 laminates in connecting groove 113.
The surface of the aluminum plate 112 is provided with the heat dissipation groove 114 at a distance from the connecting groove 113, the aluminum plate 112 is provided with the heat dissipation groove 114, and the heat dissipation effect of the aluminum plate 112 can be further improved through the effect of the heat dissipation groove 114, so that the heat dissipation effect is good, and the heat dissipation efficiency is high.
The heat conduction copper 111 deviates from heat dissipation aluminum plate 112 one side and is the smooth surface, and convenient laminating installation can realize even heat conduction, and convenient even coating heat conduction glue improves heat transfer effect in-service use to guarantee the radiating efficiency.
The radiating fin 120 comprises a copper sheet base material 121 and radiating aluminum sheets 122 integrally formed on two sides of the copper sheet base material 121, and the further improvement is that the copper sheet base material 121 and the radiating aluminum sheets 122 are integrally connected in a metallurgical bonding mode, a composite board formed in a metallurgical bonding mode is adopted, the radiating aluminum sheets 122 are arranged on two sides of the copper sheet base material 121, and the radiating effect is greatly improved.
The base 110 is arranged, so that the installation, connection and use are convenient, meanwhile, the stable heat conduction can be ensured after the installation position is attached, the heat dissipation effect is improved, and the use is convenient, practical and reliable; the base 110 is composed of a heat-conducting copper plate 111 and a heat-dissipating aluminum plate 112, the heat-conducting copper plate 111 and the heat-dissipating aluminum plate 112 are integrated by metallurgical bonding, which is bonding formed by mutual diffusion of atoms between interfaces of two metals. The combination is in a connection state or formed under the action of temperature or pressure (or under the combined action of temperature and pressure), and has strong integration, high use strength and good heat conduction and heat dissipation effects; the connecting groove 113 is formed in the heat dissipation aluminum plate 112, and the heat dissipation fins 120 are attached to the connecting groove 113, so that heat can be conducted out through the connecting groove 113 and dissipated through the heat dissipation fins 120, the heat dissipation effect can be further improved, the heat dissipation effect is good, and the heat dissipation efficiency is high; the connecting groove 113 is connected to the heat conducting copper plate 111, and the heat sink 120 is attached to the connecting groove 113, so that heat conduction and heat dissipation effects can be further improved.
The utility model discloses in, the heat conduction heat dissipation is realized to base 110 that adopts the metallurgical combination of copper aluminium, laminates fin 120 on base 110, can realize high-speed, efficient radiating effect, compares traditional pure aluminium radiator radiating effect and can improve at double, and the radiating effect is good.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A high-speed heat conduction radiator based on copper aluminium paster which characterized in that: including the base, laminate in the fin on base surface, the base is including being used for deriving thermal heat conduction copper, the heat dissipation aluminum plate that links to each other with heat conduction copper an organic whole, heat dissipation aluminum plate adopts the metallurgical combination to form an organic whole with heat conduction copper, heat dissipation aluminum plate has seted up a plurality of spread grooves, the spread groove communicates to heat conduction copper, the fin laminates in the spread groove.
2. The high-speed heat conduction radiator based on the copper-aluminum patch as claimed in claim 1, characterized in that: and the surface of the heat dissipation aluminum plate is provided with heat dissipation grooves at intervals with the connection grooves.
3. The high-speed heat conduction radiator based on the copper-aluminum patch as claimed in claim 2, characterized in that: the heat conduction copper deviates from the heat dissipation aluminum plate and is a flat surface.
4. The high-speed heat conduction radiator based on the copper-aluminum patch as claimed in claim 3, characterized in that: the radiating fin comprises a copper sheet base material and radiating aluminum sheets integrally formed on two sides of the copper sheet base material.
5. The high-speed heat conduction radiator based on the copper-aluminum patch as claimed in claim 4, characterized in that: the copper sheet substrate and the heat dissipation aluminum sheet are connected in a metallurgical bonding mode.
6. The high-speed heat conduction radiator based on the copper-aluminum patch as claimed in claim 5, characterized in that: the copper sheet substrate extends downwards to be attached to the connecting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239932.XU CN210053731U (en) | 2019-02-26 | 2019-02-26 | High-speed heat conduction radiator based on copper-aluminum paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239932.XU CN210053731U (en) | 2019-02-26 | 2019-02-26 | High-speed heat conduction radiator based on copper-aluminum paster |
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| Publication Number | Publication Date |
|---|---|
| CN210053731U true CN210053731U (en) | 2020-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920239932.XU Expired - Fee Related CN210053731U (en) | 2019-02-26 | 2019-02-26 | High-speed heat conduction radiator based on copper-aluminum paster |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
-
2019
- 2019-02-26 CN CN201920239932.XU patent/CN210053731U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200211 |