CN216775338U - Heat dissipation module based on lateral groove veneering structure - Google Patents
Heat dissipation module based on lateral groove veneering structure Download PDFInfo
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- CN216775338U CN216775338U CN202122958741.9U CN202122958741U CN216775338U CN 216775338 U CN216775338 U CN 216775338U CN 202122958741 U CN202122958741 U CN 202122958741U CN 216775338 U CN216775338 U CN 216775338U
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Abstract
The utility model relates to the technical field of aluminum material heat dissipation, in particular to a heat dissipation module based on a lateral groove veneering structure, which comprises a heat dissipation aluminum profile, a first heat transfer plate integrally and compositely connected to the heat dissipation aluminum profile, a first heat dissipation sheet and a second heat dissipation sheet which are respectively connected to two sides of the first heat transfer plate, and a second heat transfer plate which is attached to the heat dissipation aluminum profile and is attached to the first heat transfer plate; the section of the heat dissipation aluminum profile is triangular, a heat transfer groove is formed in the bottom surface of the heat dissipation aluminum profile, the second heat transfer plate is embedded into the heat transfer groove, and the first heat transfer plate extends to the heat transfer groove and is attached to the second heat transfer plate; according to the utility model, the heat source is transmitted to the first heat transfer plate through the second heat transfer plate, the first heat transfer plate transmits the heat source to the first radiating fin and the second radiating fin, and the first radiating fin and the second radiating fin are arranged on two sides of the first heat transfer plate to radiate the heat source, so that the heat transfer coefficient is high, and the radiating efficiency is high.
Description
Technical Field
The utility model relates to the technical field of aluminum material heat dissipation, in particular to a heat dissipation module based on a lateral groove veneering structure.
Background
Along with the continuous development of science and technology, many scientific and technological products have all been merged into in production and the life, these scientific and technological products are in the production of giving people, the life provides convenient while, self can constantly generate heat at energy conversion's in-process, how guarantee the normal operating of these products, firstly, will solve their heat dissipation problem, especially inside some equipment that power is higher, because the work efficiency of equipment constantly improves, peripheral electronic component also constantly increases simultaneously, make the whole calorific capacity of equipment also promote thereupon by a wide margin, traditional heat abstractor is mostly the cooling method of fin with the fan, this cooling method has gradually can not satisfy the heat dissipation demand of high-power equipment, often make equipment can not normal operating because of the high temperature.
The existing radiator comprises an aluminum radiator which is formed by processing aluminum alloy, the overall structure is aluminum, the efficiency is lower in the heat transfer process, the heat transfer efficiency of the aluminum is lower than that of copper, so that the existing radiator combining copper and aluminum is in split arrangement, the structure is mostly in split arrangement, the bonding density between the aluminum and the copper is insufficient, the heat transfer efficiency is insufficient, and the heat dissipation efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides a heat dissipation module based on a lateral groove facing structure, wherein a first heat transfer plate is integrally and compositely molded on a heat dissipation aluminum profile, the first heat transfer plate is attached to a second heat transfer plate, a heat source is transmitted to the first heat transfer plate through the second heat transfer plate, the first heat transfer plate transmits the heat source to a first heat dissipation plate and a second heat dissipation plate, and the first heat dissipation plate and the second heat dissipation plate are arranged on two sides of the first heat transfer plate to dissipate the heat source, so that the heat dissipation module has high heat transfer coefficient and high heat dissipation efficiency.
The technical scheme adopted by the utility model is as follows: a heat dissipation module based on a lateral groove facing structure comprises a heat dissipation aluminum profile, a first heat transfer plate integrally and compositely connected to the heat dissipation aluminum profile, a first heat dissipation sheet and a second heat dissipation sheet which are respectively connected to two sides of the first heat transfer plate, and a second heat transfer plate which is attached to the heat dissipation aluminum profile and attached to the first heat transfer plate; the cross-sectional shape of heat dissipation aluminium alloy is triangle-shaped and sets up, heat transfer groove has been seted up to the bottom surface of heat dissipation aluminium alloy, the second heat transfer board imbeds to the heat transfer inslot, first heat transfer board extends to heat transfer groove and laminates with the second heat transfer board.
The further improvement of the scheme is that mounting holes are formed in two sides of the heat dissipation aluminum profile and penetrate through the heat dissipation aluminum profile.
The further improvement of the scheme is that arc surfaces are arranged on two sides of the heat dissipation aluminum profile, and heat dissipation grooves are uniformly distributed on the arc surfaces.
The further improvement of the scheme is that the heat dissipation aluminum profile is connected with the first heat transfer plate through metallurgical bonding, and the first heat transfer plate is arranged in the middle of the heat dissipation aluminum profile.
The further improvement of the scheme is that a first connecting clamping groove and a second connecting clamping groove are arranged on two sides of the first heat transfer plate, the first radiating fin is connected to the first connecting clamping groove, and the second radiating fin is connected to the second connecting clamping groove.
The further improvement of the above scheme is that the first heat sink includes a plurality of first fins, the first connecting slot is provided with a plurality of first connecting slots, and the first fins are inserted into the first connecting slots.
In a further improvement of the above scheme, the second heat sink includes a plurality of second fins, the second connecting card slots are provided with a plurality of second fins, and the second fins are inserted into the second connecting card slots.
The further improvement of the scheme is that the groove surface of the heat transfer groove is provided with a first binding layer, the second heat transfer plate is provided with a second binding layer, and the first binding layer and the second binding layer are mutually bound.
The further improvement of the scheme is that the first bonding layer is a first copper layer formed on the heat transfer groove through cold spraying, the second bonding layer is a second copper layer formed on the second heat transfer plate through cold spraying, and the first copper layer and the second copper layer are bonded with each other.
The further improvement of the scheme is that the first adhesive layer is heat-conducting silica gel, the second adhesive layer is a second copper layer formed on the second heat transfer plate through cold spraying, and the heat-conducting silica gel is mutually attached to the second copper layer.
The utility model has the beneficial effects that:
compared with the existing heat dissipation module, the heat dissipation module has the advantages that the first heat transfer plate is integrally and compositely molded on the heat dissipation aluminum profile, the first heat transfer plate is attached to the second heat transfer plate, the heat source is transmitted to the first heat transfer plate through the second heat transfer plate, the first heat transfer plate transmits the heat source to the first heat dissipation plate and the second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate are arranged on the two sides of the first heat transfer plate, the heat source is dissipated, the heat dissipation coefficient is high, the heat dissipation efficiency is high, an integral composite structure is adopted, the integrity is strong, and the heat dissipation coefficient is high. The heat dissipation aluminum profile is provided with a heat dissipation aluminum profile, a first heat transfer plate integrally and compositely connected with the heat dissipation aluminum profile, a first cooling fin and a second cooling fin which are respectively connected to two sides of the first heat transfer plate, and a second heat transfer plate which is attached to the heat dissipation aluminum profile and is attached to the first heat transfer plate; the cross-sectional shape of heat dissipation aluminium alloy is the triangle-shaped setting, heat transfer groove has been seted up to the bottom surface of heat dissipation aluminium alloy, the second heat transfer board imbeds to the heat transfer inslot, first heat transfer board extends to heat transfer groove and laminates with the second heat transfer board. The heat transfer groove is used for fixing the second heat transfer plate and transferring heat by being attached to the first heat transfer plate, so that the structure installation and the heat transfer are facilitated, and meanwhile, the heat dissipation aluminum profile and the first heat transfer plate which are metallurgically combined are adopted, so that the structure is reliable, and the heat dissipation is stable.
Drawings
FIG. 1 is a schematic perspective view of a heat dissipation module based on a lateral groove overlay structure according to the present invention;
fig. 2 is a schematic perspective view of another view of the heat dissipation module based on the lateral groove facing structure in fig. 1.
Description of reference numerals: the heat dissipation aluminum profile comprises a heat dissipation aluminum profile 1, a heat transfer groove 11, a first adhesive layer 111, a mounting hole 12, an arc surface 13, a heat dissipation groove 131, a first heat transfer plate 2, a first connecting clamping groove 21, a second connecting clamping groove 22, a first heat dissipation fin 3, a first fin 31, a second heat dissipation fin 4, a second fin 41, a second heat transfer plate 5 and a second adhesive layer 51.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
As shown in fig. 1-2, a heat dissipation module based on a lateral groove facing structure includes a heat dissipation aluminum profile 1, a first heat transfer plate 2 integrally and compositely connected to the heat dissipation aluminum profile 1, a first heat sink 3 and a second heat sink 4 respectively connected to two sides of the first heat transfer plate 2, and a second heat transfer plate 5 attached to the heat dissipation aluminum profile 1 and attached to the first heat transfer plate 2; the cross-sectional shape of heat dissipation aluminium alloy 1 is the triangle-shaped setting, heat transfer groove 11 has been seted up to the bottom surface of heat dissipation aluminium alloy 1, second heat transfer board 5 imbeds to heat transfer inslot 11, first heat transfer board 2 extends to heat transfer groove 11 and laminates with second heat transfer board 5.
The arc surfaces 13 are formed in the two sides of the heat dissipation aluminum profile 1, the heat dissipation grooves 131 are uniformly distributed on the arc surfaces 13, the arc surfaces 13 and the heat dissipation grooves 131 are formed in the two sides of the heat dissipation aluminum profile 1, the structure is cooled through the heat dissipation grooves 131, and the heat dissipation effect of the structure can be further improved.
Heat dissipation aluminium alloy 1 and first heat transfer board 2 are connected through metallurgical bonding, heat dissipation aluminium alloy 1 is located between two parties to first heat transfer board 2, adopts metallurgical bonding to connect heat dissipation aluminium alloy 1 and first heat transfer board 2 and forms an organic whole, and metallurgical bonding means the interface atomic interdiffusion of two metals and the combination that forms.
The first heat transfer plate 2 both sides are equipped with first connecting slot 21 and second connecting slot 22, first fin 3 connect in first connecting slot 21, second fin 4 connects in second connecting slot 22, and the further improvement does, and first fin 3 includes multi-disc first fin 31, first connecting slot 21 is equipped with a plurality ofly, first fin 31 inserts in first connecting slot 21, and second fin 4 includes multi-disc second fin 41, second connecting slot 22 is equipped with a plurality ofly, second fin 41 inserts in second connecting slot 22, and first fin 31 and the cooperation connecting slot of second fin 41 through the multiunit are connected, and structural connection is stable, and the radiating coefficient is high.
Example 1
In this embodiment, the groove surface of the heat transfer groove 11 is provided with the first adhesion layer 111, the second heat transfer plate 5 is provided with the second adhesion layer 51, the first adhesion layer 111 and the second adhesion layer 51 are adhered to each other, the first adhesion layer 111 is a first copper layer formed on the heat transfer groove 11 by cold spraying, the second adhesion layer 51 is a second copper layer formed on the second heat transfer plate 5 by cold spraying, the first copper layer and the second copper layer are adhered to each other, the first adhesion layer 111 and the second adhesion layer 51 are adhered to each other, and the copper layer formed by cold spraying is adopted for adhesion, so that the adhesion density of the two layers is high, and the heat transfer efficiency is high.
Example 2
In this embodiment, a first adhesion layer 111 is disposed on a groove surface of the heat transfer groove 11, a second adhesion layer 51 is disposed on the second heat transfer plate 5, the first adhesion layer 111 and the second adhesion layer 51 are adhered to each other, the first adhesion layer 111 is a heat conductive silica gel, the second adhesion layer 51 is a second copper layer formed on the second heat transfer plate 5 by cold spraying, and the heat conductive silica gel and the second copper layer are adhered to each other; through the laminating of heat conduction silica gel and second copper layer, can realize high-efficient heat transfer efficiency equally.
According to the utility model, the first heat transfer plate 2 is integrally and compositely molded on the heat dissipation aluminum profile 1, the first heat transfer plate 2 is attached to the second heat transfer plate 5, the heat source is transmitted to the first heat transfer plate 2 through the second heat transfer plate 5, the first heat transfer plate 2 transmits the heat source to the first radiating fin 3 and the second radiating fin 4, the first radiating fin 3 and the second radiating fin 4 are arranged on two sides of the first heat transfer plate 2, the heat source is radiated, the heat transfer coefficient is high, the heat dissipation efficiency is high, and the integral composite structure is adopted, so that the integrity is strong, and the heat transfer and radiation coefficient is high. Specifically, a heat dissipation aluminum profile 1, a first heat transfer plate 2 integrally and compositely connected to the heat dissipation aluminum profile 1, a first heat sink 3 and a second heat sink 4 respectively connected to two sides of the first heat transfer plate 2, and a second heat transfer plate 5 attached to the heat dissipation aluminum profile 1 and attached to the first heat transfer plate 2 are provided; the cross-sectional shape of heat dissipation aluminium alloy 1 is the triangle-shaped setting, heat transfer groove 11 has been seted up to the bottom surface of heat dissipation aluminium alloy 1, second heat transfer board 5 imbeds to heat transfer inslot 11, first heat transfer board 2 extends to heat transfer groove 11 and laminates with second heat transfer board 5. Be used for second heat transfer plate 5 fixed and with the laminating of first heat transfer plate 2 through heat transfer groove 11 and transfer heat, make things convenient for structural mounting and heat transfer, adopt the heat dissipation aluminium alloy 1 and the first heat transfer plate 2 of metallurgical combination simultaneously, the structure is reliable, and the heat dissipation is stable.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a heat dissipation module based on side direction slot wainscot structure which characterized in that: the heat dissipation aluminum profile comprises a heat dissipation aluminum profile, a first heat transfer plate integrally and compositely connected to the heat dissipation aluminum profile, a first cooling fin and a second cooling fin which are respectively connected to two sides of the first heat transfer plate, and a second heat transfer plate which is attached to the heat dissipation aluminum profile and is attached to the first heat transfer plate; the cross-sectional shape of heat dissipation aluminium alloy is triangle-shaped and sets up, heat transfer groove has been seted up to the bottom surface of heat dissipation aluminium alloy, the second heat transfer board imbeds to the heat transfer inslot, first heat transfer board extends to heat transfer groove and laminates with the second heat transfer board.
2. The heat dissipation module based on lateral groove overlay structure of claim 1, wherein: mounting holes are formed in the two sides of the heat dissipation aluminum profiles and penetrate through the heat dissipation aluminum profiles.
3. The heat dissipation module based on lateral groove overlay structure of claim 1, wherein: the heat dissipation aluminum profile is characterized in that arc surfaces are formed in two sides of the heat dissipation aluminum profile, and heat dissipation grooves are uniformly distributed on the arc surfaces.
4. The heat dissipation module based on lateral groove overlay structure of claim 1, wherein: the heat dissipation aluminum profile is connected with the first heat transfer plate through metallurgical bonding, and the heat dissipation aluminum profile is arranged in the middle of the first heat transfer plate.
5. The heat dissipation module based on lateral groove overlay structure of claim 1, wherein: and a first connecting clamping groove and a second connecting clamping groove are formed in two sides of the first heat transfer plate, the first radiating fin is connected to the first connecting clamping groove, and the second radiating fin is connected to the second connecting clamping groove.
6. The heat dissipation module based on lateral groove overlay structure of claim 5, wherein: the first heat radiating fin comprises a plurality of first fins, the first connecting clamping grooves are provided with a plurality of first connecting clamping grooves, and the first fins are inserted into the first connecting clamping grooves.
7. The heat dissipation module based on lateral groove facing structure of claim 6, wherein: the second heat radiating fin comprises a plurality of second fins, the second connecting clamping grooves are provided with a plurality of second connecting clamping grooves, and the second fins are inserted into the second connecting clamping grooves.
8. The heat dissipation module based on lateral groove overlay structure of claim 1, wherein: the groove surface of the heat transfer groove is provided with a first adhesive layer, the second heat transfer plate is provided with a second adhesive layer, and the first adhesive layer and the second adhesive layer are mutually adhered.
9. The heat dissipation module based on lateral groove overlay structure of claim 8, wherein: the first laminating layer is a first copper layer formed on the heat transfer groove through cold spraying, the second laminating layer is a second copper layer formed on the second heat transfer plate through cold spraying, and the first copper layer and the second copper layer are mutually laminated.
10. The heat dissipation module based on lateral groove overlay structure of claim 8, wherein: the first adhesive layer is heat-conducting silica gel, the second adhesive layer is formed on a second copper layer of the second heat transfer plate through cold spraying, and the heat-conducting silica gel is mutually attached to the second copper layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122958741.9U CN216775338U (en) | 2021-11-26 | 2021-11-26 | Heat dissipation module based on lateral groove veneering structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122958741.9U CN216775338U (en) | 2021-11-26 | 2021-11-26 | Heat dissipation module based on lateral groove veneering structure |
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| CN216775338U true CN216775338U (en) | 2022-06-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709725A (en) * | 2023-04-19 | 2023-09-05 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
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2021
- 2021-11-26 CN CN202122958741.9U patent/CN216775338U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709725A (en) * | 2023-04-19 | 2023-09-05 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
| CN116709725B (en) * | 2023-04-19 | 2024-02-06 | 东莞市万亨达热传科技有限公司 | High-density composite radiator |
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