CN214852407U - High-efficient radiating electron ceramic element connection structure - Google Patents
High-efficient radiating electron ceramic element connection structure Download PDFInfo
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- CN214852407U CN214852407U CN202120378250.4U CN202120378250U CN214852407U CN 214852407 U CN214852407 U CN 214852407U CN 202120378250 U CN202120378250 U CN 202120378250U CN 214852407 U CN214852407 U CN 214852407U
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- heat dissipation
- ceramic element
- electronic ceramic
- heat conduction
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Abstract
The utility model provides an electronic ceramic element connecting structure with high-efficiency heat dissipation, which comprises a circuit board, an electronic ceramic element arranged on the circuit board, a fixing mechanism for connecting the circuit board and the electronic ceramic element and a heat dissipation mechanism arranged on the electronic ceramic element, wherein the heat dissipation mechanism comprises a heat conduction top plate arranged on the electronic ceramic element, an insulating plate arranged on the circuit board, a heat conduction bottom plate arranged on the insulating plate, a heat dissipation cover arranged on the circuit board, connecting threaded holes arranged at the two ends of the heat conduction bottom plate and the heat conduction top plate, a bolt for connecting the heat conduction bottom plate and the heat conduction top plate, a heat dissipation sheet arranged at the top of the heat dissipation cover and a heat conduction connecting plate for connecting and fixing the heat conduction top plate and the heat dissipation sheet, the electronic ceramic element is attached on the heat conduction bottom plate, the bolt is engaged with the connecting threaded holes, the heat-conducting top plate, the heat-conducting bottom plate and the heat-conducting connecting plate are made of copper materials. The heat dissipation performance of the electronic element can be improved.
Description
Technical Field
The utility model relates to a heat abstractor especially relates to a high-efficient radiating electron ceramic element connection structure.
Background
Because a large amount of electronic components are integrated on the circuit board, a large amount of heat can be released during working, the temperature of the circuit board rises, and the working stability of the electronic components can be influenced due to overhigh temperature of a local area, so that the heat dissipation effect of the circuit board needs to be improved, the working temperature is reduced, the stability of the circuit board is ensured, and the service life is prolonged.
When the existing electronic element radiator is used, most of the electronic element radiators cannot enable all positions of radiating fins on the radiator to uniformly radiate heat, and the radiating effect of the electronic element radiator can be influenced.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned not enough of present heat abstractor existence, the utility model provides a high-efficient radiating electron ceramic element connection structure can improve the effect of electronic component heat dispersion.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high-efficient radiating electron ceramic element connection structure, high-efficient radiating electron ceramic element connection structure includes the circuit board, sets up electron ceramic element on the circuit board, the fixed establishment of connecting circuit board and electron ceramic element and the heat dissipation mechanism of setting on electron ceramic element, heat dissipation mechanism is including setting up the heat conduction roof at electron ceramic element, the insulation board of setting on the circuit board, the heat conduction bottom plate of setting on the insulation board, the heat dissipation cover of setting on the circuit board, the connecting screw hole of setting at heat conduction bottom plate and heat conduction roof both ends, the bolt of connecting heat conduction bottom plate and heat conduction roof, the fin of setting at the heat dissipation cover top and the heat conduction connecting plate of connecting and fixing heat conduction roof and fin, electron ceramic element laminates on heat conduction bottom plate, the bolt with connecting screw hole screw thread interlock, heat conduction roof, The heat-conducting bottom plate and the heat-conducting connecting plate are made of copper materials.
According to the utility model discloses an aspect, fixed establishment is including setting up at the pin of electron ceramic element both sides, setting up limiting plate, the spacing groove of setting on the limiting plate and the circuit connection component of setting at the spacing inslot in the both sides of circuit board, the pin card is gone into the spacing inslot.
According to one aspect of the present invention, the joints of the heat conducting bottom plate, the heat conducting top plate and the electronic ceramic element are filled with an insulating sealing filling layer.
According to the utility model discloses an aspect, the material of insulating close filling layer is silica gel, UV glues, epoxy glue, polyurethane glue, anaerobism glue, acrylic acid glue, organic ceramic coating or polyurea.
According to an aspect of the present invention, the heat sink is provided with heat dissipation grooves parallel to each other.
The utility model discloses the advantage of implementing:
the utility model provides an electronic ceramic element connecting structure with high-efficiency heat dissipation, which comprises a circuit board, an electronic ceramic element arranged on the circuit board, a fixing mechanism for connecting the circuit board and the electronic ceramic element and a heat dissipation mechanism arranged on the electronic ceramic element, wherein the heat dissipation mechanism comprises a heat conduction top plate arranged on the electronic ceramic element, an insulating plate arranged on the circuit board, a heat conduction bottom plate arranged on the insulating plate, a heat dissipation cover arranged on the circuit board, connecting threaded holes arranged at the two ends of the heat conduction bottom plate and the heat conduction top plate, a bolt for connecting the heat conduction bottom plate and the heat conduction top plate, a heat dissipation sheet arranged at the top of the heat dissipation cover and a heat conduction connecting plate for connecting and fixing the heat conduction top plate and the heat dissipation sheet, the electronic ceramic element is attached on the heat conduction bottom plate, the bolt is engaged with the connecting threaded holes, the heat-conducting top plate, the heat-conducting bottom plate and the heat-conducting connecting plate are made of copper materials. The heat dissipation performance of the electronic element can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of a layered structure of a connection structure of an electronic ceramic element with high heat dissipation efficiency according to the present invention;
fig. 2 is a schematic diagram of a front structure of a high-efficiency heat-dissipating electronic ceramic element connection structure for removing a heat-dissipating cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-2, a heat dissipation device of an electronic ceramic element 5, the heat dissipation device of the electronic ceramic element 5 comprises a circuit board 1, an electronic ceramic element 5 disposed on the circuit board 1, a fixing mechanism for connecting the circuit board 1 and the electronic ceramic element 5, and a heat dissipation mechanism disposed on the electronic ceramic element 5, the heat dissipation mechanism comprises a heat conductive top plate 6 disposed on the electronic ceramic element 5, an insulating plate 9 disposed on the circuit board 1, a heat conductive bottom plate 8 disposed on the insulating plate 9, a heat dissipation cover disposed on the circuit board 1, connection screw holes disposed at two ends of the heat conductive bottom plate 8 and the heat conductive top plate 6, a bolt 7 for connecting the heat conductive bottom plate 8 and the heat conductive top plate 6, a heat dissipation plate 11 disposed at the top of the heat dissipation cover, and a heat conductive connection plate 10 for connecting and fixing the heat conductive top plate 6 and the heat dissipation plate 11, the electronic ceramic element 5 is attached to the heat conductive bottom plate 8, the bolt 7 is meshed with the connecting threaded hole in a threaded manner, and the heat-conducting top plate 6, the heat-conducting bottom plate 8 and the heat-conducting connecting plate 10 are made of copper materials.
In this embodiment, the fixing mechanism includes pins 4 disposed on two sides of the electronic ceramic element 5, the limiting plates 2 disposed on two sides of the circuit board 1, the limiting grooves 3 disposed on the limiting plates 2, and the circuit connecting element disposed in the limiting grooves 3, wherein the pins 4 are inserted into the limiting grooves 3.
In the present embodiment, the joints of the heat-conducting bottom plate 8, the heat-conducting top plate 6 and the electronic ceramic element 5 are filled with an insulating sealing filling layer.
In this embodiment, the insulating dense filling layer is made of silica gel, UV glue, epoxy glue, polyurethane glue, anaerobic glue, acrylic glue, organic ceramic paint or polyurea.
In the present embodiment, the heat dissipation fins 11 are provided with heat dissipation grooves 12 parallel to each other.
The utility model discloses the advantage of implementing:
the utility model provides an electronic ceramic element connecting structure with high-efficiency heat dissipation, which comprises a circuit board, an electronic ceramic element arranged on the circuit board, a fixing mechanism for connecting the circuit board and the electronic ceramic element and a heat dissipation mechanism arranged on the electronic ceramic element, wherein the heat dissipation mechanism comprises a heat conduction top plate arranged on the electronic ceramic element, an insulating plate arranged on the circuit board, a heat conduction bottom plate arranged on the insulating plate, a heat dissipation cover arranged on the circuit board, connecting threaded holes arranged at the two ends of the heat conduction bottom plate and the heat conduction top plate, a bolt for connecting the heat conduction bottom plate and the heat conduction top plate, a heat dissipation sheet arranged at the top of the heat dissipation cover and a heat conduction connecting plate for connecting and fixing the heat conduction top plate and the heat dissipation sheet, the electronic ceramic element is attached on the heat conduction bottom plate, the bolt is engaged with the connecting threaded holes, the heat-conducting top plate, the heat-conducting bottom plate and the heat-conducting connecting plate are made of copper materials. The heat dissipation performance of the electronic element can be improved.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are all covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. The utility model provides a high-efficient radiating electron ceramic element connection structure which characterized in that: the electronic ceramic element connecting structure with high-efficiency heat dissipation comprises a circuit board, an electronic ceramic element arranged on the circuit board, a fixing mechanism for connecting the circuit board and the electronic ceramic element, and a heat dissipation mechanism arranged on the electronic ceramic element, the heat dissipation mechanism comprises a heat conduction top plate arranged on the electronic ceramic element, an insulation plate arranged on the circuit board, a heat conduction bottom plate arranged on the insulation plate, a heat dissipation cover arranged on the circuit board, connection threaded holes arranged at two ends of the heat conduction bottom plate and the heat conduction top plate, bolts for connecting the heat conduction bottom plate and the heat conduction top plate, a heat dissipation sheet arranged at the top of the heat dissipation cover and a heat conduction connecting plate for connecting and fixing the heat conduction top plate and the heat dissipation sheet, the electronic ceramic element is attached to the heat-conducting bottom plate, the bolt is meshed with the connecting threaded hole in a threaded mode, and the heat-conducting top plate, the heat-conducting bottom plate and the heat-conducting connecting plate are made of copper materials.
2. The electronic ceramic component connection structure for efficient heat dissipation according to claim 1, wherein: the fixing mechanism comprises pins arranged on two sides of the electronic ceramic element, limiting plates arranged on two sides of the circuit board, limiting grooves arranged on the limiting plates and circuit connecting elements arranged in the limiting grooves, wherein the pins are clamped into the limiting grooves.
3. The electronic ceramic component connection structure for efficient heat dissipation according to claim 2, wherein: and the joints of the heat-conducting bottom plate, the heat-conducting top plate and the electronic ceramic element are filled with insulating sealing filling layers.
4. A connection structure of electronic ceramic components with high heat dissipation efficiency as recited in claim 3, wherein: the insulating dense filling layer is made of silica gel, UV glue, epoxy glue, polyurethane glue, anaerobic glue, acrylic glue, organic ceramic paint or polyurea.
5. The electronic ceramic component connection structure with high heat dissipation efficiency as recited in claim 4, wherein: the radiating fins are provided with radiating grooves which are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120378250.4U CN214852407U (en) | 2021-02-17 | 2021-02-17 | High-efficient radiating electron ceramic element connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120378250.4U CN214852407U (en) | 2021-02-17 | 2021-02-17 | High-efficient radiating electron ceramic element connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214852407U true CN214852407U (en) | 2021-11-23 |
Family
ID=78952328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120378250.4U Active CN214852407U (en) | 2021-02-17 | 2021-02-17 | High-efficient radiating electron ceramic element connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214852407U (en) |
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2021
- 2021-02-17 CN CN202120378250.4U patent/CN214852407U/en active Active
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