CN203289732U - Circuit board having heat radiating function - Google Patents

Circuit board having heat radiating function Download PDF

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Publication number
CN203289732U
CN203289732U CN2012206812358U CN201220681235U CN203289732U CN 203289732 U CN203289732 U CN 203289732U CN 2012206812358 U CN2012206812358 U CN 2012206812358U CN 201220681235 U CN201220681235 U CN 201220681235U CN 203289732 U CN203289732 U CN 203289732U
Authority
CN
China
Prior art keywords
wiring board
circuit board
heat
heat radiating
porous radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012206812358U
Other languages
Chinese (zh)
Inventor
刘军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG BOYA ELECTRIC TECHNOLOGY Co Ltd
Original Assignee
ZHEJIANG BOYA ELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG BOYA ELECTRIC TECHNOLOGY Co Ltd filed Critical ZHEJIANG BOYA ELECTRIC TECHNOLOGY Co Ltd
Priority to CN2012206812358U priority Critical patent/CN203289732U/en
Application granted granted Critical
Publication of CN203289732U publication Critical patent/CN203289732U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a circuit board, especially a circuit board having a heat radiating function, comprising a circuit board and a heat radiating device, wherein the back part of the circuit board is fixedly provided with a porous radiator served as the heat radiating device. According to the structure, the back surface of the circuit board is fixedly provided with the porous radiator, the heat radiating area is increased by utilizing the regular hexagon, a wiring hole is arranged in the center of the circuit board which belongs to an auxiliary heat radiating device, and the porous radiator is made into an internally-connected regular hexagon of the circuit board, thus the structure is more compact, the heat radiating performance is good, and the structure is simple.

Description

A kind of wiring board with heat sinking function
Technical field
The utility model relates to a kind of wiring board, especially a kind of wiring board with heat sinking function.
Background technology
Wiring board is a kind of being widely used, and electron trade is requisite device all.Along with advancing by leaps and bounds of electronic technology, the integrated level of components and parts is more and more higher, heat radiation to some high power devices requires also more and more higher, to add aluminum or copper radiator by the surface at heater element or the back side to reduce the temperature of element with the heat radiation of traditional method, but due to radiator need by machinery fix or chemical adhesive on the surface of element, will cause like this element to be subject to mechanical failure or chemical corrosion; Again because of the encapsulating structure process technology limit of element, most of element is to be encapsulated on the copper support, support is again because of the needs of encapsulated electrode, general support uses support originally as thermally namely charged as electrode again, easily cause defective insulation during fixed heat sink in use on element, certain potential safety hazard is arranged.Radiator generally is merely able to independent use, will cause like this wiring board temperature unequal, easily causes on circuit other component temperatures of radiator periphery too high, accelerates the aging of other elements, thereby affects the bulk life time of circuit.
Summary of the invention
The purpose of this utility model is, provide a kind of can be simple in structure, the wiring board with heat sinking function of actual perfect heat-dissipating.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of wiring board with heat sinking function, comprise wiring board, heat abstractor, and the wiring board back is fixedly installed a porous radiator, as heat abstractor.
This back that is arranged on wiring board arranges porous radiator,, due to the area of dissipation of porous radiator, in the structure of same volume size, is maximum, greatly improves heat dispersion.
Of the present utility modelly further be set to: the louvre on porous radiator is regular hexagon, forms cellular louvre layer.
This arranges makes cellular louvre layer structure with the louvre of porous radiator, is the area that improves to greatest extent heat radiation, and louvre can be other shapes certainly, such as circular, square.
Of the present utility modelly further be set to: porous radiator comprises heat dissipation lateral wall, and heat dissipation lateral wall is regular hexagon, wraps in the side of cellular louvre layer.
This side that is arranged on the louvre layer has surrounded heat dissipation lateral wall, and not only structure is compacter, and has increased area of dissipation, has improved radiating efficiency.
Of the present utility modelly further be set to: wiring board is circular wiring board, connects regular hexagon in porous radiator shape and wiring board, and porous radiator is sticked with one heart at circuit backboard face.
Of the present utility modelly further be set to: also comprise wiring hole, be provided with an opening at the center of wiring board as wiring hole.
Said structure has been fixedly installed porous radiator at the back side of wiring board, utilize regular hexagon to increase area of dissipation, and at the wiring board center, wiring hole is set, also belong to an auxiliary radiating device, many empty radiators make wiring board in connect regular hexagon, structure is compacter, and heat dispersion is fine, and is simple in structure.
Description of drawings
Fig. 1 is the schematic rear view of the present embodiment;
Fig. 2 is the front schematic view of the present embodiment
Embodiment
with reference to figure 1, Fig. 2 as can be known, a kind of wiring board with heat sinking function, comprise wiring board 1, heat abstractor, heat abstractor is porous radiator 2, louvre 21 is regular hexagon, form cellular louvre layer, heat dissipation lateral wall 22 is regular hexagon, wrap in the side of cellular louvre layer, form porous radiator 2, and wiring board 1 is circular wiring board, porous radiator 2 shapes (heat dissipation lateral wall 22 for wiring board 1 in connect regular hexagon) with wiring board 1 in connect regular hexagon, porous radiator 2 is sticked with one heart at wiring board 1 back side, be provided with an opening at the center of wiring board 1 as wiring hole 11.
because the wiring board substrate is FR-1 ~ FR4 or aluminium base or copper base, FR-1 ~ FR4 is after the circuit that the front-side etch of substrate need to be produced well, the back side can be pressed together on porous radiator 2 by the corrosion-free neutral heat-conducting glue of green, can use after curing, aluminium base or copper base is after the good circuit of front-side etch, the back side can use bit copper tin cream or weldering aluminium tin cream to make porous radiator 2 directly be welded on the back side of substrate by the reflow ovens heating cure, both thermocontact areas are larger, porous radiator 2 has the light efficiently radiates heat face increasing of volume simultaneously, the heat that element produces is by the substrate good insulation preformance, heater element produces when work heat outwards distributes rapidly by the hot conducting energy of substrate, and the heat of whole wiring board is even, good heat dissipation effect, thereby the working temperature that makes wiring board is in suitable temperature range, to extend the useful life of circuit.

Claims (6)

1. the wiring board with heat sinking function, comprise wiring board, heat abstractor, it is characterized in that: the wiring board back is fixedly installed a porous radiator, as heat abstractor.
2., according to the wiring board with heat sinking function claimed in claim 1, it is characterized in that: the louvre on porous radiator is regular hexagon, forms cellular louvre layer.
3. according to the wiring board with heat sinking function claimed in claim 2, it is characterized in that: porous radiator comprises heat dissipation lateral wall, and heat dissipation lateral wall is regular hexagon, wraps in the side of cellular louvre layer.
4. according to claim 1 or 2 or 3 described wiring boards with heat sinking function, it is characterized in that: wiring board is circular wiring board, connects regular hexagon in porous radiator shape and wiring board, and porous radiator is sticked with one heart at circuit backboard face.
5., according to claim 1 or 2 or 3 described wiring boards with heat sinking function, it is characterized in that: also comprise wiring hole, be provided with an opening at the center of wiring board as wiring hole.
6., according to the wiring board with heat sinking function claimed in claim 4, it is characterized in that: also comprise wiring hole, be provided with an opening at the center of wiring board as wiring hole.
CN2012206812358U 2012-12-07 2012-12-07 Circuit board having heat radiating function Expired - Fee Related CN203289732U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012206812358U CN203289732U (en) 2012-12-07 2012-12-07 Circuit board having heat radiating function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012206812358U CN203289732U (en) 2012-12-07 2012-12-07 Circuit board having heat radiating function

Publications (1)

Publication Number Publication Date
CN203289732U true CN203289732U (en) 2013-11-13

Family

ID=49546069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012206812358U Expired - Fee Related CN203289732U (en) 2012-12-07 2012-12-07 Circuit board having heat radiating function

Country Status (1)

Country Link
CN (1) CN203289732U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104333981A (en) * 2014-10-16 2015-02-04 惠州智科实业有限公司 Manufacturing method of LED heat radiating substrate and LED module with substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104333981A (en) * 2014-10-16 2015-02-04 惠州智科实业有限公司 Manufacturing method of LED heat radiating substrate and LED module with substrate

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131113

Termination date: 20151207

EXPY Termination of patent right or utility model