CN217957588U - High-heat-conduction relieved tooth type radiator structure - Google Patents

Abstract

The utility model discloses a high heat conduction tine type radiator structure, which is applied to the heat conduction of a power module and comprises a tine-shaped heat dissipation main body, wherein the upper surface of the tine-shaped heat dissipation main body is a flat plate surface, and the lower surface of the tine-shaped heat dissipation main body is a heat dissipation surface; the flat plate surface is provided with a plurality of grooves, corresponding inserts are embedded in the grooves, the upper surfaces of the inserts are matched with the required heat dissipation area of the component to be cooled, the inserts are embedded in the grooves in an interference fit manner, and after press mounting is completed and machining is carried out, the upper surfaces of the inserts are flush with the upper surface of the flat plate surface; the heat conductivity of the insert material is greater than or equal to that of the flat plate layer material. A comparison detection experiment is carried out by adopting the existing heat conduction product with the same specification and the structural product in the application, the heat conduction coefficient of the structure in the application is 3.2-3.4W/m.k, and the conventional heat conduction coefficient of the existing product is 1.2-1.5W/m.k.

Description

High-heat-conduction relieved tooth type radiator structure

Technical Field

The utility model relates to a high heat conduction's forming relieved tooth type radiator structure.

Background

At present, electronic equipment is increasingly applied to industries such as high-speed rails and wind power generation, a power module is a core element in a frequency converter, products gradually develop towards high-frequency high-power and high integration, and the heat dissipation requirement on the power modules such as IGBT is higher and higher; therefore, a reasonable and efficient heat dissipation method must be adopted.

The existing heat dissipation mode is more with the mode that the tooth-shaped heat dissipation structure of forming a shovel matches with the forced air cooling structure, and this kind of structure has the radiating efficiency height, and the security is high, can research and develop the direction many, a great deal of benefits such as low cost.

However, with the control of production cost, the cost of pure copper heat dissipation structures is too high, which is not suitable for the requirement of large-scale industrial production, and with the development of copper-aluminum composite materials, more and more heat dissipation structures adopt aluminum-through composite structures for heat dissipation.

However, the heat conductivity of the existing copper-aluminum composite radiator is too dispersed, the requirement of high heat dissipation of the over-frequency 3 module cannot be effectively met, and the heat conduction and heat dissipation performance of the power module is poor. When the module assembly is in over-frequency operation, heat cannot be timely conducted out, so that the comprehensive service life of the radiator is short, and the radiating effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects of the prior art, and providing a high-heat-conduction relieved tooth type radiator structure.

For solving prior art's problem, the heat conduction structure of built-in insert formula that this patent provided can carry out effectual heat dissipation to the bigger power module of local heat dissipation demand to satisfy the heat dissipation demand of whole device.

A high-heat-conductivity relieved tooth type heat radiator structure is applied to heat conduction of a power module and comprises a relieved tooth type heat radiating main body, wherein the upper surface of the relieved tooth type heat radiating main body is a flat plate surface, and the lower surface of the relieved tooth type heat radiating main body is a heat radiating surface; the flat plate surface is provided with a plurality of grooves, corresponding inserts are embedded in the grooves, the upper surfaces of the inserts are matched with the required heat dissipation area of the component to be cooled, the inserts are embedded in the grooves in an interference fit manner, and after press mounting is completed and machining is carried out, the upper surfaces of the inserts are flush with the upper surface of the flat plate surface; the heat conductivity of the insert material is greater than or equal to that of the flat plate layer material.

The device adopts the scheme that the heat conductivity is improved by the insert, and the specific insert structure can be designed adaptively according to actual requirements and can be designed into a rectangle, a circle or a triangle.

In order to prolong the service life of the whole device and fill gaps during assembly so as to obtain the maximum heat conduction capability, the connection mode of the insert and the tooth-shaped heat dissipation main body is an interference mode, the inner surface of the groove is connected with the insert through high heat conduction epoxy resin glue, the thickness of the high heat conduction epoxy resin glue is 0.1-0.5mm, and the height of the insert is higher than the depth of the groove.

In order to facilitate the installation of the power module and save the installation cost, the middle part of the groove is provided with a connecting structure for installing the power module to be radiated.

Specifically, the connecting structure is a connecting hole, a buckle or a welding point.

In order to facilitate processing and save processing cost, the depth of the groove is 2-5mm, and the bottom plate of the groove is coated with epoxy resin glue.

In addition, a new measure is provided in the aspect of the service life of the copper-aluminum radiator, and in order to prevent the materials from generating electron flow direction after splicing and causing oxidation, the bottom of the splicing part is provided with the high-heat-conductivity epoxy resin adhesive which is a conductive material with better heat conduction effect at present, so that the heat transfer of the radiator is not influenced, and the service life of the radiator is greatly prolonged.

Has the advantages that:

the device connects the power module which needs to radiate more efficiently on the insert through the form of embedding the insert with better heat conduction performance, and radiates heat better through the high heat conduction capability of the insert, thereby realizing the efficient heat radiation of the whole device.

Compared with the traditional integral heat conduction structure, the device forms a new heat conduction layer in a high-precision interference fit mode, and adopts a pouring sealant mode to fill the gap, so that the effective enhancement of the heat conduction capability can be met.

Compare with current mode of connecting between through glue, though this application has introduced new connection face, insert in this application and heat conduction main part, insert and treat that the heat conductivity of being connected between the heat dissipation power module all has very big reinforcing, and the heat conductivity of inserting itself also compares with current heat dissipation main part, has had great promotion. In practical application, the insert can be made of pure copper materials, so that the heat conduction efficiency is improved to the maximum extent.

Drawings

FIG. 1 is an exploded view of an assembled structure;

FIG. 2 is a detailed dimensional parameter representation of an interference fit when assembled;

FIG. 3 is a report of a specific test of thermal conductivity according to one embodiment;

1. a relieved tooth-shaped heat dissipation main body 2, an insert.

Detailed Description

In order to deepen the understanding of the present invention, the present invention will be further described in detail with reference to the following embodiments and the attached drawings, the embodiments are only used for explaining the present invention, and do not constitute the limitation to the protection scope of the present invention.

Example (b):

as shown in fig. 1 and 2. A copper-aluminum composite shovel blade radiator comprises the following specific processing steps:

the hole is opened on the shovel-tooth-shaped heat dissipation main body 1, the thickness of the hole is reserved to be 2-5mm, then the conducting layer is coated on the position of the contact surface of the shovel-tooth-shaped heat dissipation main body and the insert 2, and the thickness of the conducting layer is 0.1-0.5mm.

And then the relieving-shaped heat dissipation main body 1 and the insert 2 are pressed in an interference mode, the processing center is used for processing the relieving-shaped heat dissipation main body smoothly, the overall scheme adopts the high-efficiency heat conductivity of copper to quickly transfer heat, and the tail end of the relieving-shaped heat dissipation main body 1 is additionally provided with an air cooling device.

The fan in the air cooling device takes away heat in time, so that the heat dissipation efficiency is further improved, the cost is greatly reduced compared with that of pure copper, in addition, a new measure is provided in the service life of the copper-aluminum radiator, in order to prevent the materials from generating electron flow direction after splicing, a conductive layer with better heat conduction effect at present is used at the bottom of the splicing part, the heat transfer is not influenced, and the service life of the radiator is greatly prolonged.

Compared with the structure product in the application, the heat conduction product with the prior equal specification is adopted to carry out a comparative detection experiment, the heat conduction coefficient of the structure in the application is 3.2-3.4W/m.k, the conventional heat conduction coefficient of the prior product is 1.2-1.5W/m.k, the heat conduction capability of the application is superior to that of the prior product, and the cost is still improved within an acceptable range.

The above description is only for the preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A high-heat-conduction tine type radiator structure is characterized by being applied to heat conduction of a power module and comprising a tine type heat dissipation main body, wherein the upper surface of the tine type heat dissipation main body is a flat plate surface, and the lower surface of the tine type heat dissipation main body is a heat dissipation surface; the flat plate surface is provided with a plurality of grooves, corresponding inserts are embedded in the grooves, the upper surfaces of the inserts are matched with the required heat dissipation area of the component to be cooled, the inserts are embedded in the grooves in an interference fit manner, and after press mounting is completed and machining is carried out, the upper surfaces of the inserts are flush with the upper surface of the flat plate surface; the heat conductivity of the insert material is greater than or equal to that of the flat plate layer material.

2. The relieved tooth type heat sink structure of high thermal conductivity of claim 1 wherein the cross section of the insert is rectangular, circular or triangular.

3. The relieved tooth type heat radiator structure with high heat conductivity of claim 1, wherein the connection mode of the insert and the relieved tooth type heat radiating main body is an interference mode, the inner surface of the groove is connected with the insert through high heat conductivity epoxy resin glue, the thickness of the high heat conductivity epoxy resin glue is 0.1-0.5mm, and the height of the insert is higher than the depth of the groove.

4. The structure of claim 1, wherein the middle of the groove is provided with a connecting structure for installing a power module to be cooled.

5. The structure of claim 4, wherein the connecting structure is a connecting hole, a snap or a welding point.

6. The structure of claim 1, wherein the depth of the groove is 2-5mm, and the bottom plate of the groove is coated with epoxy glue.

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