CN210053730U - High-efficient radiator of embedded heat conduction structure - Google Patents
High-efficient radiator of embedded heat conduction structure Download PDFInfo
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- CN210053730U CN210053730U CN201920239884.4U CN201920239884U CN210053730U CN 210053730 U CN210053730 U CN 210053730U CN 201920239884 U CN201920239884 U CN 201920239884U CN 210053730 U CN210053730 U CN 210053730U
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- heat
- heat dissipation
- heat conduction
- main body
- fins
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of radiators, in particular to a high-efficiency radiator with an embedded heat conduction structure, which comprises an aluminum heat dissipation main body, and a heat conduction main body embedded in the aluminum heat dissipation main body, wherein one surface of the aluminum heat dissipation main body is provided with a plurality of heat dissipation fins, and the other surface of the aluminum heat dissipation main body is provided with an embedding groove; the utility model discloses in the high-efficient radiating aluminium matter heat dissipation main part of copper main part embedding with high-speed heat conduction, realize quick heat conduction and heat dissipation and use, compare the radiator radiating effect of traditional pure copper or pure aluminium and improve at double, the radiating efficiency is high, and is effectual.
Description
Technical Field
The utility model relates to a radiator technical field especially relates to a high-efficient radiator of embedded heat conduction structure.
Background
The electronic product can produce a large amount of heat when working, if not in time distribute away these heats, light leads to the dead halt, heavy probably burns out the electronic product, and the radiator is used for the radiating for the electronic product. The heat sink plays a decisive role in stable operation of the electronic product.
The heat sink can be divided into air-cooling, heat pipe and water-cooling according to its heat dissipation method, wherein the air-cooling heat sink reduces the temperature of the electronic product by heat exchange between the heat sink and the surrounding air, and generally includes a heat dissipation substrate and heat dissipation fins mounted on the heat dissipation substrate. The radiator in the prior art generally adopts pure aluminium or pure copper material machine-shaping structure, because pure aluminium material heat conductivility is not as good as pure copper material, and pure copper material overall cost is higher, leads to whole inconvenient use, and the radiator that ordinary copper aluminium combines generally can't reach best heat conduction and heat dissipation cooperation in the in-service use to need to improve above the structure to the radiator that copper aluminium combines, in order to strengthen the whole radiating effect of radiator.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a with the high-efficient radiating high-efficient radiator of aluminium matter heat dissipation main part of copper main part embedding of high-speed heat conduction in, realize quick heat conduction and heat dissipation and use, compare the radiator radiating effect of traditional pure copper or pure aluminium and improve at double, the radiating efficiency is high, the effectual high-efficient radiator of embedded heat conduction structure.
The utility model adopts the technical proposal that: the utility model provides an embedded heat conduction structure's high-efficient radiator, includes aluminium matter heat dissipation main part, inlays the heat conduction main part of locating aluminium matter heat dissipation main part, aluminium matter heat dissipation main part one side is provided with a plurality of heat radiation fins, another side setting and inlays the groove, the heat conduction main part sets up the rigging board, with rigging board integrated into one piece's heat conduction fins, the rigging board is inlayed and is located and inlays the groove, heat radiation fins has seted up the slot, heat conduction fins inlays and locates in the slot.
The further improvement of the scheme is that the aluminum heat dissipation main body is formed in a die-casting or wire-drawing mode.
The scheme is further improved in that the inlaid groove and the slot are coated with heat-conducting glue and attached to the heat-conducting main body.
The scheme is further improved in that the heat conduction main body is a copper heat conduction main body.
The scheme is further improved in that a plurality of radiating fins are provided with radiating grooves for separation, and a plurality of through grooves are formed in each group of radiating fins corresponding to the radiating grooves.
The scheme is further improved in that the heat-conducting fins are provided with a plurality of heat-conducting holes.
The utility model has the advantages that:
the aluminum heat dissipation main body is combined with the heat conduction main body, particularly, heat is collected and guided out through the heat conduction main body and guided out to the aluminum heat dissipation main body to achieve heat dissipation, rapid heat conduction and heat dissipation are achieved, compared with a traditional heat radiator, the heat dissipation effect is improved in a multiplied mode, and the heat dissipation effect is excellent; the aluminum heat dissipation main body is provided with the plurality of heat dissipation fins, the heat dissipation effect of the heat sink can be further improved through the action of the heat dissipation fins, and a heat dissipation fan can be installed in practical use to realize high-speed air exhaust heat dissipation and realize quick heat dissipation; the aluminum radiator is also provided with an embedding groove, the heat conducting main body is provided with an attaching plate which is embedded in the embedding groove, so that a quick heat conducting effect is realized, specifically, the attaching plate acts as a heat radiating conductor to lead heat out to the aluminum heat radiating main body, heat can be quickly and newly radiated through the aluminum heat radiating main body, and the heat radiating efficiency is high; the heat radiating fins are provided with the slots, the heat conducting main body is provided with the heat conducting fins, and the heat conducting fins are inserted into the slots, so that the heat radiating fins are completely attached, the heat conducting and heat radiating can be realized quickly in actual use, and the heat radiating effect is excellent.
The utility model discloses in, in the high-efficient radiating aluminium matter heat dissipation main part of copper main part embedding that will high-speed heat conduction, realize quick heat conduction and heat dissipation and use, compare the radiator radiating effect of traditional pure copper or pure aluminium and improve at double, the radiating efficiency is high, and is effectual.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Description of reference numerals: the heat sink includes an aluminum heat sink body 100, heat sink fins 110, a slot 120, a slot 130, a through groove 140, a heat conductive body 200, an attachment plate 210, and heat conductive fins 220.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a high-efficiency heat sink with an embedded heat conducting structure includes an aluminum heat dissipating body 100 and a heat conducting body 200 embedded in the aluminum heat dissipating body 100, wherein one surface of the aluminum heat dissipating body 100 is provided with a plurality of heat dissipating fins 110, and the other surface is provided with an embedding groove 120, the heat conducting body 200 is provided with an attaching plate 210 and heat conducting fins 220 integrally formed with the attaching plate 210, the attaching plate 210 is embedded in the embedding groove 120, the heat dissipating fins 110 are provided with slots 130, and the heat conducting fins 220 are embedded in the slots 130.
The aluminum heat dissipation main body 100 is formed by die casting or wire drawing, and is low in manufacturing cost, good in forming effect, convenient to assemble, laminate and use, convenient to use, practical and reliable.
The heat conduction main part 200 is copper heat conduction main part 200, adopts copper heat conduction main part 200, and the heat conduction effect is splendid, can realize heat transfer fast to guarantee that aluminium matter heat dissipation main part 100 can dispel the heat fast, the radiating effect is good, and is practical reliable.
The plurality of heat dissipation fins 110 are provided with heat dissipation grooves for separation, each group of heat dissipation fins 110 is provided with a plurality of through grooves 140 corresponding to the heat dissipation grooves, the through grooves 140 are arranged for ensuring quick heat dissipation, and the heat dissipation effect is obviously improved.
The heat conduction fins are provided with a plurality of heat conduction holes, the heat conduction holes are arranged to ensure quick heat conduction, the reserved space realizes heat dissipation, and the heat dissipation effect can be greatly improved.
The aluminum heat dissipation main body 100 is combined with the heat conduction main body 200, particularly, heat is collected and guided out through the heat conduction main body 200 and guided to the aluminum heat dissipation main body 100 to achieve heat dissipation, rapid heat conduction and heat dissipation are achieved, compared with a traditional heat radiator, the heat dissipation effect is improved in a multiple mode, and the heat dissipation effect is excellent; the aluminum heat dissipation body 100 is provided with the plurality of heat dissipation fins 110, the heat dissipation effect of the heat sink can be further improved through the action of the heat dissipation fins 110, and a heat dissipation fan can be installed in practical use to realize high-speed air exhaust heat dissipation and realize quick heat dissipation; the aluminum heat radiator is also provided with an embedding groove 120, the heat conduction main body 200 is provided with an attaching plate 210 which is embedded in the embedding groove 120, so that a quick heat conduction effect is realized, specifically, the attaching plate 210 acts as a heat radiation conductor to guide heat to the aluminum heat radiation main body 100, heat can be quickly and newly radiated through the aluminum heat radiation main body 100, and the heat radiation efficiency is high; the heat dissipation fins 110 are provided with the slots 130, the heat conduction body 200 is provided with the heat conduction fins 220, and the heat conduction fins 220 are inserted into the slots 130, so that the heat dissipation effect is excellent, the heat conduction and the heat dissipation can be realized quickly in practical use, and the heat dissipation effect is excellent.
The utility model discloses in, in the high-efficient radiating aluminium matter heat dissipation main part 100 of copper main part embedding that will high-speed heat conduction, realize quick heat conduction and heat dissipation and use, compare the radiator radiating effect of traditional pure copper or pure aluminium and improve at double, the radiating efficiency is high, and is effectual.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The utility model provides an embedded heat conduction structure's high-efficient radiator which characterized in that: including aluminium matter heat dissipation main part, inlay the heat conduction main part of locating aluminium matter heat dissipation main part, aluminium matter heat dissipation main part one side is provided with a plurality of heat radiation fins, the another side sets up inlays the groove, the heat conduction main part sets up the attaching plate, with attaching plate integrated into one piece's heat conduction fin, the attaching plate is inlayed and is located and inlay the groove, heat radiation fins has seted up the slot, heat conduction fins inlays and locates in the slot.
2. The efficient heat sink with embedded heat conducting structure as claimed in claim 1, wherein: the aluminum heat dissipation main body is formed in a die casting or wire drawing mode.
3. The efficient heat sink with embedded heat conducting structure as claimed in claim 2, wherein: the inlaid groove and the slot are coated with heat-conducting glue to be attached to the heat-conducting main body.
4. A high efficiency heat sink with embedded heat conducting structure as claimed in claim 3, wherein: the heat conduction main body is a copper heat conduction main body.
5. The efficient heat sink with embedded heat conducting structure as claimed in claim 4, wherein: the plurality of radiating fins are provided with radiating grooves for separation, and each group of radiating fins is provided with a plurality of through grooves corresponding to the radiating grooves.
6. The efficient heat sink with embedded heat conducting structure as claimed in claim 5, wherein: the heat conduction fins are provided with a plurality of heat conduction holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239884.4U CN210053730U (en) | 2019-02-26 | 2019-02-26 | High-efficient radiator of embedded heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239884.4U CN210053730U (en) | 2019-02-26 | 2019-02-26 | High-efficient radiator of embedded heat conduction structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210053730U true CN210053730U (en) | 2020-02-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920239884.4U Expired - Fee Related CN210053730U (en) | 2019-02-26 | 2019-02-26 | High-efficient radiator of embedded heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210053730U (en) |
-
2019
- 2019-02-26 CN CN201920239884.4U patent/CN210053730U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200211 |