CN217085706U

CN217085706U - Passive CPU radiator

Info

Publication number: CN217085706U
Application number: CN202220967477.7U
Authority: CN
Inventors: 张文涛; 郑章立
Original assignee: Dongguan Yizhao Electronic Co ltd
Current assignee: Dongguan Yizhao Electronic Co ltd
Priority date: 2022-04-25
Filing date: 2022-04-25
Publication date: 2022-07-29
Anticipated expiration: 2032-04-25

Abstract

The utility model belongs to the technical field of passive form radiator, especially, a passive form CPU radiator, it is not good to current ordinary CPU radiator radiating temperature effect, and the high temperature then influences the problem of CPU normal work, now proposes following scheme, and it includes the bottom plate, a plurality of first radiating fin of the even fixedly connected with of outer wall of bottom plate, a plurality of second radiating fin of the even fixedly connected with of outer wall of bottom plate, the outer wall of bottom plate is equipped with heat dissipation mechanism, the utility model discloses a mounting hole contacts bottom plate and CPU's outer wall with fastening screw on, heat accessible copper claps flat heat pipe, better assembles on first radiating fin and the second radiating fin, leads first radiating fin and second radiating fin with the heat through the bottom plate, carries out the thermal treatment.

Description

Passive CPU radiator

Technical Field

The utility model relates to a passive form radiator technical field especially relates to a passive form CPU radiator.

Background

The passive radiator does not contain a fan, takes away heat by air flow, thereby realizing zero noise, improving thermal cooling to compensate the condition of lack of the fan, aiming at reducing system noise and eliminating the possibility of catastrophic overheating of a CPU (Central processing Unit) caused by fan failure, and being widely applied to the fields of communication electronic equipment, solar energy equipment, military electronic equipment and the like.

In the prior art, a common CPU radiator has a poor heat dissipation temperature effect, and a CPU works normally when the temperature is too high, so a passive CPU radiator is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that the heat dissipation temperature effect of the common CPU radiator is not good, and the over-high temperature influences the defect of the normal work of the CPU, and provides a passive CPU radiator.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a passive form CPU radiator, includes the bottom plate, the even fixedly connected with a plurality of first radiating fin of outer wall of bottom plate, the even fixedly connected with a plurality of second radiating fin of outer wall of bottom plate, the outer wall of bottom plate is equipped with heat dissipation mechanism.

Preferably, the heat dissipation mechanism comprises three flat heat pipes, the outer walls of the first heat dissipation fins and the outer walls of the second heat dissipation fins are fixedly connected with two connecting pieces, three mounting grooves are formed in the outer wall of the base plate, and the inner walls of the three mounting grooves are fixedly connected with the outer walls of the three flat heat pipes.

Preferably, four mounting holes are formed in the outer wall of the bottom plate, and the positions of the first radiating fins and the second radiating fins are stable by arranging the connecting pieces.

Preferably, the inner walls of the four mounting holes are in threaded connection with fastening screws.

Preferably, the bottom plate, the first radiating fins and the second radiating fins are all made of aluminum materials, and the bottom plate, the first radiating fins and the second radiating fins are made of aluminum materials, so that the LED lamp is more portable.

Preferably, the flat heat pipe is made of copper.

Preferably, the outer walls of the flat beating heat pipes are fixedly connected with the outer walls of the first radiating fins and the outer walls of the second radiating fins.

Compared with the prior art, the utility model has the advantages of:

according to the scheme, the bottom plate is in contact with the outer wall of the CPU through the mounting hole and the fastening screw, the heat can be made of copper to form the flat heat pipe, the heat can be better gathered on the first radiating fins and the second radiating fins, and the heat is conducted to the first radiating fins and the second radiating fins through the bottom plate to be subjected to heat dissipation treatment.

Drawings

Fig. 1 is a schematic perspective view of a passive CPU heat sink according to the present invention;

fig. 2 is a schematic structural view of a bottom plate, a mounting hole, a second heat dissipating fin and a connecting sheet of the passive CPU heat sink according to the present invention;

fig. 3 is a schematic structural view of the bottom plate, the mounting hole, the mounting groove and the flat heat pipe of the passive CPU heat sink provided by the present invention.

In the figure: 1. a base plate; 2. mounting holes; 3. a first heat radiation fin; 4. a second heat radiation fin; 5. connecting sheets; 6. mounting grooves; 7. and flattening the heat pipe.

Detailed Description

Shown by figures 1-3, relate to a passive form CPU radiator, including bottom plate 1, four mounting holes 2 have been seted up to the outer wall of bottom plate 1, the even fixedly connected with a plurality of first radiating fin 3 of outer wall of bottom plate 1, the even fixedly connected with a plurality of second radiating fin 4 of outer wall of bottom plate 1, the material of bottom plate 1, first radiating fin 3 and second radiating fin 4 is aluminium system material, and the outer wall of bottom plate 1 is equipped with heat dissipation mechanism.

As shown in fig. 1-3, the heat dissipation mechanism comprises three flat-beating heat pipes 7, the flat-beating heat pipes 7 are made of copper, the copper flat-beating heat pipes 7 better collect a part of heat generated by the operation of the CPU to the first heat dissipation fins 3 and the second heat dissipation fins 4, the outer walls of the first heat dissipation fins 3 and the second heat dissipation fins 4 are fixedly connected with two connecting pieces 5, the connecting pieces 5 fix the positions between the first heat dissipation fins 3 and the second heat dissipation fins 4 to prevent deformation, the inner walls of the four mounting holes 2 are in threaded connection with fastening screws, install the bottom plate to CPU through mounting hole 2 and fastening screw on, three mounting groove 6 has been seted up to the outer wall of bottom plate 1, and the inner wall of three mounting groove 6 and the three outer wall fixed connection who claps flat heat pipe 7, the outer wall of clapping flat heat pipe 7 all with first radiating fin 3, second radiating fin 4's outer wall fixed connection.

The working principle is as follows: install bottom plate 1 on CPU through four mounting holes 2 and fastening screw, make bottom plate 1 and CPU contact, copper three beat flat heat pipe 7 with the produced some heats of CPU operation, better assemble on first radiating fin 3 and the second radiating fin 4, copper three beat flat heat pipe 7 can carry out the radiating treatment to 120W's CPU simultaneously, another part heat is by bottom plate 1 heat conduction to first radiating fin 3 and the second radiating fin 4 on, the circulating air of machine incasement can take away the heat.

The above descriptions are only preferred embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to, replaced or changed.

Claims

1. The utility model provides a passive form CPU radiator, includes bottom plate (1), its characterized in that, the even fixedly connected with a plurality of first radiating fin (3) of outer wall of bottom plate (1), the even fixedly connected with a plurality of second radiating fin (4) of outer wall of bottom plate (1), the outer wall of bottom plate (1) is equipped with heat dissipation mechanism.

2. The passive CPU radiator according to claim 1, wherein the heat dissipation mechanism comprises three flat beating heat pipes (7), the outer walls of the first heat dissipation fins (3) and the second heat dissipation fins (4) are fixedly connected with two connecting pieces (5), the outer wall of the bottom plate (1) is provided with three mounting grooves (6), and the inner walls of the three mounting grooves (6) are fixedly connected with the outer walls of the three flat beating heat pipes (7).

3. The passive CPU heat sink according to claim 1, wherein the outer wall of the bottom plate (1) is provided with four mounting holes (2).

4. A passive CPU heat sink according to claim 3, characterized in that the inner walls of the four mounting holes (2) are each threadedly connected with a fastening screw.

5. The passive CPU heat sink according to claim 1, wherein the base plate (1), the first heat dissipating fins (3) and the second heat dissipating fins (4) are made of aluminum.

6. The passive CPU heat sink according to claim 2, wherein the flattened heat pipe (7) is made of copper.

7. The passive CPU heat sink according to claim 2, wherein the outer walls of the flat-beat heat pipe (7) are fixedly connected to the outer walls of the first heat dissipating fin (3) and the second heat dissipating fin (4).