CN212544160U

CN212544160U - Circuit board with good heat dissipation function

Info

Publication number: CN212544160U
Application number: CN202021569058.5U
Authority: CN
Inventors: 邓秋英; 颜妙慧
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-02
Filing date: 2020-08-02
Publication date: 2021-02-12
Anticipated expiration: 2030-08-02

Abstract

The utility model belongs to the technical field of the heating panel technique and specifically relates to a circuit board that heat dissipation function is good, including the circuit board body, the bottom fixed mounting of circuit board body has a plurality of erection columns, the inside fixed mounting of circuit board body has a plurality of heat pipes that run through, the heat pipe distributes along the horizontal direction equidistance, a plurality of heat dissipation through-holes have been seted up on the circuit board body, the thermal-arrest groove has still been seted up to the one end of circuit board body, the bottom fixed mounting in thermal-arrest groove has netted section of thick bamboo, the bottom fixed mounting of netted section of thick bamboo has the mounting panel, the bottom fixed mounting of mounting panel has electric motor, electric motor. The electric motor can enable the heat dissipation impeller to rotate at a high speed so as to form an air vortex, on one hand, the circuit board can be cooled, on the other hand, hot air flow on the surface of the circuit board can be sucked into the heat collection groove and cooled, and the mode can quickly transfer heat on the circuit board and can quickly cool.

Description

Circuit board with good heat dissipation function

Technical Field

The utility model relates to a circuit board technical field especially relates to a circuit board that heat dissipation function is good.

Background

The circuit board is a circuit integrated board, and its surface is covered with the circuit, and meanwhile, through line connection component, whole circuit board can produce the heat at the during operation, along with the functional structure of circuit board is more and more complicated, and its heat dissipation capacity is also more and more big, sets up the reliable heat dissipation of unable realization of the self heat dissipation mode of through-hole on traditional circuit board, unable quick heat dissipation, if the heat too much can lead to electronic component's damage, influences the circuit normal work of circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that the quick heat dissipation can not be realized in the prior art, and the circuit board that the heat dissipation function is good that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the design one kind dispels the heat functional circuit board, including the circuit board body, the bottom fixed mounting of circuit board body has a plurality of erection columns, the inside fixed mounting of circuit board body has a plurality of heat pipes that run through, the heat pipe distributes along the horizontal direction equidistance, a plurality of heat dissipation through-holes have been seted up on the circuit board body, the thermal-arrest groove has still been seted up to the one end of circuit board body, the bottom fixed mounting in thermal-arrest groove has netted section of thick bamboo, the bottom fixed mounting of netted section of thick bamboo has the mounting panel, the bottom fixed mounting of mounting panel has electric motor, electric motor's output shaft fixed mounting has the heat dissipation impeller, the heat dissipation impeller.

Preferably, the bottom of the circuit board body is fixedly provided with a heat-conducting plate, and the heat-conducting plate is of a closed rectangular structure.

Preferably, a plurality of radiating fins are fixedly arranged on the inner side of the heat conducting plate and are uniformly distributed on the inner side of the heat conducting plate.

Preferably, the circuit board body comprises a heat collecting layer, an aluminum substrate and a PCB, the heat collecting layer is fixedly mounted on the top of the PCB, and the aluminum substrate is fixedly mounted on the bottom of the PCB.

Preferably, the heat collecting layer is a heat conducting silicone layer, and the thickness of the heat collecting layer is 0.5-1 mm.

The utility model provides a pair of circuit board that heat dissipation function is good, beneficial effect lies in: part of heat of the circuit board can be guided to two ends of the heat conduction pipe through the heat conduction pipe and then air cooling is carried out; the electric motor can enable the heat dissipation impeller to rotate at a high speed so as to form an air vortex, on one hand, the circuit board can be cooled, on the other hand, hot air flow on the surface of the circuit board can be sucked into the heat collection groove and cooled, and the mode can quickly transfer heat on the circuit board and can quickly cool.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board with a good heat dissipation function according to the present invention;

fig. 2 is a partial cross-sectional view of a circuit board with good heat dissipation function provided by the present invention;

fig. 3 is a schematic structural diagram of a circuit board with a good heat dissipation function according to the present invention;

fig. 4 is a schematic structural diagram of a circuit board body of a circuit board with a good heat dissipation function according to the present invention.

In the figure: the solar heat collector comprises a circuit board body 1, a mounting column 2, a heat conduction pipe 3, a heat dissipation through hole 4, a heat collection groove 5, a mesh cylinder 6, a mounting plate 8, an electric motor 9, a heat dissipation impeller 10, a heat conduction plate 11, a heat dissipation fin 12, a heat collection layer 13, an aluminum substrate 14 and a PCB 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example 1:

referring to fig. 1-2, a circuit board with good heat dissipation function, including circuit board body 1, the bottom fixed mounting of circuit board body 1 has a plurality of erection columns 2, the inside fixed mounting of circuit board body 1 has a plurality of heat pipes 3 that run through, heat pipe 3 distributes along horizontal direction equidistance, a plurality of heat dissipation through-holes 4 have been seted up on circuit board body 1, heat collection slot 5 has still been seted up to circuit board body 1's one end, the bottom fixed mounting in heat collection slot 5 has netted section of thick bamboo 6, the bottom fixed mounting of netted section of thick bamboo 6 has mounting panel 8, the bottom fixed mounting of mounting panel 8 has electric motor 9, electric motor 9's output shaft fixed mounting has heat dissipation impeller 10, heat dissipation impeller 10 is. A part of the heat of the circuit board can be guided to both ends of the heat conductive pipe 3 by the heat conductive pipe 3 and then air-cooled; the electric motor 9 can rotate the heat-dissipating impeller 10 at a high speed to form an air vortex, so that the circuit board can be heat-dissipated, and the hot air on the surface of the circuit board can be sucked into the heat-collecting groove 5 and cooled.

Example 2:

referring to fig. 1 to 4, as another preferred embodiment of the present invention, the difference from embodiment 1 is that a heat conducting plate 11 is fixedly installed at the bottom of a circuit board body 1, the heat conducting plate 11 is a closed rectangular structure, a plurality of heat dissipation fins 12 are fixedly installed at the inner side of the heat conducting plate 11, and the heat dissipation fins 12 are uniformly distributed at the inner side of the heat conducting plate 11; the heat conducting plate 11 can conduct part of the heat of the circuit board and dissipate the heat through the heat sink 12.

The circuit board body 1 comprises a heat collecting layer 13, an aluminum substrate 14 and a PCB 15, wherein the heat collecting layer 13 is fixedly installed at the top of the PCB 15, the aluminum substrate 14 is fixedly installed at the bottom of the PCB 15, the heat collecting layer 13 is a heat conducting silicone grease layer, and the thickness of the heat collecting layer 13 is 0.5-1 mm. The heat collecting layer 13 can quickly collect heat of the circuit board, which is advantageous for heat dissipation.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A circuit board with good heat dissipation function comprises a circuit board body (1) and is characterized in that, a plurality of mounting columns (2) are fixedly arranged at the bottom of the circuit board body (1), a plurality of heat conducting pipes (3) which penetrate through the circuit board body (1) are fixedly arranged in the circuit board body, the heat conducting pipes (3) are distributed at equal intervals along the horizontal direction, a plurality of heat radiating through holes (4) are arranged on the circuit board body (1), one end of the circuit board body (1) is also provided with a heat collecting groove (5), the bottom end of the heat collecting groove (5) is fixedly provided with a reticular cylinder (6), the bottom of the reticular cylinder (6) is fixedly provided with an installation plate (8), the bottom of the installation plate (8) is fixedly provided with an electric motor (9), an output shaft of the electric motor (9) is fixedly provided with a heat dissipation impeller (10), and the heat dissipation impeller (10) is positioned inside the reticular cylinder (6).

2. The circuit board with good heat dissipation function according to claim 1, wherein a heat conducting plate (11) is fixedly mounted at the bottom of the circuit board body (1), and the heat conducting plate (11) has a closed rectangular structure.

3. The circuit board with good heat dissipation function according to claim 2, wherein a plurality of heat dissipation fins (12) are fixedly installed on the inner side of the heat conduction plate (11), and the heat dissipation fins (12) are uniformly distributed on the inner side of the heat conduction plate (11).

4. The circuit board with good heat dissipation function according to claim 1, wherein the circuit board body (1) comprises a heat collecting layer (13), an aluminum substrate (14) and a PCB circuit board (15), the heat collecting layer (13) is fixedly mounted on the top of the PCB circuit board (15), and the aluminum substrate (14) is fixedly mounted on the bottom of the PCB circuit board (15).

5. The circuit board with good heat dissipation function as claimed in claim 4, wherein the heat collecting layer (13) is a heat conductive silicone layer, and the thickness of the heat collecting layer (13) is 0.5-1 mm.