CN219612351U - Ceramic circuit board with mounting structure - Google Patents
Ceramic circuit board with mounting structure Download PDFInfo
- Publication number
- CN219612351U CN219612351U CN202320529173.7U CN202320529173U CN219612351U CN 219612351 U CN219612351 U CN 219612351U CN 202320529173 U CN202320529173 U CN 202320529173U CN 219612351 U CN219612351 U CN 219612351U
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- circuit board
- plate
- ceramic
- ceramic circuit
- fixed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a ceramic circuit board with a mounting structure, which comprises a ceramic plate, a plurality of groups of T-shaped radiating fins and a connecting plate, wherein the top of the ceramic plate is fixedly provided with radiating silicone grease, the top of the radiating silicone grease is fixedly provided with a radiating plate, the connecting plate is fixedly arranged at the top of the T-shaped radiating fins, the T-shaped radiating fins are provided with a radiating mechanism, the radiating mechanism comprises a radiating component and a mounting component, the radiating component comprises two groups of exhaust fans and three groups of air inlet fans, and the exhaust fans and the air inlet fans are both positioned between the two groups of T-shaped radiating fins; according to the utility model, through the designed heat dissipation mechanism, when the ceramic circuit board is installed in equipment with a small space in use, the heat dissipation effect of the ceramic circuit board can not be influenced, so that the ceramic circuit board can dissipate heat normally when the ceramic circuit board dissipates heat through air convection, the heat dissipation stability of the ceramic circuit board when the ceramic circuit board is used is improved, and the use effect of the ceramic circuit board is improved.
Description
Technical Field
The utility model belongs to the technical field of ceramic circuit boards, and particularly relates to a ceramic circuit board with a mounting structure.
Background
The ceramic circuit board is a heat-conducting organic ceramic circuit board which is prepared by utilizing heat-conducting ceramic powder and an organic adhesive under the condition of being lower than 250 ℃, has good high-frequency performance and electrical performance, has the performance which is not possessed by organic substrates with high heat conductivity, excellent chemical stability and thermal stability and the like, and Chinese patent application number 202021757006.0 discloses a novel ceramic circuit board.
When the prior ceramic circuit board is used, the ceramic circuit board is generally installed in equipment, when the ceramic circuit board is installed in the equipment with small internal space, the connecting plate is installed in the top of the T-shaped radiating fin when radiating through air convection, the air convection can be blocked by the connecting plate when radiating, at this time, the connecting plate can block a part of hot air to rise, and the cold air can also be blocked by the connecting plate when descending, so that the ceramic circuit board is affected to radiate, and the problem of normal use of the ceramic circuit board is affected.
Disclosure of Invention
The utility model aims to provide a ceramic circuit board with a mounting structure, which solves the problems that when the prior ceramic circuit board is used, air convection is blocked by a connecting plate when the prior ceramic circuit board is used for radiating through air convection, at the moment, the connecting plate can block part of hot air to rise when the air convection is performed, and the connecting plate can block cold air to influence the radiating of the ceramic circuit board when the cold air descends.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a take mounting structure's ceramic circuit board, includes ceramic plate, multiunit T type fin and connecting plate, the fixed heat dissipation silicone grease that is provided with in top of ceramic plate, the fixed heating panel that is provided with in top of heat dissipation silicone grease, the connecting plate is fixed the top of T type fin, be provided with cooling mechanism on the T type fin, cooling mechanism includes cooling module and installation component, cooling module includes two sets of exhaust fans and three air inlet machine, the exhaust fan with the air inlet machine all is located two sets of between the T type fin, the multiunit through-hole has been seted up to the inside of connecting plate, the fixed heat conduction post that is provided with in inside of connecting plate, the fixed fin that is provided with in top of heat conduction post.
Preferably, the mounting assembly comprises a mounting plate and a side plate, and a through groove is formed in the mounting plate.
Preferably, a stud is fixedly arranged at the top of the side plate, and the top of the stud penetrates through the through groove.
Preferably, nuts are arranged outside the studs, the side plates are fixed on the exhaust fan and the air inlet fan, and the mounting plate is fixed on the T-shaped radiating fins.
Preferably, the outside of ceramic plate is provided with buffer gear, buffer gear includes concave plate and buffering cotton, the buffering cotton is fixed the inner wall of concave plate, the ceramic plate is fixed on the buffering cotton.
Preferably, the bottom of the ceramic plate is fixedly provided with a copper aluminum foil, and the bottom of the copper aluminum foil is fixedly provided with a protective layer.
Preferably, the front surface of the ceramic plate is provided with a sealing plate, and the T-shaped radiating fin is positioned inside the ceramic plate.
Preferably, a plurality of groups of T-shaped grooves are formed in the ceramic plate, and the T-shaped radiating fins are located in the T-shaped grooves.
Compared with the prior art, the utility model has the beneficial effects that:
(1) According to the utility model, through the designed heat dissipation mechanism, when the ceramic circuit board is installed in equipment with a small space in use, the heat dissipation effect of the ceramic circuit board can not be influenced, so that the ceramic circuit board can dissipate heat normally when the ceramic circuit board dissipates heat through air convection, the heat dissipation stability of the ceramic circuit board when the ceramic circuit board is used is improved, and the use effect of the ceramic circuit board is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of a connecting plate according to the present utility model;
FIG. 3 is a schematic cross-sectional view of a mounting plate of the present utility model;
FIG. 4 is a schematic top view of an exhaust fan according to the present utility model;
in the figure: 1. a connecting plate; 2. a concave plate; 3. buffering cotton; 4. a protective layer; 5. copper aluminum foil; 6. a ceramic plate; 7. an exhaust fan; 9. a heat radiation fin; 10. t-shaped radiating fins; 11. a heat conducting column; 12. a sealing plate; 13. a side plate; 14. a mounting plate; 15. a through hole; 16. a through groove; 17. a nut; 18. a stud; 19. and a wind inlet machine.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the ceramic circuit board with the mounting structure comprises a ceramic plate 6, a plurality of groups of T-shaped radiating fins 10 and a connecting plate 1, wherein heat in the ceramic plate 6 can be led out through the T-shaped radiating fins 10 when the ceramic circuit board is used, the top of the ceramic plate 6 is fixedly provided with radiating silicone grease, the top of the radiating silicone grease is fixedly provided with a radiating plate, the radiating plate has a radiating effect when the ceramic circuit board is used, the connecting plate 1 is fixedly arranged at the top of the T-shaped radiating fins 10, the T-shaped radiating fins 10 are provided with a radiating mechanism, the radiating mechanism comprises a radiating assembly and a mounting assembly, the radiating assembly comprises two groups of exhaust fans 7 and three groups of air inlet fans 19, the exhaust fans 7 and the air inlet fans 19 can exhaust heat when the ceramic circuit board is used, the exhaust fans 7 and the air inlet fans 19 are all positioned between the two groups of T-shaped radiating fins 10, the inside of the connecting plate 1 is provided with a plurality of groups of through holes 15, and the through holes 15 play the effects of air inlet or air outlet when the ceramic circuit board is used, the heat conduction column 11 is fixedly arranged in the connecting plate 1, the heat dissipation fins 9 are fixedly arranged at the top of the heat conduction column 11, the heat dissipation fins 9 have heat dissipation effect when in use, the mounting assembly comprises a mounting plate 14 and a side plate 13, a through groove 16 is formed in the mounting plate 14, a stud 18 is fixedly arranged at the top of the side plate 13, the top of the stud 18 penetrates through the through groove 16, a nut 17 is arranged outside the stud 18, the side plate 13 can be fixed after the nut 17 is screwed when in use, the exhaust fan 7 or the air inlet machine 19 is further installed, the side plate 13 is fixed on the exhaust fan 7 and the air inlet machine 19, the mounting plate 14 is fixed on the T-shaped heat dissipation fin 10, the heat dissipation effect of the ceramic circuit board can not be influenced when the ceramic circuit board is installed in the interior of equipment with a narrow space through the designed heat dissipation mechanism, let the ceramic circuit board dispel the heat normally when dispelling the heat through the air convection, promoted the radiating stability of ceramic circuit board when using, improved the result of use of ceramic circuit board.
In this embodiment, preferably, the outside of ceramic plate 6 is provided with buffer gear, and buffer gear includes recess plate 2 and buffering cotton 3, and buffering cotton 3 is fixed at the inner wall of recess plate 2, and ceramic plate 6 is fixed on buffering cotton 3, through the buffer gear of design, can cushion inside ceramic circuit board when equipment appears falling in the time of being convenient for use with ceramic circuit board installation in the inside of equipment, reduces the influence that ceramic circuit board dredged and falls and produce vibration, is convenient for use.
In this embodiment, preferably, the bottom of the ceramic plate 6 is fixedly provided with a copper aluminum foil 5, and the bottom of the copper aluminum foil 5 is fixedly provided with a protective layer 4.
In this embodiment, preferably, the front surface of the ceramic plate 6 is provided with a sealing plate 12, and the t-shaped heat sink 10 is located inside the ceramic plate 6.
In this embodiment, preferably, the ceramic plate 6 is provided with a plurality of sets of T-shaped grooves inside, and the T-shaped cooling fins 10 are fixed inside the T-shaped grooves when in use, and the T-shaped cooling fins 10 are located inside the T-shaped grooves.
The working principle and the using flow of the utility model are as follows:
when the heat-dissipating device is used, the tops of the studs 18 on the side plates 13 on the exhaust fan 7 and the air inlet machine 19 penetrate through the through grooves 16, then the nuts 17 are screwed on the studs 18, the air inlet machine 19 and the exhaust fan 7 can be fixed at the moment, when the heat-dissipating device is used, after the ceramic plate 6 generates heat, part of the heat is discharged from the through holes 15 through the exhaust fan 7, at the moment, the heat on the T-shaped radiating fins 10 is transferred to the radiating fins 9 through the heat-conducting columns 11, then the radiating fins 9 discharge the heat into surrounding air, the radiating effect is further improved, at the moment, the air inlet machine 19 enters external cold air from the through holes 15 to the radiating plate to radiate the heat, and the radiating effect of air convection on the ceramic plate 6 is increased;
when the exhaust fan 7 or the air inlet fan 19 is required to be disassembled, the nut 17 is unscrewed, then the exhaust fan 7 or the air inlet fan 19 is moved downwards, the top of the stud 18 is driven to be separated from the through groove 16, and then the screw can be disassembled.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a take mounting structure's ceramic circuit board, includes ceramic plate (6), multiunit T type fin (10) and connecting plate (1), the fixed heat dissipation silicone grease that is provided with in top of ceramic plate (6), the fixed heating panel that is provided with in top of heat dissipation silicone grease, connecting plate (1) are fixed the top of T type fin (10), its characterized in that: be provided with cooling mechanism on T type fin (10), cooling mechanism includes radiating component and installation component, radiating component includes two sets of exhaust fans (7) and three air inlet machine (19), exhaust fan (7) with air inlet machine (19) all are located two sets of between T type fin (10), multiunit through-hole (15) have been seted up to the inside of connecting plate (1), the inside of connecting plate (1) is fixed to be provided with heat conduction post (11), the fixed fin (9) that are provided with in top of heat conduction post (11).
2. The ceramic circuit board with a mounting structure according to claim 1, wherein: the mounting assembly comprises a mounting plate (14) and side plates (13), and a through groove (16) is formed in the mounting plate (14).
3. The ceramic circuit board with a mounting structure according to claim 2, wherein: the top of the side plate (13) is fixedly provided with a stud (18), and the top of the stud (18) penetrates through the through groove (16).
4. A ceramic circuit board with a mounting structure according to claim 3, wherein: the screw bolt (18) is externally provided with a nut (17), the side plate (13) is fixed on the exhaust fan (7) and the air inlet machine (19), and the mounting plate (14) is fixed on the T-shaped radiating fin (10).
5. The ceramic circuit board with a mounting structure according to claim 1, wherein: the outside of ceramic plate (6) is provided with buffer gear, buffer gear includes recess board (2) and buffering cotton (3), buffering cotton (3) are fixed the inner wall of recess board (2), ceramic plate (6) are fixed on buffering cotton (3).
6. The ceramic circuit board with a mounting structure according to claim 5, wherein: the bottom of ceramic plate (6) is fixed and is provided with copper aluminium foil (5), the bottom of copper aluminium foil (5) is fixed and is provided with protective layer (4).
7. The ceramic circuit board with a mounting structure according to claim 6, wherein: the front face of the ceramic plate (6) is provided with a sealing plate (12), and the T-shaped radiating fins (10) are positioned inside the ceramic plate (6).
8. The ceramic circuit board with a mounting structure according to claim 7, wherein: a plurality of groups of T-shaped grooves are formed in the ceramic plate (6), and the T-shaped radiating fins (10) are located in the T-shaped grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320529173.7U CN219612351U (en) | 2023-03-17 | 2023-03-17 | Ceramic circuit board with mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320529173.7U CN219612351U (en) | 2023-03-17 | 2023-03-17 | Ceramic circuit board with mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219612351U true CN219612351U (en) | 2023-08-29 |
Family
ID=87749551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320529173.7U Active CN219612351U (en) | 2023-03-17 | 2023-03-17 | Ceramic circuit board with mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219612351U (en) |
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2023
- 2023-03-17 CN CN202320529173.7U patent/CN219612351U/en active Active
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