CN217821458U

CN217821458U - Heat dissipation structure cabinet for display control integrated numerical control system equipment

Info

Publication number: CN217821458U
Application number: CN202221564913.2U
Authority: CN
Inventors: 陈锦铭; 黄伟榕
Original assignee: Higerman Cnc Technology Shenzhen Co ltd
Current assignee: Higerman Cnc Technology Shenzhen Co ltd
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2022-11-15
Anticipated expiration: 2032-06-21

Abstract

The utility model provides a heat dissipation structure case for display control integrated numerical control system equipment, which comprises a machine body, wherein a side wall surface of the machine body is provided with a limiting groove, one side of the bottom surface of an inner cavity of the limiting groove is connected with a circuit board through four groups of internal thread columns, the top surface of the circuit board is provided with a CPU chip, the top surface of the CPU chip is provided with a heat conducting piece, and the heat conducting piece is used for heat conduction on the surface of the CPU chip; the heat-conducting part top surface is provided with the radiating piece, the radiating piece is used for fast radiating the heat of heat-conducting part top surface, the heat-conducting part includes heat conduction aluminum plate, first recess has been seted up to heat conduction aluminum plate bottom surface middle part one side, first recess inner chamber intermediate position is provided with the clamp plate, this equipment is when using owing to adopt the mode of no fan, the heat dissipation is accomplished by quick-witted case itself, transmit the quick-witted case with the heat from CPU through the heat-conducting part, and distribute away the heat along its surface and radiating piece, guarantee the stability of industrial computer work.

Description

Heat dissipation structure cabinet for display control integrated numerical control system equipment

Technical Field

The utility model relates to a numerical control system equipment field, in particular to display control integration heat radiation structure machine case for numerical control system equipment.

Background

At present, the constitution of a numerical control system is basically similar to a microcomputer, and the numerical control system comprises a processor, a hard disk, a memory, a system bus and the like which are specially formulated aiming at the application of the numerical control machine, so that the numerical control system and the microcomputer have great differences in the aspects of processing capacity, stability, reliability, safety, expandability, manageability and the like. The factors influencing the numerical control system are many, the heat dissipation problem is one of the main factors, the numerical control system is a high-performance computer and is also a machine with extremely high power consumption, and the heat dissipated by the numerical control system is very large.

The heat of the numerical control system is mainly because the high-speed operation of CPU, produce a large amount of heat energy, the ordinary high-power consumption computer, generally adopt the heat-dissipating mode of the fan, distribute a large amount of heat to the outside of chassis through the fan, this heat-dissipating mode is simple and high-efficient, but there is a fatal disadvantage, the commercial computer generally operates for a long time, there is thick dust oil smoke of a layer on fan and mainboard, and then reduced the apparatus heat-dissipating effect, so need to provide and reveal the integrated numerical control system apparatus of control and use the receiving machine of the organization to solve the above-mentioned technical problem.

SUMMERY OF THE UTILITY MODEL

The utility model provides a show that control integration heat radiation structure machine case for numerical control system equipment and use receipts material machine of this mechanism to there is the thick dust oil smoke of one deck on fan among the solution prior art and the mainboard, and then has reduced the problem of equipment radiating effect.

In order to solve the technical problem, the utility model adopts the technical scheme that: the heat dissipation structure case for the display control integrated numerical control system equipment comprises a case body, wherein a limiting groove is formed in the surface of one side wall of the case body, a circuit board is connected to one side of the bottom surface of an inner cavity of the limiting groove through four groups of internal threaded columns, a CPU chip is arranged on the surface of the top of the circuit board, and a heat conducting piece is arranged on the surface of the top of the CPU chip and used for conducting heat on the surface of the CPU chip;

the heat-conducting part is characterized in that a heat-radiating piece is arranged on the top surface of the heat-conducting part and used for quickly radiating heat on the top surface of the heat-conducting part.

Preferably, the heat conducting part comprises a heat conducting aluminum plate, a first groove is formed in the middle of the bottom surface of the heat conducting aluminum plate, a pressing plate is arranged at the middle position of an inner cavity of the first groove, limiting blocks are formed in the four corners of the inner cavity of the first groove in an integrated mode, first positioning holes are formed in one side of the surface of each limiting block, second positioning holes are formed in the top surface of the heat conducting aluminum plate and located above the four groups of first positioning holes, and the second positioning holes are communicated with the first positioning holes.

Preferably, the inner diameter of the first positioning hole is smaller than the outer diameter of the second positioning hole.

Preferably, the heat conducting member further comprises a second groove, and the second groove is arranged on the surface of the bottom of the heat conducting aluminum plate and is positioned on one side of the first groove.

Preferably, first mounting holes are formed in four corners of the top surface of the heat-conducting aluminum plate, and the first mounting holes penetrate through the upper surface and the lower surface of the heat-conducting aluminum plate.

Preferably, the multiunit standing groove has been seted up to heat conduction aluminum plate top surface to every group standing groove inner chamber all is provided with the semiconductor refrigeration piece, semiconductor refrigeration piece cold end face simultaneously with standing groove inner chamber bottom surface laminating.

Preferably, the outer diameter of the semiconductor refrigeration piece is the same as the inner diameter of the placing groove, and an embedded structure is formed.

Preferably, the heat dissipation member is an aluminum fin, and the surface area of the bottom of the aluminum fin is the same as the surface area of the top of the heat conduction aluminum plate.

Preferably, the four corners of the top surface of the aluminum type fin are provided with second mounting holes, and the second mounting holes are detachably connected with the first mounting holes through second screws.

Preferably, the bottom surface of the aluminum type fin is provided with a heat-conducting silica gel sheet, and the bottom surface of the heat-conducting silica gel sheet is attached to the top surface of the heat-conducting aluminum plate

The utility model discloses compare in prior art, its beneficial effect is:

1. the utility model provides a display control integration heat radiation structure machine case for numerical control system equipment, through the heat-conducting piece, can be nimble install on the internal thread post, can laminate with CPU chip top surface again, and heat conduction aluminum plate in the heat-conducting piece, can provide the space of seting up to first recess, thereby can make first recess cover the circuit board and make clamp plate laminating CPU chip top surface, and then can make things convenient for the heat transfer that the CPU chip produced to clamp plate and heat conduction aluminum plate on, reach the heat dissipation effect to the CPU chip.

2. The utility model provides a display control integration heat radiation structure machine case for numerical control system equipment through the cold junction face in the semiconductor refrigeration piece, can accelerate heat conduction aluminum plate's cooling, has improved heat conduction aluminum plate to CPU chip radiating effect, and semiconductor refrigeration piece hot junction can carry out the heat in the effect of radiating piece again simultaneously, has guaranteed semiconductor refrigeration piece safe in utilization.

3. The utility model provides a display control integration heat radiation structure machine case for numerical control system equipment, because the radiating piece is aluminium type fin, and aluminium type fin bottom surface area is the same with heat conduction aluminum plate top surface area, thereby can make the heat large tracts of land efficient on radiating piece surface distribute away, and then guarantee the stability of industrial computer work, through heat conduction silica gel piece, can with the aluminium type fin direct contact of large tracts of land, and then on directly conveying the heat that the CPU chip gived off to the aluminium type fin of large tracts of land, the CPU chip radiating effect has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments are briefly described below, and the drawings in the following description are only corresponding drawings of some embodiments of the present invention.

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic diagram of the explosion structure of the present invention;

FIG. 4 is a schematic view of the structure of the heat conducting member of the present invention;

fig. 5 is a schematic side view of the heat conducting member of the present invention.

Reference numbers in the figures: 1. a body; 2. a limiting groove; 3. a circuit board; 4. a CPU chip; 5. an internally threaded post; 6. a heat conductive member; 601. a heat conducting aluminum plate; 602. a first groove; 603. pressing a plate; 604. a limiting block; 605. a first positioning hole; 606. a second positioning hole; 607. a second groove; 608. a first mounting hole; 609. a placement groove; 610. a semiconductor refrigeration sheet; 7. a heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.

In the drawings, elements having similar structures are denoted by the same reference numerals.

The terms "first," "second," and the like in the terms of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, nor should they be construed as limiting in any way.

Example 1

Referring to fig. 1, 2 and 3, the heat dissipation structure chassis for display control integrated numerical control system device of the present invention includes a body 1, a side wall surface of the body 1 is provided with a limiting groove 2, and one side of the bottom surface of the inner cavity of the limiting groove 2 is connected with a circuit board 3 through four groups of internal screw posts 5, and the top surface of the circuit board 3 is provided with a CPU chip 4, the top surface of the CPU chip 4 is provided with a heat conducting member 6, and the heat conducting member 6 is used for heat conduction of the surface of the CPU chip 4; the top surface of the heat conducting member 6 is provided with a heat dissipating member 7, and the heat dissipating member 7 is used for rapidly dissipating heat from the top surface of the heat conducting member 6.

In use passes through the organism 1, can be fixed four internal thread post of group 5 through spacing groove 2, thereby can be 3 spacing to the circuit board, and then can play the installation to CPU chip 4, then through heat-conducting piece 6, can be nimble install on internal thread post 5, again can with the laminating of CPU chip 4 top surface, thereby can make the heat that 6 conduction CPU chips of heat-conducting piece 4 produced, and then can reach the effect of cooling to CPU chip 4, simultaneously through radiating piece 7, can give off in the air to the heat on 6 surfaces of heat-conducting piece again, and then can strengthen CPU chip 4's radiating effect, so that can guarantee the stability of industrial computer work.

Referring to fig. 4 and 5, the heat conducting member 6 includes a heat conducting aluminum plate 601, a first groove 602 is formed in one side of the middle of the bottom surface of the heat conducting aluminum plate 601, a pressing plate 603 is disposed in the middle of the inner cavity of the first groove 602, four corners of the inner cavity of the first groove 602 are integrally formed with a limiting block 604, a first positioning hole 605 is formed in one side of the surface of the limiting block 604, a second positioning hole 606 is formed in the top surface of the heat conducting aluminum plate 601 and located above the four groups of first positioning holes 605, and the second positioning hole 606 is connected to the first positioning hole 605 in a conducting manner.

In use through heat conduction aluminum plate 601 in the heat-conducting piece 6, can offer the space to first recess 602, thereby can make first recess 602 cover circuit board 3 and make clamp plate 603 laminate 4 top surfaces of CPU chip, and then can make things convenient for the heat transfer that CPU chip 4 produced to on clamp plate 603 and the heat conduction aluminum plate 601, reach the heat dissipation effect to CPU chip 4, through inserting the screw to second locating hole 606, then run through first locating hole 605, thereby can make the screw bottom install on interior screw post 5, and then can play the effect to the installation of heat conduction aluminum plate 601, heat conduction aluminum plate 601 stability in use has been improved.

Referring to fig. 5, the inner diameter of the first positioning hole 605 is smaller than the outer diameter of the second positioning hole 606.

In use, the screw top can be conveniently and completely penetrated into the heat-conducting aluminum plate 601 through the second positioning hole 606, so that the top surface of the heat-conducting aluminum plate 601 is smooth, the heat-radiating piece 7 can be conveniently installed, and heat can be conveniently transferred from the top surface of the heat-conducting aluminum plate 601.

Referring to fig. 4, the heat conducting member 6 further includes a second groove 607, and the second groove 607 is disposed on the bottom surface of the heat conducting aluminum plate 601 and located at one side of the first groove 602.

In use, the second groove 607 facilitates the heat-conducting aluminum plate 601 to cover other components in the limiting groove 2, thereby facilitating the installation of the limiting groove 2.

Referring to fig. 4, four corners of the top surface of the heat-conducting aluminum plate 601 are respectively provided with a first mounting hole 608, and the first mounting holes 608 penetrate through the upper and lower surfaces of the heat-conducting aluminum plate 601.

In use, the heat-conducting aluminum plate 601 can be conveniently installed and fixed on the heat sink 7 through the first installation hole 608.

Referring to fig. 2, the heat sink 7 is an aluminum fin, and the surface area of the bottom of the aluminum fin is the same as the surface area of the top of the heat conductive aluminum plate 601.

In use, the heat dissipation piece 7 is an aluminum type fin, and the surface area of the bottom of the aluminum type fin is the same as that of the top of the heat conduction aluminum plate 601, so that heat on the surface of the heat dissipation piece 7 can be efficiently dissipated in a large area, and the working stability of the industrial personal computer is further ensured.

Referring to fig. 2, the four corners of the top surface of the aluminum fin are respectively provided with a second mounting hole, and the second mounting holes are detachably connected to the first mounting holes 608 through second screws.

In use, the second mounting hole on the aluminum fin can be connected with the first mounting hole 608 through the second screw, so that the aluminum fin can be mounted and dismounted, and the convenience of later maintenance or replacement of the aluminum fin is improved.

Referring to fig. 2, the bottom surface of the aluminum fin is provided with a heat conductive silicone sheet, and the bottom surface of the heat conductive silicone sheet is attached to the top surface of the heat conductive aluminum plate 601.

When in use, the heat-conducting silica gel sheet can be in direct contact with the large-area aluminum type fins, so that the heat emitted by the CPU chip 4 is directly transmitted to the large-area aluminum type fins, and the heat dissipation effect of the CPU chip 4 is improved.

Example 2

Referring to fig. 4 and 5, the heat conducting member 6 includes a heat conducting aluminum plate 601, a first groove 602 is formed in one side of the middle of the bottom surface of the heat conducting aluminum plate 601, a pressing plate 603 is disposed in the middle of the inner cavity of the first groove 602, four corners of the inner cavity of the first groove 602 are integrally formed with a limiting block 604, a first positioning hole 605 is formed in one side of the surface of the limiting block 604, a second positioning hole 606 is formed in the top surface of the heat conducting aluminum plate 601 and located above the four sets of first positioning holes 605, and the second positioning hole 606 is connected to the first positioning hole 605 in a conduction manner.

Referring to FIG. 5, the inner diameter of the first positioning hole 605 is smaller than the outer diameter of the second positioning hole 606. In use, the screw top can be conveniently and completely penetrated into the heat-conducting aluminum plate 601 through the second positioning hole 606, so that the top surface of the heat-conducting aluminum plate 601 is smooth, the heat-radiating piece 7 can be conveniently installed, and heat can be conveniently transferred from the top surface of the heat-conducting aluminum plate 601.

Referring to fig. 4, the heat conducting member 6 further includes a second groove 607, and the second groove 607 is disposed on the bottom surface of the heat conducting aluminum plate 601 and located at one side of the first groove 602. In use, the second groove 607 facilitates the heat-conducting aluminum plate 601 to cover other components in the limiting groove 2, thereby facilitating the installation of the limiting groove 2.

Referring to fig. 4, four corners of the top surface of the heat conductive aluminum plate 601 are respectively provided with a first mounting hole 608, and the first mounting holes 608 penetrate through the upper and lower surfaces of the heat conductive aluminum plate 601. In use, the heat-conducting aluminum plate 601 can be conveniently installed and fixed on the heat sink 7 through the first installation hole 608.

Referring to fig. 5, three sets of placing grooves 609 are formed in the top surface of the heat conducting aluminum plate 601, a semiconductor refrigeration sheet 610 is disposed in an inner cavity of each set of placing grooves 609, and a cold end surface of the semiconductor refrigeration sheet 610 is attached to the bottom surface of the inner cavity of the placing grooves 609.

In use passes through heat conduction aluminum plate 601, can provide to three standing grooves 609 of group and set up the space, then make three standing grooves 609 of group, semiconductor refrigeration piece 610 of three groups of installation that again can be nimble, then through the cold terminal surface in the semiconductor refrigeration piece 610, heat conduction aluminum plate 601's cooling can accelerate, heat conduction aluminum plate 601 has been improved to CPU chip 4 radiating effect, semiconductor refrigeration piece 610 hot junction simultaneously, can carry out the heat in the effect of radiating element 7 again, semiconductor refrigeration piece 610 has been guaranteed safe in utilization.

Referring to fig. 5, the semiconductor cooling plate 610 has an outer diameter equal to the inner diameter of the placing slot 609, and is embedded. In use, the outer diameter of the semiconductor refrigeration piece 610 is the same as the inner diameter of the placing groove 609, so that the mounting stability of the semiconductor refrigeration piece 610 can be improved.

Referring to fig. 2, the heat sink 7 is an aluminum fin, and the surface area of the bottom of the aluminum fin is the same as the surface area of the top of the aluminum heat conducting plate 601. In use, the heat dissipation piece 7 is an aluminum type fin, and the surface area of the bottom of the aluminum type fin is the same as that of the top of the heat conduction aluminum plate 601, so that heat on the surface of the heat dissipation piece 7 can be efficiently dissipated in a large area, and the working stability of the industrial personal computer is further ensured.

Referring to fig. 2, the four corners of the top surface of the aluminum fin are respectively provided with a second mounting hole, and the second mounting holes are detachably connected to the first mounting holes 608 through second screws. In use, the second mounting hole on the aluminum fin can be connected with the first mounting hole 608 through the second screw, so that the aluminum fin can be mounted and dismounted, and the convenience of later maintenance or replacement of the aluminum fin is improved.

Referring to fig. 2, the bottom surface of the aluminum fin is provided with a heat conductive silicone sheet, and the bottom surface of the heat conductive silicone sheet is attached to the top surface of the heat conductive aluminum plate 601. When in use, the heat-conducting silica gel sheet can be in direct contact with the large-area aluminum type fins, so that the heat emitted by the CPU chip 4 is directly transmitted to the large-area aluminum type fins, and the heat dissipation effect of the CPU chip 4 is improved.

The utility model discloses a theory of operation: through the machine body 1, can be fixed to four internal screw post 5 through spacing groove 2, thereby can be spacing to circuit board 3, and then can play the installation to CPU chip 4, then through heat-conducting piece 6, can be nimble install on internal screw post 5, can laminate with CPU chip 4 top surface again, through heat conduction aluminum plate 601 among heat-conducting piece 6, can offer the space to first recess 602, thereby can make first recess 602 cover circuit board 3 and make clamp plate 603 laminate CPU chip 4 top surface, and then can make things convenient for the heat transfer that CPU chip 4 produced to clamp plate 603 and heat conduction aluminum plate 601, reach the radiating effect to CPU chip 4, through inserting the screw to second locating hole 606 in, then run through first locating hole 605, thereby can make the screw bottom install on internal screw post 5, and then can play the effect of installing to heat conduction aluminum plate 601, heat conduction aluminum plate 601 stability in use has been improved, through second locating hole 606, can make things convenient for the screw top completely to heat conduction aluminum plate 601 to go deep into heat conduction aluminum plate 601, and can make heat conduction aluminum plate 601 top surface smooth, and then can make things convenient for the installation of heat conduction aluminum plate 601 to pass through the mounting groove 2, and then make things convenient for heat-conducting plate 601 to pass through heat-conducting plate 601 in heat-conducting plate mounting heat-conducting plate can make things convenient for heat-conducting plate 601 to pass through the mounting groove 608, it can be convenient for the heat-conducting plate 601 to pass through the heat-conducting plate 601 mounting in the mounting groove to pass through the heat-conducting plate mounting groove 2, it can make things convenient for heat-conducting plate 601 mounting in heat-conducting plate 601 mounting groove 608.

Through the heat-conducting aluminum plate 601, a space can be provided for the three groups of placing grooves 609, then the three groups of placing grooves 609 are flexibly provided with the three groups of semiconductor refrigerating pieces 610, then through the cold end surfaces in the semiconductor refrigerating pieces 610, the cooling of the heat-conducting aluminum plate 601 can be accelerated, the heat dissipation effect of the heat-conducting aluminum plate 601 on the CPU chip 4 is improved, meanwhile, the hot end of the semiconductor refrigerating pieces 610 can perform heat under the action of the heat dissipation piece 7, and the use safety of the semiconductor refrigerating pieces 610 is guaranteed; because radiating piece 7 is aluminium type fin, and aluminium type fin bottom surface area is the same with heat conduction aluminum plate 601 top surface area, thereby can make the heat large tracts of land efficient on radiating piece 7 surface distribute away, and then guarantee the stability of industrial computer work, through the second mounting hole on the aluminium type fin, can link to each other with first mounting hole 608 through the second screw, thereby can play installation and the dismantlement to the aluminium type fin, the convenience of aluminium type fin later maintenance or change has been improved, through heat conduction silica gel piece, can with the aluminium type fin direct contact of large tracts of land, and then on the aluminium type fin of directly conveying the heat that CPU chip 4 gived off to large tracts of land, CPU chip 4 radiating effect has been improved.

Furthermore, the utility model provides an still be provided with the bump on the aluminium type fin, the bump increases the aluminium type fin surface area of fin to can promote the heat radiating area of radiating piece 7 by the efficient, promote the radiating efficiency of quick-witted case.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention is to be determined by the appended claims.

Claims

1. The heat dissipation structure cabinet for the display control integrated numerical control system equipment is characterized by comprising a cabinet body (1), wherein a limiting groove (2) is formed in the surface of one side wall of the cabinet body (1), one side of the bottom surface of an inner cavity of the limiting groove (2) is connected with a circuit board (3) through four groups of internal thread columns (5), a CPU chip (4) is arranged on the top surface of the circuit board (3), a heat conducting piece (6) is arranged on the top surface of the CPU chip (4), and the heat conducting piece (6) is used for heat conduction on the surface of the CPU chip (4);

the heat-conducting component (6) is characterized in that a heat dissipation part (7) is arranged on the top surface of the heat-conducting component (6), and the heat dissipation part (7) is used for rapidly dissipating heat of the top surface of the heat-conducting component (6).

2. The heat dissipation structure cabinet for the display control integrated numerical control system device according to claim 1, wherein the heat conducting member (6) comprises a heat conducting aluminum plate (601), a first groove (602) is formed in one side of the middle of the bottom surface of the heat conducting aluminum plate (601), a pressing plate (603) is arranged in the middle of the inner cavity of the first groove (602), limiting blocks (604) are integrally formed in four corners of the inner cavity of the first groove (602), first positioning holes (605) are formed in one side of the surface of each limiting block (604), second positioning holes (606) are formed in the top surface of the heat conducting aluminum plate (601) and located above the four groups of first positioning holes (605), and the second positioning holes (606) are connected with the first positioning holes (605) in a conduction manner.

3. The chassis with the heat dissipation structure for the display-control integrated numerical control system device according to claim 2, wherein an inner diameter of the first positioning hole (605) is smaller than an outer diameter of the second positioning hole (606).

4. The heat dissipation structure cabinet for the display control integrated numerical control system device according to claim 2, wherein the heat conducting member (6) further comprises a second groove (607), and the second groove (607) is disposed on the bottom surface of the heat conducting aluminum plate (601) and located on one side of the first groove (602).

5. The chassis with the heat dissipation structure for the display control integrated numerical control system device according to claim 4, wherein four corners of the top surface of the heat-conducting aluminum plate (601) are provided with first mounting holes (608), and the first mounting holes (608) penetrate through the upper and lower surfaces of the heat-conducting aluminum plate (601).

6. The heat dissipation structure chassis for the display control integrated numerical control system device according to claim 5, wherein a plurality of sets of placing grooves (609) are formed in the top surface of the heat conduction aluminum plate (601), semiconductor refrigeration sheets (610) are arranged in the inner cavity of each set of placing grooves (609), and the cold end surfaces of the semiconductor refrigeration sheets (610) are attached to the bottom surface of the inner cavity of the placing grooves (609).

7. The chassis with the heat dissipation structure for the display-control integrated numerical control system device according to claim 6, wherein the semiconductor refrigeration sheet (610) has an outer diameter equal to an inner diameter of the placement groove (609), and forms an embedded structure.

8. The chassis with the heat dissipation structure for the display control integrated numerical control system device according to claim 2, wherein the heat dissipation member (7) is an aluminum fin, and the surface area of the bottom of the aluminum fin is the same as the surface area of the top of the aluminum heat conduction plate (601).

9. The heat dissipation structure chassis for the display-control integrated numerical control system device according to claim 8, wherein four corners of the top surface of the aluminum type fin are provided with second mounting holes, and the second mounting holes are detachably connected with the first mounting holes (608) through second screws.

10. The heat dissipation structure cabinet for the display control integrated numerical control system device according to claim 8, wherein a heat conductive silicone sheet is disposed on a bottom surface of the aluminum type fin, and the bottom surface of the heat conductive silicone sheet is attached to a top surface of the heat conductive aluminum plate (601).