CN216905422U

CN216905422U - PCB with heat dissipation function

Info

Publication number: CN216905422U
Application number: CN202122109830.6U
Authority: CN
Inventors: 潘卫湘
Original assignee: Shenzhen Zhichuang Jieyu Electronic Technology Co ltd
Current assignee: Shenzhen Zhichuang Jieyu Electronic Technology Co ltd
Priority date: 2021-09-02
Filing date: 2021-09-02
Publication date: 2022-07-05
Anticipated expiration: 2031-09-02

Abstract

The utility model discloses a PCB with a heat dissipation function, and relates to the technical field of PCBs, wherein the PCB comprises a PCB, a heat absorption block and a connecting seat, an upper protection layer is arranged at the top of the PCB, a lower protection layer is arranged at the bottom of the PCB, heat conduction rods are arranged between the upper protection layer and the PCB, the lower protection layer and the PCB, and a plurality of heat dissipation cavities are arranged at the bottom of the lower protection layer. In the utility model, the heat on the side surface of the PCB is dissipated in the using process, the heat of the PCB is reduced, the safety of the PCB is protected, meanwhile, after the PCB is used for a long time, the radiating fins can be taken out by rotating the fixing rod and replaced by new radiating fins, the radiating efficiency is improved, the radiating effect is prevented from being influenced by aging, the heat on the top and the bottom can be concentrated, the heat is dissipated by the micro fan, the radiating efficiency is further improved, meanwhile, the PCB can be protected, and the safety and the service life in use are improved.

Description

PCB with heat dissipation function

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a PCB board with a heat dissipation function.

Background

A PCB, i.e., a printed circuit board, which is called a printed board for short, is one of important components in the electronic industry, and almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronic equipment, and military weapon systems, only electronic components such as integrated circuits are required, and the printed board is used for electrical interconnection between the components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate.

PCB board among the prior art is not enough when using a little, discovers at the in-process that it does not possess the heat dissipation function that uses, leads to long-time during operation can produce high temperature, leads to the fact the damage to PCB board body, reduces life, and it is more complicated to carry out the installation of structure simultaneously, and is relatively poor to the protection of PCB board, influences normal use.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a PCB with heat dissipation function to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme:

a PCB with heat dissipation function comprises a PCB, a heat absorption block and a connecting seat, wherein an upper protective layer is arranged at the top of the PCB, a lower protective layer is arranged at the bottom of the PCB, heat conducting rods are arranged between the upper protective layer and the PCB and between the lower protective layer and the PCB, a plurality of heat dissipation cavities are arranged at the bottom of the lower protective layer, micro fans are fixedly arranged on the inner walls of the heat dissipation cavities, heat absorption wires are fixedly connected to the inner walls of the heat dissipation cavities close to the micro fans, grooves are formed in one side of the upper protective layer, fixing rods are arranged at the edges of the heat absorption block close to the grooves, fixing bolts are arranged at one ends of the fixing rods, movable grooves are formed in the top and the bottom of the grooves, limit blocks are fixedly connected to two sides of the inner walls of the movable grooves, springs are fixedly connected to the bottoms of the inner walls of the movable grooves, and convex blocks are fixedly connected to one ends of the springs, the top and the bottom of connecting seat all are provided with the spacing groove, one side fixedly connected with a plurality of radiating fin of connecting seat.

As a further scheme of the utility model: the PCB heat-conducting structure is characterized in that heat-conducting silica gel is filled between the upper protective layer and the PCB, the heat-conducting silica gel covers the heat-conducting rods, and the heat-conducting rods are distributed in a pairwise staggered manner.

As a still further scheme of the utility model: the upper protective layer and the lower protective layer are both made of heat conducting materials, and the heat absorbing wire is located at the top of the micro fan.

As a still further scheme of the utility model: the heat absorption block is of a concave structure, the concave surface of the heat absorption block is matched with the side surfaces of the upper protective layer and the limiting block, a rotating shaft is arranged at one end of the fixing rod, one end of the fixing rod is rotatably connected with one side of the heat absorption block through the rotating shaft, the fixing bolt penetrates through the other end of the fixing rod, and the fixing bolt is connected with the fixing rod through threads.

As a still further scheme of the utility model: the fixing bolt is connected with one side of the heat absorption block through threads, and the connecting seat is matched with the groove.

As a still further scheme of the utility model: one end of the lug is provided with a certain radian, the lug is matched with the limiting groove, the lug is matched with the movable groove, and the miniature fan is provided with a power supply.

Compared with the prior art, the utility model has the beneficial effects that: through the radiating fin who sets up, the dead lever, fixing bolt, the connecting seat, a groove, the spacing groove, a spring, the activity groove, cooperation between stopper and the lug, make this PCB board in the in-process that uses with the heat effluvium of its side, reduce the heat of PCB board, protect the safety of PCB board, long-time back of using simultaneously, the accessible rotates the dead lever, take out its radiating fin, the radiating fin who updates, the radiating efficiency has been improved, avoid ageing influence radiating effect, through the last protective layer that sets up, the lower protective layer, the heat conduction pole, the heat dissipation chamber, cooperation between miniature fan and the heat absorption silk, can concentrate the heat of PCB board in-process top and bottom, effluvium through miniature fan, further improved radiating efficiency, can protect the PCB board simultaneously, security and life when having improved the use.

Drawings

Fig. 1 is a schematic structural diagram of a PCB having a heat dissipation function.

Fig. 2 is a schematic cross-sectional view of a PCB board with heat dissipation function.

Fig. 3 is an enlarged structural diagram of a PCB with a heat dissipation function.

The labels in the figure are: 1. an upper protective layer; 2. a heat absorbing block; 3. a heat dissipating fin; 4. a connecting seat; 5. fixing the rod; 6. a PCB board; 7. a lower protective layer; 8. a heat conducting rod; 9. a heat dissipation cavity; 10. a micro fan; 11. heat absorbing wires; 12. a limiting groove; 13. a bump; 14. a movable groove; 15. a spring; 16. fixing the bolt; 17. a limiting block; 18. and (4) a groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, in an embodiment of the present invention, a PCB board with a heat dissipation function includes a PCB board 6, a heat absorbing block 2 and a connecting seat 4, and is characterized in that: an upper protective layer 1 is arranged at the top of a PCB 6, a lower protective layer 7 is arranged at the bottom of the PCB 6, heat conducting rods 8 are arranged between the upper protective layer 1 and the PCB 6 as well as between the lower protective layer 7 and the PCB 6, a plurality of heat dissipation cavities 9 are arranged at the bottom of the lower protective layer 7, micro fans 10 are fixedly arranged on the inner walls of the heat dissipation cavities 9, heat absorbing wires 11 are fixedly connected to the inner walls of the heat dissipation cavities 9 close to the micro fans 10, a groove 18 is arranged at one side of the upper protective layer 1, a fixing rod 5 is arranged at the edge of one side of a heat absorbing block 2 close to the groove 18, a fixing bolt 16 is arranged at one end of the fixing rod 5, movable grooves 14 are arranged at the top and the bottom of the groove 18, limit blocks 17 are fixedly connected to the two sides of the inner wall of the movable groove 14, a spring 15 is fixedly connected to the bottom of the inner wall of the movable groove 14, a lug 13 is fixedly connected to one end of the spring 15, and limit grooves 12 are arranged at the top and the bottom of a connecting seat 4, one side fixedly connected with a plurality of radiating fin 3 of connecting seat 4 avoids ageing influence radiating effect.

Referring to fig. 1 and 2, heat conductive silica gel is filled between the upper protective layer 1, the lower protective layer 7 and the PCB 6, the heat conductive silica gel covers the heat conductive rods 8, and the heat conductive rods 8 are distributed in a staggered manner, so that the heat absorption speed is increased.

Referring to fig. 1 and 2, the upper protective layer 1 and the lower protective layer 7 are made of heat conductive material, and the heat absorbing wire 11 is located at the top of the micro fan 10 to reduce the temperature and protect the safety during use.

Referring to fig. 1 to 3, the heat absorbing block 2 is a concave structure, a concave surface of the heat absorbing block 2 is matched with the side surfaces of the upper protective layer 1 and the limiting block 17, a rotating shaft is arranged at one end of the fixing rod 5, one end of the fixing rod 5 is rotatably connected with one side of the heat absorbing block 2 through the rotating shaft, the fixing bolt 16 penetrates through the other end of the fixing rod 5, and the fixing bolt 16 is connected with the fixing rod 5 through threads, so that the heat radiating fins 3 can be replaced conveniently.

Referring to fig. 1 to 3, the fixing bolt 16 is connected to one side of the heat absorbing block 2 by a screw thread, and the connecting seat 4 is adapted to the groove 18, so as to fix the connecting seat 4.

Referring to fig. 2 and 3, one end of the bump 13 is provided with a certain radian, the bump 13 is matched with the limiting groove 12, the bump 13 is matched with the movable groove 14, and the micro fan 10 is provided with a power supply, so that the heat dissipation efficiency is improved.

The working principle of the utility model is as follows:

when in use, a worker installs the PCB 6, firstly installs the upper protective layer 1 and the lower protective layer 7, injects heat-conducting silica gel into a gap between the PCB and the upper protective layer 1, then installs the heat absorption block 2 at two sides of the protective layer, finally presses the connecting seat 4 fixedly connected with the heat dissipation fin 3 into the groove 18, the spring 15 stretches, the lug 13 moves in the movable groove 14, so that the end with radian of the lug 13 is adapted into the limiting groove 12, at the moment, the fixing rod 5 is rotated, so that one end of the fixing rod 5 corresponds to the thread groove on the heat absorption block 2, then screws the bolt into the heat absorption block 2 from one end of the fixing rod 5 through threaded connection, thereby fixing and installing the connecting seat 4, at the moment, the PCB 6 can be installed at a proper place for use, during the use, the heat dissipated from the top and the bottom of the PCB 6 can be absorbed through the heat-conducting rod 8 and the upper protective layer 1 in cooperation with the lower protective layer 7, thereby go up during protective layer 1's heat spreads into lower protective layer 7 and enters into heat dissipation chamber 9, carries out thermal concentration through heat absorption silk 11, starts miniature fan 10 and distributes away its concentrated heat, and on the other hand heat absorption piece 2 absorbs the heat with the temperature of 6 sides of PCB board, is dispelling its heat through radiating fin 3, has improved radiating efficiency, effectual reduction in temperature.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a PCB board with heat dissipation function, includes PCB board (6), heat absorption piece (2) and connecting seat (4), its characterized in that: the heat-absorbing and heat-insulating PCB is characterized in that an upper protective layer (1) is arranged at the top of the PCB (6), a lower protective layer (7) is arranged at the bottom of the PCB (6), heat-conducting rods (8) are arranged between the upper protective layer (1), the lower protective layer (7) and the PCB (6), a plurality of heat-radiating cavities (9) are arranged at the bottom of the lower protective layer (7), micro fans (10) are fixedly arranged on the inner walls of the heat-radiating cavities (9), heat-absorbing wires (11) are fixedly connected to the inner walls of the heat-radiating cavities (9) close to the micro fans (10), grooves (18) are formed in one side of the upper protective layer (1), fixing rods (5) are arranged at the edges of the heat-absorbing blocks (2) close to the grooves (18), fixing bolts (16) are arranged at one ends of the fixing rods (5), and movable grooves (14) are arranged at the top and the bottom of the grooves (18), the inner wall both sides fixedly connected with stopper (17) of activity groove (14), the inner wall bottom fixedly connected with spring (15) of activity groove (14), the one end fixedly connected with lug (13) of spring (15), the top and the bottom of connecting seat (4) all are provided with spacing groove (12), one side fixedly connected with a plurality of radiating fin (3) of connecting seat (4).

2. The PCB board with heat dissipation function of claim 1, wherein: go up and to have filled heat conduction silica gel between protective layer (1) and lower protective layer (7) and PCB board (6), heat conduction silica gel covers heat conduction pole (8), heat conduction pole (8) are two liang of crisscross distributions.

3. The PCB board with heat dissipation function of claim 1, wherein: the upper protection layer (1) and the lower protection layer (7) are both made of heat conduction materials, and the heat absorption wires (11) are located at the top of the micro fan (10).

4. The PCB board with heat dissipation function of claim 1, wherein: the heat absorption block (2) is of a concave structure, the concave surface of the heat absorption block (2) is matched with the side surfaces of the upper protective layer (1) and the limiting block (17), a rotating shaft is arranged at one end of the fixing rod (5), one end of the fixing rod (5) is rotatably connected with one side of the heat absorption block (2) through the rotating shaft, the fixing bolt (16) penetrates through the other end of the fixing rod (5), and the fixing bolt (16) is connected with the fixing rod (5) through threads.

5. The PCB board with heat dissipation function of claim 1, wherein: the fixing bolt (16) is connected with one side of the heat absorption block (2) through threads, and the connecting seat (4) is matched with the groove (18).

6. The PCB board with heat dissipation function of claim 1, wherein: one end of the lug (13) is provided with a certain radian, the lug (13) is matched with the limiting groove (12), the lug (13) is matched with the movable groove (14), and the micro fan (10) is provided with a power supply.