CN203523173U - Communication module supporting OpenVPX standard and electronic device using communication module - Google Patents

Communication module supporting OpenVPX standard and electronic device using communication module Download PDF

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Publication number
CN203523173U
CN203523173U CN201320597517.4U CN201320597517U CN203523173U CN 203523173 U CN203523173 U CN 203523173U CN 201320597517 U CN201320597517 U CN 201320597517U CN 203523173 U CN203523173 U CN 203523173U
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China
Prior art keywords
communication module
middle frame
cabinet
guide groove
heat
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Expired - Lifetime
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CN201320597517.4U
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Chinese (zh)
Inventor
涂云宏
贺升荣
李壮
张振波
朱少佳
张星淳
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Beijing Ucas Technology Co ltd
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BEIJING GUOKEHUANYU SPACE TECHNOLOGY Co Ltd
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Abstract

The utility model discloses a reinforcing and large power communication module supporting an OpenVPX standard, and the communication module is fixed in a cabinet and connected with the cabinet through a guide groove. The communication module includes a PCB assembly and a middle frame assembly; the middle frame assembly includes a middle frame and a heat pipe, and the middle frame contacts with the PCB assembly and conducts heat; and the heat pipe is fixed to the middle frame and contacts with the guide groove of the cabinet. According to the communication module, the heat pipe which is a high efficient heat transfer apparatus is disposed on the middle frame, the thermal resistance of the heat pipe is much less than that of the middle frame, and the heat-transfer capability of the heat pipe is dozens of that of metal material; and the heat pipe contacts with the guide groove of the cabinet, heat produced by the PCB assembly can be rapidly transmitted to the cabinet, and the heat dissipation problem of large power electronic components is effectively solved. The utility model further discloses an electronic device including the cabinet and the communication module supporting the OpenVPX standard, wherein the communication module is disposed in the cabinet and connected with the cabinet through the guide groove.

Description

Support the communication module of OpenVPX standard and use its electronic equipment
Technical field
The utility model relates to communication equipment technical field, relates in particular to the communication module of the powerful a kind of OpenVPX of the support standard of reinforced and uses its electronic equipment.
Background technology
High temperature will produce serious influence to most of electronic devices and components, and it can cause the inefficacy of electronic devices and components, thereby cause the inefficacy of whole equipment.Radiating treatment is exactly to control the temperature of all electronic devices and components of electronic equipment internal, makes it under the residing working environment of equipment, be no more than the maximum permissible temperature of regulation.The heat dissipating method of device interior is between heat sink, to provide a path of low thermal resistance at thermal source, guarantees that heat passes smoothly, and utilizing metal heat-conducting is the most basic heat-conducting method, and its hot appearance of a street is easy to control.
As shown in Figure 1, existing communication module comprises PCB assembly, center, protecgulum and bonnet to existing conductive structure.Center is metal structure, in order to support structure to be provided, guarantees that whole module has enough intensity and height.PCB assembly comprises pcb board and the electronic devices and components that are fixed thereon.Pcb board is fixed on center by screw.Protecgulum and bonnet are sandwiched in centre by PCB assembly and center, and all by screw and center, fix, to play the effect of protection PCB assembly.Whole communication module can be by being arranged at connector and the peripheral communications on pcb board.During heat conduction, the electronic devices and components on PCB assembly contact with center, to transfer heat to center; In addition, the edge of center is connected with extraneous cabinet guide groove, and by the contact area heat conduction with cabinet guide groove to cabinet wall, cabinet wall is delivered to heat heat sink again by modes such as convection current, contact conduction, radiation, thereby forms electronic devices and components-center-cabinet guide groove-cabinet wall-heat sink complete passage of heat.
In practical application, along with the development of electronic technology, the miniaturization increasingly of electronic devices and components and equipment, high-power electronic component is used and causes integrated circuit density of heat flow rate greatly to increase, and tradition utilizes metal heat-conducting can not meet heat radiation requirement.In aforementioned modules, the thermal resistance of center is larger, causes boss can not effectively transmit to the heat between center and center and cabinet guide groove, thereby greatly reduces radiating effect.
Summary of the invention
In view of this, the utility model proposes a kind of communication module of the OpenVPX of support standard and use its electronic equipment, to address the above problem.
For achieving the above object, the technical scheme of the utility model embodiment is achieved in that
A communication module of supporting OpenVPX standard, is fixed in cabinet, and is connected by guide groove with cabinet, comprising: PCB assembly and center assembly;
Described center assembly comprises middle frame and heat pipe, wherein:
Described middle frame and described PCB assembly thermal contact conductance;
Described heat pipe is fixed on described middle frame and contacts with described cabinet guide groove.
Further, described heat pipe and described medium frame welding.
Further, communication module, also comprises: protecgulum and bonnet;
Described protecgulum and described bonnet lay respectively at described PCB assembly and described middle frame back to a side;
Described protecgulum is all fixedly connected with described middle frame with described bonnet.
Further, described PCB assembly comprises the electronic devices and components of the one side that pcb board is relative with described middle frame with being fixed on described pcb board;
Described middle frame is by the contact realization of described electronic devices and components and the thermal contact conductance of described PCB assembly.
Further, the one side that described middle frame is relative with described pcb board is provided with boss,
Described electronic devices and components are connected by described boss with described middle frame.
Further, a part for described heat pipe is around described boss.
Further, between described boss and described electronic devices and components, be further provided with heat conductive insulating pad.
Further, described pcb board is further connected with described middle frame by screw.
Further, on described PCB assembly, be also provided with the connector for communicating by letter with the external world;
The both sides along perpendicular to described connector direction of described middle frame are respectively equipped with connecting portion, and peg graft by described connecting portion and described cabinet guide groove;
Described heat pipe extends to described connecting portion and contacts with described cabinet guide groove.
Further, described heat pipe is two, and every described heat pipe extends to a described connecting portion.
Further, on described middle frame, be provided with the locking device for being fixedly connected with described guide groove.
Further, described locking device comprises slide block group and the screw rod that runs through described slide block group.
Further, described slide block group comprises and moves axially piece, moves radially piece and stationary wedge piece;
The described piece that moves radially moves axially between piece and described stationary wedge piece described, and described stationary wedge piece and described middle frame integrally formed;
When locking, described bolt rotary, and then described in driving, move axially piece along axially the moving towards described stationary wedge piece of described screw rod, thus described in extruding, move radially piece and it is moved along the axial direction perpendicular to described screw rod, to be fixedly connected with the described guide groove of described cabinet;
When unclamping, described bolt rotary and drive described in move axially piece and move away from the direction of described stationary wedge piece along the axial court of described screw rod, thereby described in unclamping, move radially piece, the described guide groove of itself and described cabinet is unclamped.
The utility model embodiment also provides a kind of electronic equipment, comprises cabinet, it is characterized in that, also comprises the communication module of the support OpenVPX standard as above that is positioned at cabinet and is connected by guide groove with cabinet.
Further, the Aluminum Alloy Chassis that described cabinet is welding forming.
Further, the top of described communication module contacts with described cabinet, to form passage of heat.
The beneficial effects of the utility model are, heat pipe is set on middle frame, heat pipe is a kind of efficient heat transfer unit (HTU), its thermal resistance is much smaller than the thermal resistance of middle frame, heat-transfer capability is tens times of metal material, and heat pipe is contacted with cabinet guide groove, can fast the heat producing on PCB assembly be passed to cabinet, thereby effectively solve the heat dissipation problem of high-power electronic component.
1, the electronic devices and components on pcb board just differ, for avoiding occur interfering, general all and between middle frame, leave certain distance.When doing heat conduction and processing, at needs, lead between heat treated electronic devices and components and middle frame boss is set, boss is arranged on middle frame, and by thermal interfacial material, contacts between boss and electronic devices and components.
2, the setting of heat conductive insulating pad, both can realize heat conduction, also can avoid conducting between electronic devices and components and middle frame and affect the normal work of pcb board.
3, the setting of two heat pipes, can make heat be distributed to equably the connecting portion of middle frame both sides, and be delivered to cabinet wall by guide groove, thereby avoids heat to transmit uneven and affect radiating effect.
4, existing communication module is all generally to lock by common wedge-shaped locking strip, because the heat pipe in the present invention has occupied the installation site of locking strip, so by screw rod being set and moving axially piece, moves radially piece and stationary wedge piece, fast this module is fixed in cabinet guide groove.
Accompanying drawing explanation
Fig. 1 is the conduction process schematic diagram of communication module in prior art;
Fig. 2 is electronic devices and components in the utility model embodiment and the connection diagram of boss;
Fig. 3 is the conduction process schematic diagram in the utility model embodiment;
Fig. 4 is the explosive view of the communication module of the support OpenVPX standard in the utility model embodiment;
Fig. 5 a is the center assembly front view in the utility model embodiment;
Fig. 5 b is the center assembly left view in the utility model embodiment;
Fig. 6 a is the front view of the communication module of the support OpenVPX standard in the utility model embodiment;
Fig. 6 b is the vertical view of the communication module of the support OpenVPX standard in the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below, by specific embodiment and referring to accompanying drawing, the utility model is elaborated.
The utility model embodiment provides a kind of communication module of the OpenVPX of support standard, as shown in Fig. 4, Fig. 6 a, Fig. 6 b, is fixed in cabinet, and is connected by guide groove with cabinet, it is characterized in that, comprising: PCB assembly, center assembly, protecgulum 6 and bonnet 7.
It should be noted that the direction marking, only for the reference direction under a kind of common use state, is not unique may occur and changeless direction in Fig. 6 a and Fig. 6 b and Fig. 4.
Wherein, the structure of center assembly is as shown in Fig. 5 a and Fig. 5 b.Center assembly comprises middle frame 2 and heat pipe 8, and described heat pipe 8 is fixed on described middle frame 2, and contacts with described cabinet guide groove.The connected mode of heat pipe 8 and middle frame 2 has multiple, comprises welding, crimping etc., and the present embodiment is preferably welding, is reserved with heat pipe 8 welding grooves on middle frame 2, and heat pipe 8 and middle frame 2 are welded as a whole.
As shown in Figure 4, described PCB assembly and middle frame 2 thermal contact conductances, to be passed to heat on described middle frame 2 and described heat pipe 8.Wherein, PCB assembly comprises pcb board 1 and the electronic devices and components 4 that are fixed thereon, and described pcb board 1 is connected with described middle frame 2 by screw.
Heat pipe 8 will be brought into play maximum efficiency, the heat of thermal source need to be directly delivered to heat-exchange surface.Based on this, as shown in Figure 6 a, on pcb board 1, be provided with the connector 9 for communicating by letter with the external world; The both sides along perpendicular to described connector 9 directions of described middle frame 2 are respectively equipped with connecting portion 10, and peg graft with described cabinet guide groove by described connecting portion 10; Heat pipe 8 extends to described connecting portion 10 and contacts with described cabinet guide groove, heat is passed to described cabinet.Wherein, middle frame 2 is responsible for providing support structure, guarantees that this module has enough intensity and height; Heat pipe 8 is responsible for heat to be delivered to fast connecting portion 10, and is passed to cabinet side by connecting portion 10, fairly obvious to improving the heat-transfer effect of inside modules.
In the present embodiment, heat pipe 8 is two, and every described heat pipe 8 extends to a described connecting portion 10.Can make like this heat be distributed to equably the connecting portion 10 of middle frame 2 both sides, and be delivered to cabinet wall by guide groove, thereby avoid heat to transmit uneven and affect radiating effect.
In addition, during actual use, at connecting portion, appropriate heat-conducting silicone grease is smeared at 10 places, can effectively reduce middle frame 2 to the contact heat resistance of cabinet guide groove.
In the present embodiment, two heat pipes 8 are main passage of heat, in addition, the top of communication module, the top surface areas of middle frame 2 can be used as the 3rd passage, as shown in Figure 6 b.By cabinet cover plate corresponding to custom communication module end face, heat also can pass through heat conductive insulating dig pass to cabinet cover plate from top surface areas.
The aluminium alloy that cabinet material selection conductive coefficient is higher, chassis body welding forming, the equal thermal effect of strengthening machine shell.
During actual use, electronic devices and components 4 height on pcb board 1 differ, for avoiding occurring interfering, general all and between middle frame 2, leave certain distance.So while doing heat conduction processing, the one side that middle frame 2 is relative with described PCB plate 1 is provided with boss 3, described electronic devices and components 4 are connected by described boss 3 with described middle frame 2, as shown in Figure 2.While arranging heat pipe 8 on middle frame 2, a part for heat pipe 8 is around boss 3, thereby can conduct quickly heat.
The heat that electronic devices and components 4 give out is delivered to boss 3 by contact, for reducing contact heat resistance between the two, need select suitable thermal interfacial material.The thermal interfacial material that is applied to this environment need to meet insulation, self high heat conductance, the good wettability in surface, soft compressible, can play the effect of damping, buffering, the error that in the time of simultaneously also can be by self the adjustable processing of compression, assembling, structural member produces, reusable, manufacturability is good, and soft heat conductive insulating pad 5 is optimal selection.So, further, between boss 3 and electronic devices and components 4, be provided with heat conductive insulating pad 5, as shown in Figure 2.
As shown in Figure 4, protecgulum 6 and bonnet 7 lay respectively at described PCB assembly and described middle frame 2 back to a side, that is, in the middle of protecgulum 6 and bonnet 7 are sandwiched in PCB assembly and center assembly, and be all fixedly connected with middle frame 2, to play a protective role.
In sum, the conduction process of the utility model embodiment as shown in Figure 3, the heat that electronic devices and components 4 give out passes to boss 3 by heat conductive insulating pad 5, boss 3 is delivered to heat the connecting portion 10 of middle frame 2 and cabinet guide groove by heat pipe 8 and middle frame 2 structures, and be further delivered to cabinet wall, cabinet wall is delivered to heat heat sink by modes such as convection current, contact conduction, radiation, thereby forms electronic devices and components 4-boss 3-middle frame 2-cabinet guide groove-cabinet wall-heat sink complete passage of heat.
The present embodiment, to the key link specific aim design on the main thermally conductive pathways of the highly reliable all-purpose computer of support OpenVPX standard, reduces the thermal resistance of links, finally reduces the entire thermal resistance of equipment, effectively controls the temperature rise of high performance components.
Communication module in the present embodiment, goes for meeting on the single submodule of OpenVPX standard.Single submodule comprises 3U, two kinds of specifications of 6U.6U single module structure forms with 3U single module structure similar, and Fig. 4 is the typical structure of 3U single module structure.
Heat pipe 8 will be brought into play maximum efficiency, the heat of thermal source need to be directly delivered to connecting portion 10.Realize this effect, the version filling after the locking strip in can only selection standard vita48.2.Meanwhile, because heat pipe 8 is in connecting portion 10, thereby cannot use traditional wedge-shaped locking strip, so in the present embodiment, on middle frame 2, be provided with the locking device for being fixedly connected with described guide groove, as shown in Figure 5 b.
Locking device comprises slide block group and runs through the screw rod 21 of slide block group, and wherein, slide block group comprises and moves axially piece 22, moves radially piece 23 and stationary wedge piece 24; The described piece 23 that moves radially moves axially between piece 22 and described stationary wedge piece 24 described, and described stationary wedge piece 24 is integrally formed with described middle frame 2;
When locking, described screw rod 21 rotates, and then move axially piece 22 axially moving towards described stationary wedge piece 24 along described screw rod 21 described in driving, thereby described in extruding, move radially piece 23 and it is moved along the axial direction perpendicular to described screw rod 21, to be fixedly connected with the described guide groove of described cabinet;
When unclamping, described screw rod 21 rotate and drive described in move axially piece 22 and move away from the direction of described stationary wedge piece 24 along the axial court of described screw rod 21, thereby described in unclamping, move radially piece 23, the described guide groove of itself and described cabinet is unclamped.
More firm in order to connect, in the present embodiment, on middle frame 2, be provided with altogether two screw rods 21, every screw rod 21 is through two slide block groups.
In sum, the utility model embodiment arranges heat pipe 8 on middle frame 2, heat pipe 8 is a kind of efficient heat transfer unit (HTU)s, its thermal resistance is much smaller than the thermal resistance of middle frame 2, heat-transfer capability is tens times of metal material, and heat pipe 8 is contacted with cabinet guide groove, can fast the heat producing on PCB assembly be passed to cabinet side, thereby effectively solve the heat dissipation problem of high-power electronic component 4.
The utility model embodiment also discloses a kind of electronic equipment, comprises cabinet, also comprises the communication module of the support OpenVPX standard as above that is positioned at cabinet and is connected by guide groove with cabinet.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in the scope of the utility model protection.

Claims (16)

1. a communication module of supporting OpenVPX standard, is fixed in cabinet, and is connected by guide groove with described cabinet, it is characterized in that, comprising: PCB assembly and center assembly;
Described center assembly comprises middle frame and heat pipe, wherein:
Described middle frame and described PCB assembly thermal contact conductance;
Described heat pipe is fixed on described middle frame and contacts with described cabinet guide groove.
2. the communication module of support OpenVPX standard according to claim 1, is characterized in that described heat pipe and described medium frame welding.
3. the communication module of support OpenVPX standard according to claim 1, is characterized in that, also comprises: protecgulum and bonnet;
Described protecgulum and described bonnet lay respectively at described PCB assembly and described middle frame back to a side;
Described protecgulum is all fixedly connected with described middle frame with described bonnet.
4. the communication module of support OpenVPX standard according to claim 1, is characterized in that, described PCB assembly comprises the electronic devices and components of the one side that pcb board is relative with described middle frame with being fixed on described pcb board;
Described middle frame is by the contact realization of described electronic devices and components and the thermal contact conductance of described PCB assembly.
5. the communication module of support OpenVPX standard according to claim 4, is characterized in that,
The one side that described middle frame is relative with described pcb board is provided with boss,
Described electronic devices and components are connected by described boss with described middle frame.
6. the communication module of support OpenVPX standard according to claim 5, is characterized in that, a part for described heat pipe is around described boss.
7. the communication module of support OpenVPX standard according to claim 5, is characterized in that, between described boss and described electronic devices and components, is further provided with heat conductive insulating pad.
8. the communication module of support OpenVPX standard according to claim 4, is characterized in that, described pcb board is further connected with described middle frame by screw.
9. the communication module of support OpenVPX standard according to claim 4, is characterized in that, on described PCB assembly, is also provided with the connector for communicating by letter with the external world;
The both sides along perpendicular to described connector direction of described middle frame are respectively equipped with connecting portion, and peg graft by described connecting portion and described cabinet guide groove;
Described heat pipe extends to described connecting portion and contacts with described cabinet guide groove.
10. the communication module of support OpenVPX standard according to claim 9, is characterized in that, described heat pipe is two, and every described heat pipe extends to a described connecting portion.
The communication module of 11. support OpenVPX standards according to claim 1, is characterized in that, is provided with the locking device for being fixedly connected with described guide groove on described middle frame.
The communication module of 12. support OpenVPX standards according to claim 11, is characterized in that, described locking device comprises slide block group and the screw rod that runs through described slide block group.
The communication modules of 13. support according to claim 12 OpenVPX standards, is characterized in that, described slide block group comprises and moves axially piece, moves radially piece and stationary wedge piece;
The described piece that moves radially moves axially between piece and described stationary wedge piece described, and described stationary wedge piece and described middle frame integrally formed;
When locking, described bolt rotary, and then described in driving, move axially piece along axially the moving towards described stationary wedge piece of described screw rod, thus described in extruding, move radially piece and it is moved along the axial direction perpendicular to described screw rod, to be fixedly connected with the described guide groove of described cabinet;
When unclamping, described bolt rotary and drive described in move axially piece and move away from the direction of described stationary wedge piece along the axial court of described screw rod, thereby described in unclamping, move radially piece, the described guide groove of itself and described cabinet is unclamped.
14. 1 kinds of electronic equipments, comprise cabinet, it is characterized in that, also comprise the communication module of the support OpenVPX standard as described in claim 1 to 13 any one that is arranged in cabinet and is connected by guide groove with described cabinet.
15. electronic equipments according to claim 14, is characterized in that, the Aluminum Alloy Chassis that described cabinet is welding forming.
16. electronic equipments according to claim 14, is characterized in that, the top of described communication module contacts with described cabinet, to form passage of heat.
CN201320597517.4U 2013-09-23 2013-09-23 Communication module supporting OpenVPX standard and electronic device using communication module Expired - Lifetime CN203523173U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017067220A1 (en) * 2015-10-22 2017-04-27 乐视控股(北京)有限公司 Middle frame for mobile terminal, and mobile terminal
CN106714507A (en) * 2015-11-16 2017-05-24 华为技术有限公司 Middle frame component and production method thereof
CN107846830A (en) * 2017-12-19 2018-03-27 成都芯通软件有限公司 A kind of functional module radiator structure and cabinet
CN108770291A (en) * 2018-06-11 2018-11-06 Oppo广东移动通信有限公司 A kind of radiating subassembly and electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017067220A1 (en) * 2015-10-22 2017-04-27 乐视控股(北京)有限公司 Middle frame for mobile terminal, and mobile terminal
CN106714507A (en) * 2015-11-16 2017-05-24 华为技术有限公司 Middle frame component and production method thereof
CN106714507B (en) * 2015-11-16 2019-09-13 华为技术有限公司 Middle framework and its production method
CN107846830A (en) * 2017-12-19 2018-03-27 成都芯通软件有限公司 A kind of functional module radiator structure and cabinet
CN107846830B (en) * 2017-12-19 2024-04-02 成都芯通软件有限公司 Functional module heat radiation structure and machine case
CN108770291A (en) * 2018-06-11 2018-11-06 Oppo广东移动通信有限公司 A kind of radiating subassembly and electronic device
CN108770291B (en) * 2018-06-11 2020-07-31 Oppo广东移动通信有限公司 Heat dissipation assembly and electronic device

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Address after: 16th Floor of No.63 Satellite Building, Zhichun Road, Haidian District, Beijing, 100190

Patentee after: BEIJING UCAS TECHNOLOGY Co.,Ltd.

Address before: 16th Floor of No.63 Satellite Building, Zhichun Road, Haidian District, Beijing, 100190

Patentee before: Beijing Guoke Huanyu Space Technology Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140402