CN218038860U

CN218038860U - Capacitor

Info

Publication number: CN218038860U
Application number: CN202222096067.2U
Authority: CN
Inventors: 王雪丽
Original assignee: Zhejiang Saining Electronic Industry And Trade Co ltd
Current assignee: Zhejiang Saining Electronic Industry And Trade Co ltd
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2022-12-13
Anticipated expiration: 2032-08-10

Abstract

The application discloses a capacitor, relate to electronic equipment technical field, which comprises an outer shell, the inner chamber intermediate position department of shell body is provided with the capacitor body, the both sides wall symmetry of capacitor body is fixed with radiator unit, radiator unit includes second heat radiation fin, second heat radiation fin is provided with two sets ofly, two sets of second heat radiation fin symmetries are fixed in the outer wall position of capacitor body, two sets of second heat radiation fin roof and diapire evenly are fixed with first heat radiation fin, and first heat radiation fin slope sets up on second heat radiation fin, the intermediate position department of shell body roof is fixed to be inlayed and is had the semiconductor refrigeration piece. This application has increased capacitor body's surface area under radiator unit's effect, starts the high-temperature air of semiconductor refrigeration piece to the external casing inner chamber and cools down to start miniature fan and produce decurrent air current and then exchange with the outside air fast through the air current hole, thereby make things convenient for the temperature of quick reduction capacitor body during operation.

Description

Capacitor with improved structure

Technical Field

The application relates to the technical field of electronic equipment, in particular to a capacitor.

Background

In the process of implementing the present application, the inventor finds that at least the following problems exist in the technology, and the specific problems are as follows:

most capacitors in the current market are not timely enough in heat dissipation, the heat dissipation efficiency is low, and thermal breakdown is easily caused to further cause the failure of the capacitors.

SUMMERY OF THE UTILITY MODEL

In order to improve the heat dissipation of most condensers in the above-mentioned existing market not timely enough, the radiating efficiency is lower, causes the problem of thermal breakdown and then lead to the inefficacy of this condenser easily, the utility model provides a condenser.

The application provides a capacitor, adopts following technical scheme:

the utility model provides a capacitor, includes the shell body, the inner chamber intermediate position department of shell body is provided with capacitor body, capacitor body's both sides wall symmetry is fixed with radiator unit, radiator unit includes second heat radiation fin, second heat radiation fin is provided with two sets ofly, and is two sets of the outer wall position at capacitor body is fixed to the second heat radiation fin symmetry, and is two sets of second heat radiation fin roof and diapire evenly are fixed with first heat radiation fin, and first heat radiation fin slope sets up on second heat radiation fin, the intermediate position department of shell body roof is fixed to inlay and is had the semiconductor refrigeration piece, the air current hole has all been seted up all around shell body roof and diapire, all be fixed with miniature fan around shell body inner chamber roof and the diapire.

Through adopting above-mentioned technical scheme, through the surface area of radiator unit increase capacitor body to start semiconductor refrigeration piece and miniature fan and accelerate the air exchange when the inside air cooling of housing, thereby improve the radiating efficiency.

Optionally, a dust screen is fixed inside the airflow hole formed in the outer shell.

Through adopting above-mentioned technical scheme, be convenient for prevent that the dust in the air from entering into in the shell body.

Optionally, the upper end and the lower end of the inner cavity of the outer shell are both fixed with a screen plate, the two sets of screen plates are fixed with the top wall and the bottom wall of the capacitor body respectively on the side wall close to the capacitor body, and the two sets of screen plates are arranged at positions between the upper set of micro fan and the lower set of micro fan.

Through adopting above-mentioned technical scheme for the upper and lower two sides of capacitor body also can contact with the air, thereby improves the radiating efficiency.

Optionally, the lantern ring has been cup jointed to the outer wall screw of shell body, both ends symmetry is fixed with the installation diaphragm about the lateral wall of lantern ring one side, and is two sets of installation diaphragm is inside to be kept away from the one end of the lantern ring and all has seted up the installation through-hole.

Through adopting above-mentioned technical scheme, be convenient for install fixed this condenser.

Optionally, the shell body includes the insulating layer, the insulating layer sets up the outside position at the capacitor body, the insulating layer is fixed mutually with otter board and miniature fan, the outer wall of insulating layer is fixed with first metal level, the outer wall of first metal level is fixed with the second metal level, the insulating layer is the ceramic layer, first metal level is the iron-carbon alloy, the second metal level is the aluminum sheet.

By adopting the technical scheme, the insulativity, the structural strength and the corrosion resistance are convenient to improve.

In summary, the present application includes at least one of the following advantages: the surface area of the capacitor body is increased under the action of the heat dissipation assembly, the semiconductor refrigerating sheet is started to cool high-temperature air in the inner cavity of the outer shell, and the micro fan is started to generate downward airflow so as to be rapidly exchanged with external air through the airflow hole, so that the temperature of the capacitor body during working can be conveniently and rapidly reduced.

Drawings

FIG. 1 is a front view of the internal structure of the present application;

FIG. 2 is a schematic top view of the present application;

FIG. 3 is a schematic view of a connection three-dimensional structure of a lantern ring, an outer shell, a dust screen and a semiconductor chilling plate according to the present application;

fig. 4 is a schematic perspective view of an insulating layer, a first metal layer, and a second metal layer according to the present application.

In the figure: 1. a heat dissipating component; 101. a first heat dissipation fin; 102. a second heat radiation fin; 2. a collar; 3. an outer housing; 301. an insulating layer; 302. a first metal layer; 303. a second metal layer; 4. a micro fan; 5. a capacitor body; 6. a screen plate; 7. a dust screen; 8. installing a transverse plate; 9. mounting a through hole; 10. semiconductor refrigeration piece.

Detailed Description

Referring to fig. 1 of the drawings, the present application provides an embodiment: a capacitor comprises an outer shell 3, a capacitor body 5 is arranged in the middle of an inner cavity of the outer shell 3, two side walls of the capacitor body 5 are symmetrically fixed with heat dissipation assemblies 1, each heat dissipation assembly 1 comprises second heat dissipation fins 102, the second heat dissipation fins 102 are provided with two groups, the two groups of second heat dissipation fins 102 are symmetrically fixed on the outer wall of the capacitor body 5, the top walls and the bottom walls of the two groups of second heat dissipation fins 102 are uniformly fixed with first heat dissipation fins 101, the first heat dissipation fins 101 are obliquely arranged on the second heat dissipation fins 102, the first heat dissipation fins 101 and the second heat dissipation fins 102 are made of heat conduction metal materials and have large heat conduction performance, when the capacitor is used, heat generated by the work of the capacitor body 5 is conducted to the outer wall of the capacitor body 5 and the heat dissipation assemblies 1, at the moment, the surface areas of the capacitor body 5 are increased by the second heat dissipation fins 102 and the first heat dissipation fins 101, and accordingly the contact areas of the capacitor body 5 and air are increased.

Please refer to fig. 1 and 2 in the drawings of the specification, a semiconductor refrigeration sheet 10 is fixedly embedded in the middle position of the top wall of the outer shell 3, the cross section of the semiconductor refrigeration sheet 10 is circular, the heating end and the cooling end of the semiconductor refrigeration sheet 10 are respectively arranged at the top wall and the bottom wall of the semiconductor refrigeration sheet 10, the cooling end of the semiconductor refrigeration sheet 10 is embedded in the inner cavity of the outer shell 3, airflow holes are respectively formed around the top wall and the bottom wall of the outer shell 3, the airflow holes are circular, a dust screen 7 is fixed inside the airflow holes formed in the outer shell 3, micro fans 4 are respectively fixed around the top wall and the bottom wall of the inner cavity of the outer shell 3, the airflow directions of the upper and lower micro fans 4 are downward, when the capacitor is used, the semiconductor refrigeration sheet 10 is started and the cooling end embedded in the inner cavity of the outer shell 3 is used for cooling the high-temperature air in the inner cavity of the outer shell 3, and the micro fans 4 are started to generate downward airflow to rapidly exchange with the external air through the airflow holes, thereby conveniently and rapidly reducing the air temperature when the capacitor body 5 works.

Referring to fig. 1 in the drawings of the specification, the upper and lower ends of the inner cavity of the outer shell 3 are both fixed with the mesh plates 6, the side walls of two groups of mesh plates 6 near the capacitor body 5 are respectively fixed with the top wall and the bottom wall of the capacitor body 5, two groups of mesh plates 6 are both arranged at the positions between the upper and lower groups of micro fans 4, the mesh plates 6 are alloy metal mesh plates, and the top wall and the bottom wall of the capacitor body 5 can also be contacted with air under the action of the two groups of mesh plates 6, so that the cooling efficiency is increased.

Please refer to fig. 1 and 3 in the drawings of the specification, the outer wall of the outer shell 3 is screwed with the lantern ring 2, the outer diameter of the outer shell 3 is equal to the inner diameter of the lantern ring 2, the outer wall of the outer shell 3 is evenly engraved with external threads, the inner wall of the lantern ring 2 is engraved with internal threads matched with the external threads engraved on the outer wall of the outer shell 3, the upper and lower ends of the side wall of one side of the lantern ring 2 are symmetrically fixed with mounting transverse plates 8, one ends of the two sets of mounting transverse plates 8 far away from the lantern ring 2 are both provided with mounting through holes 9, the mounting through holes 9 penetrate through the mounting transverse plates 8, when the capacitor needs to be mounted, the lantern ring 2 is sleeved on the outer shell 3 and screwed with the lantern ring 2 to rotate, the lantern ring 2 and the outer shell 3 are connected with each other through threads and drive the two sets of mounting transverse plates 8 to move to proper positions along with the movement of the lantern ring 2, and then, the external bolt penetrates through the mounting through holes 9 and fixes the capacitor at proper positions.

Referring to fig. 4 in the drawings of the specification, the outer case 3 includes an insulating layer 301, the insulating layer 301 is a ceramic layer, the insulating layer 301 is disposed at an outer position of the capacitor body 5, the insulating layer 301 is fixed to the screen 6 and the micro fan 4, a first metal layer 302 is fixed to an outer wall of the insulating layer 301, the first metal layer 302 is made of iron-carbon alloy, a second metal layer 303 is fixed to an outer wall of the first metal layer 302, the second metal layer 303 is made of aluminum sheet, insulation of the capacitor is ensured by using insulation characteristics of ceramic material under the effect of the insulating layer 301, structural strength of the capacitor is improved by using characteristics of high strength of alloy metal under the effect of the first metal layer 302, and corrosion resistance of the capacitor is improved by using characteristics of corrosion resistance of aluminum products under the effect of the second metal layer 303.

The working principle is as follows: when the capacitor is used, the heat generated by the operation of the capacitor body 5 is conducted to the outer wall of the capacitor body 5 and the heat dissipation assembly 1, and at this time, the second heat dissipation fins 102 and the first heat dissipation fins 101 increase the surface area of the capacitor body 5, thereby increasing the contact area of the capacitor body 5 with the air.

The semiconductor refrigerating sheet 10 is started and is buried in the refrigerating end of the inner cavity of the outer shell 3 by the semiconductor refrigerating sheet 10 to cool high-temperature air in the inner cavity of the outer shell 3, the micro fan 4 is started to generate downward airflow, and then the downward airflow is rapidly exchanged with outside air through the airflow hole, so that the temperature of the capacitor body 5 during working can be rapidly reduced conveniently.

Make capacitor body 5 top wall and diapire also can contact with the air under the effect of two sets of otter boards 6 to increase cooling efficiency.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A capacitor, includes shell body (3), the inner chamber intermediate position department of shell body (3) is provided with capacitor body (5), its characterized in that: the capacitor is characterized in that heat dissipation assemblies (1) are symmetrically fixed on two side walls of the capacitor body (5), semiconductor refrigeration sheets (10) are fixedly embedded in the middle of the top wall of the outer shell (3), airflow holes are formed in the periphery of the top wall and the periphery of the bottom wall of the outer shell (3), and micro fans (4) are fixed on the periphery of the top wall and the periphery of the bottom wall of an inner cavity of the outer shell (3).

2. A capacitor according to claim 1, wherein: the heat dissipation assembly (1) comprises second heat dissipation fins (102), two groups of the second heat dissipation fins (102) are arranged, the two groups of the second heat dissipation fins (102) are symmetrically fixed on the outer wall of the capacitor body (5), first heat dissipation fins (101) are uniformly fixed on the top wall and the bottom wall of the two groups of the second heat dissipation fins (102), and the first heat dissipation fins (101) are obliquely arranged on the second heat dissipation fins (102).

3. A capacitor according to claim 1, wherein: and a dust screen (7) is fixed in an airflow hole formed in the outer shell (3).

4. A capacitor according to claim 1, wherein: the upper end and the lower end of the inner cavity of the outer shell (3) are respectively fixed with a screen plate (6), the screen plates (6) are two groups, the side wall of one side, close to the capacitor body (5), of each screen plate is respectively fixed with the top wall and the bottom wall of the capacitor body (5), and the screen plates (6) are two groups and are arranged at positions between the upper micro fan and the lower micro fan (4).

5. A capacitor according to claim 1, wherein: the outer wall screw thread of shell body (3) has cup jointed the lantern ring (2), both ends symmetry is fixed with installation diaphragm (8) about the lateral wall of the lantern ring (2) one side, and is two sets of installation diaphragm (8) inside one end of keeping away from the lantern ring (2) has all been seted up installation through-hole (9).

6. A capacitor according to claim 4, wherein: the outer casing (3) includes insulating layer (301), insulating layer (301) set up the outside position in capacitor body (5), insulating layer (301) are fixed mutually with otter board (6) and micro fan (4), the outer wall of insulating layer (301) is fixed with first metal level (302), the outer wall of first metal level (302) is fixed with second metal level (303).

7. A capacitor according to claim 6, wherein: the insulating layer (301) is a ceramic layer, the first metal layer (302) is made of iron-carbon alloy, and the second metal layer (303) is made of aluminum sheet.