CN215299236U

CN215299236U - Device for reducing thermal contact resistance of chip cold conducting plate

Info

Publication number: CN215299236U
Application number: CN202121278251.8U
Authority: CN
Inventors: 任宏; 贾俊秋
Original assignee: Shenzhen Xinzhongda Heat Dissipation Co ltd
Current assignee: Shenzhen Xinzhongda Heat Dissipation Co ltd
Priority date: 2021-06-07
Filing date: 2021-06-07
Publication date: 2021-12-24
Anticipated expiration: 2031-06-07

Abstract

The utility model discloses a device for reducing thermal contact resistance of a chip cooling guide plate, which comprises a cooling guide plate chip, a heating panel, a mounting groove, a heat conducting pad, a pad taking groove, a fixing component and a spring component, wherein the mounting groove is arranged on the outer wall of the top end of the cooling guide plate chip; the utility model discloses the heat conduction pad that sets up is a heat conduction silica gel pad, can effectual low thermal contact resistance, improves the working property of chip, has saved the manual work and has paintd heat conduction silicone grease, has reduced intensity of labour, and the installation and the dismantlement of heating panel of being convenient for, and comparison labour saving and time saving makes things convenient for the change of heat conduction pad, and is more perfect and practical, is worth extensive popularization and application.

Description

Device for reducing thermal contact resistance of chip cold conducting plate

Technical Field

The utility model relates to a cold drawing equipment technical field is led to the chip specifically is a device that reduces chip and leads cold drawing thermal contact resistance.

Background

The integrated circuit made on the surface of the semiconductor chip is also called as a thin film integrated circuit, another thick film integrated circuit is a miniaturized circuit formed by independent semiconductor equipment and passive components integrated on a substrate or a circuit board, when the chip radiates, the heat on the chip shell is often conducted to a top cover radiating fin or a radiating module through a cold conducting plate, and according to the heat transfer principle, the contact thermal resistance must exist between the chip cold conducting plate and the radiating fin or the radiating module; at present, in order to reduce the contact thermal resistance, heat-conducting silicone grease is often coated between the chip and the heat-conducting silicone grease, most of the heat-conducting silicone grease coating is manually operated, the coating effect is poor, the working performance of the chip is reduced, time and labor are wasted, the labor intensity is increased, and the heat-conducting silicone grease is not worth being widely popularized and applied.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a reduce device that cold drawing thermal contact resistance is led to chip, the utility model discloses the heat conduction pad that sets up is a heat conduction silica gel pad, can effectual low thermal contact resistance, improves the working property of chip, has saved the manual work and has paintd heat conduction silicone grease, has reduced intensity of labour, and the fixed subassembly of setting is convenient for the installation and the dismantlement of heating panel, and more labour saving and time saving makes things convenient for the change of heat conduction pad, and is more perfect and practical, is worth extensive popularization and application.

The purpose of the utility model can be realized by the following technical scheme:

the utility model provides a reduce device that cold drawing thermal contact resistance is led to chip, is including leading cold plate chip, heating panel, mounting groove, heat conduction pad, getting and fill up groove, fixed subassembly and popping out the subassembly, lead and seted up the mounting groove on the top outer wall of cold plate chip, lead the cold plate chip and be located and seted up on the outer wall of mounting groove one side and get and fill up the groove, and get and fill up groove and mounting groove intercommunication, install the heat conduction pad on the inside of mounting groove, lead the cold plate chip and be located the outer wall of heat conduction pad top and install the heating panel, heating panel and lead and set gradually fixed subassembly and pop out the subassembly between the cold plate chip.

As a further aspect of the present invention: fixed subassembly includes first inserting groove, fixed slot, shell fragment, triangle fixed block, first spring and locating lever, lead cold plate chip and all seted up a plurality of first inserting grooves on being located the outer wall of mounting groove both sides, link up on one side inner wall of first inserting groove and seted up the fixed slot, correspond first inserting groove and install a plurality of shell fragments on the bottom outer wall of heating panel, it is fixed with the triangle fixed block to correspond the fixed slot on one side of shell fragment, and triangle fixed block lock is in the fixed slot, the heating panel is located the outer wall of shell fragment one side and is fixed with the locating lever, the welding has first spring on one side that the locating lever is located first inserting groove, and the other end of first spring welds in one side of shell fragment.

As a further aspect of the present invention: pop out the subassembly and include second inserting groove, inserted bar, spout, slider, roof and second spring, a plurality of inserted bars have all been welded to the bottom both sides of heating panel, lead to correspond the inserted bar on the top outer wall of cold plate chip and seted up a plurality of second inserted grooves, and the inserted bar inserts in the second inserted groove, install the roof on the inside that the second inserted groove is located the inserted bar below, the welding has the slider on the both sides of roof, correspond the slider on the both sides inner wall of second inserted groove and seted up the spout, and the inner wall of spout and the outer wall laminating of slider, the welding has the second spring on the bottom inner wall of second inserted groove, and the top of second spring welds in the outer wall of roof.

As a further aspect of the present invention: and a plurality of fins are fixed on the outer wall of the top end of the heat dissipation plate.

As a further aspect of the present invention: the heat conducting pad is a heat conducting silica gel pad.

The utility model has the advantages that: the utility model discloses the heat conduction pad that sets up, be a heat conduction silica gel pad, can effectual low thermal contact resistance, the working property of chip is improved, the artifical heat conduction silicone grease of paining has been saved, labor intensity is reduced, the fixed subassembly of setting, through first inserting groove, the fixed slot, the shell fragment, the triangle fixed block, the cooperation of first spring and locating lever, the installation and the dismantlement of the heating panel of being convenient for, it is labour saving and time saving relatively, make things convenient for the change of heat conduction pad, relatively perfect and practical, the subassembly that pops out of setting, through the second inserting groove, the inserted bar, the spout, the slider, the cooperation of roof and second spring, the heating panel of being convenient for and cold plate chip autosegregation lead, the efficiency of dismantlement is improved, be worth extensively popularizing and applying.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall front perspective structure of the present invention;

FIG. 2 is a front view of the fixing component of the present invention;

FIG. 3 is a schematic view of the overall overlooking and sectioning structure of the utility model;

fig. 4 is a front sectional view of the area a in fig. 3 according to the present invention;

in the figure: 1. a cold guide plate chip; 2. a heat dissipation plate; 3. a fin; 4. mounting grooves; 5. a thermally conductive pad; 6. taking a pad groove; 7. a fixing assembly; 8. a pop-up assembly; 71. a first insertion groove; 72. fixing grooves; 73. a spring plate; 74. a triangular fixed block; 75. a first spring; 76. positioning a rod; 81. a second insertion groove; 82. a plug rod; 83. a chute; 84. a slider; 85. a top plate; 86. a second spring.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1-4, a device for reducing thermal contact resistance of a chip cold conducting plate comprises a cold conducting plate chip 1, a heat radiating plate 2, a mounting groove 4, a heat conducting pad 5, a pad taking groove 6, a fixing component 7 and a pop-up component 8, wherein the mounting groove 4 is formed in the outer wall of the top end of the cold conducting plate chip 1, the pad taking groove 6 is formed in the outer wall of the cold conducting plate chip 1 on one side of the mounting groove 4, the pad taking groove 6 is communicated with the mounting groove 4, the heat conducting pad 5 is mounted inside the mounting groove 4, the heat radiating plate 2 is mounted on the outer wall of the cold conducting plate chip 1 above the heat conducting pad 5, and the fixing component 7 and the pop-up component 8 are sequentially arranged between the heat radiating plate 2 and the cold conducting plate chip 1; the fixing assembly 7 comprises a first inserting groove 71, a fixing groove 72, elastic pieces 73, a triangular fixing block 74, a first spring 75 and a positioning rod 76, a plurality of first inserting grooves 71 are respectively arranged on the outer walls of the cold guide plate chip 1 positioned at the two sides of the mounting groove 4, the fixing groove 72 is penetratingly arranged on the inner wall at one side of the first inserting groove 71, a plurality of elastic pieces 73 are arranged on the outer wall at the bottom end of the heat dissipation plate 2 corresponding to the first inserting grooves 71, the triangular fixing block 74 is fixed on one side of the elastic pieces 73 corresponding to the fixing groove 72, the triangular fixing block 74 is fastened in the fixing groove 72, the outer wall of the heat dissipating plate 2 on one side of the elastic piece 73 is fixed with a positioning rod 76, one side of the positioning rod 76 in the first inserting groove 71 is welded with a first spring 75, the other end of the first spring 75 is welded on one side of the elastic sheet 73, so that the heat dissipation plate 2 is convenient to mount and dismount, the heat conduction pad 5 is convenient to replace, and the heat conduction plate is practical; the pop-up assembly 8 comprises a second inserting groove 81, inserting rods 82, a sliding groove 83, a sliding block 84, a top plate 85 and a second spring 86, wherein a plurality of inserting rods 82 are welded on both sides of the bottom end of the heat dissipation plate 2, a plurality of second inserting grooves 81 are arranged on the outer wall of the top end of the cold guide plate chip 1 corresponding to the inserting rods 82, and the inserting rod 82 is inserted into the second inserting groove 81, the inner part of the second inserting groove 81 below the inserting rod 82 is provided with a top plate 85, two sides of the top plate 85 are welded with sliding blocks 84, sliding grooves 83 are arranged on the inner walls of two sides of the second inserting groove 81 corresponding to the sliding blocks 84, the inner wall of the sliding groove 83 is attached to the outer wall of the sliding block 84, the inner wall of the bottom end of the second inserting groove 81 is welded with a second spring 86, the top end of the second spring 86 is welded on the outer wall of the top plate 85, when the heat dissipation plate 2 is disassembled, the heat dissipation plate 2 is conveniently and automatically separated from the cold guide plate chip 1, and the disassembly method is practical and perfect; a plurality of fins 3 are fixed on the outer wall of the top end of the heat dissipation plate 2, so that the heat dissipation effect of the heat dissipation plate 2 is improved, and the heat dissipation effect is relatively perfect; the heat conducting pad 5 is a heat conducting silica gel pad, so that the contact thermal resistance is effectively reduced, and the heat dissipation efficiency of the cold conducting plate is improved.

The utility model discloses a theory of operation: when the heat conducting pad 5 is replaced, the triangular fixing block 74 is manually extruded, the triangular fixing block 74 is separated from the fixing groove 72, due to the elastic action of the second spring 86, the second spring 86 drives the top plate 85 to move upwards, the top plate 85 pushes the inserting rod 82 to move again, the inserting rod 82 is separated from the second inserting groove 81, the heat dissipation plate 2 is taken down, the heat conducting pad 5 in the installation groove 4 is taken down through the pad taking groove 6 and replaced by a new heat conducting pad 5, after the heat conducting pad 5 is replaced, the heat dissipation plate 2 is covered, the inserting rod 82 is aligned to the second inserting groove 81, the elastic sheet 73 and the positioning rod 76 are aligned to the first inserting groove 71, the heat dissipation plate 2 is pressed again, the triangular fixing block 74 is clamped into the fixing groove 72 and fixed, the heat conducting pad 5 is a heat conducting silica gel pad, effective low thermal contact resistance is achieved, and the heat dissipation efficiency of the cold conducting plate chip 1 is improved.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a reduce device that cold drawing thermal contact resistance is led to chip, its characterized in that, including leading cold plate chip (1), heating panel (2), mounting groove (4), heat conduction pad (5), getting pad groove (6), fixed subassembly (7) and popping out subassembly (8), mounting groove (4) have been seted up on the top outer wall of leading cold plate chip (1), lead cold plate chip (1) and seted up on the outer wall that is located mounting groove (4) one side and get pad groove (6), and get pad groove (6) and mounting groove (4) intercommunication, install heat conduction pad (5) on the inside of mounting groove (4), it installs heating panel (2) on the outer wall that cold plate chip (1) is located heat conduction pad (5) top to lead cold plate chip (1), heating panel (2) and lead to set gradually between cold plate chip (1) fixed subassembly (7) and pop out subassembly (8).

2. The device for reducing the thermal contact resistance of the cold conducting plate of the chip according to claim 1, wherein the fixing assembly (7) comprises a first inserting groove (71), a fixing groove (72), a spring plate (73), a triangular fixing block (74), a first spring (75) and a positioning rod (76), the outer walls of the cold conducting plate chip (1) on two sides of the mounting groove (4) are respectively provided with a plurality of first inserting grooves (71), the inner wall of one side of each first inserting groove (71) is provided with the fixing groove (72) in a penetrating manner, the outer wall of the bottom end of the heat radiating plate (2) is provided with a plurality of spring plates (73) corresponding to the first inserting grooves (71), the triangular fixing block (74) is fixed on one side of each spring plate (73) corresponding to the fixing groove (72), the triangular fixing block (74) is buckled in the fixing groove (72), the positioning rod (76) is fixed on the outer wall of the heat radiating plate (2) on one side of each spring plate (73), one side of the positioning rod (76) in the first inserting groove (71) is welded with a first spring (75), and the other end of the first spring (75) is welded on one side of the elastic sheet (73).

3. The device for reducing the thermal contact resistance of the cold conducting plate of the chip according to claim 1, wherein the ejecting assembly (8) comprises a second inserting groove (81), a plurality of inserting rods (82), a sliding groove (83), a sliding block (84), a top plate (85) and a second spring (86), the inserting rods (82) are welded on two sides of the bottom end of the heat radiating plate (2), the second inserting groove (81) is formed in the outer wall of the top end of the cold conducting plate chip (1) corresponding to the inserting rods (82), the inserting rods (82) are inserted into the second inserting groove (81), the top plate (85) is installed on the inner portion of the second inserting groove (81) below the inserting rods (82), the sliding block (84) is welded on two sides of the top plate (85), the sliding groove (83) is formed in the inner wall of the second inserting groove (81) corresponding to the sliding block (84), and the inner wall of the sliding groove (83) is attached to the outer wall of the sliding block (84), and a second spring (86) is welded on the inner wall of the bottom end of the second inserting groove (81), and the top end of the second spring (86) is welded on the outer wall of the top plate (85).

4. The device for reducing the contact thermal resistance of the cold conducting plate of the chip as claimed in claim 1, wherein a plurality of fins (3) are fixed on the outer wall of the top end of the heat radiating plate (2).

5. The apparatus for reducing the contact thermal resistance of a cold plate of a chip as claimed in claim 1, wherein the thermal pad (5) is a thermal conductive silicone pad.