CN216357451U - Quick radiating multilayer circuit board - Google Patents
Quick radiating multilayer circuit board Download PDFInfo
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- CN216357451U CN216357451U CN202122406510.7U CN202122406510U CN216357451U CN 216357451 U CN216357451 U CN 216357451U CN 202122406510 U CN202122406510 U CN 202122406510U CN 216357451 U CN216357451 U CN 216357451U
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Abstract
The utility model discloses a multilayer circuit board capable of quickly radiating heat, which comprises a waterproof layer, a circuit board body, a green oil layer and a heat radiating mechanism, wherein the heat radiating mechanism is arranged on the outer side of the circuit board body, a threaded pipe is connected to external air conditioning equipment, then the external air conditioning equipment guides cold air into the threaded pipe, the cold air circulates on the inner side of a vent pipe after passing through the threaded pipe and a fixed pipe, so that the temperature of heat radiating fins is reduced, meanwhile, the heat conducting plate and a heat conducting rod conduct the heat of the circuit board body, and then the heat is quickly radiated through a plurality of heat radiating fins, so that the circuit board in the using process is quickly radiated, and the service life of the circuit board is prolonged.
Description
Technical Field
The utility model relates to the related field of circuit boards, in particular to a multilayer circuit board capable of quickly dissipating heat.
Background
The circuit board is also called as a circuit board, has the characteristics of high wiring density, light weight, thin thickness and good bending property, enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
When the circuit board is used, a large amount of heat is generated due to the use of the electronic element, the electronic element easily guides the heat to the circuit board, the existing circuit board is slow in heat dissipation, and the service life of the circuit board is easily influenced when the circuit board is in a high-temperature state for a long time.
Disclosure of Invention
Therefore, in order to solve the above-mentioned disadvantages, the present invention provides a multilayer circuit board with fast heat dissipation.
The utility model is realized in such a way that a multi-layer circuit board capable of fast heat dissipation is constructed, the device comprises a waterproof layer and a circuit board body, the waterproof layer is arranged at the top of a green oil layer, the green oil layer is coated on the top end surface of the circuit board body, a heat dissipation mechanism and a dust prevention mechanism are arranged at the outer side of the circuit board body, the heat dissipation mechanism comprises an inserting plate, an inserting groove, an outer frame, rubber sheets, a mounting plate, an air guide mechanism, a heat conduction plate, heat dissipation holes, heat conduction rods and heat dissipation fins, the inserting plate is arranged at the tops of the left end and the right end of the inner side of the outer frame, the inserting plate is locked at the inner sides of the inserting grooves formed in the middle parts of the left end and the right end of the circuit board body, the rubber sheets are adhered at the left end and the right end of the inner side of the outer frame, the rubber sheets are adhered to the side surfaces of the circuit board body, the mounting plate is arranged at the bottoms of the left end and the right end of the outer frame, the air guide mechanism is arranged at the bottom end of the inner side of the outer frame, the heat conduction plate, the heat conducting plate is tightly attached to the bottom end face of the circuit board body, the heat dissipation holes penetrate through the upper end face and the lower end face of the heat conducting plate, the heat conducting rods are arranged on the top end face of the heat conducting plate and are matched with the inner sides of the grooves formed in the bottom end face of the circuit board body, and the upper end face and the lower end face of each heat dissipation fin are respectively connected to the top end face of the heat conducting plate and the bottom end face of the inner side of the outer frame.
Preferably, the air guide mechanism includes mounting groove, screwed pipe, fixed pipe, breather pipe and embedded groove, the inside bottom of frame is seted up to the mounting groove, the screwed pipe sets up in fixed pipe rear end face middle part, fixed pipe embedding is in frame rear end face bottom, the breather pipe is pasted in the embedded groove inboard, and the breather pipe inboard links up in fixed intraductal side front end, the embedded groove is seted up in the inboard bottom face of mounting groove.
Preferably, the dustproof mechanism 5 includes a pulling plate 51, a clamping rod 52, a micro spring 53, a protruding plate 54, a connecting groove 55 and a U-shaped dustproof cover 56, the pulling plate 51 is disposed in the middle of the right end face of the clamping rod 52, the clamping rod 52 penetrates through the top of the outer side of the outer frame 33, the clamping rod 52 movably extends into the inner side of the clamping groove formed in the middle of the outer side of the protruding plate 54, two ends of the micro spring 53 are respectively connected to the top of the left end face of the pulling plate 51 and the top of the right end face of the outer frame 33, the end face of the inner side of the micro spring 53 is movably connected to the side surface of the clamping rod 52, the protruding plate 54 is disposed at the left and right ends of the bottom end face of the U-shaped dustproof cover 56, the protruding plate 54 tightly extends into the inner side of the connecting groove 55, the connecting groove 55 is disposed at the left and right ends of the top end face of the outer frame 33, and the top end face of the inner side of the U-shaped dustproof cover 56 covers the top end face of the waterproof layer 1.
Preferably, the mounting panel top end face has been seted up the bar hole, and the bar hole is provided with two both ends around the mounting panel top.
Preferably, the radiating holes are distributed on the top end surface of the heat conducting plate at equal intervals, and the radiating holes and the heat conducting rods are distributed in a staggered mode.
Preferably, the heat conducting rods are arranged at equal intervals in more than two rows on the top end surface of the heat conducting plate, and the bottom end surface of the circuit board body is provided with corresponding grooves.
Preferably, the top end face of the rubber sheet is flush with the top end face of the outer frame, and the thickness of the rubber sheet is 0.1cm to 0.2 cm.
Preferably, the side surfaces of the heat dissipation fins are perpendicular to the bottom end surface of the heat conduction plate and the bottom end surface of the inner side of the outer frame.
Preferably, the screwed pipe and the fixed pipe are respectively provided with two ends at the left and right sides of the bottom of the rear end surface of the outer frame, and the two fixed pipes are respectively connected with the head and the tail ends of the inner side of the vent pipe.
The utility model has the following advantages: the utility model provides a multi-layer circuit board capable of rapidly dissipating heat through improvement, compared with the same type of equipment, the utility model has the following improvement:
the method has the advantages that: according to the multilayer circuit board capable of quickly dissipating heat, the heat dissipation mechanism is arranged on the outer side of the circuit board body, the threaded pipe is connected to external air conditioning equipment, then the external air conditioning equipment guides cold air into the threaded pipe, the cold air flows through the threaded pipe and the fixed pipe and then flows on the inner side of the vent pipe, so that the temperature of the heat dissipation fins is reduced, meanwhile, the heat conduction plate and the heat conduction rod conduct heat of the circuit board body, and then the heat dissipation is quickly performed through the plurality of heat dissipation fins, so that the circuit board in the use process is quickly dissipated heat, and the service life of the circuit board is prolonged.
The method has the advantages that: according to the multilayer circuit board capable of rapidly dissipating heat, more than two heat dissipation holes are distributed on the top end surface of the heat conduction plate at equal intervals, and the heat dissipation holes and the heat conduction rods are distributed in a staggered manner, so that the heat dissipation efficiency of the circuit board body is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic front sectional view of a circuit board body according to the present invention;
FIG. 3 is a schematic front sectional view of the heat dissipation mechanism of the present invention;
FIG. 4 is a schematic view of the connection structure of the outer frame of the present invention;
FIG. 5 is a schematic top cross-sectional view of the gas directing mechanism of the present invention;
fig. 6 is an enlarged view of the structure at a in fig. 3 according to the present invention.
Wherein: the heat-conducting plate comprises a waterproof layer-1, a circuit board body-2, a green oil layer-4, a heat-radiating mechanism-3, a dustproof mechanism-5, an inserting plate-31, an inserting groove-32, an outer frame-33, a rubber sheet-34, a mounting plate-35, an air-guiding mechanism-36, a heat-conducting plate-37, a heat-radiating hole-38, a heat-conducting rod-39, a heat-radiating fin-310, a mounting groove-361, a threaded pipe-362, a fixed pipe-363, a vent pipe-364, a pre-embedded groove-365, a pull plate-51, a clamping rod-52, a micro spring-53, a convex plate-54, a connecting groove-55 and a U-shaped dustproof cover-56.
Detailed Description
The present invention will be described in detail below with reference to fig. 1 to 6, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, the present invention provides a multilayer circuit board with rapid heat dissipation by improvement, including a waterproof layer 1 and a circuit board body 2, wherein the waterproof layer 1 is disposed on top of a green oil layer 4, and the green oil layer 4 is coated on top end surface of the circuit board body 2.
Referring to fig. 3 and 4, the present invention provides a multi-layer circuit board with rapid heat dissipation by improvement, wherein a heat dissipation mechanism 3 and a dust prevention mechanism (5) are disposed on the outer side of a circuit board body 2, the heat dissipation mechanism 3 includes an insertion plate 31, an insertion slot 32, an outer frame 33, a rubber sheet 34, a mounting plate 35, an air guide mechanism 36, a heat conduction plate 37, a heat dissipation hole 38, a heat conduction rod 39 and a heat dissipation fin 310, the insertion plate 31 is disposed on the top of the left and right ends of the inner side of the outer frame 33, the insertion plate 31 is locked inside the insertion slot 32 disposed in the middle of the left and right ends of the circuit board body 2, the rubber sheet 34 is adhered on the left and right ends of the inner side of the outer frame 33, the rubber sheet 34 is adhered on the side surface of the circuit board body 2, the top end surface of the rubber sheet 34 is flush with the top end surface of the outer frame 33, the thickness of the rubber sheet 34 is 0.1cm to 0.2cm, the appearance is improved, the mounting plate 35 is disposed on the bottom of the left and right ends of the outer frame 33, the top end surface of the mounting plate is provided with a strip-shaped hole, and the strip-shaped holes are arranged at the front end and the rear end of the top of the mounting plate 35 to facilitate the stable mounting of the mounting plate 35, the air guide mechanism 36 is arranged at the bottom end inside the outer frame 33, the heat conducting plate 37 is fixedly arranged at the middle part of the inner side of the outer frame 33, the heat conducting plate 37 is tightly attached to the bottom end surface of the circuit board body 2, the heat dissipation holes 38 penetrate through the upper end surface and the lower end surface of the heat conducting plate 37, the heat dissipation holes 38 are distributed at equal intervals more than two on the top end surface of the heat conducting plate 37, the heat dissipation efficiency of the circuit board body 2 is improved, the heat conducting rods 39 are arranged on the top end surface of the heat conducting plate 37, the heat conducting rods 39 are matched with the inner sides of the grooves formed on the bottom end surface of the circuit board body 2, the heat conducting rods 39 are arranged at equal intervals more than two on the top end surface of the heat conducting plate 37, the bottom end surface of the circuit board body 2 is provided with corresponding grooves, the heat conducting efficiency of the circuit board body is improved, the upper end surface and the lower end surface of the heat dissipation fins 310 are respectively connected with the top end surface of the heat conducting plate 37 and the inner side of the outer frame 33, the side surfaces of the radiator fins 310 are perpendicular to the bottom surface of the heat conductive plate 37 and the bottom surface of the inner side of the outer frame 33, so as to facilitate the circulation of air over the outer surfaces of the radiator fins 310.
Referring to fig. 5, the air guide mechanism 36 includes a mounting groove 361, a threaded pipe 362, a fixed pipe 363, a ventilation pipe 364 and a pre-buried groove 365, the mounting groove 361 is disposed at the bottom end inside the outer frame 33, the threaded pipe 362 is disposed in the middle of the rear end surface of the fixed pipe 363, the threaded pipe 362 and the fixed pipe 363 are both disposed at the left and right ends of the bottom of the rear end surface of the outer frame 33, the two fixed pipes 363 are respectively connected to the head and tail ends inside the ventilation pipe 364 for conveying and discharging the cold air inside the ventilation pipe 364, the fixed pipe 363 is embedded in the bottom of the rear end surface of the outer frame 33, the ventilation pipe 364 is adhered to the inside of the pre-buried groove 365, the inside of the ventilation pipe 364 is connected to the front end inside the fixed pipe 363, and the pre-buried groove 365 is disposed on the inside surface of the mounting groove 361.
Referring to fig. 6, the present invention provides a multi-layer circuit board with a fast heat dissipation function through an improvement, wherein the dustproof mechanism includes a pulling plate, a clamping rod, a micro spring, a protruding plate, a connecting groove and a U-shaped dust cover, the pulling plate is disposed in the middle of the right end surface of the clamping rod, the clamping rod penetrates through the top of the outer side of the outer frame, the clamping rod movably extends into the inner side of the clamping groove formed in the middle of the outer side of the protruding plate, two ends of the micro spring are respectively connected to the top of the left end surface of the pulling plate and the top of the right end surface of the outer frame, the inner end surface of the micro spring is movably connected to the side surface of the clamping rod, the protruding plate is disposed at the left and right ends of the bottom end surface of the U-shaped dust cover, the protruding plate tightly extends into the inner side of the connecting groove, the connecting groove is disposed at the left and right ends of the top end surface of the outer frame, and the top end surface of the inner side of the U-shaped dust cover covers the waterproof layer.
The utility model provides a quick heat-radiating multilayer circuit board through improvement, and the working principle is as follows;
firstly, the whole device is placed at a designated position, and the outer frame 33 can be fixedly arranged at the designated position through a strip-shaped hole at the top of the mounting plate 35;
secondly, the circuit board body 2 can drive the waterproof layer 1 and the green oil layer 3 to move, the slot 32 is aligned to the inserting plate 31 to be placed, then the circuit board body 2 is continuously moved to drive the slot 32 to move, when the front end face and the rear end face of the circuit board body 2 are aligned to the front end face and the rear end face of the outer frame 33, the circuit board body 2 is stopped to be pushed, and then the inserting plate 31 and the circuit board body 2 are fixedly connected by bolts with corresponding models;
thirdly, the electronic components can be mounted correspondingly on the top of the circuit board body 2, when the electronic components on the top of the circuit board body 2 are mounted, the electronic components can be used, and when the electronic components are used, the amount of external dust falling onto the electronic components can be reduced through the U-shaped dust cover 56;
fourthly, in the using process of the circuit board, the threaded pipe 362 is connected to an external air-conditioning device, then the external air-conditioning device guides the cool air into the threaded pipe 362, the cool air passes through the threaded pipe 362 and the fixed pipe 363 and then circulates inside the ventilation pipe 364, so that the temperature of the heat dissipation fins 310 is reduced, meanwhile, the heat conduction plate 37 and the heat conduction rod 39 conduct the heat of the circuit board body 2, then the heat is quickly dissipated through the plurality of heat dissipation fins 310, and the heat dissipation efficiency of the circuit board body 2 can be further improved through the heat dissipation holes 37 in the heat dissipation process of the circuit board body 2.
The utility model provides a multi-layer circuit board capable of fast radiating through improvement, a threaded pipe 362 is connected to external air-conditioning equipment, then the air-conditioning equipment guides the air-conditioning to the threaded pipe 362, the air-conditioning circulates in the inner side of an air pipe 364 after passing through the threaded pipe 362 and a fixed pipe 363, thereby reducing the temperature of a radiating fin 310, meanwhile, a heat conducting plate 37 and a heat conducting rod 39 conduct the heat of a circuit board body 2, then the heat is fast radiated through a plurality of radiating fins 310, the radiating efficiency of the circuit board body 2 can be further improved through a radiating hole 37 in the process of radiating the circuit board body 2, the circuit board in the use process is fast radiated, the beneficial effect of prolonging the service life of the circuit board is achieved, more than two radiating holes 38 are distributed on the top end surface of the heat conducting plate 37 at equal intervals, and the radiating holes 38 and the heat conducting rod 39 are distributed in a staggered way, the heat dissipation efficiency of the circuit board body 2 is improved.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A multilayer circuit board capable of rapidly dissipating heat comprises a waterproof layer (1) and a circuit board body (2), wherein the waterproof layer (1) is arranged at the top of a green oil layer (4), and the green oil layer (4) is coated on the top end face of the circuit board body (2);
the method is characterized in that: still include heat dissipation mechanism (3) and dustproof mechanism (5), heat dissipation mechanism (3) and dustproof mechanism (5) set up in the circuit board body (2) outside, heat dissipation mechanism (3) includes picture peg (31), slot (32), frame (33), sheet rubber (34), mounting panel (35), air guide mechanism (36), heat-conducting plate (37), louvre (38), heat-conducting rod (39) and radiating fin (310), picture peg (31) set up in both ends top about frame (33) inboard, and picture peg (31) closure slot (32) inboard of seting up in the middle part of both ends about circuit board body (2), sheet rubber (34) paste both ends about frame (33) inboard, and sheet rubber (34) laminate in circuit board body (2) side surface, mounting panel (35) set up in both ends bottom about frame (33), air guide mechanism (36) set up in the inside bottom of frame (33), heat-conducting plate (37) fixed mounting is in the inboard middle part of frame (33), and heat-conducting plate (37) hug closely in circuit plate body (2) bottom face, louvre (38) link up in heat-conducting plate (37) terminal surface from top to bottom, heat-conducting rod (39) set up in heat-conducting plate (37) top face, and heat-conducting rod (39) coincide in the recess inboard that circuit plate body (2) bottom face was seted up, heat radiation fins (310) up the terminal surface from top to bottom are connected in heat-conducting plate (37) top face and frame (33) inboard bottom face respectively.
2. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: air guide mechanism (36) are including mounting groove (361), screwed pipe (362), fixed pipe (363), breather pipe (364) and buried groove (365), the inside bottom of frame (33) is seted up in mounting groove (361), screwed pipe (362) set up in fixed pipe (363) rear end face middle part, fixed pipe (363) are embedded in frame (33) rear end face bottom, breather pipe (364) are pasted in buried groove (365) inboard, and breather pipe (364) inboard links up in fixed pipe (363) inboard front end, buried groove (365) are seted up in mounting groove (361) inboard bottom face.
3. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: the dustproof mechanism (5) comprises a pulling plate (51), a clamping rod (52), a micro spring (53), a convex plate (54), a connecting groove (55) and a U-shaped dustproof cover (56), the pulling plate (51) is arranged in the middle of the right end face of the clamping rod (52), the clamping rod (52) penetrates through the top of the outer side of the outer frame (33), and the clamping rod (52) movably extends into the inner side of a clamping groove formed in the middle of the outer side of the convex plate (54), two ends of the miniature spring (53) are respectively connected with the left end surface of the pulling plate (51) and the top of the right end surface of the outer frame (33), and the inner end surface of the micro spring (53) is movably connected with the side surface of the clamping rod (52), the convex plates (54) are arranged at the left end and the right end of the bottom end surface of the U-shaped dust cover (56), the convex plate (54) tightly extends into the inner side of the connecting groove (55), the connecting groove (55) is arranged at the left end and the right end of the top end surface of the outer frame (33), the top end surface of the inner side of the U-shaped dust cover (56) covers the top end surface of the waterproof layer (1).
4. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: strip-shaped holes are formed in the top end face of the mounting plate (35), and two ends of the strip-shaped holes are arranged at the front and the rear of the top of the mounting plate (35).
5. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: the heat dissipation holes (38) are distributed on the top end face of the heat conduction plate (37) at equal intervals, and the heat dissipation holes (38) and the heat conduction rods (39) are distributed in a staggered mode.
6. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: the heat conducting rods (39) are arranged at equal intervals and are more than two lines of top end surfaces of the heat conducting plates (37), and corresponding grooves are formed in the bottom end surfaces of the circuit board bodies (2).
7. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: the top end face of the rubber sheet (34) is flush with the top end face of the outer frame (33), and the thickness of the rubber sheet (34) is 0.1 cm-0.2 cm.
8. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein: the side surfaces of the radiating fins (310) are perpendicular to the bottom end surface of the heat conducting plate (37) and the bottom end surface of the inner side of the outer frame (33).
9. The multilayer circuit board for rapid heat dissipation according to claim 2, wherein: the threaded pipe (362) and the fixed pipe (363) are respectively provided with two ends at the left end and the right end of the bottom of the rear end face of the outer frame (33), and the two fixed pipes (363) are respectively connected with the head end and the tail end of the inner side of the vent pipe (364).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122406510.7U CN216357451U (en) | 2021-10-08 | 2021-10-08 | Quick radiating multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122406510.7U CN216357451U (en) | 2021-10-08 | 2021-10-08 | Quick radiating multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216357451U true CN216357451U (en) | 2022-04-19 |
Family
ID=81174243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122406510.7U Active CN216357451U (en) | 2021-10-08 | 2021-10-08 | Quick radiating multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216357451U (en) |
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2021
- 2021-10-08 CN CN202122406510.7U patent/CN216357451U/en active Active
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