CN217564005U

CN217564005U - High-efficient radiator unit of PCB board that rigidity and flexibility combine

Info

Publication number: CN217564005U
Application number: CN202221540998.0U
Authority: CN
Inventors: 不公告发明人
Original assignee: Xi'an Fusion Materials Technology Co ltd
Current assignee: Xi'an Fusion Materials Technology Co ltd
Priority date: 2022-06-20
Filing date: 2022-06-20
Publication date: 2022-10-11
Anticipated expiration: 2032-06-20

Abstract

A rigid and flexible combined PCB high-efficiency heat dissipation assembly is used for reinforcing a rigid frame of a large-size PCB and flexibly connecting multiple power devices in parallel. The heat dissipation frame can prevent the large-size PCB from deforming when being impacted and vibrated by the outside and can increase the heat capacity of the heat dissipation system. The front ends of the flexible heat conducting strips are embedded into the heat conducting end heads, the rear ends of the flexible heat conducting strips are embedded into the heat conducting strip packaging cavities, and the seals are treated by silica gel. The heat conduction band has the characteristics of self flexibility and end customization processing, so that the heat conduction end is flexibly installed when being attached to a power device and is not influenced by high-position devices and electric fitting precision on a PCB.

Description

High-efficient radiator unit of PCB board that rigidity and flexibility combine

Technical Field

The utility model belongs to the heat management field, concretely relates to high-efficient radiator unit of PCB board of rigidity and flexible combination.

Background

In the aerospace activity, all aspects of indexes of airborne electronic equipment have strict requirements, along with the improvement of science and technology, electronic components develop towards the trend of multifunction, miniaturization and high integration level, and the heating power consumption is also obviously increased. If the heat cannot be dissipated in time, the reliability and the service life of the electronic components are reduced, and permanent thermal failure is caused in serious cases.

Traditional PCB integrated circuit board adopts cold plate radiating mode, has following several big defects: 1) In order to avoid high-level devices, the structure of the cold plate is larger, and the weight is increased; 2) The process installation is difficult, and a plurality of layers of heat conducting pads are needed to adjust the fitting degree between the heating device and the cold plate; 3) The application of the heat conducting pad (the heat conductivity is 1.9-3.0 w/m.k) and the locking strip makes the heat resistance of the heat transfer link become huge.

According to the application number: 202210178607.3 'patent of a light flexible heat transfer mechanism for realizing the heat dissipation of the plug-in PCB board card in the chassis', this PCB board card adopts the flexible heat transfer mechanism, can solve several big defects of the traditional heat dissipation cold drawing effectively, have characteristics such as light weight, little thermal resistance, easy installation. The PCB is mainly composed of FR4 layers, copper foil layers, copper clad layers and the like, and the thickness of the PCB is usually between 0.8 and 1.6 mm. However, for the heat dissipation of a plurality of power devices on a large-size PCB, the problems that the PCB is weak in shock and vibration resistance and the strength and rigidity are difficult to guarantee are mainly solved; secondly, flexible heat conducting belts connected on the multi-power device are transversely (in the length direction) arranged, so that an interference phenomenon occurs, the heat coupling between the belt bodies is serious, the temperature rise is large, and the heat transfer efficiency is influenced. Therefore, a heat dissipation mechanism with higher strength, rigidity and heat transfer efficiency is needed.

Disclosure of Invention

The purpose of the invention is as follows: for the jumbo size PCB board that solves and to put forward in the background art needs to have stronger shock-resistant vibration ability, the faster technical requirement of heat transfer efficiency, the utility model aims to provide a high-efficient radiator unit of PCB board of rigidity and flexible combination for but the rigidity frame of consolidating jumbo size PCB board and the flexible parallelly connected multi-power device. The rigid heat dissipation frame of the heat dissipation assembly can not only reinforce a large-size PCB, but also increase the heat capacity of a heat dissipation system; the flexible heat conduction belt is vertically connected to the cross beam of the heat dissipation frame in the longitudinal direction, and the interference phenomenon caused by transverse arrangement can be effectively avoided.

The technical scheme is as follows: in order to achieve the above objects, the present invention provides the following technical solutions, please refer to fig. 2, which is a schematic diagram of an efficient rigid and flexible PCB heat dissipation assembly according to an embodiment of the present application, and fig. 3 is an exploded schematic diagram of the heat dissipation assembly.

The manufacturing steps of the flexible heat conducting strip are as follows:

1, a plurality of coupling flexible heat conduction belt bodies are made of carbon series high heat conduction flexible materials, and the belt width is determined according to the size of a heating device and is formed into a heat conduction belt in a hot press molding mode;

2, reserving a section of length at the front end and the rear end of the heat conduction belt, wrapping the middle part of the heat conduction belt by a high-temperature resistant film, then wrapping the middle part of the heat conduction belt by a heat radiation resistant material, finally sleeving an insulating corrosion-resistant heat shrinkage film, and blowing the heat shrinkage film to enable the heat shrinkage film to be tightly attached to the inner material by using a hot air gun;

and 3, array holes with the interval of 5mm and the aperture of phi 2 are arranged on the belt body reserved at the front end and the rear end of the heat conduction belt.

The manufacturing steps of the heat conduction end and the heat dissipation frame are as follows:

1] the heat-conducting terminal is divided into two parts, namely a terminal base and a terminal cover plate, the structure of the heat-conducting terminal is designed according to the upper surface of a power device, and materials include but are not limited to metal and heat-conducting ceramic;

2] array columns with the interval of 5mm, the diameter of phi 2mm and the height of 1.5mm are arranged in the end socket base;

3, reasonably designing a heat dissipation frame structure according to the PCB, wherein the material comprises but is not limited to copper and aluminum alloy;

4, array columns with the spacing of 5mm, the diameter of phi 2mm and the height of 1.5mm are also arranged in the packaging cavity of the heat dissipation frame;

embedding a belt body reserved at the front end of the heat conduction belt into the heat conduction end head, and pressing and packaging through a hot pressing process; a belt body reserved at the rear end is embedded into the heat conduction belt packaging cavity, is packaged in a pressing and welding mode, and is sealed at an outlet of an end head by adopting silica gel;

and 6, threaded holes are formed in two sides of the heat dissipation frame and used for mounting the PCB.

The heat dissipation assembly consists of a rigid heat dissipation frame, a plurality of coupling flexible heat conduction belts and heat conduction end heads. The heat dissipation frame and the PCB are fixed in a screw connection mode, and then the heat conduction end head and the power device are fixedly connected in a gluing mode, so that heat transfer from the power device to the heat dissipation frame is completed.

Has the beneficial effects that:

1) The heat dissipation assembly adopts the heat conduction belt with low density and high heat conduction to replace the traditional metal cold plate, can realize great weight reduction, can quickly transfer heat to a heat dissipation frame, and reduces the temperature of a power device;

2) The heat conduction belt has the characteristics of self flexibility and customized processing of the heat conduction end, and is flexible to mount when the heat conduction end is attached to the power device, and is not influenced by the precision of high-position devices and electric fittings on a PCB.

Compared with the prior art, the invention has the advantages that:

1) The rigid heat dissipation frame adopted by the technical scheme of the utility model is provided with the beam in the middle and the heat conduction belt packaging cavity on the beam, which not only can effectively enhance the strength of the PCB board card and bear the impact vibration influence of the outside, but also can increase the heat capacity of the heat dissipation system;

2) The utility model discloses many coupling flexible heat conduction areas that technical scheme adopted can vertically connect in heat dissipation frame's crossbeam, and the structure that can effectively solve transversal arrangement appearance is interfered, the heat is gathered more seriously.

Description of the drawings:

fig. 1 is a schematic view illustrating the installation of a large-sized PCB board in a chassis provided by the present invention;

fig. 2 is a schematic view of a rigid and flexible PCB high efficiency heat dissipation assembly provided in the present invention;

fig. 3 is an exploded view of the heat sink assembly provided by the present invention;

the drawings are as follows:

1-a chassis; 2-a card slot; 3-wedge-shaped locking strips; 4-PCB board card; 5-a heat dissipation component; 6-PCB board; 7-a power device; 8-a heat dissipation frame; 9-end base; 10-a flexible thermally conductive strip; 11-end cover plate; 12-packaging an upper cover; 13-a threaded hole; and 14, packaging the cavity by using the heat conduction tape.

The specific implementation mode is as follows:

in order to make the objects and technical solutions of the present invention more simple and clear, the present invention will be further described in detail with reference to the accompanying drawings and the detailed description, but should not be construed as limiting the present invention. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

The specific implementation mode mainly comprises the following three parts, namely manufacturing and processing of the heat dissipation frame 8, reasonably designing the structure of the heat dissipation frame according to the size of the PCB 6 and the height of a device, wherein the length and the width are 280mm 120mm 15mm, processing a piece of copper into the shape of the heat dissipation frame 8 by adopting a CNC machining or other modes, and arranging a countersunk threaded hole 13 and a hole diameter size M3 for mounting the PCB 6.

And secondly, processing and manufacturing a heat conduction end, wherein the heat conduction end is divided into an end base 9 and an end cover plate 11. According to the size of the upper surface of the power device 7, the size of a contact surface of the power device 7 and a heat conduction end is determined to be 34mm 32mm, so that the size of the end base 9 is 34mm 32mm 2.75mm, the internal hollow depth is 1.5mm, the end base is provided with array small cylinders with the intervals of 5mm, the diameter of 2mm and the height of 1.5mm, the size of the end cover plate 11 is 34mm 32mm 1.25mm, and 6063-T5 aluminum alloy is processed according to the structural size in a machining mode.

And finally, manufacturing a flexible heat conduction belt, wherein the size of the heat conduction belt 10 is designed to be 70mm x 29mm x 1.5mm according to the size of the inner cavity of the end base 9 and the distance from the heating device 7 to the heat dissipation frame 8. The front end and the rear end of the heat conduction belt are reserved with a section of length, the middle part is firstly coated with a high-temperature-resistant film, then is coated with a heat radiation resistant material, finally is sleeved with an insulating corrosion-resistant heat shrinkage film, and is blown to be tightly attached to an internal material by using a hot air gun, and the heat conduction belt is respectively matched with the heat conduction belt in a punching way according to the array small cylindrical structures in the heat conduction belt packaging cavity 14 and the end socket base 9.

The front end of the manufactured flexible heat conducting strip 10 is embedded into the end socket base 9 and is compacted and welded by the end socket cover plate 11, and the rear end of the manufactured flexible heat conducting strip is embedded into the heat conducting strip packaging cavity 14 and is compacted and welded by the packaging upper cover 12. Then, the PCB 6 is fixedly connected through the threaded hole 13, and the heat conducting end head and the heating device 7 are fixed in a bonding mode to form the PCB card 4. And coating heat-conducting silicone grease on the contact surface of the heat-radiating frame 8 and the case clamping groove 2, and finally screwing the wedge-shaped locking strip 3 to fix the PCB (printed circuit board) card 4 in the case.

Claims

1. A rigid and flexible combined PCB board high-efficiency heat dissipation assembly is used for reinforcing a rigid frame of a large-size PCB board and flexibly connecting multiple power devices in parallel, and is composed of a rigid heat dissipation frame, a plurality of coupled flexible heat conduction belts and heat conduction end heads.

2. The heat removal assembly of claim 1, wherein said thermally conductive tip is characterized by:

the heat conducting end is divided into an end base and an end cover plate and is made of metal and heat conducting ceramic;

array small cylinders with the interval of 5mm, the diameter phi 2 and the height of 1.5mm are also arranged in the end socket;

the front end of the heat conduction belt body is embedded into the heat conduction end head, and is pressed and packaged through a hot pressing process;

the heat conducting end is directly jointed with the heating device on the PCB and can be fixedly connected by adopting a gluing or screwing mode.

3. The heat removal assembly of claim 1, wherein the plurality of coupled flexible thermally conductive strips are characterized by:

the number of the plurality of coupled flexible heat conducting strips is consistent with that of the power devices on the PCB;

the heat conducting belt body is made of carbon series high heat conducting flexible material, a section of length is reserved at the front end and the rear end of the belt body, and the middle section is sealed and coated in a multi-layer mode by adopting insulating and heat insulating films;

the strip material has a surface thermal conductivity of greater than 800w/m x k, a vertical thermal conductivity of greater than 45 w/m x k, and a density of not greater than 2.0g/cm ³ ；

The reserved belt bodies at the front end and the rear end of the heat conduction belt are provided with array holes with the spacing of 5mm and the aperture of phi 2.

4. The heat dissipating assembly of claim 1, wherein a cross member is provided in the middle of the rigid heat dissipating frame to withstand impact vibration from the external environment, prevent bending deformation, and increase heat capacity of the heat dissipating system.

5. The heat dissipating assembly of claim 1, wherein the heat conducting strip has a certain flexibility, and the heat conducting tip is easy to mount when attached to the power device, and is not affected by interference of a high-level device.

6. The heat dissipating assembly of claim 1, wherein during heat transfer, heat generated by the power device is transferred to the heat dissipating frame via the heat conducting tips and the flexible heat conducting strips that are not in heat exchange with the outside.