CN210005996U - shielding and heat dissipation structure - Google Patents
shielding and heat dissipation structure Download PDFInfo
- Publication number
- CN210005996U CN210005996U CN201921005832.7U CN201921005832U CN210005996U CN 210005996 U CN210005996 U CN 210005996U CN 201921005832 U CN201921005832 U CN 201921005832U CN 210005996 U CN210005996 U CN 210005996U
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- Prior art keywords
- shielding
- heat
- heat dissipation
- shell
- copper block
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- 230000017525 heat dissipation Effects 0.000 title claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229910001369 Brass Inorganic materials 0.000 claims description 12
- 239000010951 brass Substances 0.000 claims description 12
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 7
- -1 silver-aluminum Chemical compound 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 235000014676 Phragmites communis Nutrition 0.000 description 6
- ZHBBDTRJIVXKEX-UHFFFAOYSA-N 1-chloro-2-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2)Cl)=C1 ZHBBDTRJIVXKEX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to an electronic product accessory field specifically provides shielding heat radiation structure its structure comprises PCB board, shielding subassembly and radiator unit, the shielding subassembly sets up on the PCB board, the shielding subassembly includes shielding shell, conductive rubber strip and copper billet, on the shielding shell was fixed in the PCB board, and there was the spacing hole on the shielding shell, the copper billet passed spacing hole and was fixed mutually with the shielding shell, and the conductive rubber strip is inlayed between shielding shell and copper billet, radiator unit comprises radiator fan, fin and heat pipe, the fin passes through the heat pipe and is connected with the copper billet of shielding subassembly, radiator fan is located the fin, compare with prior art, the utility model discloses a shielding heat radiation structure has characteristics such as reasonable in design, simple structure, easy to process, convenient to use, has good value that pushes away.
Description
Technical Field
The utility model relates to an electronic product accessory field specifically provides shielding heat radiation structure.
Background
In a computer board card, high-frequency chips such as DAC chips are often used, and such chips can generate high-frequency electromagnetic waves in the operation process of the board card and generate electromagnetic interference on a circuit of the computer board card, so that the chips need to be shielded in the design of the board card. The traditional shielding case is formed by shielding a chip by a metal sheet shell, and the shell is fixed with a PCB (printed circuit board) by welding. However, due to the characteristics of the high-frequency chip, the self heat productivity of the high-frequency chip is large, the temperature rise is fast, the natural heat dissipation space of the chip is reduced due to the shielding method, the heat transfer thermal resistance of the chip is large, and the heat dissipation requirement of the high-frequency chip cannot be met. When the temperature of the chip is too high, the performance of the high-frequency chip is affected, and the signal output quality is further affected. Meanwhile, a gap exists between the welding shell and the PCB, so that the shielding effect is reduced.
Disclosure of Invention
The utility model discloses a to the not enough of above-mentioned prior art, provide kinds of reasonable in design, simple structure, convenient and fast's shielding heat radiation structure.
The utility model provides a technical scheme that its technical problem adopted is:
kinds of shielding and heat dissipation structures are composed of a PCB board, a shielding component and a heat dissipation component;
the shielding assembly is arranged on the PCB and comprises a shielding shell, a conductive rubber strip and a copper block, the shielding shell is fixed on the PCB, a limiting hole is formed in the shielding shell, the copper block penetrates through the limiting hole and is fixed with the shielding shell, and the conductive rubber strip is embedded between the shielding shell and the copper block;
the heat dissipation assembly is composed of a heat dissipation fan, a heat dissipation sheet and a heat pipe, the heat dissipation sheet is connected with the copper block of the shielding assembly through the heat pipe, and the heat dissipation fan is located on the heat dissipation sheet.
, the shielding component further comprises a beryllium copper reed which is welded at the bottom end of the shielding shell and fixed with the PCB on the lower PCB by covering copper.
, the shield assembly further includes a thermal pad disposed at the end of the copper block inside the shield shell.
And , processing a limit boss in the middle of the copper block, wherein the top surface of the limit boss is closely attached to the top surface of the shielding shell and is fixed by a bolt.
Preferably, the conductive rubber strip is embedded between the top surface of the shielding shell and the top surface of the limiting boss.
Preferably, the shielding shell and the PCB are fixed by flange connection.
, a heat pipe fixing groove is formed in the upper surface of the copper block, and the heat absorbing part of the heat pipe is fixed with the heat pipe fixing groove of the copper block in a brazing mode.
Preferably, the heat sink is a pin fin heat sink.
Preferably, the conductive rubber strip is a silver-aluminum conductive rubber strip.
Preferably, the shielding shell is an aluminum alloy shielding shell; the copper block is brass.
Compared with the prior art, the shielding heat radiation structure of the utility model has the following outstanding beneficial effects:
1. the utility model discloses can be very big reduce the thermal resistance on the chip heat transfer route, with the quick conduction to the fin of the heat that the chip during operation produced, including radiator fan's work, greatly reduced chip operating temperature improves the chip reliability.
2. Beryllium copper reed is welded at the bottom of the shielding shell of the shielding assembly, so that the gap between the shielding shell and the copper clad of the PCB can be filled, and the shielding efficiency is improved.
3. The shielding shell is fixed with the PCB through the flange, and the shielding shell is connected with the copper block through the bolt, so that the dismounting is convenient, and the maintenance of the chip is convenient.
4. The heat pipe adopts a metal pipe body with sintered copper powder inside, has the characteristics of light weight and rapid temperature equalization, and has excellent heat conduction performance.
5. The conductive rubber strip is adopted, so that the electromagnetic shielding function of high-frequency electromagnetic waves generated in the operation process of the board card is achieved, and the conductive rubber strip has good conductive performance.
6. Has the characteristics of reasonable design, simple structure, easy processing, convenient use and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a shielding heat dissipation structure;
FIG. 2 is a schematic structural diagram of the heat dissipation assembly of FIG. 1;
FIG. 3 is a schematic view of the shield assembly of FIG. 1 mounted to a PCB board;
fig. 4 is a cross-sectional view of the shield assembly of fig. 3 mounted to a PCB.
The reference numerals in the drawings denote:
1. the heat pipe comprises a shielding component, 2, a heat dissipation component, 3, a heat pipe, 4, a pin fin heat dissipation sheet, 5, a heat dissipation fan, 6, a PCB (printed circuit board), 7, a shielding shell, 8, a flange, 9, brass, 10, a beryllium copper reed, 11, a silver-aluminum conductive rubber strip, 12, a PCB copper-clad layer, 13, a heat conduction silica gel pad, 14, a heating chip, 15 and a heat pipe fixing groove.
Detailed Description
The invention will now be described with reference to the drawings and specific examples , but not as a limitation on the invention.
In the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, left, and right" generally means upper, lower, left, and right as illustrated with reference to the accompanying drawings; "inner and outer" refer to the inner and outer relative to the profile of the components themselves.
The following are preferred embodiments:
as shown in fig. 1, 2, 3, and 4, the shielding and heat dissipating structure in this embodiment is composed of a PCB 6, a shielding assembly 1, and a heat dissipating assembly 2, wherein the shielding assembly 1 is disposed on the PCB 6, and the shielding assembly 1 is fixedly connected to the heat dissipating assembly 2 by soldering.
The shielding assembly 1 is composed of a shielding shell 7, a silver-aluminum conductive rubber strip 11, brass 9, a beryllium copper reed 10 and a heat-conducting silicone pad 13. The shielding shell 7 is rectangular with a limiting hole in the middle, is formed by milling, is made of aluminum alloy and is fixedly connected to the PCB 6 through a flange 8. Brass 9 is the cross, is spacing boss in the middle of brass 9, just in time can place in the spacing hole of shielding shell 7, and spacing boss top surface and 7 top surfaces of shielding shell are hugged closely to pass through the bolt fastening. A groove with the depth of 1mm is machined in the periphery of the top surface of the limiting boss in the middle of the brass 9, and the silver-aluminum conductive rubber strip 11 is embedded in the groove in the top surface of the limiting boss in the middle of the brass 9 and is closely attached to the top surface of the shielding shell 7. The silver-aluminum conductive rubber strip 11 has an efficiency of shielding high frequency electromagnetic waves of 40dB, and the silver-aluminum conductive rubber strip 11 has a compression amount of 30%. The upper surface of the brass 9 is provided with a heat pipe fixing groove 15, and the heat absorption part of the heat pipe 3 is fixedly connected with the heat pipe fixing groove 15 of the brass 9 in a brazing mode to conduct heat. The lower end of the lower part of the brass 9 is provided with a heat-conducting silica gel pad 13, the heat-conducting silica gel pad 13 is made of silica gel serving as a base material and added with metal oxide, and is matched with the heating chip 14 at the lower end to rapidly conduct heat into the brass 9, so that the shell temperature and the junction temperature of the heating chip 14 are greatly reduced. The beryllium copper reed 10 is welded at the bottom end of the shielding shell 7, and the beryllium copper reed 10 can be tightly combined with the PCB copper-clad plate 12 on the PCB 6 under the action of structural force, so that the shielding efficiency is improved.
The heat dissipation assembly 2 is composed of a heat dissipation fan 5, pin fin heat dissipation fins 4 and heat pipes 3, the heat dissipation assembly 2 in the embodiment is a cube, the heat dissipation fan 5 is located above the pin fin heat dissipation fins 4, and the heat pipes 3 are metal pipe bodies with the inner portions sintered with copper powder, the diameter of the heat pipes is 6mm, and the metal pipe bodies are flattened to be 3 mm.
The above-mentioned embodiments are only kinds of preferred embodiments of the present invention, and the general changes and substitutions performed by those skilled in the art within the technical scope of the present invention should be included in the protection scope of the present invention.
Claims (10)
1, shielding heat dissipation structure, which is characterized in that the structure is composed of a PCB board, a shielding component and a heat dissipation component;
the shielding assembly is arranged on the PCB and comprises a shielding shell, a conductive rubber strip and a copper block, the shielding shell is fixed on the PCB, a limiting hole is formed in the shielding shell, the copper block penetrates through the limiting hole and is fixed with the shielding shell, and the conductive rubber strip is embedded between the shielding shell and the copper block;
the heat dissipation assembly is composed of a heat dissipation fan, a heat dissipation sheet and a heat pipe, the heat dissipation sheet is connected with the copper block of the shielding assembly through the heat pipe, and the heat dissipation fan is located on the heat dissipation sheet.
2. The kinds of shielding and heat dissipating structures of claim 1, wherein the shielding assembly further comprises a beryllium copper spring plate welded to the bottom end of the shielding case and fixed to a copper clad of the PCB on the lower PCB.
3. The kind of shielding and heat dissipating structure of claim 1 or 2, wherein the shielding assembly further comprises a thermal pad disposed at the end of the copper block inside the shielding case.
4. The kinds of shielding and heat dissipating structures of claim 3, wherein a limiting boss is formed at the middle of the copper block, and the top surface of the limiting boss is closely attached to the top surface of the shielding case and fixed by bolts.
5. The kinds of shielding and heat dissipating structures of claim 4, wherein the conductive rubber strip is embedded between the top surface of the shielding case and the top surface of the position-limiting protrusion.
6. The kinds of shielding and heat dissipating structures of claim 5, wherein the shielding case is fixed to the PCB by flange connection.
7. The kinds of shielding and heat dissipating structures of claim 1, wherein the copper block has heat pipe fixing grooves on its upper surface, and the heat absorbing part of the heat pipe is soldered to the heat pipe fixing grooves of the copper block.
8. The kinds of shielding and heat dissipating structure of claim 1, wherein said heat sink is a pin fin heat sink.
9. The kinds of shielding and heat dissipating structures of claim 1, wherein the conductive rubber strips are silver-aluminum conductive rubber strips.
10. The shielded heat sink structure of claim 1, wherein:
the shielding shell is an aluminum alloy shielding shell;
the copper block is brass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921005832.7U CN210005996U (en) | 2019-07-01 | 2019-07-01 | shielding and heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921005832.7U CN210005996U (en) | 2019-07-01 | 2019-07-01 | shielding and heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210005996U true CN210005996U (en) | 2020-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921005832.7U Active CN210005996U (en) | 2019-07-01 | 2019-07-01 | shielding and heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210005996U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114546077A (en) * | 2022-02-22 | 2022-05-27 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic equipment |
-
2019
- 2019-07-01 CN CN201921005832.7U patent/CN210005996U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114546077A (en) * | 2022-02-22 | 2022-05-27 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic equipment |
| CN114546077B (en) * | 2022-02-22 | 2023-11-17 | Oppo广东移动通信有限公司 | Radiating assembly and electronic equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230406 Address after: 250000 building S02, No. 1036, Langchao Road, high tech Zone, Jinan City, Shandong Province Patentee after: Shandong Inspur Scientific Research Institute Co.,Ltd. Address before: No. 1036, Shandong high tech Zone wave road, Ji'nan, Shandong Patentee before: INSPUR GROUP Co.,Ltd. |