CN208638869U - A kind of radiator structure - Google Patents
A kind of radiator structure Download PDFInfo
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- CN208638869U CN208638869U CN201821119765.7U CN201821119765U CN208638869U CN 208638869 U CN208638869 U CN 208638869U CN 201821119765 U CN201821119765 U CN 201821119765U CN 208638869 U CN208638869 U CN 208638869U
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- heat transfer
- plate
- unit piece
- transfer unit
- heat
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Abstract
The utility model relates to a kind of radiator structures, including shell, the heat source plate of the compositions such as wiring board is disposed in shell, heat transfer plate is arranged between the shell and heat source plate, the side plate face of the heat transfer plate is bonded with shell, is disposed with heat transfer unit piece in another lateral plates, and the heat transfer unit piece global shape is tile and its extrados and heat source plate collision type cooperate.Compared with prior art, the radiator structure core of the utility model is the design of the heat transfer unit piece of tile, the extrados and heat source plate collision type of heat transfer unit piece cooperate, this tile type structure has elasticity appropriate, to avoid the circuit destroyed on heat source plate, and since globoidal structure is adapted to the rough plate face of heat source plate, this is greatly lowered requirement of the product to the machining accuracy of components, to reduce production cost.
Description
Technical field
The utility model belongs to technical field of heat dissipation.
Background technique
With the development of integrated technology and microelectronic packaging technology, the general power and density of electronic component constantly increase,
And the physical size of electronic component and electronic equipment is gradually intended to small-sized, micromation, generated heat accumulates rapidly,
The heat flow density around integrated device is caused also to increase, so, hot environment will influence whether electronic component and equipment
Performance, this just needs more efficient thermal control scheme.Therefore, the heat dissipation problem of electronic component has become Current electronic member
One large focal spot of device and electronic equipment manufacturing.
There are mainly two types of modes for the heat dissipation of electronic product currently on the market: one is directly connect to generate heat by product casing
Chip, it is directly thermally conductive；Two, increase the heat-conducting mediums such as silica gel, silicone grease among product casing and euthermic chip, it is thermally conductive by these
Medium radiates.Although first way has certain heat dissipation effect, relatively more passive, effect is not satisfactory；And second
Mode improves heat dissipation effect although increasing heat-conducting medium carries out hot transmitting to a certain extent, and service life is shorter, and
Deformation easy to aging is used for a long time, thus influences the service performance of electronic product.And above two radiating mode is to shell
Requirement on machining accuracy it is very high, thus processing cost can correspondingly increase.
Utility model content
The purpose of this utility model is to provide a kind of good heat dissipation effects, the heat dissipation knot low to product casing required precision
Structure.
To achieve the above object, the utility model adopts the technical scheme that a kind of radiator structure, including shell, shell
It is disposed with the heat source plate of the compositions such as wiring board in vivo, heat transfer plate is arranged between the shell and heat source plate, the heat transfer plate
Side plate face is bonded with shell, is disposed with heat transfer unit piece in another lateral plates, and the heat transfer unit piece global shape is tile
Shape and the cooperation of its extrados and heat source plate collision type.
Compared with prior art, the radiator structure core of the utility model is the design of the heat transfer unit piece of tile,
The extrados and heat source plate collision type of heat transfer unit piece cooperate, and this tile type structure has elasticity appropriate, to avoid destruction
Circuit on heat source plate, and since globoidal structure is adapted to the rough plate face of heat source plate, this is greatly lowered production
Requirement of the product to the machining accuracy of components, to reduce production cost.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model；
Fig. 2 is the schematic perspective view of heat dissipation version；
In figure:
10: shell 20: heat source plate 30: heat transfer plate 31: heat-sink unit piece 32: square hole
Specific embodiment
With reference to the accompanying drawing, the embodiment of the utility model is illustrated.
A kind of radiator structure, including shell 10 are disposed with the heat source plate 20 of the compositions such as wiring board, the shell in shell 10
Heat transfer plate 30 is arranged between body 10 and heat source plate 20, the side plate face of the heat transfer plate 30 is bonded with shell 10, another lateral plates
On be disposed with heat transfer unit piece 31,31 global shape of heat transfer unit piece is tile and its extrados and heat source plate 20 contradict
Formula cooperation.
Preferably, the heat transfer unit piece 31 is connected on the heat transfer plate 30 in suspension shape.This arrangement side
Whether formula can increase the shock resistance of heat transfer unit piece, and when cooperating with heat source plate collision type, put down to the plate face of heat source plate
Whole, the regular too big requirement of nothing, further reduces the requirement of the machining accuracy to correlation unit part.
Preferably, the heat transfer unit piece 31 is that punch forming obtains on the copper sheet of Heat Conduction Material, punching back plate
The hole portion region 32 being integrally square, the whole arc-shaped tile of heat transfer unit piece 31 and one side straight flange and side are left out on face
The a side in the hole portion region 32 of shape is along holding disjunctor.Metallic copper is as Heat Conduction Material, compared to other metal materials such as iron, aluminium
Deng thermal coefficient is much higher, better heat-radiation effect.The punch forming on copper sheet of heat transfer unit piece, not only production is simple, section
Material saving, and heat transfer unit piece and heat transfer plate is in an entirety, more stable, the heat transfer unit piece elasticity stamped out in structure
Also more preferable.
Preferably, the heat transfer unit piece 31 is evenly arranged on the heat transfer plate 30.Heat transfer unit piece on heat transfer plate
Be have it is a certain number of, to ensure that itself and heat source plate have enough contacts area, while these uniform cloth of heat transfer unit piece
It sets on heat transfer plate, to guarantee that forming access between unit piece can make air form convection current, further enhance heat dissipation effect.
Compared with prior art, the metallic copper that the radiator structure of the utility model selects thermal conductivity high as making material,
Thermal expansion coefficient is smaller, and thermal conductivity is bigger, therefore better heat-radiation effect；And compared to traditional high molecular material, copper metal
The thermal expansion coefficient of material is smaller, is unlikely to deform, non-aging；The core of the utility model is the suspension watt of heat transfer unit piece
Laminated structure, more preferable than the heat-transfer effect of conventional polymer elastic material, damping performance is more excellent, is fully able to meet electronic product
It minimizes, the design requirement of ultrathin, great craftsmanship and usability, and more to the requirement on machining accuracy of each component of product
It is low, it obtains from process equipment and process flow and simplifies to a certain extent, production is simple, and it is applied widely, electronic product is dissipated
The development of hot system has very big impetus.
Claims (4)
1. a kind of radiator structure, including shell (10), the interior heat source plate (20) for being disposed with the compositions such as wiring board of shell (10) is special
Sign is: arranging heat transfer plate (30) between the shell (10) and heat source plate (20), the side plate face of the heat transfer plate (30)
It is bonded, is disposed in another lateral plates heat transfer unit piece (31) with shell (10), heat transfer unit piece (31) global shape is
Tile and the cooperation of its extrados and heat source plate (20) collision type.
2. radiator structure according to claim 1, it is characterised in that: the heat transfer unit piece (31) is connected in suspension shape
On the heat transfer plate (30).
3. radiator structure according to claim 1 or 2, it is characterised in that: the heat transfer unit piece (31) is in heat conduction material
Punch forming obtains on the copper sheet of material, leaves out the hole portion region (32) being integrally square after punching in plate face 10, heat transfer
The whole arc-shaped tile of unit piece (31) and a side in one side straight flange and rectangular hole portion region (32) edge holding disjunctor.
4. radiator structure according to claim 1, it is characterised in that: the heat transfer unit piece (31) is evenly arranged in described
On heat transfer plate (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821119765.7U CN208638869U (en) | 2018-07-12 | 2018-07-12 | A kind of radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821119765.7U CN208638869U (en) | 2018-07-12 | 2018-07-12 | A kind of radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208638869U true CN208638869U (en) | 2019-03-22 |
Family
ID=65738512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821119765.7U Active CN208638869U (en) | 2018-07-12 | 2018-07-12 | A kind of radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208638869U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
-
2018
- 2018-07-12 CN CN201821119765.7U patent/CN208638869U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
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