CN218679677U - Single-layer printed circuit board based on anti-electromagnetic interference structure - Google Patents
Single-layer printed circuit board based on anti-electromagnetic interference structure Download PDFInfo
- Publication number
- CN218679677U CN218679677U CN202222714634.6U CN202222714634U CN218679677U CN 218679677 U CN218679677 U CN 218679677U CN 202222714634 U CN202222714634 U CN 202222714634U CN 218679677 U CN218679677 U CN 218679677U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- housing
- inner chamber
- electromagnetic interference
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002356 single layer Substances 0.000 title claims description 8
- 230000000694 effects Effects 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000005057 refrigeration Methods 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an individual layer printed circuit board based on anti-electromagnetic interference structure, including circuit board main part and installing frame, the left and right sides of installing frame has all seted up flutedly, one side fixedly connected with spring of recess inner chamber, the spacing fixture block of other end fixedly connected with of spring, the outside of circuit board main part is provided with the housing, spacing draw-in groove has all been seted up to the left and right sides of housing inner chamber lower extreme, the activity groove has been seted up to the one end of spacing draw-in groove inner chamber, the one end of activity inslot chamber is provided with the movable block, one side fixedly connected with ejector pad of movable block, the heat-conducting plate has been inlayed at the top of housing. The utility model discloses an effect of recess, spacing draw-in groove, spacing fixture block, spring, movable block, ejector pad and activity groove has solved current protective housing from taking anti-electromagnetic interference device and has all been installed on the circuit board through the screw, leads to the very inconvenient problem of later stage dismouting maintenance.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is an individual layer printed circuit board based on anti electromagnetic interference structure.
Background
The printed circuit board is also called a printed circuit board, and is a provider of electrical connection of electronic components, the printed circuit board is generally represented by "PCB" and cannot be called "PCB", the printed circuit board can be divided into a single-sided board, a double-sided board, a four-sided board, a six-sided board and other multilayer circuit boards according to the number of layers of the circuit board, and the definition of the name is slightly disordered because the printed circuit board is not a general terminal product.
When the existing printed circuit board in the current market is used in a severe environment, the existing printed circuit board is easy to be subjected to electromagnetic interference, and electronic elements on the printed circuit board are damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an individual layer printed circuit board based on anti-electromagnetic interference structure possesses the advantage of making things convenient for the dismouting to maintain, has solved current protective housing from taking anti-electromagnetic interference device and has all installed on the circuit board through the screw, leads to the very inconvenient problem of later stage dismouting maintenance.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an individual layer printed circuit board based on anti-electromagnetic interference structure, includes circuit board main part and installing frame, the recess has all been seted up to the left and right sides of installing frame, one side fixedly connected with spring of recess inner chamber, the spacing fixture block of the other end fixedly connected with of spring, the outside of circuit board main part is provided with the housing, spacing draw-in groove has all been seted up to the left and right sides of housing inner chamber lower extreme, the activity groove has been seted up to the one end of spacing draw-in groove inner chamber, the one end of activity inslot chamber is provided with the movable block, one side fixedly connected with ejector pad of movable block, the top of housing is inlayed and is equipped with the heat-conducting plate, the top fixedly connected with radiating fin of heat-conducting plate, the top of housing inner chamber is inlayed and is equipped with the semiconductor refrigeration piece.
Preferably, both ends all are provided with the through-hole around the circuit board main part, the inboard of through-hole is provided with connecting bolt, the last pot head of connecting bolt surface is equipped with the installing frame, the top and the bottom of installing frame all are provided with the protection and fill up, the upper end threaded connection of connecting bolt surface has the connecting cap.
Preferably, one end of the limiting clamping block is matched with the limiting clamping groove, and the longitudinal section of the limiting clamping groove is in a right-angled triangle shape.
Preferably, the number of the radiating fins is multiple, and the distance between two adjacent radiating fins is equal.
Preferably, the number of the semiconductor refrigeration pieces is multiple, and the hot surfaces of the semiconductor refrigeration pieces are in contact with the bottom of the heat conducting plate.
Preferably, the fixed frame of top fixedly connected with of housing inner chamber, the lower extreme fixedly connected with mount of fixed frame inner chamber, the equal fixed mounting in both ends has the heat dissipation fan about the mount, the equal fixed mounting in both ends has anti electromagnetic interference device about the housing inner chamber top.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses an effect of recess, spacing draw-in groove, spacing fixture block, spring, movable block, ejector pad and activity groove for the housing of this circuit board has possessed the purpose of making things convenient for the dismouting to maintain.
2. The utility model discloses a heat-conducting plate and radiating fin and semiconductor refrigeration piece's effect for the housing of this circuit board has possessed effective radiating purpose.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A of the present invention;
fig. 3 is a schematic top view of the mounting frame of the present invention;
fig. 4 is the utility model discloses the cooperation structure sketch map of circuit board main part and installing frame under the state of looking sideways at.
In the figure: 1. a circuit board main body; 2. installing a frame; 3. a heat conducting plate; 4. a heat dissipating fin; 5. a semiconductor refrigeration sheet; 6. a fixed mount; 7. a heat dissipation fan; 8. a fixing frame; 9. an anti-electromagnetic interference device; 10. a housing; 11. a groove; 12. a limiting clamping groove; 13. a limiting clamping block; 14. a spring; 15. a through hole; 16. a connecting bolt; 17. a connecting cap; 18. a protective pad; 19. a movable block; 20. a push block; 21. a movable groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a single-layer printed circuit board based on an anti-electromagnetic interference structure comprises a circuit board main body 1 and a mounting frame 2, grooves 11 are respectively formed in the left side and the right side of the mounting frame 2, springs 14 are fixedly connected to one sides of inner cavities of the grooves 11, limiting clamping blocks 13 are fixedly connected to the other ends of the springs 14, a housing 10 is arranged on the outer side of the circuit board main body 1, limiting clamping grooves 12 are respectively formed in the left side and the right side of the lower end of the inner cavity of the housing 10, movable grooves 21 are formed in one ends of the inner cavities of the limiting clamping grooves 12, movable blocks 19 are arranged at one ends of the inner cavities of the movable grooves 21, pushing blocks 20 are fixedly connected to one sides of the movable blocks 19, a heat conduction plate 3 is embedded in the top of the housing 10, heat dissipation fins 4 are fixedly connected to the top of the heat conduction plate 3, and semiconductor refrigeration sheets 5 are embedded in the top of the inner cavity of the housing 10.
Both ends all are provided with through-hole 15 around circuit board main part 1, and the inboard of through-hole 15 is provided with connecting bolt 16, and the last pot head of connecting bolt 16 surface is equipped with installing frame 2, and the top and the bottom of installing frame 2 all are provided with protection pad 18, and the upper end threaded connection of connecting bolt 16 surface has connecting cap 17.
Through the cooperation of through-hole 15, after connecting bolt 16 is inserted to its inboard, then, establish installing frame 2 at connecting bolt 16's upper end cover, then, at connecting bolt 16's upper end threaded connection connecting cap 17, and then fixed installing frame 2 fast.
One end of the limiting clamping block 13 is matched with the limiting clamping groove 12, and the longitudinal section of the limiting clamping groove 12 is a right-angled triangle.
Through the setting of spacing fixture block 13 and spacing draw-in groove 12, at the in-process of housing 10 downstream, can force spacing fixture block 13 to retract in recess 11 under the assistance of spacing fixture block 13 direction inclined plane to compression spring 14, treat that spacing draw-in groove 12 crosses spacing fixture block 13 after, spring 14 can drive spacing fixture block 13 and reset, makes it and spacing draw-in groove 12 realize the joint cooperation, reaches the quick installation to housing 10.
The number of the heat dissipation fins 4 is plural, and the distance between two adjacent heat dissipation fins 4 is equal.
Through the setting of radiating fin 4, the heat radiating area of 5 hot faces of expansion semiconductor refrigeration piece that can the very big degree, guarantee semiconductor refrigeration piece 5's refrigeration work.
The number of the semiconductor refrigerating pieces 5 is multiple, and the hot surface of each semiconductor refrigerating piece 5 is in contact with the bottom of the heat conducting plate 3.
Through the setting of semiconductor refrigeration piece 5, can refrigerate circuit board main part 1, ensure its normal work.
The top fixedly connected with fixed frame 8 of housing 10 inner chamber, the lower extreme fixedly connected with mount 6 of fixed frame 8 inner chamber, the equal fixed mounting in both ends has heat dissipation fan 7 about mount 6, the equal fixed mounting in both ends has anti electromagnetic interference device 9 about the top of housing 10 inner chamber.
Through the setting of heat dissipation fan 7, can accelerate the gas flow in the housing 10, ensure the normal heat dissipation demand of circuit board main part 1.
During the use, cooperation through-hole 15, after connecting bolt 16 is inserted to its inboard, then, establish installing frame 2 at connecting bolt 16's upper end cover, then, upper end threaded connection connecting cap 17 at connecting bolt 16, and then fix installing frame 2 fast, then, drive housing 10 and cover the outside in circuit board main part 1, in the in-process of housing 10 downstream, can be under the assistance of spacing fixture block 13 direction inclined plane, force spacing fixture block 13 to retract into recess 11, and compress spring 14, treat spacing draw-in groove 12 and cross spacing fixture block 13 after, spring 14 can drive spacing fixture block 13 and reset, make it realize the joint cooperation with spacing draw-in groove 12, reach the quick installation to housing 10, simultaneously, after housing 10 installs fast, circuit board main part 1 during operation, the hot face of semiconductor refrigeration piece 5 can be heat through heat-conducting plate 3 and radiating fin 4 outward transmission, simultaneously, the cold face of semiconductor refrigeration piece 5 can refrigerate fast, when heat dissipation fan 7 is worked, can effectively dispel the heat to circuit board main part 1, guarantee its normal use, can drive the inboard compression block 13 of compression in the recess 21 that people can push away from the activity again when dismantling, thereby the movable block 13 has satisfied the recess, thereby the compression of the compression block 13, thereby the inboard of the compression of the drive of the movable block 13 again, thereby, the movable block 21 can be satisfied.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a single-deck printed circuit board based on anti-electromagnetic interference structure, includes circuit board main part (1) and installing frame (2), its characterized in that: recess (11) have all been seted up to the left and right sides of installing frame (2), one side fixedly connected with spring (14) of recess (11) inner chamber, the spacing fixture block of the other end fixedly connected with (13) of spring (14), the outside of circuit board main part (1) is provided with housing (10), spacing draw-in groove (12) have all been seted up to the left and right sides of housing (10) inner chamber lower extreme, activity groove (21) have been seted up to the one end of spacing draw-in groove (12) inner chamber, the one end of activity groove (21) inner chamber is provided with movable block (19), one side fixedly connected with ejector pad (20) of movable block (19), the top of housing (10) is inlayed and is equipped with heat-conducting plate (3), the top fixedly connected with radiating fin (4) of heat-conducting plate (3), the top of housing (10) inner chamber is inlayed and is equipped with semiconductor refrigeration piece (5).
2. The single-layer printed circuit board based on the anti-electromagnetic interference structure as claimed in claim 1, wherein: both ends all are provided with through-hole (15) around circuit board main part (1), the inboard of through-hole (15) is provided with connecting bolt (16), the last pot head of connecting bolt (16) surface is equipped with installing frame (2), the top and the bottom of installing frame (2) all are provided with protection pad (18), the upper end threaded connection of connecting bolt (16) surface has connection cap (17).
3. The single-layer printed circuit board based on the anti-electromagnetic interference structure, according to claim 1, wherein: one end of the limiting clamping block (13) is matched with the limiting clamping groove (12), and the longitudinal section of the limiting clamping groove (12) is in the shape of a right triangle.
4. The single-layer printed circuit board based on the anti-electromagnetic interference structure as claimed in claim 1, wherein: the number of the radiating fins (4) is multiple, and the distance between every two adjacent radiating fins (4) is equal.
5. The single-layer printed circuit board based on the anti-electromagnetic interference structure as claimed in claim 1, wherein: the number of the semiconductor refrigeration pieces (5) is multiple, and the hot surfaces of the semiconductor refrigeration pieces (5) are in contact with the bottom of the heat conducting plate (3).
6. The single-layer printed circuit board based on the anti-electromagnetic interference structure, according to claim 1, wherein: the fixed frame (8) of top fixedly connected with of housing (10) inner chamber, the lower extreme fixedly connected with mount (6) of fixed frame (8) inner chamber, the equal fixed mounting in both ends has heat dissipation fan (7) about mount (6), the equal fixed mounting in both ends has anti electromagnetic interference device (9) about housing (10) inner chamber top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222714634.6U CN218679677U (en) | 2022-10-10 | 2022-10-10 | Single-layer printed circuit board based on anti-electromagnetic interference structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222714634.6U CN218679677U (en) | 2022-10-10 | 2022-10-10 | Single-layer printed circuit board based on anti-electromagnetic interference structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218679677U true CN218679677U (en) | 2023-03-21 |
Family
ID=85564974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222714634.6U Expired - Fee Related CN218679677U (en) | 2022-10-10 | 2022-10-10 | Single-layer printed circuit board based on anti-electromagnetic interference structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218679677U (en) |
-
2022
- 2022-10-10 CN CN202222714634.6U patent/CN218679677U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201706440U (en) | LED lamp | |
| CN218679677U (en) | Single-layer printed circuit board based on anti-electromagnetic interference structure | |
| CN201210783Y (en) | a heat transfer device | |
| CN207282486U (en) | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor | |
| CN114302609A (en) | Optical module and electronic equipment | |
| CN218939655U (en) | A high-power MOS tube fixing and cooling device | |
| CN216650328U (en) | Optical module and electronic equipment | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN217470363U (en) | Multilayer circuit board with high aspect ratio blind hole | |
| CN215773699U (en) | High heat conduction chip package copper-based circuit board | |
| CN211745100U (en) | Insulating high-efficient heat conduction heat abstractor | |
| CN221010545U (en) | Aluminum-based PCB | |
| CN221151622U (en) | Porous heat dissipation circuit board structure | |
| CN216357923U (en) | High-efficient radiating electronic equipment casing | |
| CN201059516Y (en) | A luminous body heat dissipation structure | |
| CN219919549U (en) | Electronic equipment | |
| CN221553742U (en) | Controller and electric vehicle | |
| CN221103622U (en) | Integrated circuit board convenient to heat dissipation | |
| CN223844114U (en) | Radiating mechanism of solid state relay | |
| CN222996743U (en) | High-efficiency heat-dissipation circuit board with multiple electric elements | |
| CN219437446U (en) | Circuit board assembly | |
| CN217445722U (en) | Power device heat radiation structure | |
| CN223666531U (en) | Preplating tin ceramic substrate | |
| CN221486482U (en) | Novel high-temperature-resistant silicon carbide device packaging structure | |
| CN217693818U (en) | Detachable electronic ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230321 |