CN218483011U - High-efficient heat dissipation type circuit board - Google Patents
High-efficient heat dissipation type circuit board Download PDFInfo
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- CN218483011U CN218483011U CN202222457801.3U CN202222457801U CN218483011U CN 218483011 U CN218483011 U CN 218483011U CN 202222457801 U CN202222457801 U CN 202222457801U CN 218483011 U CN218483011 U CN 218483011U
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Abstract
The utility model relates to a circuit board technical field just discloses a high-efficient heat dissipation type circuit board, including mounting substrate, mounting substrate's fixed surface plug bush has a plurality of heat-conducting plates, and is a plurality of the same heat conduction installing frame of upper end fixedly connected with of heat-conducting plate, the inboard of heat conduction installing frame is fixed and has been installed the circuit board body, and is a plurality of the same heating panel of lower extreme fixedly connected with of heat-conducting plate, the waterproof frame of upper end fixedly connected with of mounting substrate, the integrative outward expansion in the lower extreme outside of waterproof frame has the connection frame board, through a plurality of connecting bolt fixed connection between connection frame board and the mounting substrate. The circuit board protection device has the advantages of being good in heat dissipation protection performance, stable in use and good in protection performance on the premise of guaranteeing effective waterproof protection of the circuit board.
Description
Technical Field
The application belongs to the technical field of the circuit board, especially relates to a high-efficient heat dissipation type circuit board.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The current circuit board heat dissipation quality is the important factor that influences the stable use of circuit board, but present circuit board is in order to guarantee that heat dissipation quality directly exposes the placing mostly, and such structure has just also caused waterproof performance weak, brings certain inconvenience when using in the waterproof environment of needs attention.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem and providing a high-efficient heat dissipation type circuit board.
In order to achieve the purpose, the following technical scheme is adopted in the application:
a high-efficiency heat dissipation type circuit board comprises a mounting substrate, wherein a plurality of heat conduction plates are fixedly inserted and sleeved on the surface of the mounting substrate, the upper ends of the heat conduction plates are fixedly connected with the same heat conduction mounting frame, a circuit board body is fixedly arranged on the inner side of the heat conduction mounting frame, the lower ends of the heat conduction plates are fixedly connected with the same heat dissipation plate, the upper end of the mounting substrate is fixedly connected with a waterproof frame, a connecting frame plate is integrally and outwardly expanded on the outer side of the lower end of the waterproof frame, and the connecting frame plate and the mounting substrate are fixedly connected through a plurality of connecting bolts;
the fixed plug bush in relative one side of waterproof frame has same root circulative cooling pipe, the one end that circulative cooling pipe's both ends all are located waterproof frame all is fixed the intercommunication to have the cavity buffering dish, the even fixed intercommunication of lateral wall of cavity buffering dish has a plurality of cooling blast heads, be equipped with circulating fan and cooling cylinder on the circulative cooling pipe.
Preferably, the lower end of the mounting substrate is symmetrically and fixedly connected with two L-shaped positioning plates, the horizontal part of each L-shaped positioning plate is provided with a positioning screw hole, and a positioning bolt is sleeved in a manner of corresponding to the internal thread of each positioning screw hole.
Preferably, the upper end of the mounting substrate is fixedly connected with a sealing abutting frame which abuts against the inner side of the waterproof frame in a sealing manner.
Preferably, the upper end of the mounting substrate is also fixedly connected with an insertion frame, and the lower end of the waterproof frame is provided with an insertion groove which is inserted in a matched manner with the insertion frame.
Preferably, the inner side of the cooling cylinder is fixedly connected with a plurality of heat collecting plates in a staggered and symmetrical mode, one end of each heat collecting plate penetrates through the cooling cylinder to extend out of the cooling cylinder, and each heat collecting plate is fixedly connected with the corresponding arc-shaped heat diffusion plate.
Preferably, a plurality of vent holes are uniformly formed on the surface of the heat collecting plate.
Compared with the prior art, this application provides a high-efficient heat dissipation type circuit board, possesses following beneficial effect:
1. this high-efficient heat dissipation type circuit board, mounting substrate through being equipped with, circuit board body and waterproof frame, the circuit board body is installed earlier in the heat conduction installing frame, the heat conduction installing frame can lead away the heat that circuit board body in-service production fast, cooperation heat-conducting plate and heating panel give off the heat to mounting substrate's downside, guarantee the stable heat dissipation of circuit board body, and waterproof frame realizes earlier the stable connection with mounting substrate through the accordant connection of grafting frame and inserting groove, sealed conflict frame is contradicted in waterproof frame's inboard this moment, realize the further stable sealing of being connected between waterproof frame and the mounting substrate, and connect the upside at mounting substrate of framed board contact this moment, it is fixed through a plurality of connecting bolt, can carry out stable waterproof sealing protection to the circuit board body, it is safer to use.
2. This high-efficient heat dissipation type circuit board, through the circulative cooling pipe that is equipped with, circuit board body during operation starts circulating fan, circulating fan cooperation circulative cooling pipe cools off the temperature in waterproof frame, the cooperation of cavity buffer disc and a plurality of cooling wind head has increased the conveying scope of cooling wind, comprehensive heat dissipation to the circuit board body has been guaranteed, and in the air admission cooling cylinder after carrying the heat in waterproof frame, the heat in the air is led away to a plurality of thermal-arrest boards, the circulation of ventilation hole easy air on thermal-arrest board surface, the thermal-arrest board further expands the heat transfer to the outside air with heat cooperation arc, guarantee heat dispersion, realize the stable heat dissipation to the circuit board body.
And the part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, and this application still possesses fine heat dissipation protective properties under the prerequisite of having guaranteed the effective waterproof protection of circuit board, and it is stable to use, and protectiveness is good.
Drawings
Fig. 1 is a schematic structural diagram of an efficient heat dissipation type circuit board provided in the present application;
fig. 2 is an enlarged view of a portion a in fig. 1.
In the figure: 1. a mounting substrate; 2. a heat conducting plate; 3. a heat-conducting mounting frame; 4. a circuit board body; 5. a heat dissipation plate; 6. a waterproof frame; 7. connecting the frame plates; 8. a circulating cooling pipe; 9. a hollow buffer tray; 10. cooling the air head; 11. a circulating fan; 12. a cooling cylinder; 13. an L-shaped positioning plate; 14. sealing the abutting frame; 15. a plug-in frame; 16. inserting grooves; 17. a heat collecting plate; 18. an arc-shaped heat spreading plate; 19. a vent hole.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Referring to fig. 1-2, a high-efficiency heat dissipation type circuit board comprises a mounting substrate 1, wherein a plurality of heat conduction plates 2 are fixedly inserted and sleeved on the surface of the mounting substrate 1, the upper ends of the heat conduction plates 2 are fixedly connected with a same heat conduction mounting frame 3, a circuit board body 4 is fixedly arranged on the inner side of the heat conduction mounting frame 3, the lower ends of the heat conduction plates 2 are fixedly connected with a same heat dissipation plate 5, the upper end of the mounting substrate 1 is fixedly connected with a waterproof frame 6, a connecting frame plate 7 is integrally and outwardly expanded on the outer side of the lower end of the waterproof frame 6, and the connecting frame plate 7 is fixedly connected with the mounting substrate 1 through a plurality of connecting bolts;
the fixed plug bush in one side relative of waterproof frame 6 has same root circulative cooling pipe 8, and the one end that circulative cooling pipe 8's both ends all are located waterproof frame 6 all is fixed the intercommunication have cavity buffering dish 9, and the even fixed intercommunication of lateral wall of cavity buffering dish 9 has a plurality of cooling blast heads 10, is equipped with circulating fan 11 and cooling cylinder 12 on the circulative cooling pipe 8.
The lower end of the mounting base plate 1 is symmetrically and fixedly connected with two L-shaped positioning plates 13, the horizontal part of the L-shaped positioning plates 13 is provided with positioning screw holes, and positioning bolts are sleeved in the corresponding positioning screw holes in a sleeved mode.
A sealing abutting frame 14 which abuts on the inner side of the waterproof frame 6 in a sealing manner is fixedly connected to the upper end of the mounting substrate 1.
The upper end of the mounting substrate 1 is also fixedly connected with an inserting frame 15, and the lower end of the waterproof frame 6 is provided with an inserting groove 16 which is inserted in a matching way with the inserting frame 15.
The inner side of the cooling cylinder 12 is fixedly connected with a plurality of heat collecting plates 17 in a staggered and symmetrical manner, one end of each heat collecting plate 17 penetrates through and extends out of the cooling cylinder 12, and is fixedly connected with an arc-shaped heat diffusion plate 18.
A plurality of vent holes 19 are uniformly opened on the surface of the heat collecting plate 17.
Now, the operation principle of the present invention is described as follows:
when the heat-radiating type heat-collecting plate is used, the heat generated in the working process of the circuit board body 4 can be quickly conducted away by the aid of the mounting base plate 1, the circuit board body 4 and the waterproof frame 6, the heat is radiated to the lower side of the mounting base plate 1 by the aid of the heat-conducting plate 2 and the heat-radiating plate 5, stable heat radiation of the circuit board body 4 is guaranteed, stable connection between the waterproof frame 6 and the mounting base plate 1 is realized firstly by the aid of matching connection of the plug-in frame 15 and the plug-in groove 16, the sealing and butting frame 14 is butted against the inner side of the waterproof frame 6 at the moment, further stable sealing of connection between the waterproof frame 6 and the mounting base plate 1 is realized, the connecting frame plate 7 is in contact with the upper side of the mounting base plate 1 at the moment, the circuit board body 4 can be stably protected in a sealing mode through a plurality of connecting bolts, the heat-collecting plate is safer to use, the circulating fan 11 is started when the circuit board body 4 works, the circulating fan 11 is matched with the circulating cooling and cooling air of the heat-radiating plate 6, the heat-collecting plate 9 and the cooling air-collecting plate, the heat-collecting plate is enabled to be comprehensively carried by the air, and the heat-radiating plate 17, and the heat-radiating plate is easy to be carried by the air-radiating plate.
The above description is only for the preferred embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present application, and equivalent alternatives or modifications according to the technical solutions and the application concepts of the present application, which are within the technical scope of the present application.
Claims (6)
1. The efficient heat dissipation type circuit board comprises a mounting substrate (1), and is characterized in that a plurality of heat-conducting plates (2) are fixedly inserted and sleeved on the surface of the mounting substrate (1), the upper ends of the heat-conducting plates (2) are fixedly connected with a same heat-conducting mounting frame (3), a circuit board body (4) is fixedly arranged on the inner side of the heat-conducting mounting frame (3), the lower ends of the heat-conducting plates (2) are fixedly connected with a same heat-radiating plate (5), the upper end of the mounting substrate (1) is fixedly connected with a waterproof frame (6), a connecting frame plate (7) is integrally and outwardly expanded on the outer side of the lower end of the waterproof frame (6), and the connecting frame plate (7) is fixedly connected with the mounting substrate (1) through a plurality of connecting bolts;
the fixed plug bush in relative one side of waterproof frame (6) has same root circulative cooling pipe (8), the one end that the both ends of circulative cooling pipe (8) all are located waterproof frame (6) all is fixed the intercommunication all has cavity buffering dish (9), the even fixed intercommunication of lateral wall of cavity buffering dish (9) has a plurality of cooling blower heads (10), be equipped with circulating fan (11) and cooling cylinder (12) on circulative cooling pipe (8).
2. The efficient heat dissipation type circuit board according to claim 1, wherein the lower end of the mounting substrate (1) is symmetrically and fixedly connected with two L-shaped positioning plates (13), a horizontal portion of each L-shaped positioning plate (13) is provided with a positioning screw hole, and a positioning bolt is sleeved in a corresponding positioning screw hole in a threaded manner.
3. The high-efficiency heat dissipation circuit board according to claim 1, wherein a sealing abutting frame (14) which abuts against the inner side of the waterproof frame (6) in a sealing manner is fixedly connected to the upper end of the mounting substrate (1).
4. The efficient heat dissipation type circuit board according to claim 1, wherein an insertion frame (15) is further fixedly connected to the upper end of the mounting substrate (1), and an insertion groove (16) matched and inserted with the insertion frame (15) is formed in the lower end of the waterproof frame (6).
5. A high-efficiency heat-dissipation type circuit board according to claim 1, wherein a plurality of heat collecting plates (17) are fixedly connected to the inner side of the cooling cylinder (12) in a staggered and symmetrical manner, one end of each heat collecting plate (17) extends out of the cooling cylinder (12) in a penetrating manner, and is fixedly connected with an arc-shaped heat spreading plate (18).
6. A high-efficiency heat-dissipation type circuit board according to claim 5, wherein a plurality of vent holes (19) are uniformly formed on the surface of the heat collection plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222457801.3U CN218483011U (en) | 2022-09-16 | 2022-09-16 | High-efficient heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222457801.3U CN218483011U (en) | 2022-09-16 | 2022-09-16 | High-efficient heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218483011U true CN218483011U (en) | 2023-02-14 |
Family
ID=85168676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222457801.3U Active CN218483011U (en) | 2022-09-16 | 2022-09-16 | High-efficient heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218483011U (en) |
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2022
- 2022-09-16 CN CN202222457801.3U patent/CN218483011U/en active Active
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