CN218158944U

CN218158944U - Temperature equalizing plate heat radiator of central processing chip board for super computer

Info

Publication number: CN218158944U
Application number: CN202221558361.4U
Authority: CN
Inventors: 欧阳柳卿
Original assignee: Jiangsu Aogong Information Technology Co ltd
Current assignee: Jiangsu Aogong Information Technology Co ltd
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2022-12-27
Anticipated expiration: 2032-06-21

Abstract

The utility model provides a temperature-uniforming plate heat abstractor of central processing chip board for supercomputer relates to chip heat dissipation technical field. This temperature equalization board heat abstractor of central processing chip board for super computer, including mounting plate and protective frame, the sap cavity has been seted up at the mounting plate top, mounting plate top fixedly connected with upper cover plate, the upper cover plate covers in the sap cavity top, a plurality of radiating fin of mounting plate portion fixedly connected with, this temperature equalization board heat abstractor of central processing chip board for super computer through a plurality of radiating fin of fixedly connected with in mounting plate bottom, transmits the absorbing heat of mounting plate through a plurality of radiating fin to dispel the heat fast through a plurality of radiating fin, and at mounting plate bottom fixedly connected with protective frame, start through the inside radiator fan of protective frame, produce wind-force for the heat on the radiating fin dispels the heat fast, improves the thermal diffusivity after whole heat conduction.

Description

Temperature equalizing plate heat dissipation device of central processing chip board for super computer

Technical Field

The utility model relates to a samming board heat abstractor specifically is a samming board heat abstractor of central processing chip board for supercomputer belongs to chip heat dissipation technical field.

Background

A Supercomputer (Supercomputer) refers to a computer capable of executing a large amount of data and high-speed operations that cannot be processed by a general personal computer. The constituent components are substantially the same in terms of the composition of the supercomputer and the ordinary computer.

The integration level and performance frequency of the computer central processing unit CPU are continuously improved. The heat generated when the chip in the computer runs can not be dissipated in time, which affects the working stability of the computer, reduces the average time without failure and can burn the chip when the average time is serious. Meanwhile, the movement of the transistors of different functional modules in the chip can cause highly uneven heat generation, and then a hot spot area which changes along with time and space appears in the chip, and the hot spot can bring greater damage to the chip. However, the trend of miniaturization and integration of chips is not changed, and the heat dissipation problem of chips is becoming more serious.

The heat dissipation treatment is carried out through the temperature-uniforming plate in the heat dissipation of chip, but the temperature-uniforming plate device that provides on the market at present has a lot of, and the radiating mode of temperature-uniforming plate self is relatively poor, leads to heat conduction efficiency to be lower, and the heat after the heat conduction can't be dispelled around equipment, leads to the whole rising of the temperature of its equipment, influences the work efficiency of chip.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model aims at providing a temperature-uniforming plate heat abstractor of central processing chip board for super computer just lies in order to solve above-mentioned problem to solve but the temperature-uniforming plate device that provides on the market among the prior art has a lot, and the radiating mode of temperature-uniforming plate self is relatively poor, lead to heat conduction efficiency lower, heat after the heat conduction can't dispel around equipment, the temperature that leads to its equipment wholly risees, influence the work efficiency of chip, influence the problem of the work efficiency of chip.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a temperature-uniforming plate heat abstractor of central processing chip board for supercomputer, includes mounting plate and protective frame, the sap cavity has been seted up at the mounting plate top, mounting plate top fixedly connected with upper cover plate, the upper cover plate covers in the sap cavity top, a plurality of radiating fin of mounting plate portion fixedly connected with, it is a plurality of radiating fin is horizontal arrangement in proper order, protective frame sets up in a plurality of radiating fin one end, the inside radiator fan that is equipped with of protective frame, be provided with between protective frame and the radiator fan and be used for carrying out the installed part fixed to radiator fan, upper cover plate top fixedly connected with copper.

Preferably, the installed part includes two threaded rods, two the equal fixed connection of threaded rod is in the inside one side of protective frame, the equal fixedly connected with locating piece in radiator fan both sides, the draw-in groove has been seted up in the locating piece outside.

Preferably, the installed part still includes two connection baffle, two connection baffle fixed connection respectively is in two threaded rod outsides, two the locating piece overlaps respectively and locates two threaded rod outsides, two the equal threaded connection in threaded rod outside has fixation nut, is favorable to inserting the draw-in groove that the locating piece was seted up through the threaded rod to carry out quick location installation to radiator fan.

Preferably, a rear fixing plate is arranged on one side of the protection frame, a circulation groove is formed in the outer side of the rear fixing plate, positioning frames are fixedly connected to the two sides of the protection frame, a sliding groove is formed in the outer side of each positioning frame, and the ventilation grooves formed in the outer side of the rear fixing plate are favorable for enabling the cooling fan to suck air.

Preferably, sliding plates are fixedly connected to two sides of the rear fixed plate, and the two sliding plates are respectively matched with sliding grooves formed in the outer sides of the two positioning frames.

Preferably, two the locating frame outside all is equipped with positioning bolt, positioning bolt runs through locating frame and sliding plate in proper order and with locating frame and sliding plate threaded connection, is favorable to making positioning bolt fix the sliding plate.

Preferably, an opening is formed in the outer side of the mounting base plate, the opening is communicated with the liquid cavity, and a sealing plug for sealing the liquid cavity is arranged at the opening formed in the outer side of the mounting base plate.

The utility model provides a temperature-uniforming plate heat abstractor of central processing chip board for super computer, its beneficial effect who possesses as follows:

1. this temperature-uniforming plate heat abstractor of central processing chip board for super computer, through a plurality of radiating fin of fixedly connected with in mounting plate bottom, transmit the absorptive heat of mounting plate through a plurality of radiating fin, and dispel the heat fast through a plurality of radiating fin, and at mounting plate bottom fixedly connected with protective frame, start through the inside radiator fan of protective frame, produce wind-force, accelerate the heat on the radiating fin to dispel the heat fast, improve the thermal diffusivity after whole heat conduction.

2. This temperature equalization board heat abstractor of central processing chip board for super computer, the locating piece through with radiator fan both sides fixed connection slides in two threaded rod outsides, and contact with threaded rod outside fixed connection's connecting baffle, operating personnel is through rotating fixation nut, install fixation nut in the threaded rod outside, thereby install radiator fan, and insert rear fixed plate both sides fixed connection's sliding plate in protective frame both sides fixed connection's the locating frame, carry out quick location to the rear fixed plate, reinsert positioning bolt and fix the sliding plate, make radiator fan can install between protective frame and rear fixed plate, convenient to detach maintains.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the upper cover plate of the present invention;

FIG. 3 is a schematic view of the structure of the heat dissipation fan of the present invention;

FIG. 4 is a schematic structural view of the mounting member of the present invention;

fig. 5 is an enlarged view of the structure of the portion a of fig. 3 according to the present invention.

In the figure: 101. mounting a bottom plate; 102. an upper cover plate; 103. a liquid chamber; 104. an opening; 105. a sealing plug; 2. a heat dissipating fin; 3. a protective frame; 4. a copper plate; 5. a heat-dissipating fan; 6. a rear fixing plate; 7. a threaded rod; 8. connecting a baffle plate; 9. fixing a nut; 10. positioning blocks; 11. a positioning frame; 12. a sliding plate; 13. and (6) positioning the bolt.

Detailed Description

The embodiment of the utility model provides a temperature-uniforming plate heat abstractor of central processing chip board for supercomputer.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the liquid cooling system comprises a mounting base plate 101 and a protection frame 3, a liquid chamber 103 is formed in the top of the mounting base plate 101, an upper cover plate 102 is fixedly connected to the top of the mounting base plate 101, the upper cover plate 102 covers the top of the liquid chamber 103, a plurality of radiating fins 2 are fixedly connected to the top of the mounting base plate 101, the radiating fins 2 are horizontally arranged in sequence, the protection frame 3 is arranged at one ends of the radiating fins 2, a radiating fan 5 is arranged inside the protection frame 3, an installation part for fixing the radiating fan 5 is arranged between the protection frame 3 and the radiating fan 5, a copper plate 4 is fixedly connected to the top of the upper cover plate 102, an opening 104 is formed in the outer side of the mounting base plate 101, the opening 104 is communicated with the liquid chamber 103, and a sealing plug 105 for sealing the liquid chamber 103 is arranged at the opening 104 formed in the outer side of the mounting base plate 101.

Specifically, the copper plate 4 is fixedly connected to the top of the upper cover plate 102 and is attached to a central processing chip board for a computer, heat is absorbed through the copper plate 4 and conducted to the upper cover plate 102, heat conduction is conducted through a liquid cavity 103 between the mounting base plate 101 and the upper cover plate 102 (specifically, the principle of a temperature equalizing plate on the market can be referred to, liquid at the bottom of the vacuum cavity evaporates and diffuses into the vacuum cavity after absorbing the heat of the chip, the heat is conducted to the heat radiating fins and then condensed into liquid to return to the bottom), the heat absorbed by the mounting base plate 101 is transmitted through the plurality of heat radiating fins 2, the heat is quickly radiated through the plurality of heat radiating fins 2, the protection frame 3 is fixedly connected to the bottom of the mounting base plate 101, the heat radiating fan 5 inside the protection frame 3 is started to generate wind power, the heat on the heat radiating fins 2 is quickly radiated, and it is worth explaining that the mounting base plate 101 and the upper cover plate 102 are both made of heat conducting materials.

Please refer to fig. 1 again, fig. 2, fig. 3, fig. 4 and fig. 5, the mounting member includes two threaded rods 7, two threaded rods 7 are fixedly connected to one side inside the protection frame 3, positioning blocks 10 are fixedly connected to two sides of the heat dissipation fan 5, a clamping groove is formed in the outer side of the positioning blocks 10, the mounting member further includes two connection baffle plates 8, the two connection baffle plates 8 are fixedly connected to the outer sides of the two threaded rods 7 respectively, the two positioning blocks 10 are respectively sleeved on the outer sides of the two threaded rods 7, fixing nuts 9 are threadedly connected to the outer sides of the two threaded rods 7 respectively, and are beneficial to inserting the clamping grooves formed in the positioning blocks 10 through the threaded rods 7, so as to quickly position and mount the heat dissipation fan 5, a rear fixing plate 6 is arranged on one side of the protection frame 3, a circulation groove is formed in the outer side of the rear fixing plate 6, positioning frames 11 are fixedly connected to the outer sides of the protection frame 3, and are beneficial to sucking the heat dissipation fan 5 through the circulation groove formed in the outer side of the rear fixing plate 6, sliding plates 12 are fixedly connected to the two sliding plates 12 respectively adapted to the sliding grooves formed in the outer sides of the two positioning frames 11.

And the outer sides of the two positioning frames 11 are respectively provided with a positioning bolt 13, and the positioning bolts 13 sequentially penetrate through the positioning frames 11 and the sliding plates 12 and are in threaded connection with the positioning frames 11 and the sliding plates 12, so that the positioning bolts 13 can fix the sliding plates 12.

Specifically, through setting up radiator fan 5 inside protective frame 3, prevent dust treatment to radiator fan 5, avoid the dust to influence radiator fan 5's radiating effect, when needs are installed radiator fan 5, through sliding into two threaded rod 7 outsides with radiator fan 5 both sides fixed connection's locating piece 10, and contact with threaded rod 7 outside fixed connection's connecting baffle 8, operating personnel is through rotating fixation nut 9, install fixation nut 9 in the threaded rod 7 outside, thereby install radiator fan 5, and insert protective frame 3 both sides fixed connection's locating frame 11 with rear fixed plate 6 both sides fixed connection's sliding plate 12, carry out quick location to rear fixed plate 6, reinsert positioning bolt 13 and fix sliding plate 12, make radiator fan 5 can install between protective frame 3 and rear fixed plate 6, be convenient for dismantle and maintain.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a temperature-uniforming plate heat abstractor of central processing chip board for super computer, includes mounting plate (101) and protective frame (3), sap cavity (103) have been seted up at mounting plate (101) top, mounting plate (101) top fixedly connected with upper cover plate (102), upper cover plate (102) cover in sap cavity (103) top, its characterized in that: mounting plate (101) portion fixedly connected with a plurality of radiating fin (2), it is a plurality of radiating fin (2) are horizontal arrangement in proper order, protective frame (3) set up in a plurality of radiating fin (2) one end, inside radiator fan (5) that are equipped with of protective frame (3), be provided with between protective frame (3) and radiator fan (5) and be used for carrying out the installed part fixed to radiator fan (5), upper cover plate (102) top fixedly connected with copper (4).

2. The heat sink of claim 1, wherein the heat sink comprises: the mounting part comprises two threaded rods (7) and two threaded rods (7) which are fixedly connected to one side inside the protective frame (3), positioning blocks (10) are fixedly connected to two sides of the cooling fan (5), and clamping grooves are formed in the outer sides of the positioning blocks (10).

3. The heat sink of claim 2, wherein the heat sink comprises: the installed part still includes two connection baffle (8), two connection baffle (8) fixed connection respectively in two threaded rod (7) outsides, two locating piece (10) overlap respectively and locate two threaded rod (7) outsides, two threaded rod (7) outside equal threaded connection has fixation nut (9).

4. The heat sink of claim 1, wherein the heat sink comprises: the protective frame is characterized in that a rear fixing plate (6) is arranged on one side of the protective frame (3), a circulation groove is formed in the outer side of the rear fixing plate (6), positioning frames (11) are fixedly connected to two sides of the protective frame (3), and a sliding groove is formed in the outer side of each positioning frame (11).

5. The device of claim 4, wherein the heat sink comprises: and sliding plates (12) are fixedly connected to two sides of the rear fixed plate (6), and the two sliding plates (12) are respectively matched with sliding grooves formed in the outer sides of the two positioning frames (11).

6. The device of claim 5, wherein the heat sink comprises: and positioning bolts (13) are arranged on the outer sides of the two positioning frames (11), and the positioning bolts (13) sequentially penetrate through the positioning frames (11) and the sliding plates (12) and are in threaded connection with the positioning frames (11) and the sliding plates (12).

7. The device of claim 1, wherein the heat sink comprises: an opening (104) is formed in the outer side of the mounting base plate (101), the opening (104) is communicated with the liquid cavity (103), and a sealing plug (105) used for sealing the liquid cavity (103) is arranged at the opening (104) formed in the outer side of the mounting base plate (101).