CN219758750U - Computer heat abstractor - Google Patents

Computer heat abstractor Download PDF

Info

Publication number
CN219758750U
CN219758750U CN202320983719.6U CN202320983719U CN219758750U CN 219758750 U CN219758750 U CN 219758750U CN 202320983719 U CN202320983719 U CN 202320983719U CN 219758750 U CN219758750 U CN 219758750U
Authority
CN
China
Prior art keywords
heat dissipation
support
air cooling
heat
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320983719.6U
Other languages
Chinese (zh)
Inventor
陈浩亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hubei Land Resources Vocational College
Original Assignee
Hubei Land Resources Vocational College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hubei Land Resources Vocational College filed Critical Hubei Land Resources Vocational College
Priority to CN202320983719.6U priority Critical patent/CN219758750U/en
Application granted granted Critical
Publication of CN219758750U publication Critical patent/CN219758750U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a computer heat dissipating device, which comprises a heat dissipating device and an air cooling device, wherein heat dissipating fins are symmetrically arranged at the positions of two sides of the top of the heat dissipating device, a plurality of heat homogenizing metal pipes penetrate through the inner sides of the heat dissipating fins, the positions of water outlets at the bottom ends of the heat homogenizing metal pipes are connected with two sides of a CPU (Central processing Unit) joint cold storage box in a penetrating way, and the air cooling device is fixedly arranged between the two adjacent heat dissipating fins.

Description

Computer heat abstractor
Technical Field
The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a computer heat dissipation device.
Background
High temperature is a major challenge for integrated circuits. The high temperature not only can cause unstable operation of the system and shorten the service life, but also can cause burning of certain parts. The radiator is used for absorbing the heat and then radiating the heat into or out of the case so as to ensure the normal temperature of computer components.
When the existing computer heat dissipation device is used, water cooling is adopted for lamination, fins are evenly heated, a cooling mode of radiating heat is adopted for the fins through a side fan, heat dissipation treatment is carried out on a CPU part, at the moment, the heat dissipation direction of the fins is single, the cooling duration time is long, and multi-position auxiliary heat dissipation cannot be effectively achieved, so that the computer heat dissipation device is provided.
Disclosure of Invention
The utility model aims to provide a computer heat dissipation device, which solves the problems of single heat dissipation direction and long heat dissipation duration of the prior computer heat dissipation device in the prior art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a computer heat abstractor, includes the radiator support, still includes the forced air cooling device, radiator support's top both sides position department symmetry installs heat radiation fins, wherein heat radiation fins's inboard runs through and is provided with a plurality of even hot metal pipes, wherein even hot metal pipes's bottom delivery port position department and CPU laminating cold storage box's both sides link-up connection, and two adjacent between the heat radiation fins fixed mounting has the forced air cooling device, just the forced air cooling device is including corresponding the forced air cooling support of fixing at radiator support top, just the front surface position department fixed mounting of forced air cooling support has the heat radiation fan support, vertical distribution has two heat radiation fans one on the heat radiation fan support, just the bottom position department fixed mounting of forced air cooling support has the chassis support, fixed mounting has the heat radiation fan two on the chassis support.
Further, a plurality of heat conduction row holes are symmetrically and vertically formed in the positions of two sides of the rear surface of the air cooling support, and an air port is formed in the top of the air cooling support.
Further, a heat dissipation fan mounting opening for fixing the heat dissipation fan support is matched and formed in the front surface position of the air cooling support.
Further, fin folds are formed on the radiating fins.
Further, a mounting groove is formed in the position, corresponding to the position where the air port coincides with the air port, of the radiator support.
Further, the first radiating fan and the second radiating fan are connected in series and are connected with an external power supply.
Compared with the prior art, the utility model has the beneficial effects that:
1. in this scheme, through the forced air cooling device that corresponds the setting on the radiator support, increased the radiating mode of bottom heat dissipation and side heat conduction, effectively increased the direction of heat dissipation of device, played the face-increasing heat dissipation to CPU laminating cold storage box part, very big reduction the heat dissipation time of device.
2. Through the integral type setting of forced air cooling support, can effectually be compatible a plurality of radiators to the realization is dispelled the heat to the laminating of device, utilizes the outer of heat conduction hole to lead to set up, and the optional capping setting of wind gap, increases the utilization ratio to bottom heat dissipation fan.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
fig. 2 is a schematic structural diagram of an air cooling device according to the present utility model;
FIG. 3 is a schematic view of an air-cooled bracket according to the present utility model;
in the figure: 1. a radiator support; 2. the CPU is attached to the cold storage box; 3. a heat radiation fin; 4. an air-cooled bracket; 5. a heat-homogenizing metal tube; 6. fin folding; 7. heat conducting row holes; 8. a heat radiation fan mounting opening; 9. a first heat radiation fan; 10. a heat radiation fan bracket; 11. a chassis support; 12. a second heat dissipation fan; 13. and a tuyere.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-3, the present utility model proposes a technical solution: the utility model provides a computer heat abstractor, including radiator support 1, still include the forced air cooling device, radiator support 1's top both sides position department symmetry installs fin 3, wherein the inboard of fin 3 runs through and is provided with a plurality of even hot metal pipes 5, wherein even hot metal pipe 5's bottom delivery port position department and CPU laminating cold storage box 2's both sides link-up, and fixed mounting has the forced air cooling device between two adjacent fin 3, and the forced air cooling device is including the forced air cooling support 4 that corresponds to be fixed at radiator support 1 top, and the front surface position department fixed mounting of forced air cooling support 4 has heat dissipation fan support 10, vertically distributed has two heat dissipation fan one 9 on the heat dissipation fan support 10, and the bottom position department fixed mounting of forced air cooling support 4 has chassis support 11, fixed mounting has two heat dissipation fans two 12 on the chassis support 11, a plurality of heat conduction exhaust holes 7 have been seted up to forced air cooling support 4's rear surface both sides position department symmetry vertically, the wind gap 13 has been seted up at the top of forced air cooling support 4.
In this embodiment, further, a heat dissipation fan mounting opening 8 for fixing a heat dissipation fan bracket 10 is cooperatively provided at the front surface position of the air cooling bracket 4, and fin folds 6 are provided on the heat dissipation fins 3, wherein the top view section of the heat dissipation fan mounting opening 8 is of a funnel-shaped structure, so as to ensure the maximization of the air receiving surface.
In this embodiment, further, the mounting groove is opened at the position corresponding to the position of the air port 13 on the radiator support 1, the first radiating fan 9 and the second radiating fan 12 are connected in series, and the top of the air port 13 is fixed with a cover plate structure with the same shape for realizing capping, so that wind power can be generated on the second radiating fan 12, the outer row with a seam on the heat conducting row hole 7 plays an auxiliary radiating effect, and the integrated arrangement of the air cooling support 4 can effectively be compatible with a plurality of radiators, thereby realizing the fitting and radiating of the device, utilizing the outer guide arrangement of the heat conducting row hole 7 and the optional capping arrangement of the air port 13, and increasing the utilization rate of the bottom radiating fan.
The working principle and the using flow of the utility model are as follows: when the computer heat radiator is used, the radiator bracket 1 is fixed at the position of a computer main board through a screw, the CPU is attached to the cold storage box 2, cold storage liquid filled in the heat-homogenizing metal pipe 5 and the CPU is attached to the cold storage box 2 is effectively used for attaching water cooling, when the air cooling device is used, the power supply on the first heat radiating fan 9 and the second heat radiating fan 12 is directly connected, the cooling air on one side is driven by the first heat radiating fan 9 to attach and radiate one side of the heat radiating fin 3, the hole site on the mounting opening 8 of the heat radiating fan is used for radiating the heat along with the wind to the other side of the heat radiating fin 3, the part is shielded, the bottom of the second heat radiating fan 12 is used for radiating the heat of the CPU directly and the attached part is effectively used for radiating the air, and the heat is directly exhausted through the air opening 13;
and selecting the capped air port 13, and directly cooling the shielding part of the radiating fins 3 on the other side through the hole position on the heat conduction row hole 7 to finish the use.
The working process can be as follows: in this scheme, through the forced air cooling device that corresponds the setting on radiator support 1, increased the radiating mode of bottom heat dissipation and side heat conduction, effectively increased the radiating direction of device, played the face-increasing type heat dissipation to CPU laminating cold storage box 2 part, very big reduction the heat dissipation time of device.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (6)

1. A computer heat sink, comprising a heat sink holder (1), characterized in that: the heat dissipation device comprises a heat dissipation support (1), and is characterized by further comprising an air cooling device, wherein heat dissipation fins (3) are symmetrically arranged at the positions of two sides of the top of the heat dissipation support (1), a plurality of heat dissipation metal pipes (5) are arranged on the inner sides of the heat dissipation fins (3) in a penetrating mode, the positions of water outlets at the bottom ends of the heat dissipation metal pipes (5) are in penetrating connection with two sides of a CPU (Central processing Unit) laminating cold storage box (2), the two adjacent heat dissipation fins (3) are fixedly provided with the air cooling device, the air cooling device comprises an air cooling support (4) correspondingly fixed at the top of the heat dissipation support (1), a heat dissipation fan support (10) is fixedly arranged at the position of the front surface of the air cooling support (4), two heat dissipation fans (9) are vertically distributed on the heat dissipation fan support (10), a chassis support (11) is fixedly arranged at the position of the bottom of the air cooling support (4), and two heat dissipation fans (12) are fixedly arranged on the chassis support (11).
2. A computer heat sink according to claim 1, wherein: a plurality of heat conduction row holes (7) are symmetrically and vertically formed in two side positions of the rear surface of the air cooling support (4), and an air port (13) is formed in the top of the air cooling support (4).
3. A computer heat sink according to claim 1, wherein: the front surface position of the air cooling bracket (4) is provided with a heat dissipation fan mounting opening (8) for fixing a heat dissipation fan bracket (10) in a matching way.
4. A computer heat sink according to claim 1, wherein: fin folds (6) are formed on the radiating fins (3).
5. A computer heat sink according to claim 2, wherein: the radiator support (1) is provided with a mounting groove at the position corresponding to the superposition position of the air port (13).
6. A computer heat sink according to claim 1, wherein: the first radiating fan (9) and the second radiating fan (12) are connected in series and are connected with an external power supply.
CN202320983719.6U 2023-04-27 2023-04-27 Computer heat abstractor Active CN219758750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320983719.6U CN219758750U (en) 2023-04-27 2023-04-27 Computer heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320983719.6U CN219758750U (en) 2023-04-27 2023-04-27 Computer heat abstractor

Publications (1)

Publication Number Publication Date
CN219758750U true CN219758750U (en) 2023-09-26

Family

ID=88074217

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320983719.6U Active CN219758750U (en) 2023-04-27 2023-04-27 Computer heat abstractor

Country Status (1)

Country Link
CN (1) CN219758750U (en)

Similar Documents

Publication Publication Date Title
CN112242586B (en) Battery pack mounting structure with stable electric new energy sanitation vehicle and easy heat dissipation
CN214586685U (en) Computer machine case heat abstractor with water-cooling function
CN101026132A (en) Multi-mode radiator comprising cooling chip and its radiating method
CN212626806U (en) Heat dissipation device for power equipment box
CN219758750U (en) Computer heat abstractor
CN210895329U (en) Module structure for radiating in board
CN105101752A (en) Charger heat dissipation device
CN209946807U (en) Auxiliary heat dissipation device for computer case
CN218162398U (en) Heat dissipation device for photovoltaic power generation
CN205665634U (en) Liquid cooling's rack -mounted server
CN201119247Y (en) Liquid cooling auxiliary heat radiation device
CN207781584U (en) A kind of high-power IGBT liquid-cooling heat radiator
CN214069636U (en) Liquid cooling type IGBT charger
CN205946472U (en) Liquid cooling heat exchanger
CN219716971U (en) High-efficient heat abstractor is used to battery
CN209590757U (en) A kind of certainly cooling radiator structure of server
CN218158944U (en) Temperature equalizing plate heat radiator of central processing chip board for super computer
CN220031191U (en) Auxiliary device for 3D printer
CN217085649U (en) Water-cooled casing for computer
CN216773343U (en) Equipment heat dissipation heat sink in high performance battery course of working
CN215834999U (en) High-efficiency power distribution cabinet easy to dissipate heat
CN109254439A (en) A kind of large size liquid crystal display microchannel aluminium alloy pipe type radiator
CN220511527U (en) Heat radiation protection device for photovoltaic inverter
CN219590784U (en) Water cooling structure of central processing unit
CN215450082U (en) Host and terminal equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant