CN217085649U - Water-cooled casing for computer - Google Patents
Water-cooled casing for computer Download PDFInfo
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- CN217085649U CN217085649U CN202220327715.8U CN202220327715U CN217085649U CN 217085649 U CN217085649 U CN 217085649U CN 202220327715 U CN202220327715 U CN 202220327715U CN 217085649 U CN217085649 U CN 217085649U
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Abstract
The utility model relates to a water-cooling machine shell for computer, including casing main part and cooling structure, wherein, cooling structure includes first cooling unit, and first cooling unit is installed inside the casing main part, including water tank, cooling tube and first pump water structure, the first water inlet and the first delivery port of cooling tube all with water tank UNICOM, first cooling unit still includes carries out radiating heat radiation structure for the treater of computer, and first pump water structure advances the cooling tube with the water pump in the water tank, and the flow through heat radiation structure reduces the inside temperature of treater and casing. The utility model discloses a water-cooling machine shell for computer through the first cooling unit that sets up in the casing main part inside, not only can reduce the inside temperature of casing, improves the poor problem of traditional computer casing radiating effect, still can dispel the heat for the treater of computer specially, has improved the stability of computer performance in the use.
Description
Technical Field
The utility model relates to a computer technology field, in particular to water-cooling machine shell for computer.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed.
The computer casing is used as one part of computer fittings, and has the main functions of holding and protecting computer fittings while fixing the computer fittings.
The existing computer casing usually only adopts an air cooling mode to realize the cooling work of the computer mainframe, the temperature of the internal environment of the casing cannot be effectively reduced, the computer mainframe is easily affected by high temperature and is down, and the use of the computer is not facilitated.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a water cooling housing for a computer to improve the problem of poor heat dissipation effect of the existing computer housing.
In order to achieve the above purpose, the technical scheme of the utility model is realized like this:
a water-cooled enclosure for a computer;
the cooling structure comprises a machine shell main body and a cooling structure, wherein the cooling structure comprises a first cooling unit, the first cooling unit is arranged in the machine shell main body and comprises a water tank, a radiating pipe and a first water pumping structure, a first water inlet and a first water outlet of the radiating pipe are communicated with the water tank, and the first water inlet is communicated with the water tank through the first water pumping structure;
the first cooling unit further comprises a heat dissipation structure for dissipating heat of a processor of the computer, the heat dissipation structure comprises a heat dissipation part attached to the processor, and a water inlet and a water outlet of the heat dissipation part are communicated with the heat dissipation pipe; the first water pumping structure pumps water in the water tank into the radiating pipe and flows through the radiating structure, so that the temperature inside the processor and the shell is reduced.
Furthermore, the cooling structure further comprises a second cooling unit, the second cooling unit is arranged on the bottom plate of the machine shell main body and comprises a cooling pipe, a second water pumping structure and a fan, a second water inlet and a second water outlet of the cooling pipe are communicated with the water tank, the second water inlet is communicated with the water tank through the second water pumping structure, and the second water pumping structure drives water in the water tank to circularly flow in the cooling pipe;
the fan is arranged between the cooling pipe and the bottom plate and is arranged on the bottom plate through a fixing frame; the fan is driven by an external power supply to blow airflow to the cooling pipe, and the airflow is cooled by the cooling pipe and then blows parts inside the casing.
Furthermore, corresponding to the second cooling unit, the bottom plate is provided with an opening for air intake, and one side of the bottom plate close to the ground is provided with four supporting legs which support the bottom plate so that airflow can flow through the opening on the bottom plate.
Further, the heat dissipation part comprises a heat exchange part and an attachment part, wherein a flow channel is formed in the heat exchange part, and the heat exchange part is attached to the attachment part on the processor.
Further, the attaching portion is made of heat-conducting silica gel.
Furthermore, the machine shell main body is provided with heat dissipation holes for ventilation.
Furthermore, the first water pumping structure and the second water pumping structure are both fixedly arranged on the water tank and connected with the machine shell main body.
Furthermore, the radiating pipes are zigzag arranged in a shape like a Chinese character 'ji', and are arranged on the water tank; the cooling pipe is arranged on a fixed frame of the fan through a bracket.
Compared with the prior art, the utility model discloses following advantage has:
the utility model discloses a water-cooling machine shell for computer through the first cooling unit that sets up in the casing main part inside, not only can reduce the inside temperature of casing, improves the poor problem of traditional computer casing radiating effect, still can dispel the heat for the treater of computer specially, has improved the stability of computer performance in the use.
Moreover, the second cooling unit is arranged on the bottom plate of the shell main body, so that the air flow entering the shell main body is cooled in one step, and the cooled air flow can further cool the structure in the shell main body; moreover, the second cooling unit is arranged on the bottom plate of the machine shell main body, so that the air flow direction inside the machine shell main body is more reasonable, and the cooling effect of the second cooling unit in the machine shell main body is effectively guaranteed.
In addition, through four supporting legss that set up on the bottom plate, and the trompil that is used for the air inlet that sets up on the bottom plate for the process that the outside air got into the casing main part through the trompil on the bottom plate is more smooth and easy, and simultaneously, the louvre that sets up in the casing main part also makes the outflow of hot gas flow more convenient.
Finally, the radiating pipes are arranged on the water tank in a zigzag manner in a shape like a Chinese character 'ji', so that the overall radiating area of the radiating pipes is increased, and the cooling effect of the cooling structure is enhanced.
Drawings
The accompanying drawings, which form a part of the present disclosure, are provided to provide a further understanding of the present disclosure, and the exemplary embodiments and descriptions thereof are provided to explain the present disclosure, wherein the related terms in the front, back, up, down, and the like are only used to represent relative positional relationships, and do not constitute an undue limitation of the present disclosure. In the drawings:
fig. 1 is a schematic overall structure diagram of a water-cooling casing for a computer according to an embodiment of the present invention;
fig. 2 is a schematic view of a cooling structure installation position of a water-cooling housing for a computer according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first cooling unit of a water-cooled enclosure for a computer according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second cooling unit of a water-cooled computer case according to an embodiment of the present invention.
Description of reference numerals:
1. a case main body; 2. a cooling structure; 21. a first cooling unit; 211. a water tank; 212. a radiating pipe; 213. a first water pumping structure; 214. a heat dissipating section; 22. a second cooling unit; 221. a cooling tube; 222. a second water pumping structure; 223. a fixed mount; 224. a fan.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it should be noted that, if terms indicating orientation or positional relationship such as "upper", "lower", "inner", "back", etc. appear, they are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, the terms "mounted," "connected," and "connecting" are to be construed broadly unless expressly limited otherwise. For example, the connection may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. To those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood in combination with the specific situation.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The utility model relates to a water-cooling machine shell for computer, an exemplary structure thereof is shown in figure 1 and combined with figures 2 and 3.
In an entirety, the water-cooling case for the computer comprises a case main body 1 and a cooling structure 2, wherein the cooling structure 2 comprises a first cooling unit 21, the first cooling unit 21 is installed inside the case main body 1 and comprises a water tank 211, a radiating pipe 212 and a first water pumping structure 213, a first water inlet and a first water outlet of the radiating pipe 212 are both communicated with the water tank 211, and the first water inlet is communicated with the water tank 211 through the first water pumping structure 213;
the first cooling unit 21 further includes a heat dissipation structure for dissipating heat of the processor of the computer, the heat dissipation structure includes a heat dissipation portion 214 attached to the processor, and a water inlet and a water outlet of the heat dissipation portion 214 are both communicated with the heat dissipation pipe 212; the first water pumping structure 213 pumps water in the water tank 211 into the heat radiating pipe 212 and flows through the heat radiating structure, lowering the temperature of the inside of the disposer and the cabinet.
In detail, in order to enhance the heat dissipation effect of the heat dissipation pipe 212, the heat dissipation area of the heat dissipation pipe 212 needs to be increased as much as possible, for this reason, the heat dissipation pipe 212 is zigzag arranged on the water tank 211 in a shape like a Chinese character 'ji', and the heat dissipation pipe 212 and the water tank 211 can also be made of aluminum alloy, so that the heat dissipation pipe 212 can be fixed relative to the water tank 211 by the connection between the first water inlet and the first water outlet and the water tank 211; of course, for convenience of processing, the connection mode between the first water inlet and the first water outlet and the water tank 211 may be selected as welding.
Meanwhile, the heat dissipation part 214 comprises a heat exchange part and an attachment part, wherein a flow channel is formed in the heat exchange part, the attachment part attaches the heat exchange part to the processor, in specific implementation, the heat exchange part can be set to be a metal box with the flow channel inside, two surfaces of the metal box are respectively communicated with the heat dissipation pipe 212, water flow in the heat dissipation pipe 212 flows through the metal box under the driving of the first water pumping structure 213, one surface of the metal box is attached to the processor through the attachment part, and therefore the heat on the processor can be taken away by the water flow flowing through the metal box;
in order to attach the metal box to the handler, the attachment portion may be provided as a heat conductive silicone.
In this embodiment, between the heat dissipating part 214 and the heat dissipating pipe 212, the heat dissipating pipe 212 may be directly constructed in a shape capable of communicating with the metal box, and then the positions of the chain communication between the heat dissipating pipe 212 and the metal box are welded together, and the specific position of the metal box may be flexibly set corresponding to the installation position of the processor.
However, this structure is not friendly to people of various kinds of machines, the shapes of different computer main boards are different, and the installation positions between the processor and the cabinet main body 1 are also different, so that once the production line of the first cooling structure 2 is determined, the structure of the produced heat dissipation pipe 212 is also fixed, and the heat dissipation pipe cannot be adapted to processors at different positions; thus, although this embodiment facilitates the processing of the first cooling structure 2, it has no positive effect on the suitability of this embodiment; to this end, preferably, in this embodiment, the communication between the heat dissipating part 214 and the heat dissipating pipe 212 is realized by a hose, and the length of the hose can be selected to be slightly longer, so that the heat dissipating part 214 can be easily adapted to the installation position of different processors.
As for the first water pumping structure 213, it includes not only the water pump but also a protrusion constructed on a portion of the water tank 211, on which the water pump is installed, and the first water inlet is communicated with the water outlet of the water pump, which in turn pumps water in the water tank 211 into the radiating pipe 212 and circulates the water between the radiating pipe 212 and the water tank 211.
In addition, in order to further enhance the cooling effect of the cooling structure 2 on the inside of the cabinet main body 1, in this embodiment, the cooling structure 2 further includes a second cooling unit 22, the second cooling unit 22 is disposed on the bottom plate of the cabinet main body 1 and includes a cooling pipe 221, a second water pumping structure 222 and a fan 224, a second water inlet and a second water outlet of the cooling pipe 221 are both communicated with the water tank 211, wherein the second water inlet is communicated with the water tank 211 through the second water pumping structure 222, and the second water pumping structure 222 drives water in the water tank 211 to circularly flow in the cooling pipe 221.
The second water pumping structure 222 has the same structure as the first water pumping structure 213, and will not be described in detail herein.
Meanwhile, as shown in fig. 4, the fan 224 is disposed between the cooling pipe 221 and the base plate and is mounted on the base plate through the fixing frame 223; the fan 224 is driven by an external power supply to blow an air flow to the cooling pipe 221, and the air flow is cooled by the cooling pipe 221 to blow components inside the housing. Thus, the airflow entering the casing main body 1 is further cooled, and the cooled airflow can further cool the structure in the casing main body 1; moreover, the second cooling unit 22 is disposed on the bottom plate of the casing main body 1, so that the airflow flowing direction inside the casing main body 1 is more reasonable, and the cooling effect of the second cooling unit 22 on the inside of the casing main body 1 is effectively guaranteed.
Of course, as for the arrangement of the cooling pipe 221 on the fan 224, reference may be made to the arrangement of the heat dissipation pipe 212 on the water tank 211; however, in the present embodiment, the cooling pipe 221 is fixedly mounted on the fixing frame 223 of the fan 224 through the replacement fixing frame 223, and the fan 224 is bolted to the bottom plate through the bolt hole of the fixing frame 223.
In order to make the outflow of the heated hot air flow in the casing main body 1 more convenient, the casing main body 1 is further provided with heat dissipation holes, in addition, in order to facilitate the air intake of the fan 224, the bottom plate is provided with four supporting legs, in addition, the bottom plate is further provided with openings, the external air flow enters the inside of the casing main body 1 through the openings on the bottom plate, and after being cooled by the cooling pipe 221, the external air flow blows other structures inside the casing main body 1 to cool the structure inside the casing main body 1.
It should be noted that the fan 224 is not disposed in the first cooling structure 2 in this embodiment, which takes into account that most computer motherboards are also installed with the fan 224 during the assembly process, and the first cooling structure 2 increases the heat dissipation area through the heat dissipation pipe 212, so that the heat dissipation area is larger, and the airflow on the fan 224 can achieve a better heat dissipation effect when flowing through the heat dissipation pipe 212.
Preferably, in this embodiment, an electric refrigeration device may be further disposed in the water tank 211, and the electric refrigeration device is driven by an external power source to continuously cool the water flow in the water tank 211.
To sum up, the water-cooling casing for computer of this embodiment, through the first cooling unit 21 that sets up in casing main part 1 inside, not only can reduce the inside temperature of casing, improve the poor problem of traditional computer casing radiating effect, still can dispel the heat for the treater of computer specially, improved the stability of computer performance in the use.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A water-cooled enclosure for a computer; the method is characterized in that:
the cooling structure (2) comprises a machine shell main body (1) and a cooling structure (2), wherein the cooling structure (2) comprises a first cooling unit (21), the first cooling unit (21) is arranged in the machine shell main body (1) and comprises a water tank (211), a radiating pipe (212) and a first water pumping structure (213), a first water inlet and a first water outlet of the radiating pipe (212) are communicated with the water tank (211), and the first water inlet is communicated with the water tank (211) through the first water pumping structure (213);
the first cooling unit (21) further comprises a heat dissipation structure for dissipating heat of a processor of the computer, the heat dissipation structure comprises a heat dissipation part (214) attached to the processor, and a water inlet and a water outlet of the heat dissipation part (214) are communicated with the heat dissipation pipe (212); the first water pumping structure (213) pumps water in the water tank (211) into the heat radiating pipe (212) and flows through the heat radiating structure, reducing the temperature inside the cooler and the cabinet.
2. The water-cooled cabinet for a computer according to claim 1, wherein:
the cooling structure (2) further comprises a second cooling unit (22), the second cooling unit (22) is arranged on the bottom plate of the machine shell main body (1) and comprises a cooling pipe (221), a second water pumping structure (222) and a fan (224), a second water inlet and a second water outlet of the cooling pipe (221) are communicated with the water tank (211), the second water inlet is communicated with the water tank (211) through the second water pumping structure (222), and the second water pumping structure (222) drives water in the water tank (211) to circularly flow in the cooling pipe (221);
the fan (224) is arranged between the cooling pipe (221) and the bottom plate and is installed on the bottom plate through a fixing frame (223); the fan (224) is driven by an external power supply to blow an air flow to the cooling pipe (221), and the air flow blows parts inside the housing after being cooled by the cooling pipe (221).
3. The water-cooled cabinet for a computer according to claim 2, wherein:
corresponding to the second cooling unit (22), the bottom plate is provided with a hole for air inlet, one side of the bottom plate close to the ground is provided with four supporting legs, and the supporting legs support the bottom plate so that airflow can flow through the hole in the bottom plate.
4. The water-cooled cabinet for a computer according to claim 1, wherein:
the heat dissipation part (214) comprises a heat exchange part and an attachment part, wherein a flow channel is formed in the heat exchange part, and the heat exchange part is attached to the processor.
5. The water-cooled cabinet for a computer according to claim 4, wherein:
the attaching portion is arranged to be heat-conducting silica gel.
6. The water-cooled cabinet for a computer according to claim 1, wherein:
the machine shell main body (1) is provided with heat dissipation holes for ventilation.
7. The water-cooled cabinet for a computer according to claim 2, wherein:
the first water pumping structure (213) and the second water pumping structure (222) are fixedly arranged on the water tank (211) and are connected with the machine shell main body (1).
8. The water-cooled cabinet for a computer according to claim 7, wherein:
the radiating pipes (212) are zigzag arranged in a shape like a Chinese character 'ji', and are arranged on the water tank (211); the cooling pipe (221) is mounted on a fixing frame (223) of the fan (224) through a bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220327715.8U CN217085649U (en) | 2022-02-17 | 2022-02-17 | Water-cooled casing for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220327715.8U CN217085649U (en) | 2022-02-17 | 2022-02-17 | Water-cooled casing for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217085649U true CN217085649U (en) | 2022-07-29 |
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ID=82545277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220327715.8U Active CN217085649U (en) | 2022-02-17 | 2022-02-17 | Water-cooled casing for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217085649U (en) |
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2022
- 2022-02-17 CN CN202220327715.8U patent/CN217085649U/en active Active
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