CN217085649U - Water-cooled casing for computer - Google Patents

Abstract

The utility model relates to a water-cooled casing for a computer, comprising a casing main body and a cooling structure, wherein the cooling structure includes a first cooling unit, and the first cooling unit is installed inside the casing main body and includes a water tank, a heat dissipation pipe and a first cooling unit. The water pump structure, the first water inlet and the first water outlet of the heat dissipation pipe are connected with the water tank, the first cooling unit also includes a heat dissipation structure for dissipating heat for the processor of the computer, and the first water pump structure heats the water pump in the water tank. tube and flow through the cooling structure, reducing the temperature inside the processor and the case. The water-cooled computer casing of the utility model, through the first cooling unit arranged inside the casing main body, can not only reduce the temperature inside the casing, improve the problem of poor heat dissipation effect of the traditional computer casing, but also can be specially designed for the processing of the computer. It can dissipate heat and improve the stability of the performance of the computer during use.

Description

computer water cooling case

technical field

The utility model relates to the technical field of computers, in particular to a water-cooled casing for a computer.

Background technique

Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed.

As a part of computer accessories, the computer case plays a major role in placing and fixing various computer accessories, while also supporting and protecting the computer accessories. important role.

Existing computer casings usually only use air cooling to cool the computer host, which cannot effectively reduce the temperature of the internal environment of the casing. Therefore, some manufacturers have produced some computer cases with water cooling function to improve the problem of unsatisfactory heat dissipation effect of traditional air-cooled cases. However, these cases have poor overall structural layout and unreasonable air duct flow. The problem of unsatisfactory cooling effect.

Utility model content

In view of this, the present invention aims to provide a water-cooled casing for a computer to improve the problem of poor heat dissipation effect of the existing computer casing.

In order to achieve the above object, the technical scheme of the present utility model is achieved in this way:

A water-cooled casing for a computer;

It includes a casing body and a cooling structure, the cooling structure includes a first cooling unit, the first cooling unit is installed inside the casing body, and includes a water tank, a heat dissipation pipe and a first pump water structure, the heat dissipation pipe Both the first water inlet and the first water outlet are communicated with the water tank, wherein the first water inlet is communicated with the water tank through a first pump water structure;

The first cooling unit also includes a heat dissipation structure for dissipating heat for the processor of the computer, the heat dissipation structure includes a heat dissipation part attached to the processor, and the water inlet and the water outlet of the heat dissipation part are the same as the The heat dissipation pipes are connected; the first water pump structure pumps the water in the water tank into the heat dissipation pipes, and flows through the heat dissipation structure to reduce the temperature inside the processor and the casing.

Further, the cooling structure further includes a second cooling unit, the second cooling unit is arranged on the bottom plate of the casing main body, and includes a cooling pipe, a second water pump structure and a fan, and the second cooling unit of the cooling pipe is Both the water inlet and the second water outlet are communicated with the water tank, wherein the second water inlet is communicated with the water tank through a second water pumping structure, and the second water pumping structure drives the water in the water tank to circulate in the water tank. circulating flow in the cooling pipe;

The fan is arranged between the cooling pipe and the bottom plate, and is mounted on the bottom plate through a fixing frame; the fan is driven by an external power supply, so that the air flow blows the cooling pipe, and the air flow passes through the cooling pipe. After the cooling pipe is cooled, the components inside the casing are blown.

Further, corresponding to the second cooling unit, the bottom plate is provided with an opening for air intake, and the side of the bottom plate close to the ground is provided with four support feet, and the support feet support the bottom plate , so that the air flows through the openings in the base plate.

Further, the heat dissipation portion includes a heat exchange portion with a flow channel formed therein, and an attachment portion for attaching the heat exchange portion to the processor.

Further, the attachment portion is set to be thermally conductive silica gel.

Further, the main body of the casing is provided with cooling holes for ventilation.

Further, the first water pumping structure and the second water pumping structure are both fixedly mounted on the water tank and connected to the main body of the casing.

Further, the cooling pipes are arranged in a zigzag shape in a "ji" shape, and are installed on the water tank; the cooling pipes are installed on the fixing frame of the fan through a bracket.

Compared with the prior art, the utility model has the following advantages:

The water-cooled casing of the computer of the utility model, through the first cooling unit arranged inside the casing main body, can not only reduce the temperature inside the casing, improve the problem of poor heat dissipation effect of the traditional computer casing, but also can be specially designed for the processing of the computer. The device is used to dissipate heat, which improves the stability of the performance of the computer during use.

In addition, through the second cooling unit arranged on the bottom plate of the casing main body, the airflow entering the casing main body is cooled first, and the cooled air flow can further cool the structure in the casing main body; The second cooling unit is arranged on the bottom plate of the casing main body, which also makes the airflow direction inside the casing main body more reasonable, so that the cooling effect of the second cooling unit on the casing main body is effectively guaranteed.

In addition, through the four supporting feet set on the bottom plate and the openings for air intake set on the bottom plate, the process of outside air entering the main body of the casing through the openings on the bottom plate is smoother. At the same time, the heat dissipation holes provided on the main body of the casing also make the outflow of hot air more convenient.

Finally, by arranging the heat pipes on the water tank in a zigzag shape, the overall heat dissipation area of the heat pipes is increased, thereby enhancing the cooling effect of the cooling structure.

Description of drawings

The accompanying drawings that form a part of the present utility model are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model. It is only used to represent the relative positional relationship, and does not constitute an improper limitation of the present invention. In the attached image:

1 is a schematic diagram of the overall structure of a computer water-cooled casing according to an embodiment of the present utility model;

2 is a schematic diagram of the installation position of the cooling structure of the computer water-cooled casing according to the embodiment of the present invention;

3 is a schematic structural diagram of a first cooling unit of a computer water-cooled casing according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a second cooling unit of a water-cooled casing for a computer according to an embodiment of the present invention.

Description of reference numbers:

1. Main body of the casing; 2. Cooling structure; 21. The first cooling unit; 211, Water tank; 222, the second pump water structure; 223, the fixing frame; 224, the fan.

Detailed ways

It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict.

In the description of the present utility model, it should be noted that if terms such as "upper", "lower", "inside", and "back" appear to indicate orientation or positional relationship, they are based on the orientation or position shown in the accompanying drawings. The relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In addition, in the description of the present invention, unless otherwise clearly defined, the terms "installed", "connected", "connected" and "connecting member" should be construed in a broad sense. For example, the connection may be a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or two elements Internal connectivity. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in combination with specific situations.

The present utility model will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

The utility model relates to a water-cooled casing for a computer, an exemplary structure of which is shown in FIG. 1 in conjunction with FIG. 2 and FIG. 3 .

In general, the water-cooled case of the computer includes a case body 1 and a cooling structure 2, wherein the cooling structure 2 includes a first cooling unit 21, and the first cooling unit 21 is installed inside the case body 1 and includes a water tank 211 , the radiating pipe 212 and the first water pump structure 213, the first water inlet and the first water outlet of the radiating pipe 212 are both communicated with the water tank 211, wherein the first water inlet is communicated with the water tank 211 through the first water pump structure 213;

The first cooling unit 21 also includes a heat dissipation structure for dissipating heat for the processor of the computer. The heat dissipation structure includes a heat dissipation portion 214 attached to the processor. The water pump structure 213 pumps the water in the water tank 211 into the heat dissipation pipe 212 and flows through the heat dissipation structure to reduce the temperature inside the processor and the casing.

In detail, in order to enhance the heat dissipation effect of the heat dissipation pipe 212, it is necessary to increase the heat dissipation area of the heat dissipation pipe 212 as much as possible. And the water tank 211 can also be made of aluminum alloy material, in this way, the heat pipe 212 can be fixed relative to the water tank 211 through the connection between the first water inlet and the first water outlet and the water tank 211; Of course, for the convenience of processing, the connection between the first water inlet and the first water outlet and the water tank 211 can be selected as welding.

At the same time, the heat dissipation part 214 includes a heat exchange part with a flow channel formed inside, and an attachment part for attaching the heat exchange part to the processor. In specific implementation, the heat exchange part can be set as a metal box with a flow channel inside, The two surfaces on the metal box are respectively communicated with the radiating pipe 212. The water flow in the radiating pipe 212 is driven by the first water pump structure 213 and flows through the metal box, and one surface of the metal box is attached by the attaching part. On the processor, so that the flow of water through the metal box removes heat from the processor;

In order to attach the metal case to the processor, the attaching portion may be configured as thermally conductive silicone.

In this embodiment, between the heat dissipation portion 214 and the heat dissipation pipe 212, the heat dissipation pipe 212 can be directly constructed into a shape that can communicate with the metal box, and then the positions where the heat dissipation pipe 212 and the metal box communicate with each other are welded together. Moreover, the specific position of the metal box can be flexibly set according to the installation position of the processor.

However, this kind of structure is not friendly to people who build various computers. Different computer motherboards have different shapes, and the installation positions between the processor and the casing body 1 are not only the same, so that the first cooling structure Once the production line of The adaptability has no positive impact; for this reason, preferably, in this embodiment, the communication between the heat dissipation part 214 and the heat dissipation pipe 212 is realized through a hose, and the length of the hose can be selected to be slightly longer, which is also convenient for The heat dissipation part 214 is adapted to the installation positions of different processors.

As for the first water pump structure 213, it not only includes a water pump, but also includes a part of a protrusion constructed on the water tank 211, on which the water pump is installed, the first water inlet is communicated with the water outlet of the water pump, and the water pump further connects the water in the water tank 211. The water is pumped into the radiating pipe 212 , and the water is circulated between the radiating pipe 212 and the water tank 211 .

In addition, in order to further enhance the cooling effect of the cooling structure 2 on the inside of the casing main body 1 , in this embodiment, the cooling structure 2 further includes a second cooling unit 22 , and the second cooling unit 22 is provided on the bottom plate of the casing main body 1 . , including a cooling pipe 221, a second water pump structure 222 and a fan 224, the second water inlet and the second water outlet of the cooling pipe 221 are both communicated with the water tank 211, wherein the second water inlet is connected to the water tank through the second water pump structure 222. 211 is connected, and the second water pump structure 222 drives the water in the water tank 211 to circulate in the cooling pipe 221 .

It should be noted that the structural form of the second water pumping structure 222 is the same as that of the above-mentioned first water pumping structure 213 , which is not repeated here.

At the same time, as shown in FIG. 4, the fan 224 is arranged between the cooling pipe 221 and the bottom plate, and is mounted on the bottom plate through the fixing frame 223; the fan 224 is driven by an external power supply, so that the air flow blows the cooling pipe 221, and the air flows through the cooling pipe 221. After the cooling pipe 221 is cooled, the components inside the casing are blown. In this way, the airflow entering the casing main body 1 is first cooled, and the cooled airflow can further cool the structure in the casing main body 1 ; The bottom plate also makes the airflow direction inside the casing main body 1 more reasonable, so that the cooling effect of the second cooling unit 22 on the casing main body 1 is effectively guaranteed.

Of course, for the arrangement of the cooling pipes 221 on the fan 224, reference may be made to the arrangement of the cooling pipes 212 on the water tank 211; however, in this embodiment, the cooling pipes 221 are fixedly installed on the fan 224 by replacing the fixing frame 223. On the fixing frame 223, the fan 224 is bolted to the bottom plate through the bolting holes on the fixing frame 223.

In order to make the outflow of the hot air heated in the casing main body 1 more convenient, the casing main body 1 is also provided with heat dissipation holes. , the bottom plate is also provided with openings, the outside air enters the inside of the casing main body 1 through the openings on the bottom plate, and is cooled by the cooling pipe 221, and then blows other structures inside the casing main body 1, which is the casing main body 1 The internal structure is cooled.

It should be noted that the first cooling structure 2 in the present embodiment is not provided with the fan 224. This is because most computer motherboards are also installed with the fan 224 during the assembly process. The first cooling structure 2 dissipates heat by The pipe 212 increases the heat dissipation area, and the larger heat dissipation area also enables the airflow on the fan 224 to have a better heat dissipation effect when flowing through the heat dissipation pipe 212 .

Preferably, in this embodiment, an electric refrigerating device may also be arranged in the water tank 211 , and the electric refrigerating device is driven by an external power supply to continuously cool the water flow in the water tank 211 .

To sum up, in the water-cooled computer casing of the present embodiment, the first cooling unit 21 disposed inside the casing main body 1 can not only reduce the temperature inside the casing, but also improve the problem of poor heat dissipation effect of the traditional computer casing. It can also specially dissipate heat for the processor of the computer, which improves the stability of the performance of the computer during use.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the within the scope of protection of the present invention.

Claims (8)

1. a computer water-cooled casing; it is characterized in that: Comprising a casing main body (1) and a cooling structure (2), the cooling structure (2) includes a first cooling unit (21), and the first cooling unit (21) is mounted on the casing main body (1) The interior includes a water tank (211), a heat pipe (212) and a first water pump structure (213). The first water inlet and the first water outlet of the heat pipe (212) are in communication with the water tank (211), Wherein, the first water inlet is communicated with the water tank (211) through a first water pump structure (213); The first cooling unit (21) further includes a heat dissipation structure for dissipating heat for the processor of the computer, the heat dissipation structure includes a heat dissipation part (214) attached to the processor, and the heat dissipation part (214) has a heat dissipation part (214). Both the water inlet and the water outlet are communicated with the heat dissipation pipe (212); the first water pump structure (213) pumps the water in the water tank (211) into the heat dissipation pipe (212) and flows through the heat dissipation structure , lowers the temperature inside the cooler and case. 2. computer water-cooling casing according to claim 1 is characterized in that: The cooling structure (2) further includes a second cooling unit (22), the second cooling unit (22) is provided on the bottom plate of the casing main body (1), and includes a cooling pipe (221), a second pump A water structure (222) and a fan (224), the second water inlet and the second water outlet of the cooling pipe (221) are in communication with the water tank (211), wherein the second water inlet passes through a second pump The water structure (222) is communicated with the water tank (211), and the second water pump structure (222) drives the water in the water tank (211) to circulate in the cooling pipe (221); The fan (224) is arranged between the cooling pipe (221) and the bottom plate, and is mounted on the bottom plate through a fixing frame (223); the fan (224) is driven by an external power supply to make the fan (224) The airflow blows the cooling pipe (221), and after being cooled by the cooling pipe (221), the airflow blows the components inside the casing. 3. computer water cooling casing according to claim 2 is characterized in that: Corresponding to the second cooling unit (22), the bottom plate is provided with an opening for air intake, and the side of the bottom plate close to the ground is provided with four support feet, and the support feet support the bottom plate , so that the air flows through the openings in the base plate. 4. computer water-cooling casing according to claim 1 is characterized in that: The heat dissipation part (214) includes a heat exchange part with a flow channel formed therein, and an attachment part for attaching the heat exchange part to the processor. 5. computer water-cooling casing according to claim 4 is characterized in that: The attachment portion is set to be thermally conductive silica gel. 6. computer water-cooling casing according to claim 1, is characterized in that: The casing main body (1) is provided with cooling holes for ventilation. 7. computer water-cooling casing according to claim 2 is characterized in that: The first water pumping structure (213) and the second water pumping structure (222) are both fixedly mounted on the water tank (211) and connected to the casing main body (1). 8. computer water-cooling casing according to claim 7, is characterized in that: The cooling pipes (212) are zigzagly arranged in a "ji" shape, and are mounted on the water tank (211); the cooling pipes (221) are mounted on the fixing frame ( 223) on.

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