CN220235064U

CN220235064U - Multilayer circuit board capable of being spliced and stacked

Info

Publication number: CN220235064U
Application number: CN202321189847.XU
Authority: CN
Inventors: 李涵; 孙家园; 李忠乐
Original assignee: Zhejiang Shanghao Electronic Technology Co ltd
Current assignee: Zhejiang Shanghao Electronic Technology Co ltd
Priority date: 2023-05-17
Filing date: 2023-05-17
Publication date: 2023-12-22
Anticipated expiration: 2033-05-17

Abstract

The utility model discloses a multi-layer circuit board capable of being spliced and stacked, and relates to the related field of PCB circuit boards, comprising a circuit board, a heat dissipation hole arranged on the top end surface of the circuit board, and a connecting port arranged on the left part of the front end of the circuit board, wherein a splicing assembly is arranged to enable splicing columns at the bottom end of the other group of circuit boards to be inserted into the inner sides of limiting through holes, and meanwhile, a limiting group is used for limiting and fixing a fixed board, so that the spliced multi-layer circuit board is prevented from being easily decomposed due to collision, and the working efficiency of the multi-layer circuit board is improved; through having set up radiating component, make the heat transfer layer indirectly derive heat from fixed shell four sides side louvre and louvre through graphene heat dissipation layer, avoid just dispelling the heat through the one deck heat-conducting plate, and make the inside electronic component of multilayer circuit board receive high temperature influence to improve its multilayer circuit board's life.

Description

Multilayer circuit board capable of being spliced and stacked

Technical Field

The utility model relates to the related field of PCB (printed Circuit Board), in particular to a spliced and stacked multilayer circuit board.

Background

The PCB circuit board is also called a printed circuit board, is a provider for electric connection of electronic components, and has the main advantages of greatly reducing errors of wiring and assembly, improving automation level and production labor rate, and being divided into a single-layer board, a double-layer board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the layer number of the circuit board.

For example, chinese patent publication No. CN208657161U discloses a PCB circuit board that can splice, including the main part, one side surface of main part is equipped with first connecting plate, and the upper surface of first connecting plate is equipped with the joint post, and the upper surface of joint post is equipped with the dog, the opposite side surface of main part is equipped with the second connecting plate, and the recess that corresponds with the joint post is seted up to the upper surface of second connecting plate, and the upper surface of second connecting plate is equipped with the fixed column, the outside surface rotation of fixed column is connected with the rotor plate, the joint groove that matches with the joint post has been seted up to the side surface of rotor plate.

In the above patent, referring to fig. 1 and 2, the PCB is spliced by the stopper, the rotating plate and the fixing block, but the friction between the rotating plate and the fixing block is small, and the spliced multilayer circuit board is easily decomposed due to collision, so that the working efficiency is reduced; and the existing multilayer circuit board only dissipates heat through one layer of heat conducting plate, so that the heat dissipation efficiency is low, and electronic components in the multilayer circuit board are easily affected by high temperature, so that the service life of the multilayer circuit board is reduced.

Disclosure of Invention

Accordingly, in order to solve the above-mentioned drawbacks, the present utility model provides a multi-layered circuit board that can be spliced and stacked.

The utility model is realized in such a way, a multi-layer circuit board capable of being spliced and stacked is constructed, the device comprises a circuit board, a first radiating hole is arranged on the top end surface of the circuit board, and a connecting port is arranged at the left part of the front end of the circuit board;

characterized by further comprising: the bottom of the outer side surface of the circuit board is fixedly welded with the splicing component; the splice assembly includes: the bottom of the outer side surface of the circuit board is fixedly welded with the mounting plate; the left and right parts of the top end of the mounting plate are respectively provided with a limiting through hole; the inner sides of the left groove and the right groove of the top end face of the mounting plate are respectively provided with a limiting group; the left part and the right part of the top end surface of the mounting plate are both rotationally connected with the fixing plate; the left part and the right part of the bottom end of the mounting plate are welded and fixed with the connecting plate; the bottom ends of the two groups of connecting plates are provided with four groups of splicing columns at equal intervals; the left end and the right end of the splicing column are respectively provided with a splicing groove; and the radiating component is fixedly welded at the middle part of the bottom end of the mounting plate.

Preferably, the heat dissipation assembly includes: the middle part of the bottom end of the mounting plate is fixedly welded with the fixing shell; the side radiating holes are respectively formed in the left end and the right end of the fixed shell.

Preferably, the heat dissipation assembly further comprises: the front end and the rear end of the fixed shell are provided with heat dissipation holes II; and the graphene heat dissipation layer is arranged at the inner bottom of the fixed shell.

Preferably, the heat dissipation assembly further comprises: the top end of the graphene heat dissipation layer is provided with a heat conduction layer; and the top end of the heat conduction layer is provided with a heat transfer layer.

Preferably, the limiting group consists of a trapezoid block and a soft cushion, and the compression height of the soft cushion is the exposed height of the trapezoid block.

Preferably, the splice groove is a T-shaped clamping groove, and the splice groove is symmetrically arranged at the left end and the right end of the splice column.

Preferably, the heat transfer is composed of copper, and the top end of the heat transfer layer is contacted with the bottom end of the circuit board.

The utility model has the following advantages: the utility model provides a multi-layer circuit board capable of being spliced and stacked through improvement, and compared with the same type of equipment, the multi-layer circuit board has the following improvement:

according to the spliced and stacked multilayer circuit board, the splicing assembly is arranged, so that the splicing columns at the bottom end of the other group of circuit boards are inserted into the inner sides of the limiting through holes, and meanwhile, the limiting groups are used for limiting and fixing the fixing plates, so that the spliced multilayer circuit boards are prevented from being easily decomposed due to collision, and the working efficiency of the spliced multilayer circuit boards is improved.

According to the spliced and stacked multilayer circuit board, the heat radiating assembly is arranged, so that the heat transfer layer indirectly conducts heat out of the side radiating holes and the radiating holes on the four sides of the fixing shell through the graphene radiating layer, heat dissipation is avoided through only one layer of heat conducting plate, electronic elements in the multilayer circuit board are affected by high temperature, and the service life of the multilayer circuit board is prolonged.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic side elevational view of a prior art structure;

FIG. 3 is a schematic diagram of the structure of the present utility model;

FIG. 4 is a schematic perspective view of a splice assembly of the present utility model;

FIG. 5 is an enlarged view of the utility model at A in FIG. 4;

FIG. 6 is a schematic perspective view of a heat dissipating assembly according to the present utility model;

fig. 7 is a perspective cross-sectional view of a heat dissipating assembly of the present utility model.

Wherein: the heat-conducting structure comprises a circuit board-1, a first heat-radiating hole-2, a connecting port-3, a splicing component-4, a mounting plate-41, a limiting through hole-42, a limiting group-43, a fixing plate-44, a connecting plate-45, a splicing column-46, a splicing groove-47, a heat-radiating component-48, a fixing shell-481, a side heat-radiating hole-482, a second heat-radiating hole-483, a graphene heat-radiating layer-484, a heat-conducting layer-485 and a heat-conducting layer-486.

Description of the embodiments

The principles and features of the present utility model are described below with reference to fig. 3-7, which are examples for illustration only and are not intended to limit the scope of the utility model. The utility model is more particularly described by way of example in the following paragraphs with reference to the drawings. Advantages and features of the utility model will become more apparent from the following description and from the claims. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Examples

Referring to fig. 3-7, the multi-layer circuit board capable of being spliced and stacked according to the present utility model includes a circuit board 1, a heat dissipation hole 2 provided on a top surface of the circuit board 1, and a connection port 3 provided on a left portion of a front end of the circuit board 1;

characterized by further comprising: the splicing component 4 is welded and fixed at the bottom of the outer side surface of the circuit board 1; the splice assembly 4 includes: the mounting plate 41 is welded and fixed at the bottom of the outer side surface of the circuit board 1, limiting through holes 42 are formed in the left and right parts of the top end of the mounting plate 41, the mounting plate 41 provides a fixing area for the limiting through holes 42, limiting groups 43 are arranged in the inner sides of the left and right grooves of the top end surface of the mounting plate 41, the left and right parts of the top end surface of the mounting plate 41 are rotationally connected with fixing plates 44, connecting plates 45 are welded and fixed at the left and right parts of the bottom end of the mounting plate 41, four groups of splicing columns 46 are arranged at equal intervals at the bottom ends of the two groups of connecting plates 45, and the connecting plates 45 provide a mounting area for the splicing columns 46;

the spliced pole 46 is equipped with splice groove 47 about both ends respectively, and the middle part welded fastening of mounting panel 41 bottom has radiator unit 48, makes mounting panel 41 provide fixed region for radiator unit 48, and limit group 43 comprises trapezoidal piece and cushion, and cushion pressurized altitude is the height that the trapezoidal piece was exposed, makes limit group 43 play spacing effect, and splice groove 47 is T shape draw-in groove, and splice groove 47 symmetry locates the both ends about splice pole 46, makes splice groove 47 play the concatenation effect.

The working principle of the multilayer circuit board capable of being spliced and stacked based on the embodiment 1 is as follows:

first, when the splice is needed, the worker inserts the splice column 46 at the bottom end of the other group of circuit boards 1 into the inner side of the limit through hole 42 at the top end of the mounting board 41, and then rotates the fixing boards 44 at the left and right sides of the top end of the mounting board 41, so that the protrusions of the fixing boards 44 are inserted into the inner sides of the splice grooves 47 of the splice column 46.

Secondly, then, make fixed plate 44 pass through the inclined plane of limit group 43 with its trapezoidal piece downwardly extrusion cushion simultaneously, when making fixed plate 44 keep away from limit group 43, can make the cushion reset trapezoidal piece to make limit group 43 carry out spacing fixed to fixed plate 44, avoid receiving the collision at spliced multilayer circuit board 1 and make it decompose easily.

Examples

Referring to fig. 3 to 7, in the multi-layer circuit board capable of being spliced and stacked according to the present utility model, compared with the first embodiment, the heat dissipation assembly 48 further includes: the heat dissipation assembly 48 includes: a fixing shell 481, wherein the middle part of the bottom end of the mounting plate 41 is fixedly welded with the fixing shell 481, the left and right ends of the fixing shell 481 are respectively provided with side heat dissipation holes 482, and the front and rear ends of the fixing shell 481 are respectively provided with a heat dissipation hole two 483, so that the fixing shell 481 provides a fixing area for the heat dissipation holes two 483;

the inner bottom of the fixed shell 481 is provided with a graphene heat dissipation layer 484, the top end of the graphene heat dissipation layer 484 is provided with a heat conduction layer 485, the top end of the heat conduction layer 485 is provided with a heat transfer layer 486, the heat transfer layer 486 is made of copper materials, and the top end of the heat transfer layer 486 contacts with the bottom end of the circuit board 1, so that the heat transfer layer 486 plays a role in heat dissipation.

In this embodiment:

when the circuit board 1 generates heat during use, the heat transfer layer 486 conducts heat to the graphene heat dissipation layer 484 through the heat conduction layer 485, and the good heat conduction of the graphene heat dissipation layer 484 dissipates heat through the side heat dissipation holes 482 and the two heat dissipation holes 483 on four sides of the fixing shell 481, so that heat dissipation is avoided through only one layer of heat conduction plate, and electronic components inside the multilayer circuit board are affected by high temperature.

The utility model provides a spliced and stacked multilayer circuit board by improvement, by arranging the splicing component 4, the splicing columns 46 at the bottom end of the other group of circuit boards 1 are inserted into the inner sides of the limiting through holes 42, and meanwhile, the limiting group 43 is used for limiting and fixing the fixed plate 44, so that the spliced multilayer circuit board 1 is prevented from being easily decomposed due to collision, and the working efficiency of the spliced multilayer circuit board is improved; through having set up the heat dissipation subassembly 48, make heat transfer layer 486 follow fixed shell 481 four sides side louvre 482 and louvre two 483 indirectly through graphene heat dissipation layer 484 derive, avoid just carrying out the heat dissipation through the one deck heat-conducting plate, and make the inside electronic component of multilayer circuit board receive high temperature influence to improve its multilayer circuit board's life.

The basic principle and main characteristics of the utility model and the advantages of the utility model are shown and described above, standard parts used by the utility model can be purchased from market, special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of the parts adopt conventional means such as mature bolt rivets and welding in the prior art, the machinery, the parts and the equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection modes in the prior art, so that the description is omitted.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-layer circuit board capable of being spliced and stacked comprises a circuit board (1), wherein a first radiating hole (2) is formed in the top end surface of the circuit board (1), and a connecting port (3) is formed in the left part of the front end of the circuit board (1);

characterized by further comprising: the splicing assembly (4) is welded and fixed at the bottom of the outer side surface of the circuit board (1);

the splice assembly (4) comprises: the mounting plate (41) is welded and fixed at the bottom of the outer side surface of the circuit board (1); the limiting through holes (42) are formed in the left and right parts of the top end of the mounting plate (41); a limiting group (43), wherein the inner sides of the left and right grooves of the top end surface of the mounting plate (41) are provided with the limiting group (43); a fixed plate (44), wherein the left and right parts of the top end surface of the mounting plate (41) are rotatably connected with the fixed plate (44); the connecting plate (45) is welded and fixed at the left and right parts of the bottom end of the mounting plate (41); the bottom ends of the two groups of connecting plates (45) are provided with four groups of splicing columns (46) at equal intervals; splice grooves (47), wherein splice grooves (47) are respectively arranged at the left end and the right end of the splice column (46); and the radiating component (48) is welded and fixed in the middle of the bottom end of the mounting plate (41).

2. The splice stackable multilayer circuit board of claim 1, wherein: the heat dissipation assembly (48) includes: a fixed shell (481), wherein the middle part of the bottom end of the mounting plate (41) is welded and fixed with the fixed shell (481); and side radiating holes (482) are respectively arranged at the left end and the right end of the fixed shell (481).

3. The splice stackable multilayer circuit board of claim 2, wherein: the heat dissipation assembly (48) further includes: the front end and the rear end of the fixed shell (481) are provided with a second radiating hole (483); and the graphene heat dissipation layer (484) is arranged at the inner bottom of the fixed shell (481).

4. A splice stackable multilayer circuit board according to claim 3, wherein: the heat dissipation assembly (48) further includes: the heat conduction layer (485), the top of the graphene heat dissipation layer (484) is provided with the heat conduction layer (485); and the top end of the heat conduction layer (485) is provided with the heat conduction layer (486).

5. The splice stackable multilayer circuit board of claim 1, wherein: the limiting group (43) consists of a trapezoid block and a soft cushion, and the compression pressure height of the soft cushion is the exposed height of the trapezoid block.

6. The splice stackable multilayer circuit board of claim 1, wherein: the splice groove (47) is a T-shaped clamping groove, and the splice groove (47) is symmetrically arranged at the left end and the right end of the splice column (46).

7. The splice stackable multilayer circuit board of claim 4, wherein: the heat transfer layer (486) is made of copper, and the top end of the heat transfer layer (486) is in contact with the bottom end of the circuit board (1).