CN210986870U - Novel heat dissipation printed circuit board - Google Patents
Novel heat dissipation printed circuit board Download PDFInfo
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- CN210986870U CN210986870U CN201922454660.8U CN201922454660U CN210986870U CN 210986870 U CN210986870 U CN 210986870U CN 201922454660 U CN201922454660 U CN 201922454660U CN 210986870 U CN210986870 U CN 210986870U
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- circuit board
- heat dissipation
- printed circuit
- plate
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Abstract
The utility model relates to the technical field of printed circuit boards, in particular to a novel heat dissipation printed circuit board, which comprises a circuit board body and electrical components, wherein the top of the circuit board body is provided with the electrical components, the top of the electrical components is abutted with a cooling plate, and the top of the cooling plate is provided with a first heat dissipation plate, the utility model provides a novel heat dissipation printed circuit board, which solves the defects of poor heat dissipation effect of the existing printed circuit boards although most of the existing printed circuit boards have the heat dissipation function in the using process through the design and the use of a series of structures, simultaneously achieves the advantage of convenient disassembly and assembly when the electrical components on the printed circuit board have problems and need to be overhauled, and has corresponding shock absorption protective measures when the circuit board body is subjected to the shock generated by installation equipment, thereby improving the use efficiency of the heat dissipation printed circuit board, and then the practicality of heat dissipation printed circuit board has been improved.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to novel heat dissipation printed circuit board.
Background
The printed circuit board, also called printed circuit board, short for printed board, short for PCB, uses insulating board as base material, and is cut into a certain size, on which at least one conductive pattern is attached, and is distributed with holes (such as element hole, fastening hole and metallized hole, etc.), and can be used for replacing chassis of electronic component and implementing interconnection between electronic components. Such boards are known as "printed" circuit boards because they are made using electronic printing. It is not exact to custom refer to a "printed wiring board" as a "printed circuit" because there are no "printed components" on the printed board, but only wiring.
When involving printed circuit board and using, however current printed circuit board mostly has radiating function, but has the poor shortcoming of radiating effect, when electrical components on printed circuit board goes wrong and need overhaul simultaneously, there is the problem of inconvenient dismantlement and equipment, moreover when the circuit board body lacks corresponding safeguard measure when meeting with the vibrations that the erection equipment produced, and then reduced heat dissipation printed circuit board's availability factor, and then reduced heat dissipation printed circuit board's practicality, therefore need to develop a novel heat dissipation printed circuit board to solve above-mentioned problem urgently.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides a novel heat dissipation printed circuit board, through the design and the use of a series of structures, the utility model solves the problem that the prior printed circuit board mostly has the heat dissipation function but has the defect of poor heat dissipation effect in the using process, and simultaneously, when the electric elements on the printed circuit board have problems and need to be overhauled, the advantage of convenient disassembly and assembly is achieved, and when the circuit board body encounters the vibration generated by the installation equipment, the circuit board body has corresponding shock absorption protective measures, thereby improving the use efficiency of the heat dissipation printed circuit board and further improving the practicability of the heat dissipation printed circuit board; and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.
The utility model discloses a following technical scheme realizes:
the utility model provides a novel heat dissipation printed circuit board, includes circuit board body and electrical components, the top of circuit board body is equipped with electrical components, electrical components's top has been supported and has been had the cooling plate, the top of cooling plate is equipped with first heating panel, the through-hole has been seted up to the four corners symmetry of first heating panel, the top of first heating panel evenly is equipped with radiating fin, the bottom of circuit board body is equipped with the shock attenuation heat-conducting plate, the bottom of shock attenuation heat-conducting plate is equipped with the second heating panel, the top four corners symmetry of second heating panel is equipped with inserts the post, the upper end of inserting the post is passed the through-hole links to each other with.
Preferably, the cooling plate is provided with an inner cavity, and cooling oil is injected into the inner cavity of the cooling plate.
Preferably, the inserted column sequentially comprises a column base and a threaded column from bottom to top, the diameter of the column base is larger than that of the threaded column, and the threaded column penetrates through the through hole and is in threaded connection with the end cover.
Preferably, the first heat dissipation plate and the second heat dissipation plate are made of copper materials.
Preferably, the heat dissipation fins are copper heat dissipation fins.
Preferably, the shock absorption heat conduction plate is made of flexible heat conduction silica gel plate materials.
The utility model has the advantages that:
through the mutual cooperation of parts such as circuit board body, electrical components, cooling plate, first heating panel, through-hole, radiating fin, shock attenuation heat-conducting plate, second heating panel, insert post, column base, screw post and end cover, the utility model discloses in carrying out the use, solved current printed circuit board and though mostly have radiating function, nevertheless have the shortcoming that the radiating effect is poor, when electrical components on the printed circuit board appear the problem and need overhaul simultaneously, reached convenient dismantlement and the advantage of assembling, and have corresponding shock attenuation safeguard measure when the circuit board body meets the vibrations that the erection equipment produced, and then improved the availability factor of heat dissipation printed circuit board, and then improved the practicality of heat dissipation printed circuit board;
and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a schematic structural view of the middle insert column of the present invention;
fig. 4 is a schematic structural diagram of the first heat dissipating plate of the present invention.
In the figure: 1-circuit board body, 2-electrical component, 3-cooling plate, 4-first heat dissipation plate, 5-through hole, 6-heat dissipation fin, 7-damping heat conduction plate, 8-second heat dissipation plate, 9-plug column, 91-column base, 92-threaded column and 10-end cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a novel heat dissipation printed circuit board, including circuit board body 1 and electrical components 2, circuit board body 1's top is equipped with electrical components 2, electrical components 2's top butt has cooling plate 3, cooling plate 3's top is equipped with first heating panel 4, through-hole 5 has been seted up to first heating panel 4's four corners symmetry, first heating panel 4's top evenly is equipped with radiating fin 6, circuit board body 1's bottom is equipped with shock attenuation heat-conducting plate 7, shock attenuation heat-conducting plate 7's bottom is equipped with second heating panel 8, second heating panel 8's top four corners symmetry is equipped with inserts post 9, the upper end of inserting post 9 is passed through-hole 5 and is linked to each other with end.
Specifically, the cooling plate 3 is provided with an inner cavity, and cooling oil is injected into the inner cavity of the cooling plate 3.
Specifically, the plug column 9 is composed of a column base 91 and a threaded column 92 from bottom to top in sequence, the diameter of the column base 91 is larger than that of the threaded column 92, and the threaded column 92 penetrates through the through hole 5 and is in threaded connection with the end cover 10.
Specifically, the first heat dissipation plate 4 and the second heat dissipation plate 8 are made of copper materials.
Specifically, the heat dissipation fins 6 are copper heat dissipation fins 6.
Specifically, the damping heat-conducting plate 7 is made of a flexible heat-conducting silica gel plate material.
The working principle is as follows: the utility model discloses when using, through the cooling plate 3 that sets up, and the cooling plate 3 has seted up the inner chamber, and has injected the coolant oil in the inner chamber of cooling plate 3, can carry out quick heat conduction to the heat that electrical components 2 produced and carry out the heat exchange through the coolant oil in cooling plate 3, carry out heat conduction to cooling plate 3 through first heating panel 4 simultaneously, through setting up radiating fin 6 at last, can reach the radiating effect of reinforcing to first heating panel 4;
by arranging the damping heat conduction plate 7, the damping heat conduction plate 7 is made of a flexible heat conduction silica gel plate material, so that the damping heat conduction plate has excellent heat conductivity coefficient and elasticity, and can absorb the vibration generated by the circuit board while heat generated by the circuit board is conducted; the second heat dissipation plate 8 is arranged, so that heat can be conducted on the damping heat conduction plate 7;
when the circuit board needs to be overhauled, the end cover 10 is unscrewed, the first heat dissipation plate 4 is taken out of the inserting column 9, when the overhauling is finished and the assembly is needed, the first heat dissipation plate 4 is sleeved on the top of the column base 91 on the inserting column 9 again, and the purpose of positioning and fixing the first heat dissipation plate 4 can be achieved through the matching of the end cover 10 and the threaded column 92;
the first heat dissipation plate 4 and the second heat dissipation plate 8 are both made of copper materials, and the heat dissipation fins 6 are copper heat dissipation fins 6, so that the heat dissipation performance of the circuit board can be further enhanced;
and then under the design and the use of above-mentioned structure, the utility model discloses in carrying out the use, solved current printed circuit board though mostly have radiating function, there is the poor shortcoming of radiating effect, when electrical components 2 on printed circuit board goes wrong simultaneously and need overhaul, the advantage of convenient dismantlement and equipment has been reached, and corresponding shock attenuation safeguard measure has when circuit board body 1 meets the vibrations that the erection equipment produced, and then the availability factor of heat dissipation printed circuit board has been improved, and then the practicality of heat dissipation printed circuit board has been improved.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The utility model provides a novel heat dissipation printed circuit board, includes circuit board body (1) and electrical components (2), its characterized in that: the top of circuit board body (1) is equipped with electrical components (2), the top butt joint of electrical components (2) has cooling plate (3), the top of cooling plate (3) is equipped with first heating panel (4), through-hole (5) have been seted up to the four corners symmetry of first heating panel (4), the top of first heating panel (4) evenly is equipped with radiating fin (6), the bottom of circuit board body (1) is equipped with shock attenuation heat-conducting plate (7), the bottom of shock attenuation heat-conducting plate (7) is equipped with second heating panel (8), the top four corners symmetry of second heating panel (8) is equipped with inserts post (9), the upper end of inserting post (9) is passed through-hole (5) link to each other with end cover (10).
2. The novel heat dissipation printed circuit board of claim 1, wherein: an inner cavity is formed in the cooling plate (3), and cooling oil is injected into the inner cavity of the cooling plate (3).
3. The novel heat dissipation printed circuit board of claim 1, wherein: insert post (9) by lower supreme column base (91) and screw thread post (92) of forming in proper order, the diameter of column base (91) is greater than the diameter of screw thread post (92), just screw thread post (92) pass through-hole (5) with threaded connection between end cover (10).
4. The novel heat dissipation printed circuit board of claim 1, wherein: the first heat dissipation plate (4) and the second heat dissipation plate (8) are both made of copper materials.
5. The novel heat dissipation printed circuit board of claim 1, wherein: the radiating fins (6) are copper radiating fins (6).
6. The novel heat dissipation printed circuit board of claim 1, wherein: the shock absorption heat conduction plate (7) is made of a flexible heat conduction silica gel plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922454660.8U CN210986870U (en) | 2019-12-31 | 2019-12-31 | Novel heat dissipation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922454660.8U CN210986870U (en) | 2019-12-31 | 2019-12-31 | Novel heat dissipation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986870U true CN210986870U (en) | 2020-07-10 |
Family
ID=71418032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922454660.8U Active CN210986870U (en) | 2019-12-31 | 2019-12-31 | Novel heat dissipation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986870U (en) |
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2019
- 2019-12-31 CN CN201922454660.8U patent/CN210986870U/en active Active
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