CN210328145U

CN210328145U - Multilayer circuit board

Info

Publication number: CN210328145U
Application number: CN201920632481.6U
Authority: CN
Inventors: 曹川�
Original assignee: Qingdao Sanyuan Te Electronic Technology Co ltd
Current assignee: Qingdao Sanyuan Te Electronic Technology Co ltd
Priority date: 2019-05-06
Filing date: 2019-05-06
Publication date: 2020-04-14
Anticipated expiration: 2029-05-06

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board, which comprises a first circuit board and a second circuit board, wherein heating components are welded on the outer walls of the first circuit board and the second circuit board, the first circuit board is positioned above the second circuit board, a plurality of first conductive blocks are fixedly connected with the lower end surface of the first circuit board, rubber blocks are fixedly connected with the lower end surface of the first conductive blocks, second conductive blocks are fixedly connected with the lower end surface of the rubber blocks, the lower end surface of the second conductive blocks is fixedly connected with the second circuit board, the rubber blocks are provided with through grooves, copper wires are arranged in the through grooves, the copper wires pass through the through grooves and are connected with the first conductive blocks and the first conductive blocks, the first conductive blocks and the second conductive blocks which are in a hemispherical structure, and rubber blocks are arranged between the first conductive blocks and the second conductive blocks, so that when the circuit board vibrates, provides a certain buffer force, and is not easy to damage the electronic components due to external vibration force.

Description

Multilayer circuit board

Technical Field

The utility model belongs to the technical field of the circuit board technique and specifically relates to a multilayer circuit board.

Background

At present, multilayer circuit board carries out the pressfitting for multilayer material and makes, but heat dispersion wherein is poor, also easily receives the influence of external vibrational force simultaneously, because traditional multilayer circuit board does not have the shock-absorbing capacity, damages electronic components because of external vibrational force easily, uses and has the limitation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving and exist among the prior art, at present, multilayer circuit board carries out the pressfitting for multilayer material and makes, but heat dispersion wherein is poor, also easily receives the influence of external vibrational force simultaneously, because traditional multilayer circuit board does not have buffer performance, damages electronic components because of external vibrational force easily, uses the shortcoming that has the limitation, and the multilayer circuit board who proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a multilayer circuit board comprises a first circuit board and a second circuit board, wherein heating components are welded on the outer walls of the first circuit board and the second circuit board, the first circuit board is positioned above the second circuit board, a plurality of first conductive blocks are fixedly connected to the lower end face of the first circuit board, rubber blocks are fixedly connected to the lower end face of the first conductive blocks, second conductive blocks are fixedly connected to the lower end face of the rubber blocks, the lower end face of the second conductive blocks is fixedly connected to the second circuit board, the rubber blocks are provided with through grooves, copper wires are arranged in the through grooves, the copper wires penetrate through the through grooves and are connected with the first conductive blocks and the first conductive blocks, first heat-conducting plates are arranged on two sides of the first circuit board, the first heat-conducting plates are fixed on the first circuit board through screws, one ends of the first heat-conducting plates are attached to the heating components, and the other ends of the first heat-conducting plates extend out, the utility model discloses a heat exchanger, including first heat-conducting plate, second circuit board, second heat-conducting plate, second circuit board both sides all are equipped with the second heat-conducting plate, the second heat-conducting plate passes through the fix with screw on the second circuit board, the one end of second heat-conducting plate and the components and parts that generate heat are pasted and are connect, and the other end extends the second heat-conducting plate, the bracing piece of two symmetries of second heat-conducting plate up end fixed connection, the bracing piece passes first heat-conducting plate to with first heat-conducting plate sliding connection, bracing piece up end fixed connection dog, and the up end butt of dog and first heat-conducting plate, the bracing piece.

Preferably, the first conductive block and the first conductive block are of a hemispherical structure, and two ends of the copper wire are respectively bonded with the first conductive block and the second conductive block through electric glue.

Preferably, the outer walls of the first heat-conducting plate and the second heat-conducting plate are fixedly connected with a plurality of heat-radiating fins.

The utility model provides a pair of multilayer circuit board, beneficial effect lies in: the utility model discloses a hemisphere structure's first conducting block, the second conducting block, be equipped with the block rubber between them simultaneously, can be when the circuit board vibrates, provide certain buffer capacity, be difficult for damaging electronic components because of external vibrational force, be equipped with the copper line in the block rubber, first conducting block, the second conducting block passes through copper link together, realize linking between two circuit boards, the electronic components who easily generates heat on the circuit board is equipped with heat dissipation mechanism, heat dispersion is strong, difficult high temperature damages electronic components.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic top view of the present invention.

In the figure: the heat-radiating device comprises a first circuit board 1, a second circuit board 2, a first conducting block 3, a rubber block 4, a copper wire 5, a second conducting block 6, a supporting rod 7, a first heat-conducting plate 8, a second heat-conducting plate 9, a spring 10, a stop block 11, heat-radiating fins 12 and a heat-generating component 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a multilayer circuit board comprises a first circuit board 1 and a second circuit board 2, wherein heating elements 13 are welded on the outer walls of the first circuit board 1 and the second circuit board 2, the first circuit board 1 is positioned above the second circuit board 2, a plurality of first conductive blocks 3 are fixedly connected with the lower end surface of the first circuit board 1, rubber blocks 4 are fixedly connected with the lower end surface of the first conductive blocks 3, second conductive blocks 6 are fixedly connected with the lower end surface of the rubber blocks 4, the lower end surface of the second conductive blocks 6 is fixedly connected with the second circuit board 2, through grooves are formed in the rubber blocks 4, copper wires 5 are arranged in the through grooves, the copper wires 5 penetrate through the through grooves and are connected with the first conductive blocks 3 and the first conductive blocks 3, first heat conduction plates 8 are arranged on the two sides of the first circuit board 1, the first heat conduction plates 8 are fixed on the first circuit board 1 through screws, one ends of the first heat conduction plates 8 are attached to the, the other end extends first heat-conducting plate 8, second circuit board 2 both sides all are equipped with second heat-conducting plate 9, second heat-conducting plate 9 passes through the fix with screw on second circuit board 2, the one end and the 13 subsides of heating element part of second heat-conducting plate 9 connect, the other end extends second heat-conducting plate 9, two symmetrical bracing pieces 7 of second heat-conducting plate 9 up end fixed connection, bracing piece 7 passes first heat-conducting plate 8, and with first heat-conducting plate 8 sliding connection, bracing piece 7 up end fixed connection dog 11, and dog 11 and the up end butt of first heat-conducting plate 8, bracing piece 7 outer wall cover is equipped with spring 10, the outer wall of first heat-conducting plate 8 is propped respectively at spring 10 both ends, the outer wall of second heat-conducting plate 9.

First conducting block 3 and first conducting block 3 are the hemisphere structure, and the material is comparatively saved, and the both ends of copper line 5 bond together through the electric glue with first conducting block 3, second conducting block 6 respectively, have electric conductive property, and the steadiness of connecting simultaneously can be strong, and a plurality of heat radiation fins 12 of the equal fixedly connected with of outer wall of first heat-conducting plate 8, second heat-conducting plate 9, it is big with external contact surface, heat dispersion is good.

The working principle is as follows: when the circuit board takes place the vibration, rubber block 4 between first conducting block 3 and the second conducting block 6 can cushion, spring 10 between first heat-conducting plate 8 and the second heat-conducting plate 9 further cushions simultaneously, and cushioning performance is strong, be difficult for damaging electronic components because of external vibrational force, in the course of the work, bracing piece 7 prevents that first circuit board 1 and second circuit board 2 from taking place lateral shifting, and stability can be good, spring 10 and rubber block 4 not only provide the buffer power, still provide the effect of support, first heat-conducting plate 8 and second heat-conducting plate 9 can carry out the heat energy that generates components and parts 13 on the circuit board and conduct and dispel the heat, and final heat energy passes to heat radiation fins 12, further strengthen heat dispersion, and the radiating effect is good, and strong practicality.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A multilayer circuit board comprises a first circuit board (1) and a second circuit board (2), wherein heating elements (13) are welded on the outer walls of the first circuit board (1) and the second circuit board (2), and is characterized in that the first circuit board (1) is positioned above the second circuit board (2), the lower end face of the first circuit board (1) is fixedly connected with a plurality of first conductive blocks (3), the lower end face of each first conductive block (3) is fixedly connected with a rubber block (4), the lower end face of each rubber block (4) is fixedly connected with a second conductive block (6), the lower end face of each second conductive block (6) is fixedly connected with the second circuit board (2), each rubber block (4) is provided with a through groove, a copper wire (5) is arranged in each through groove, and the copper wire (5) penetrates through the through grooves and is connected with the first conductive blocks (3) and the first conductive blocks (3), the heat-conducting plate is characterized in that first heat-conducting plates (8) are arranged on two sides of the first circuit board (1), the first heat-conducting plates (8) are fixed on the first circuit board (1) through screws, one ends of the first heat-conducting plates (8) are attached to heating elements (13), the other ends of the first heat-conducting plates extend out of the first heat-conducting plates (8), second heat-conducting plates (9) are arranged on two sides of the second circuit board (2), the second heat-conducting plates (9) are fixed on the second circuit board (2) through screws, one ends of the second heat-conducting plates (9) are attached to the heating elements (13), the other ends of the second heat-conducting plates extend out of the second heat-conducting plates (9), two symmetrical support rods (7) are fixedly connected to the upper end faces of the second heat-conducting plates (9), the support rods (7) penetrate through the first heat-conducting plates (8) and are in sliding connection, and the up end butt of dog (11) and first heat-conducting plate (8), bracing piece (7) outer wall cover is equipped with spring (10), the outer wall of spring (10) both ends butt first heat-conducting plate (8), the outer wall of second heat-conducting plate (9) respectively.

2. The multilayer circuit board according to claim 1, wherein the first conductive block (3) and the first conductive block (3) are hemispheroidal in structure, and two ends of the copper wire (5) are respectively bonded with the first conductive block (3) and the second conductive block (6) through electric glue.

3. A multilayer circuit board according to claim 1, characterized in that a plurality of heat dissipating fins (12) are fixedly attached to the outer walls of the first heat conducting plate (8) and the second heat conducting plate (9).