CN215529733U - Solid-state relay - Google Patents
Solid-state relay Download PDFInfo
- Publication number
- CN215529733U CN215529733U CN202121940182.2U CN202121940182U CN215529733U CN 215529733 U CN215529733 U CN 215529733U CN 202121940182 U CN202121940182 U CN 202121940182U CN 215529733 U CN215529733 U CN 215529733U
- Authority
- CN
- China
- Prior art keywords
- state relay
- solid
- face
- hole
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002791 soaking Methods 0.000 claims abstract description 25
- 239000007787 solid Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of relays, in particular to a solid-state relay which comprises a solid-state relay, a plurality of groups of first radiating fins are uniformly distributed on the end surface of the outer side of the solid-state relay, an inserting plate is connected between every two groups of the first radiating fins in a sliding way, a soaking plate is arranged on the upper end surface of the inserting plate, a second radiating fin is arranged on the upper end surface of the soaking plate, the upper end surface of the second radiating fin is provided with a radiating fan, the lower end surface of the inserting plate is provided with a plurality of groups of screw holes which penetrate through the inserting plate and the soaking plate, a third through hole is arranged on the upper end surface of the heat radiation fan, a bolt in threaded connection with the screw hole is connected in the third through hole in a sliding way, a plurality of groups of tension springs are arranged on the lower end surface of the soaking plate, the solid-state relay overcomes the defects that in the prior art, the power consumption and the heat productivity after conduction are large, the heat dissipation is poor and the like.
Description
Technical Field
The utility model relates to the technical field of relays, in particular to a solid-state relay.
Background
Compared with an electromechanical relay, a solid-state relay (SSR) is a relay without mechanical movement and moving parts, but has the same function as the electromechanical relay essentially, the SSR is a non-contact switch element which is composed of all solid-state electronic elements, the SSR utilizes the point, magnetic and optical characteristics of the electronic elements to complete the reliable isolation of input and output, and utilizes the switching characteristics of devices such as a high-power triode, a power field-effect tube, a single-phase silicon controlled rectifier, a bidirectional silicon controlled rectifier and the like to achieve the non-contact and spark-free connection and disconnection of a controlled circuit, but the tube voltage drop of the solid-state relay after connection is large, and the heat dissipation and the heat productivity of the solid-state relay after connection are also large due to the large tube voltage drop, so the heat dissipation of the solid-state relay needs to be enhanced to prolong the service life.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects of high power consumption and heat productivity after conduction, poor heat dissipation and the like in the prior art, and provides a solid-state relay.
In order to achieve the purpose, the utility model adopts the following technical scheme:
designing a solid-state relay, which comprises the solid-state relay, wherein a plurality of groups of first radiating fins are uniformly distributed on the end surface of the outer side of the solid-state relay, an inserting plate is connected between every two groups of the first radiating fins in a sliding way, a soaking plate is arranged on the upper end surface of the inserting plate, a second radiating fin is arranged on the upper end surface of the soaking plate, the upper end surface of the second radiating fin is provided with a radiating fan, the lower end surface of the inserting plate is provided with a plurality of groups of screw holes which penetrate through the inserting plate and the soaking plate, a third through hole is arranged on the upper end surface of the heat radiation fan, a bolt in threaded connection with the screw hole is connected in the third through hole in a sliding way, a plurality of groups of tension springs are arranged on the lower end surface of the soaking plate, barbs are arranged at the lower ends of the tension springs, the outer end faces of the first radiating fins are provided with convex blocks, and the barbs are movably connected to the peripheries of the convex blocks.
Preferably, multiple groups of second radiating fins are uniformly distributed on the upper end face of the soaking plate.
Preferably, a first through hole and a second through hole are formed in the lower end face of the solid-state relay.
Preferably, a heat conducting pad is arranged on the end face of the inner side of the inserting plate, and the heat conducting pad is attached to the solid-state relay and the first radiating fin.
Preferably, the solid-state relay and the first heat sink are integrally formed.
The solid-state relay provided by the utility model has the beneficial effects that: the heat dissipation efficiency of the solid-state relay can be improved through the arranged first heat dissipation fins; the heat dissipation efficiency can be further improved through the inserting plate, the soaking plate, the second heat dissipation plate and the heat dissipation fan; the soaking plate and the solid-state relay can be fixed and conveniently detached through the tension spring, the barb and the bump; through the bolts and the screw holes, the cooling fan can be additionally arranged as required; through the first through hole that sets up, the bolt makes the solid state relay and the connection between the soaking board more firm, also can make the fixed of solid state relay and place base more firm in the second through hole can be inserted in its inside.
Drawings
Fig. 1 is a schematic structural diagram of a solid-state relay according to the present invention;
fig. 2 is an exploded schematic diagram of a solid-state relay according to the present invention.
In the figure: 1. a solid state relay; 101. a first through hole; 102. a second through hole; 2. a first heat sink; 201. a bump; 3. a tension spring; 301. a barb; 4. inserting plates; 401. a screw hole; 5. a vapor chamber; 6. a second heat sink; 7. a heat radiation fan; 8. and (4) bolts.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-2, a solid-state relay includes a solid-state relay 1, multiple sets of first heat sinks 2 are uniformly arranged on an outer end face of the solid-state relay 1, an insertion board 4 is slidably connected between every two sets of first heat sinks 2, a soaking board 5 is arranged on an upper end face of the insertion board 4, a second heat sink 6 is arranged on an upper end face of the soaking board 5, a heat dissipation fan 7 is arranged on an upper end face of the second heat sink 6, multiple sets of screw holes 401 penetrating through the insertion board 4 and the soaking board 5 are formed on a lower end face of the insertion board 4, a third through hole is formed in an upper end face of the heat dissipation fan 7, a bolt 8 in threaded connection with the screw holes 401 is slidably connected in the third through hole, multiple sets of tension springs 3 are arranged on a lower end face of the soaking board 5, barbs 301 are arranged at lower ends of the tension springs 3, bumps 201 are arranged on outer end faces of the first heat sinks 2, and the barbs 301 are movably connected to peripheries of the bumps 201.
The first radiating fins 2 can improve the radiating efficiency of the solid-state relay 1; the inserting plate 4, the soaking plate 5, the second radiating fin 6 and the radiating fan 7 can further improve the radiating efficiency; the arranged tension spring 3, the barb 301 and the bump 201 can fix the soaking plate 5 and the solid-state relay 1 and are convenient to disassemble; the bolts 8 and the screw holes 401 are arranged, so that the cooling fan 7 can be additionally arranged as required; the first through hole 101 and the second through hole 102 are provided, and bolts 8 can be inserted into the first through hole and the second through hole to fasten the solid-state relay 1 and the soaking plate 5, and also to fasten the solid-state relay 1 and the base.
A working mode; the during operation, place work area with solid state relay 1 and begin work, first fin 2 on the solid state relay 1 plays basic radiating effect, when the better radiating effect of needs, insert between the first fin 2 of multiunit with picture peg 4, with 5 terminal surfaces under the soaking plate on the extension spring 3 on barb 301 and lug 201 link to each other can, or continue to install radiator fan 7 additional in order to play initiative radiating effect on second fin 6, pass bolt 8 the third through-hole and link to each other with screw 401 and can fix, stability between the reinforcing structure if need, only need in first through-hole 101 and second through-hole 102 install additional bolt 8 and link to each other with screw 401 or base can.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (5)
1. A solid state relay comprising a solid state relay (1), characterized in that: the solid-state relay is characterized in that multiple groups of first radiating fins (2) are uniformly distributed on the end face of the outer side of the solid-state relay (1), every two groups of first radiating fins (2) are connected with a plugboard (4) in a sliding mode, a soaking plate (5) is arranged on the upper end face of the plugboard (4), a second radiating fin (6) is arranged on the upper end face of the soaking plate (5), a radiating fan (7) is arranged on the upper end face of the second radiating fin (6), multiple groups of screw holes (401) penetrating through the plugboard (4) and the soaking plate (5) are formed in the lower end face of the plugboard (4), a third through hole is formed in the upper end face of the radiating fan (7), a bolt (8) in threaded connection with the screw holes (401) is connected in the third through hole in a sliding mode, multiple groups of tension springs (3) are arranged on the lower end face of the soaking plate (5), and barbs (301) are arranged at the lower ends of the tension springs (3), the outer side end faces of the first radiating fins (2) are provided with bumps (201), and the barbs (301) are movably connected to the peripheries of the bumps (201).
2. A solid state relay according to claim 1, wherein: and the second radiating fins (6) are positioned on the upper end surface of the soaking plate (5) and are uniformly distributed in multiple groups.
3. A solid state relay according to claim 1, wherein: a first through hole (101) and a second through hole (102) are formed in the lower end face of the solid-state relay (1).
4. A solid state relay according to claim 1, wherein: the heat conducting pad is arranged on the end face of the inner side of the inserting plate (4), and the heat conducting pad is attached to the solid-state relay (1) and the first radiating fin (2).
5. A solid state relay according to claim 1, wherein: the solid-state relay (1) and the first cooling fin (2) are integrally formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121940182.2U CN215529733U (en) | 2021-08-18 | 2021-08-18 | Solid-state relay |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121940182.2U CN215529733U (en) | 2021-08-18 | 2021-08-18 | Solid-state relay |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215529733U true CN215529733U (en) | 2022-01-14 |
Family
ID=79791818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121940182.2U Expired - Fee Related CN215529733U (en) | 2021-08-18 | 2021-08-18 | Solid-state relay |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215529733U (en) |
-
2021
- 2021-08-18 CN CN202121940182.2U patent/CN215529733U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113115559B (en) | Heat dissipation device and heat dissipation method based on shape memory alloy | |
US11158609B2 (en) | Three-dimensional integrated package device for high-voltage silicon carbide power module | |
CN112242480A (en) | Thermoelectric refrigeration method for chip-level electronic equipment | |
CN215529733U (en) | Solid-state relay | |
CN201819471U (en) | High power refrigeration piece | |
CN219107859U (en) | High heat conduction locking device | |
CN103594991A (en) | Bus duct side plate with inserting type heat dissipation plate | |
CN2932237Y (en) | Semiconductor thermoelectricity cooled heat pump | |
CN208444830U (en) | A kind of elastic pressuring plate fixed structure | |
CN212517238U (en) | Uniform-temperature semiconductor refrigerating piece | |
CN211745055U (en) | High-efficiency radiator for electronic component | |
KR102385112B1 (en) | Heat dissipation structure of FR4 PCB for power semiconductor device | |
CN211654804U (en) | Semiconductor fixing structure | |
CN215864134U (en) | I-shaped thermoelectric refrigerating device | |
CN215269271U (en) | Solid-state relay with heat dissipation function | |
CN219577589U (en) | High-voltage-resistant insulating printed PCB circuit board | |
CN216123292U (en) | 2.4GHz frequency channel wiFi module circuit board | |
CN216868867U (en) | High-efficient temperature control assembly | |
CN212164074U (en) | Oblique fin type radiator | |
CN216055243U (en) | Power module of parallel output of integral transformer | |
CN213243308U (en) | Ring main unit for electrical engineering | |
CN214176014U (en) | Radiator of power element | |
CN216120285U (en) | Transistor packaging frame applied to direct current motor controller | |
CN217641398U (en) | Semiconductor refrigeration piece and refrigeration system | |
CN218679677U (en) | Single-layer printed circuit board based on anti-electromagnetic interference structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220114 |
|
CF01 | Termination of patent right due to non-payment of annual fee |