CN211654804U

CN211654804U - Semiconductor fixing structure

Info

Publication number: CN211654804U
Application number: CN202020798398.9U
Authority: CN
Inventors: 杨志勇; 单庆喜; 刘芳亮; 田飞; 国景山
Original assignee: Yangzhou Sipuer Technology Co
Current assignee: Yangzhou Sipuer Technology Co
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2020-10-09
Anticipated expiration: 2030-05-14

Abstract

The utility model provides a semiconductor fixing structure, in particular to the field of semiconductor devices, which comprises a substrate, wherein a semiconductor is arranged on the substrate and is connected with the substrate, at least one locking device is uniformly arranged on the semiconductor along the circumferential direction, and the locking device comprises a clamping plate and a fixing bolt; the clamping plate is vertically bent from two ends of a flat plate to different sides to form a clamping part and a fixing part of the clamping plate; the fixing part is connected with the substrate through a fixing bolt, and the semiconductor is limited by the clamping part. The utility model discloses can improve the firm nature that the semiconductor is fixed.

Description

Semiconductor fixing structure

Technical Field

The utility model belongs to the semiconductor device field, concretely relates to semiconductor fixed knot constructs.

Background

The semiconductor refers to a material with the conductivity between the conductor and the insulator at normal temperature; semiconductors have applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and the like; the importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital recorders, have core units closely related to semiconductors; in practical application, a semiconductor is generally fixed on a substrate, and under some special conditions, the substrate vibrates, and the semiconductor inevitably vibrates along with the substrate, but the traditional structure cannot effectively ensure the fixing firmness of the semiconductor;

in view of the deficiencies of the prior art, there is a need for a semiconductor mounting structure that improves the reliability of semiconductor mounting.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor fixed knot constructs can improve the firm nature that the semiconductor is fixed.

The utility model provides a following technical scheme:

a semiconductor fixing structure comprises a substrate, wherein a semiconductor is arranged on the substrate and is connected with the substrate, at least one locking device is uniformly arranged on the semiconductor along the circumferential direction, and the locking device comprises a clamping plate and a fixing bolt; the clamping plate is vertically bent from two ends of a flat plate to different sides to form a clamping part and a fixing part of the clamping plate; the fixing part is connected with the substrate through a fixing bolt, and the semiconductor is limited by the clamping part.

Preferably, a strip-shaped through hole is formed in the fixing portion, the fixing bolt penetrates through the through hole and is connected with the substrate, and the fixing bolt can slide in the strip-shaped through hole in a reciprocating mode.

Preferably, a gasket is arranged on the lower side of the clamping part, and the gasket is connected with the clamping part through bonding.

Preferably, the gasket is a silica gel gasket, and the gasket is connected with the clamping part through heat conduction bonding glue.

Preferably, at least two strip-shaped heat dissipation grooves are uniformly formed in the upper side surface of the clamping part;

preferably, in the through hole of the fixing part, two sides of the fixing bolt are provided with a guide column, and the lower end of the guide column is connected with the substrate through threads.

Preferably, the lower end of the guide column is of an arc-shaped structure, and the upper end of the guide column is provided with a groove with a cross section being a regular hexagon.

The utility model has the advantages that:

the clamping plate of the utility model is vertically bent from two ends of a flat plate to different sides, namely a clamping part and a fixing part of the clamping plate are formed; the fixing part is connected with the substrate through the fixing bolt, the semiconductor is limited by the clamping part, and the semiconductor is fixed through the clamping plate, so that the firmness of the semiconductor fixation can be greatly improved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a view of the structure of the present invention;

FIG. 2 is a diagram showing the structure of a card board;

labeled as: 1. a substrate; 2. a semiconductor; 3. clamping a plate; 31. a chucking section; 32. a fixed part; 33. a through hole; 34. a heat dissipation groove; 4. a silica gel pad; 5. fixing the bolt; 6. and a guide column.

Detailed Description

Referring to fig. 1 to 2, a semiconductor fixing structure includes a substrate 1, a semiconductor 2 is disposed on the substrate 1, the semiconductor 2 is connected with the substrate 1, at least one locking device is uniformly disposed on the semiconductor 2 along a circumferential direction, and the locking device includes a clamping plate 3 and a fixing bolt 5; the clamping plate 3 is vertically bent from two ends of a flat plate to different sides, namely a clamping part 31 and a fixing part 32 of the clamping plate 3 are formed; the fixing portion 32 is connected to the substrate 1 by the fixing bolt 5, and the semiconductor 2 is held by the holding portion 31. The fixing of the clamping plate 3 is realized through the fixing part 32, and the fixing of the semiconductor 2 is realized through the clamping part 31, so that the semiconductor 2 can be firmly fixed; the fixing part 32 is provided with a strip-shaped through hole 33, the fixing bolt 5 penetrates through the through hole 33 to be connected with the substrate 1, and the fixing position of the clamping part 31 can be changed by the reciprocating sliding of the fixing bolt 5 in the strip-shaped through hole 33, so that the fixing requirements of different positions can be realized, and the working conditions of different environments can be met;

the gasket 4 is arranged on the lower side of the clamping part 31, the gasket 4 is connected with the clamping part 31 in an adhesion mode, the gasket 4 can play a role in buffering, rigid contact is avoided, and the service life of the device is prolonged; the gasket 4 is a silica gel gasket, the gasket 4 is connected with the clamping part 31 through heat conduction adhesive glue, the heat conduction adhesive glue and the silica gel gasket are easy to conduct heat, the semiconductor heat can be transmitted to the clamping plate 3, the heat dissipation effect can be improved, and the clamping plate 3 can be made of copper, so that the effect can be improved; at least two strip-shaped heat dissipation grooves 34 are uniformly formed in the upper side surface of the clamping part 31, and the heat dissipation area can be increased through the heat dissipation grooves 34, so that the heat dissipation effect is improved; in the through hole of the fixing part 32, the two sides of the fixing bolt 5 are provided with the guide columns 6, the lower ends of the guide columns 6 are connected with the substrate 1 through threads, the stable movement of the clamping plate can be ensured through the guide columns 6, and the guide columns 6 can be conveniently disassembled; the lower end of the guide column 6 is of an arc-shaped structure, so that the guide column is convenient to fix and install; the upper end of the guide column 6 is provided with a groove with a regular hexagonal cross section, so that the guide column can be conveniently disassembled and assembled through a hexagonal wrench;

the utility model discloses a working method:

as shown in fig. 1 to 2, the fixing of the card board 3 is realized by the fixing portion 32, and the fixing of the semiconductor 2 is realized by the holding portion 31, so that the semiconductor 2 can be firmly fixed; the heat of the semiconductor can be transmitted to the clamping plate 3, the heat dissipation effect can be improved, and the clamping plate 3 can be made of copper, so that the effect can be improved; the gasket 4 can play a role in buffering, so that rigid contact is avoided, and the service life of the device is prolonged; the heat dissipation area can be increased through the heat dissipation groove 34, which is beneficial to improving the heat dissipation effect; can ensure the steady of cardboard removal through leading positive post 6, and can conveniently realize leading the dismouting of positive post 6.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor fixed knot constructs, includes the base plate, be equipped with the semiconductor on the base plate, the semiconductor links up with the base plate, its characterized in that: the semiconductor is uniformly arranged on at least one locking device along the circumferential direction, and the locking device comprises a clamping plate and a fixing bolt; the clamping plate is vertically bent from two ends of a flat plate to different sides to form a clamping part and a fixing part of the clamping plate; the fixing part is connected with the substrate through a fixing bolt, and the semiconductor is limited by the clamping part.

2. A semiconductor mounting structure according to claim 1, wherein: the fixing part is provided with a strip-shaped through hole, the fixing bolt penetrates through the through hole and is connected with the substrate, and the fixing bolt can slide in the strip-shaped through hole in a reciprocating mode.

3. A semiconductor mounting structure according to claim 2, wherein: the lower side of the clamping part is provided with a gasket, and the gasket is connected with the clamping part in an adhesion manner.

4. A semiconductor mounting structure according to claim 3, wherein: the gasket is a silica gel gasket, and the gasket is connected with the clamping part through heat conduction bonding glue.

5. A semiconductor mounting structure according to claim 4, wherein: the side is even to be equipped with the heat dissipation recess of two at least bars on the card portion.

6. A semiconductor mounting structure according to claim 5, wherein: and the two sides of the fixing bolt are provided with a guide column in the through hole of the fixing part, and the lower end of the guide column is connected with the substrate through threads.

7. A semiconductor mounting structure according to claim 6, wherein: the lower end of the guide column is of an arc-shaped structure, and the upper end of the guide column is provided with a groove with a cross section being a regular hexagon.