CN217444375U

CN217444375U - Heat dissipation base plate with high heat dissipation function

Info

Publication number: CN217444375U
Application number: CN202221444144.2U
Authority: CN
Inventors: 陈强; 钱伟
Original assignee: Kunshan Minotech Precision Industry Co ltd
Current assignee: Kunshan Minotech Precision Industry Co ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-09-16
Anticipated expiration: 2032-06-09

Abstract

The utility model belongs to the technical field of the radiating basal plate technique and specifically relates to a radiating basal plate with high heat dissipation function, which comprises a substrate, base plate lower extreme fixedly connected with heating panel, the louvre has all been seted up at both ends about the heating panel lower extreme, the radiating groove has been seted up at heating panel lower extreme middle part, the mounting hole has all been seted up to both sides around the heating panel lower extreme, the utility model discloses in, through heating panel, louvre and the radiating groove that set up, when using this equipment, through installing the heating panel at the base plate lower extreme, through seting up the louvre and then increase the holistic circulation of air of heating panel to improve holistic radiating effect, with the poor problem of radiating effect of solution base plate self.

Description

Heat dissipation base plate with high heat dissipation function

Technical Field

The utility model relates to a heat dissipation base plate technical field specifically is a heat dissipation base plate with high heat dissipation function.

Background

The heat dissipation substrate is usually formed by assembling a plurality of LEDs on a circuit substrate, the circuit substrate plays a role of heat dissipation in addition to the role of carrying the LED module structure, and the common types of LED heat dissipation substrates include hard printed circuit boards, high thermal conductivity aluminum substrates, ceramic substrates, soft printed circuit boards, and metal composite materials. The LED industry is one of the most focused industries in recent years, and LED products have the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection, etc. however, generally, the input power of LED high-power products is about 15% of electric energy converted into light energy, and the rest 85% of electric energy is converted into heat energy, and the heat dissipation efficiency of the existing heat dissipation substrate is general, which further affects the life cycle and stability of the products, and the substrate has no damping effect when in use, and the elements in the substrate are easy to loosen after long-term use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiating basal plate with high heat dissipation function, when using this equipment, not only the radiating effect is good, still can carry out the shock attenuation to whole.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a heat dissipation base plate with high heat dissipation function, includes the base plate, base plate lower extreme fixedly connected with heating panel, the louvre has all been seted up at both ends about the heating panel lower extreme, the radiating groove has been seted up at heating panel lower extreme middle part, the mounting hole has all been seted up to both sides around the heating panel lower extreme.

Preferably, the number of the heat dissipation holes is 30, the number of one group of the heat dissipation holes is 15, and the number of the heat dissipation holes is 2.

Preferably, the lower end of the heat dissipation plate is spirally connected with a threaded rod, and the threaded rod penetrates through the heat dissipation plate.

Preferably, the lower end of the threaded rod is fixedly connected with a connecting rod, and the lower end of the connecting rod is slidably connected with a buffer block.

Preferably, the lower end of the buffer block is fixedly connected with a fixing plate, and the buffer block penetrates through the connecting rod.

Preferably, the upper end of the buffer block is fixedly connected with a connecting block, the upper end of the connecting block is fixedly connected with a fixing block, and the upper end of the fixing block is fixedly connected with a supporting block.

Preferably, the upper end of the supporting block is fixedly connected with a tensioning block, the inner side of the tensioning block is fixedly connected with a buffer rod, the buffer rod penetrates through the tensioning block, and the buffer rod is fixedly connected with the connecting rod.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in the utility model, through the arranged heat dissipation plate, the heat dissipation holes and the heat dissipation grooves, when the device is used, the heat dissipation plate is arranged at the lower end of the substrate, and the whole air circulation of the heat dissipation plate is increased by arranging the heat dissipation holes, so that the whole heat dissipation effect is improved, and the problem of poor heat dissipation effect of the substrate is solved;

2. the utility model discloses in, through connecting block, buffer block and the buffer beam that sets up, when using this equipment, through connecting block, fixed block, supporting shoe and tight piece and buffer block that rises and shock attenuation and buffering to the heating panel of upper end, improve the shock attenuation effect to the base plate, and then reduce base plate vibration degree when using to solve under long-time use, not hard up phenomenon easily appears in the component in the base plate.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the whole structure of the heat dissipating plate of the present invention;

fig. 3 is a schematic view of the installation structure of the supporting block of the present invention.

In the figure: 1-substrate, 2-heat dissipation plate, 3-heat dissipation holes, 4-heat dissipation grooves, 5-mounting holes, 6-threaded rod, 7-connecting rod, 8-buffer block, 9-fixing plate, 10-connecting block, 11-fixing block, 12-supporting block, 13-tensioning block and 14-buffer rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

the utility model provides a heat dissipation base plate with high heat dissipation function, includes base plate 1, 1 lower extreme fixedly connected with heating panel 2 of base plate, and louvre 3 has all been seted up at both ends about heating panel 2 lower extreme, and radiating groove 4 has been seted up at 2 lower extreme middle parts of heating panel, and mounting hole 5 has all been seted up to both sides around the 2 lower extreme of heating panel.

The number of the heat dissipation holes 3 is 30, and the number of one group of the heat dissipation holes 3 is 15, the number of the heat dissipation holes 3 is 2, the whole air circulation of the heat dissipation plate 2 is increased by arranging the heat dissipation holes 3, so that the whole heat dissipation effect is improved, the lower end of the heat dissipation plate 2 is spirally connected with a threaded rod 6, the threaded rod 6 penetrates through the heat dissipation plate 2, the lower end of the threaded rod 6 is fixedly connected with a connecting rod 7, the lower end of the connecting rod 7 is slidably connected with a buffer block 8, the lower end of the buffer block 8 is fixedly connected with a fixed plate 9, the buffer block 8 penetrates through the connecting rod 7, when the heat dissipation plate is installed, the threaded rod 6 at the upper end of the connecting rod 7 is installed in an installation hole 5 in the heat dissipation plate 2, so that the heat dissipation plate is convenient to install the heat dissipation plate, the upper end of the buffer block 8 is fixedly connected with a connecting block 10, the upper end of the connecting block 10 is fixedly connected with a fixed block 11, the upper end of the fixed block 11 is fixedly connected with a supporting block 12, and the upper end of the supporting block is fixedly connected with a tension block 13, the inboard fixedly connected with buffer beam 14 of tight piece 13 that rises, and buffer beam 14 runs through tight piece 13 that rises, buffer beam 14 and connecting rod 7 fixed connection, and during the inboard vibrations of equipment, collocation between connecting rod 7 and buffer block 8 in the base plate 1 lower extreme heating panel 2, including inboard buffer beam 14 and tight piece 13 that rises, improve the shock attenuation effect to base plate 1, and then reduce base plate 1 degree of vibration when using.

The working process is as follows: the utility model discloses an improve the radiating effect of base plate 1 self, and heating panel 2 that the aluminium material of fixedly connected with was made at the lower extreme, install threaded rod 6 of connecting rod 7 upper end in mounting hole 5 in heating panel 2, and then increase the position of base plate 2 in the equipment, thereby during the heat dissipation, through seting up louvre 3 and then increase the holistic circulation of air of heating panel 2, thereby improve holistic radiating effect, when the equipment uses, inboard produced vibrations, pass through connecting block 10 in the buffer block 8 this moment, fixed block 11, supporting shoe 12 and tight piece 13 and the buffer block 14 shock attenuation and buffering are carried out to heating panel 2 of upper end with rising, improve the shock attenuation effect to base plate 1, and then reduce base plate 1 degree of vibrations when using.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation substrate with a high heat dissipation function, comprising a substrate (1), characterized in that: base plate (1) lower extreme fixedly connected with heating panel (2), louvre (3) have all been seted up at both ends about heating panel (2) lower extreme, radiating groove (4) have been seted up at heating panel (2) lower extreme middle part, mounting hole (5) have all been seted up to both sides around heating panel (2) lower extreme.

2. The heat dissipating substrate having a high heat dissipating function according to claim 1, wherein: the number of the heat dissipation holes (3) is 30 in total, the number of a set of the heat dissipation holes (3) is 15, and the number of the heat dissipation holes (3) is 2 in total.

3. The heat dissipating substrate having a high heat dissipating function according to claim 1, wherein: the lower end of the heat dissipation plate (2) is spirally connected with a threaded rod (6), and the threaded rod (6) penetrates through the heat dissipation plate (2).

4. A heat dissipating substrate having a high heat dissipating function according to claim 3, wherein: threaded rod (6) lower extreme fixedly connected with connecting rod (7), connecting rod (7) lower extreme sliding connection has buffer block (8).

5. The heat dissipating substrate having a high heat dissipating function according to claim 4, wherein: buffer block (8) lower extreme fixedly connected with fixed plate (9), and buffer block (8) run through connecting rod (7).

6. The heat dissipating substrate having a high heat dissipating function according to claim 4, wherein: the buffer block (8) is fixedly connected with a connecting block (10) at the upper end, a fixing block (11) is fixedly connected with the upper end of the connecting block (10), and a supporting block (12) is fixedly connected with the upper end of the fixing block (11).

7. The heat dissipating substrate having a high heat dissipating function according to claim 6, wherein: the supporting device is characterized in that a tension block (13) is fixedly connected to the upper end of the supporting block (12), a buffer rod (14) is fixedly connected to the inner side of the tension block (13), the buffer rod (14) penetrates through the tension block (13), and the buffer rod (14) is fixedly connected with the connecting rod (7).