CN210743935U - High-efficient radiator for semiconductor - Google Patents
High-efficient radiator for semiconductor Download PDFInfo
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- CN210743935U CN210743935U CN201922323684.XU CN201922323684U CN210743935U CN 210743935 U CN210743935 U CN 210743935U CN 201922323684 U CN201922323684 U CN 201922323684U CN 210743935 U CN210743935 U CN 210743935U
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- bottom plate
- heat
- apron
- fixedly connected
- conducting plate
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Abstract
The utility model discloses a high-efficient radiator for semiconductor, comprising a base plate, a set of bracing piece of fixedly connected with on the bottom plate, the upper end fixedly connected with apron of bracing piece, be provided with a set of clearance hole of keeping away on the apron, the apron below is connected with the heat-conducting plate, the bottom plate is provided with strip frame type structure, the heat-conducting plate sets up the center department at the bottom plate, is provided with a set of heat dissipation aluminum fins on the heat-conducting plate up end, heat dissipation aluminum fins's upper end setting is in keeping away the clearance hole. The utility model relates to a simple structure, the protection nature is good, and the suitability is strong, installs convenient high-efficient radiator for semiconductor.
Description
Technical Field
The utility model relates to a radiator field specifically is a high-efficient radiator for semiconductor.
Background
With the development of semiconductor technology, semiconductors are more and more widely applied to a plurality of fields, a large amount of heat is generated during the work of the semiconductors under high load, and the working performance and the service life of the semiconductors are affected due to the fact that the heat is not dissipated in time. However, most of the conventional semiconductor radiators have poor heat dissipation performance and insufficient installation stability. Therefore, a new high-efficiency heat sink for semiconductor is needed to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiator for semiconductor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a high-efficient radiator for semiconductor, includes the bottom plate, a set of bracing piece of fixedly connected with on the bottom plate, the upper end fixedly connected with apron of bracing piece, be provided with a set of clearance hole on the apron, the apron below is connected with the heat-conducting plate, the bottom plate is provided with strip frame type structure, the heat-conducting plate sets up the center department at the bottom plate, is provided with a set of heat dissipation aluminium fin on the heat-conducting plate up end, the upper end setting of heat dissipation aluminium fin is in avoiding the clearance hole.
Preferably, an adhesive layer is arranged on the lower end face of the bottom plate, a group of mounting holes are formed in the bottom plate, and a damping device is further arranged on the bottom plate and comprises a damping pad which is located between the adhesive layer and the bottom plate.
Preferably, a pressing device is arranged between the heat conducting plate and the cover plate and comprises a spring, a group of guide rods which vertically extend downwards are arranged on the lower end face of the cover plate, the spring is sleeved on the guide rods, and the upper end and the lower end of the spring are respectively connected to the lower end face of the cover plate and the upper end face of the heat conducting plate.
Preferably, an auxiliary heat dissipation device is arranged between the bottom plate and the cover plate and comprises a set of fans, the rear side of the bottom plate and the rear side of the cover plate are fixedly connected with connecting seats, connecting rings are fixedly connected between the connecting seats on the upper side and the lower side, a set of ribs are distributed in the connecting rings in an annular array mode, one ends, far away from the connecting rings, of the ribs are fixedly connected with mounting seats, and the fans are arranged on one side end faces, facing the heat dissipation aluminum fins, of the mounting seats.
Preferably, a reinforcing rib is arranged between the supporting rod and the bottom plate.
Preferably, the heat conducting plate and the radiating aluminum fins are made of copper materials.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses in, the heat-conducting plate contacts with semiconductor device's casing, and the heat that the semiconductor during operation produced is conducted on the heat-conducting plate through the casing, then is evacuated away on transmitting heat dissipation aluminum fin, and the setting of apron has improved the protection to heat dissipation aluminum fin, and the setting of avoiding the vacancy has reduced the influence to heat dissipation aluminum fin heat dispersion. The shock pad is used for improving the cushioning effect of radiator and semiconductor device junction, avoids appearing cracked condition. The spring is used for pressing the cover plate on the shell of the semiconductor device, so that the heat conduction effect is improved. The ribs play a role in protecting foreign matters, and the fan can accelerate the heat dissipation effect of the heat dissipation aluminum fins. The utility model relates to a simple structure, the protection nature is good, and the suitability is strong, installs convenient high-efficient radiator for semiconductor.
Drawings
FIG. 1 is a schematic view of a high-efficiency heat sink for semiconductor;
fig. 2 is a rear view of a high-efficiency heat sink for a semiconductor.
In the figure: 1-bottom plate, 2-shock pad, 3-adhesive layer, 4-mounting hole, 5-support rod, 6-reinforcing rib, 7-cover plate, 8-clearance hole, 9-spring, 10-guide rod, 11-heat conducting plate, 12-heat radiating aluminum fin, 13-connecting seat, 14-connecting ring, 15-rib, 16-mounting seat, 17-fan, 18-auxiliary heat radiating device, 19-pressing device and 20-shock absorbing device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the utility model provides a high-efficient radiator for semiconductor, includes bottom plate 1, a set of bracing piece 5 of fixedly connected with on the bottom plate 1, the upper end fixedly connected with apron 7 of bracing piece 5, be provided with a set of clearance hole 8 on the apron 7, the apron 7 below is connected with heat-conducting plate 11, bottom plate 1 is provided with strip frame type structure, heat-conducting plate 11 sets up the center department at bottom plate 1, is provided with a set of heat dissipation aluminum fin 12 on the heat-conducting plate 11 up end, heat dissipation aluminum fin 12's upper end sets up in clearance hole 8.
When the heat dissipation device is used, the bottom plate 1 is fixedly connected to the semiconductor device, the heat conduction plate 11 is in contact with the shell of the semiconductor device, heat generated during operation of the semiconductor device is conducted to the heat conduction plate 11 through the shell and then is transmitted to the heat dissipation aluminum fins 12 to be evacuated, the cover plate 7 is arranged to improve protection of the heat dissipation aluminum fins 12, and influence on heat dissipation performance of the heat dissipation aluminum fins 12 is reduced due to the arrangement of the clearance holes 8.
Preferably, an adhesive layer 3 is arranged on the lower end face of the bottom plate 1, a group of mounting holes 4 is arranged on the bottom plate 1, a damping device 20 is further arranged on the bottom plate 1, the damping device 20 comprises a damping pad 2, and the damping pad 2 is located between the adhesive layer 3 and the bottom plate 1.
Adhesive layer 3 is used for bonding with the semiconductor device casing, and mounting hole 4 is used for wearing to establish screw and semiconductor device casing threaded connection, and shock pad 2 is used for improving the buffering effect of radiator and semiconductor device junction, avoids appearing the cracked condition.
Preferably, a pressing device 19 is arranged between the heat conducting plate 11 and the cover plate 7, the pressing device 19 includes a spring 9, a group of guide rods 10 extending vertically and downwardly is arranged on the lower end face of the cover plate 7, the spring 9 is sleeved on the guide rods 10, and the upper end and the lower end of the spring 9 are respectively connected to the lower end face of the cover plate 7 and the upper end face of the heat conducting plate 11.
The spring 9 presses the cover plate 7 on the shell of the semiconductor device, thereby improving the heat conduction effect.
Preferably, an auxiliary heat dissipation device 18 is arranged between the bottom plate 1 and the cover plate 7, the auxiliary heat dissipation device 18 includes a set of fans 17, the rear side of the bottom plate 1 and the rear side of the cover plate 7 are fixedly connected with a connection seat 13, a connection ring 14 is fixedly connected between the connection seats 13 on the upper and lower sides, a set of ribs 15 are distributed in the connection ring 14 in an annular array manner, one end of each rib 15 far away from the connection ring 14 is fixedly connected with a mounting seat 16, and the fans 17 are arranged and installed on one side end face of the mounting seat 16 facing the heat dissipation aluminum fins 12.
The ribs 15 play a role of protecting foreign matters, and the fan 17 can accelerate the heat dissipation effect of the heat dissipation aluminum fins 12.
Preferably, a reinforcing rib 6 is arranged between the support rod 5 and the bottom plate 1.
The reinforcing ribs 6 improve the connection strength between the support rod 5 and the bottom plate 1.
Preferably, the heat-conducting plate 11 and the radiating aluminum fins 12 are made of copper material.
The heat conducting plate 11 and the radiating aluminum fins 12 are made of copper materials and have good heat conducting performance.
The utility model discloses a theory of operation is: when the heat dissipation device is used, the bottom plate 1 is fixedly connected to the semiconductor device, the heat conduction plate 11 is in contact with the shell of the semiconductor device, heat generated during operation of the semiconductor device is conducted to the heat conduction plate 11 through the shell and then is transmitted to the heat dissipation aluminum fins 12 to be evacuated, the cover plate 7 is arranged to improve protection of the heat dissipation aluminum fins 12, and influence on heat dissipation performance of the heat dissipation aluminum fins 12 is reduced due to the arrangement of the clearance holes 8. Adhesive layer 3 is used for bonding with the semiconductor device casing, and mounting hole 4 is used for wearing to establish screw and semiconductor device casing threaded connection, and shock pad 2 is used for improving the buffering effect of radiator and semiconductor device junction, avoids appearing the cracked condition. The spring 9 presses the cover plate 7 on the shell of the semiconductor device, thereby improving the heat conduction effect. The ribs 15 play a role of protecting foreign matters, and the fan 17 can accelerate the heat dissipation effect of the heat dissipation aluminum fins 12. The reinforcing ribs 6 improve the connection strength between the support rod 5 and the bottom plate 1. The heat conducting plate 11 and the radiating aluminum fins 12 are made of copper materials and have good heat conducting performance.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A high-efficient radiator for semiconductor, includes bottom plate (1), its characterized in that: a set of bracing piece (5) of fixedly connected with on bottom plate (1), the upper end fixedly connected with apron (7) of bracing piece (5), be provided with a set of clearance hole (8) of keeping away on apron (7), apron (7) below is connected with heat-conducting plate (11), bottom plate (1) is provided with strip frame type structure, heat-conducting plate (11) set up the center department at bottom plate (1), are provided with a set of heat dissipation aluminum fin (12) on heat-conducting plate (11) up end, the upper end setting of heat dissipation aluminum fin (12) is in keeping away clearance hole (8).
2. A high-efficiency heat sink for semiconductors as claimed in claim 1, wherein: the shock absorption structure is characterized in that an adhesive layer (3) is arranged on the lower end face of the bottom plate (1), a group of mounting holes (4) is formed in the bottom plate (1), a shock absorption device (20) is further arranged on the bottom plate (1), the shock absorption device (20) comprises a shock absorption pad (2), and the shock absorption pad (2) is located between the adhesive layer (3) and the bottom plate (1).
3. A high-efficiency heat sink for semiconductors as claimed in claim 1, wherein: be provided with closing device (19) between heat-conducting plate (11) and apron (7), closing device (19) include spring (9), be provided with a set of vertical guide arm (10) that stretch out downwards on apron (7) lower terminal surface, spring (9) cover is established on guide arm (10), and the upper and lower both ends of spring (9) are connected respectively on the up end of the lower terminal surface of apron (7) and heat-conducting plate (11).
4. A high-efficiency heat sink for semiconductors as claimed in claim 1, wherein: be provided with supplementary heat abstractor (18) between bottom plate (1) and apron (7), supplementary heat abstractor (18) include a set of fan (17), and the rear side of bottom plate (1) and rear side fixedly connected with connecting seat (13) of apron (7), fixedly connected with go-between (14) between the connecting seat (13) of upper and lower both sides, annular array distributes in go-between (14) has a set of rib (15), one end fixedly connected with mount pad (16) of go-between (14) are kept away from in rib (15), fan (17) set up to be installed on mount pad (16) towards a side end face of heat dissipation aluminium fin (12).
5. A high-efficiency heat sink for semiconductors as claimed in claim 1, wherein: and a reinforcing rib (6) is arranged between the supporting rod (5) and the bottom plate (1).
6. A high-efficiency heat sink for semiconductors as claimed in claim 1, wherein: the heat conducting plate (11) and the radiating aluminum fins (12) are made of copper materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922323684.XU CN210743935U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiator for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922323684.XU CN210743935U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiator for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210743935U true CN210743935U (en) | 2020-06-12 |
Family
ID=71009595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922323684.XU Active CN210743935U (en) | 2019-12-23 | 2019-12-23 | High-efficient radiator for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210743935U (en) |
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2019
- 2019-12-23 CN CN201922323684.XU patent/CN210743935U/en active Active
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