CN220985926U - Porous ceramic circuit board - Google Patents
Porous ceramic circuit board Download PDFInfo
- Publication number
- CN220985926U CN220985926U CN202322663375.3U CN202322663375U CN220985926U CN 220985926 U CN220985926 U CN 220985926U CN 202322663375 U CN202322663375 U CN 202322663375U CN 220985926 U CN220985926 U CN 220985926U
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- heat
- ceramic
- fixing plate
- heat dissipation
- dissipating
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- 239000000919 ceramic Substances 0.000 title claims abstract description 129
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000007704 transition Effects 0.000 claims abstract description 34
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a porous ceramic circuit board, which comprises a ceramic circuit substrate and an assembly mechanism arranged in the ceramic circuit substrate, wherein the assembly mechanism comprises an installation component and a heat dissipation component; the mounting assembly comprises a power element, an element fixing plate, a heat-dissipating ceramic plate, a ceramic fixing plate, a porous transition layer, a fixing plate limiting groove, a heat-dissipating metal block, a limiting mounting groove and a mounting threaded hole, wherein the heat-dissipating assembly comprises a heat-dissipating disc and heat-dissipating fins; according to the utility model, the power element is placed in the heat-dissipating ceramic plate, and the heat of the power element is fully transferred into the heat-dissipating ceramic plate through complete contact, so that the service life is prolonged, the porous transition layer prevents cracking between the heat-dissipating ceramic plate and the heat-dissipating metal block, the heat-dissipating fins are quickly assembled and disassembled through the fixing bolts, the heat-dissipating area of the heat-dissipating metal block is increased, the heat of the power element is quickly eliminated, and the heat-dissipating efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to a porous ceramic circuit board.
Background
With the rapid progress of mobile communication technology and electronic information industry, electronic products are smaller and smaller in size and higher in integration level, so that heat dissipation becomes a problem to be solved by the circuit board. The current high heat conduction resin material has the largest heat conduction coefficient of 10W/m.K, and can not meet the heat dissipation requirements of high-power diodes, thyristors, MOSFETs (power field effect transistors), LED transistors and other elements.
The utility model discloses a radiating circuit board is disclosed to application number 201420039265.8, including base plate and the wire board of cover on the base plate, be provided with on the wire board and help welding layer and insulating layer, and help the welding layer to be located the below of insulating layer, its characterized in that: the inside of the base plate is provided with ventilation holes, the porosity of the base plate is 30-80%, and the bottom of the base plate is provided with a heat dissipation film. The utility model uses the porous ceramic plate as the base plate, and the heat dissipation copper film is additionally arranged on the base plate of the porous ceramic plate, so that the characteristics of large heat dissipation area and quick heat transfer of the copper film of the porous ceramic plate can be utilized, the heat of the electronic element and the wire guide plate and even the base plate can be quickly eliminated, and the stability of the electronic element is further ensured.
But this heat dissipation circuit board is when using, between heat dissipation copper film and the porous ceramic plate, coefficient of thermal expansion is different, in circuit board course of working and follow-up use, all be in under the high temperature environment, lead to the fracture between the layer easily, influence the stable performance of ceramic circuit board, the heat dissipation is only through heat dissipation copper mould, heat radiating area is little, the component can not install fast and dismantle simultaneously, also can not in time change after the porous ceramic plate is impaired and influence follow-up use, do not satisfy people's user demand, a porous ceramic circuit board is needed for this reason.
Disclosure of utility model
In order to solve the defects of small heat dissipation area and inconvenient assembly and disassembly in the prior art, the utility model provides a porous ceramic circuit board.
In order to solve the technical problems, the utility model provides the following technical scheme:
The utility model relates to a porous ceramic circuit board, which comprises a ceramic circuit substrate and an assembly mechanism arranged in the ceramic circuit substrate, wherein the assembly mechanism comprises an installation component and a heat dissipation component;
The mounting assembly comprises a power element, an element fixing plate, a heat-dissipating ceramic plate, a ceramic fixing plate, a porous transition layer, a fixing plate limiting groove, a heat-dissipating metal block, a limiting mounting groove and a mounting threaded hole, wherein the power element is arranged on the ceramic circuit substrate;
The heat dissipation assembly comprises a heat dissipation disc and heat dissipation fins, the heat dissipation disc is welded below the heat dissipation metal block, and the heat dissipation fins are fixedly arranged at one end, away from the heat dissipation metal block, of the heat dissipation disc.
As a preferable technical scheme of the utility model, the upper surface wall of the ceramic circuit substrate is provided with an electroplating conductive layer, and circuit substrate mounting holes are uniformly formed around the upper surface wall of the ceramic circuit substrate.
As a preferable technical scheme of the utility model, one end of the element fixing plate, which is far away from the power element, is provided with a fixing plate threaded hole, and a fixing bolt arranged in the fixing plate threaded hole sequentially penetrates through a fixing plate limiting groove and a limiting mounting groove from top to bottom to be in threaded engagement connection with the mounting threaded hole.
As a preferable technical scheme of the utility model, the outer surface wall of the power element is provided with element welding spots.
As a preferred embodiment of the present utility model, the element fixing plate is entirely fitted inside the ceramic fixing plate.
As a preferable technical scheme of the utility model, the heat-dissipating ceramic plate is completely embedded in the porous transition layer, and the width of the ceramic fixing plate is the same as that of the limiting groove of the fixing plate.
As a preferable technical scheme of the utility model, the porous transition layer is completely embedded in the heat dissipation metal block, and the limit mounting groove is completely embedded with the ceramic fixing plate.
The utility model has the following beneficial effects:
Through setting up component fixed plate, the heat dissipation ceramic plate, porous transition layer, heat dissipation metal piece, spacing mounting groove and fixing bolt, power component is directly placed in the inside of heat dissipation ceramic plate, and power component and heat dissipation ceramic plate are totally gomphosis, make the inside fixed firm of power component at the heat dissipation ceramic plate, simultaneously make the heat that power component produced more abundant transfer to the heat dissipation ceramic plate that contacts completely, prolong the life of power component, reduce the harm of power component, the heat dissipation ceramic plate is totally gomphosis in porous transition layer's inside, porous transition layer is totally gomphosis in heat dissipation metal piece again, porous transition layer can adjust the interlaminar stress that leads to because of thermal expansion between heat dissipation ceramic plate and the heat dissipation metal piece, and then prevent the fracture between heat dissipation ceramic plate and the heat dissipation metal piece, ceramic circuit substrate's stable performance has been guaranteed, through fixing bolt with ceramic fixed plate, the fixed plate spacing groove, spacing mounting groove and installation screw thread meshing connection, the dismouting is faster, it is fixed more firm;
Through setting up cooling plate and radiator fin, the cooling plate can be with the inside heat transfer of radiator metal piece to the back of ceramic circuit substrate for heat dissipation reduces the temperature on power component surface, prolongs power component's availability factor, and radiator fin on the radiator metal piece increases radiator metal piece's radiating surface area simultaneously for power component and even ceramic circuit substrate's heat can be fast eliminated, improves radiating efficiency, and then guarantees power component's stability.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
Drawings
FIG. 1 is a schematic diagram of a porous ceramic circuit board according to the present utility model;
FIG. 2 is a schematic view of a partial enlarged structure of a porous ceramic circuit board according to the present utility model;
FIG. 3 is an enlarged partial rear view of a porous ceramic circuit board of the present utility model;
FIG. 4 is an enlarged partial semi-sectional schematic view of a porous ceramic circuit board of the present utility model;
Fig. 5 is an enlarged schematic view of a porous ceramic circuit board of the present utility model.
In the figure: 1. a ceramic circuit substrate; 2. a power element; 3. a component fixing plate; 4. a heat-dissipating ceramic plate; 5. a ceramic fixing plate; 6. a porous transition layer; 7. a fixed plate limit groove; 8. a heat-dissipating metal block; 9. a limit mounting groove; 10. installing a threaded hole; 11. a heat dissipation plate; 12. a heat radiation fin; 13. electroplating a conductive layer; 14. a circuit substrate mounting hole; 15. screw holes of the fixing plate; 16. a fixing bolt; 17. and element welding spots.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Example 1
As shown in fig. 1 to 5, a porous ceramic circuit board comprises a ceramic circuit substrate 1 and an assembly mechanism arranged inside the ceramic circuit substrate 1, wherein the assembly mechanism comprises a mounting component and a heat dissipation component;
The installation component includes power component 2, the component fixed plate 3, the radiating ceramic plate 4, ceramic fixed plate 5, porous transition layer 6, fixed plate spacing groove 7, radiating metal piece 8, spacing mounting groove 9 and installation screw hole 10, be provided with the power component 2 on the ceramic circuit substrate 1, fixed mounting has component fixed plate 3 on the power component 2, and the below of power component 2 is provided with radiating ceramic plate 4, the inside at radiating ceramic plate 4 is directly placed to the power component 2, and power component 2 and radiating ceramic plate 4 gomphosis completely, make power component 2 fixed firm in radiating ceramic plate 4's inside, the heat that makes power component 2 produce more abundant transfer to radiating ceramic plate 4 simultaneously, the life of extension power component 2 reduces the harm of power component 2, fixed mounting has ceramic fixed plate 5 on the radiating ceramic plate 4, and the below of radiating ceramic plate 4 is provided with porous transition layer 6, be provided with fixed plate spacing groove 7 on the porous transition layer 6, and the below welding of porous transition layer 6 has radiating metal piece 8 again, the inside at porous transition layer 6 gomphosis completely, porous transition layer 6 is at the inside of radiating metal piece 8, the inside of radiating metal piece 8 is in the inside of porous transition layer 6, the inside is guaranteed to be equipped with the radiating metal piece 8, the thermal stress crack is prevented from setting up between the radiating metal piece 8 and the thermal-insulating layer 4, and the thermal-insulating layer 9 is installed in the thermal-insulating layer 4, and thermal-insulating layer 9, thermal-insulating layer is stable, thermal-insulating layer 9 is mounted between thermal-insulating layer and thermal-insulating layer 9.
Further, the upper surface wall of the ceramic circuit substrate 1 is provided with an electroplating conductive layer 13, and circuit substrate mounting holes 14 are uniformly formed in the periphery of the upper surface wall of the ceramic circuit substrate 1, the electroplating conductive layer 13 facilitates the power element 2 and the ceramic circuit substrate 1 to conduct electricity and information, and the circuit substrate mounting holes 14 facilitate the assembly of the ceramic circuit substrate 1 on various devices.
Further, one end of the element fixing plate 3, which is far away from the power element 2, is provided with a fixing plate threaded hole 15, and a fixing bolt 16 arranged in the fixing plate threaded hole 15 sequentially penetrates through the fixing plate limiting groove 7 and the limiting mounting groove 9 from top to bottom to be in threaded engagement with the mounting threaded hole 10, and the ceramic fixing plate 5, the fixing plate limiting groove 7, the limiting mounting groove 9 and the mounting threaded hole 10 are in threaded engagement with each other through the fixing bolt 16, so that the element fixing plate is rapid in disassembly and assembly and firm in fixation.
Furthermore, the outer surface wall of the power element 2 is provided with element welding spots 17, and the element welding spots 17 facilitate welding of the power element 2 and each substrate circuit on the ceramic circuit substrate 1, and are convenient to install and connect.
Further, the component fixing plate 3 is completely embedded in the ceramic fixing plate 5, the component fixing plate 3 and the ceramic fixing plate 5 are directly placed and installed, positioning problems are not needed to be considered in installation, the component fixing plate 3 is not easy to shake in the ceramic fixing plate 5, and the service life is prolonged.
Further, the heat dissipation ceramic plate 4 is embedded in the porous transition layer 6 completely, the width of the ceramic fixing plate 5 is the same as that of the fixing plate limiting groove 7, the porous transition layer 6 can adjust interlayer stress caused by thermal expansion between the heat dissipation ceramic plate 4 and the heat dissipation metal block 8, cracking between the heat dissipation ceramic plate 4 and the heat dissipation metal block 8 is further prevented, the ceramic fixing plate 5 is limited completely in the fixing plate limiting groove 7, the ceramic fixing plate 5 is prevented from shaking, the fixing is firmer, the heat dissipation ceramic plate 4 is cracked under extreme conditions, the heat dissipation ceramic plate 4 can be replaced through the splitting element fixing plate 3 and the ceramic fixing plate 5, and the replacement operation is simple, convenient and quick.
Further, porous transition layer 6 gomphosis is in the inside of heat dissipation metal piece 8 completely, and spacing mounting groove 9 gomphosis is complete with ceramic fixed plate 5, and heat dissipation metal piece 8 is heated the inflation and can extrude porous transition layer 6, and the deformation of porous transition layer 6 guarantees that heat dissipation ceramic plate 4 does not receive too much pressure, has solved the fragile problem of heat dissipation ceramic plate 4, and ceramic fixed plate 5 is spacing in spacing mounting groove 9 completely, guarantees that ceramic fixed plate 5 can fully fix, avoids leading to the damage of heat dissipation ceramic plate 4 because of rocking.
Example 2
As shown in fig. 1-4, compared with embodiment 1, as another implementation mode of the utility model, the heat dissipation assembly provided by the utility model comprises a heat dissipation disc 11 and heat dissipation fins 12, the heat dissipation disc 11 is welded below the heat dissipation metal block 8, the heat dissipation fins 12 are fixedly arranged at one end of the heat dissipation disc 11 away from the heat dissipation metal block 8, the heat dissipation disc 11 can transfer the heat in the heat dissipation metal block 8 to the back of the ceramic circuit substrate 1, so that the heat dissipation is accelerated, the temperature of the surface of the power element 2 is reduced, the service efficiency of the power element 2 is prolonged, and meanwhile, the heat dissipation surface area of the heat dissipation metal block 8 is increased by the heat dissipation fins 12 on the heat dissipation metal block 8, so that the heat of the power element 2 and the ceramic circuit substrate 1 can be rapidly eliminated, the heat dissipation efficiency is improved, and the stability of the power element 2 is further ensured.
During operation, the power element 2 is firstly positioned through the element fixing plate 3 and the ceramic fixing plate 5 and then placed in the heat-dissipating ceramic plate 4, the power element 2 is directly placed in the heat-dissipating ceramic plate 4, and the power element 2 and the heat-dissipating ceramic plate 4 are completely embedded, so that the power element 2 is firmly fixed in the heat-dissipating ceramic plate 4, and meanwhile, the heat generated by the power element 2 is fully transferred into the heat-dissipating ceramic plate 4 through complete contact, the service life of the power element 2 is prolonged, and the damage of the power element 2 is reduced.
Subsequently, place the inside at porous transition layer 6 after passing through fixed plate spacing groove 7 location with the heat dissipation ceramic plate 4, place the inside at heat dissipation metal piece 8 after passing through spacing mounting groove 9 location with porous transition layer 6 again, the inside at porous transition layer 6 is completely gomphosis to the heat dissipation ceramic plate 4, porous transition layer 6 is the gomphosis in heat dissipation metal piece 8 again completely, the interlaminar stress that leads to because of thermal expansion between heat dissipation ceramic plate 4 and the heat dissipation metal piece 8 can be adjusted to porous transition layer 6, and then prevent the fracture between heat dissipation ceramic plate 4 and the heat dissipation metal piece 8, the stable performance of ceramic circuit substrate 1 has been guaranteed.
Finally, the ceramic fixing plate 5, the fixing plate limiting groove 7, the limiting mounting groove 9 and the mounting threaded hole 10 are in threaded engagement connection through the fixing bolts 16, so that the ceramic fixing plate is rapid in disassembly and assembly and firm in fixation. The heat generated by the power element 2 is sequentially transferred from the heat-dissipating ceramic plate 4, the porous transition layer 6 and the heat-dissipating metal block 8 to the heat-dissipating fins 12 at the bottom of the heat-dissipating disc 11, the heat-dissipating disc 11 can transfer the heat inside the heat-dissipating metal block 8 to the back of the ceramic circuit substrate 1, heat dissipation is quickened, the temperature of the surface of the power element 2 is reduced, the service efficiency of the power element 2 is prolonged, meanwhile, the heat-dissipating fins 12 on the heat-dissipating metal block 8 increase the heat-dissipating surface area of the heat-dissipating metal block 8, so that the heat of the power element 2 and even the heat of the ceramic circuit substrate 1 can be quickly eliminated, heat-dissipating efficiency is improved, and the stability of the power element 2 is further guaranteed.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (7)
1. The utility model provides a porous ceramic circuit board, includes ceramic circuit substrate (1) and sets up at the inside equipment mechanism of ceramic circuit substrate (1), its characterized in that: the assembly mechanism comprises a mounting assembly and a heat dissipation assembly;
The mounting assembly comprises a power element (2), an element fixing plate (3), a heat-radiating ceramic plate (4), a ceramic fixing plate (5), a porous transition layer (6), a fixing plate limiting groove (7), a heat-radiating metal block (8), a limiting mounting groove (9) and a mounting threaded hole (10), wherein the power element (2) is arranged on the ceramic circuit substrate (1), the element fixing plate (3) is fixedly mounted on the power element (2), the heat-radiating ceramic plate (4) is arranged below the power element (2), the ceramic fixing plate (5) is fixedly mounted on the heat-radiating ceramic plate (4), the porous transition layer (6) is arranged below the heat-radiating ceramic plate (4), the fixing plate limiting groove (7) is arranged on the porous transition layer (6), the heat-radiating metal block (8) is welded below the porous transition layer (6), the limiting mounting groove (9) is arranged inside the heat-radiating metal block (8), and the mounting threaded hole (10) is arranged inside the limiting mounting groove (9).
The heat dissipation assembly comprises a heat dissipation disc (11) and heat dissipation fins (12), the heat dissipation disc (11) is welded below the heat dissipation metal block (8), and the heat dissipation fins (12) are fixedly installed at one end, far away from the heat dissipation metal block (8), of the heat dissipation disc (11).
2. The porous ceramic circuit board of claim 1, wherein: an electroplating conductive layer (13) is arranged on the upper surface wall of the ceramic circuit substrate (1), and circuit substrate mounting holes (14) are uniformly formed in the periphery of the upper surface wall of the ceramic circuit substrate (1).
3. The porous ceramic circuit board of claim 1, wherein: one end of the element fixing plate (3) far away from the power element (2) is provided with a fixing plate threaded hole (15), and a fixing bolt (16) arranged in the fixing plate threaded hole (15) sequentially penetrates through the fixing plate limiting groove (7) and the limiting mounting groove (9) from top to bottom to be in threaded engagement with the mounting threaded hole (10).
4. The porous ceramic circuit board of claim 1, wherein: the outer surface wall of the power element (2) is provided with element welding spots (17).
5. The porous ceramic circuit board of claim 1, wherein: the element fixing plate (3) is completely embedded in the ceramic fixing plate (5).
6. The porous ceramic circuit board of claim 1, wherein: the heat dissipation ceramic plate (4) is completely embedded in the porous transition layer (6), and the width of the ceramic fixing plate (5) is the same as that of the fixing plate limiting groove (7).
7. The porous ceramic circuit board of claim 1, wherein: the porous transition layer (6) is completely embedded in the heat dissipation metal block (8), and the limit mounting groove (9) is completely embedded with the ceramic fixing plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322663375.3U CN220985926U (en) | 2023-10-07 | 2023-10-07 | Porous ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322663375.3U CN220985926U (en) | 2023-10-07 | 2023-10-07 | Porous ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220985926U true CN220985926U (en) | 2024-05-17 |
Family
ID=91042195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322663375.3U Active CN220985926U (en) | 2023-10-07 | 2023-10-07 | Porous ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220985926U (en) |
-
2023
- 2023-10-07 CN CN202322663375.3U patent/CN220985926U/en active Active
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