CN101546738B - A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate - Google Patents
A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate Download PDFInfo
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- CN101546738B CN101546738B CN2009100433721A CN200910043372A CN101546738B CN 101546738 B CN101546738 B CN 101546738B CN 2009100433721 A CN2009100433721 A CN 2009100433721A CN 200910043372 A CN200910043372 A CN 200910043372A CN 101546738 B CN101546738 B CN 101546738B
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- base plate
- pipe radiator
- heat pipe
- semiconductor element
- radiator base
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Abstract
The present invention discloses a modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate, wherein it consists of heat pipe radiator base plate, semiconductor element, external conducting connection plate fixed onto the base plate, and elastic press mounting module that fastens base plate and semiconductor element; the elastic press mounting module is fixed onto the rectifying device through the support component on it; the heat pipe radiator base plate is located in the space formed by the fastening screws in the elastic press mounting component; on the heat pipe radiator base plate, a positioning component is provided to match the center hole of the semiconductor element, and on the external conducting connection plate, there is at least one through hole for fastening screw. This structure may significantly reduce the dimensions of the heat pipe radiator base plate. Thereby copper with great thermal conductivity may be adopted, no static friction will be generated between the screw and the base plate, and pressure can be completely transferred to the contact surface, thus remarkably reducing thermal contact resistance.
Description
Technical field
The invention belongs to the heat dissipation technology of the power device of locomotive rectifying device, be specifically related to the location structure that press-fits of a kind of improved semiconductor element and heat pipe radiator base plate.
Background technology
Use semiconductor element to make switching device in the locomotive high-power rectifying device, in order to reduce the quantity of single bridge arm unit parallel connection, all trend towards using big element, as the use for electric locomotive rectifying device by an original brachium pontis with 62 inches thyristor series and parallels, a brachium pontis is till now only used 5 inches thyristors, and the heating power consumption of single semiconductor element reaches thousands of watts.So, require supporting radiator that higher heat-sinking capability is arranged, must reduce the contact heat resistance between semiconductor element and the radiator simultaneously.It press-fits location structure and generally adopts classical steel ball to add the elasticity that disk spring forms to press-fit assembly, with 4 fastening modes of (or 2) screw rod two end nuts, the substrate of semiconductor element and radiator is closely forced together, the position perforate of corresponding screw rod on the substrate of radiator, both can pass screw rod, rely on screw rod location radiator simultaneously.
At present, use the high power switch element on locomotive, supporting radiator using heat-pipe radiator, as shown in Figure 1, is made up of circular heat pipe 12, radiating fin 13 and substrate 2.4 fastening screw via holes 14 have been opened on the radiator base plate, pass fastening screw and locate according to fastening screw, because the high power switch size of component is big, cause fastening also big with the distance between the screw rod, so the substrate of heat-pipe radiator also must be done greatly, for weight reduction with reduce cost, baseplate material can only adopt aluminium alloy.Also having an easy generation problem is exactly that fastening pressure has part consumption on the stiction between fastening screw and the substrate, causes contact pressure between substrate and the switch element to reduce and inhomogeneous.Comprehensively, its weak point is exactly, be subjected to the restricting substrate of weight and cost can not adopt the best copper of heat conductivility, simultaneously, because of contact pressure and the uniformity between reduction substrate of the stiction between fastening screw and the substrate and switch element, these all make the contact heat resistance between high power switch element and the substrate big, do not satisfy the heat radiation requirement.
Summary of the invention
The objective of the invention is in order to solve the big problem of contact heat resistance that locate mode is brought that press-fits of existing high-power components and heat-pipe radiator, thereby and provide the location structure that press-fits of a kind of improved semiconductor element and heat pipe radiator base plate to show according to ground and reduce contact heat resistance, satisfy the heat radiation requirement of high power semiconductor component on the locomotive rectifying device best.
The objective of the invention is to be achieved through the following technical solutions:
Improved semiconductor element of the present invention and heat pipe radiator base plate press-fit location structure, comprise heat pipe radiator base plate, at the semiconductor element between the substrate, be fixed on external conductive connection plates on the substrate, the elasticity that substrate and semiconductor element is fastening press-fits assembly; Described elasticity press-fits assembly and is fixed on the rectifying device by the support component on it; In the zone that described heat pipe radiator base plate forms between elasticity press-fits fastening screw in the assembly; Heat pipe radiator base plate is provided with positioning element and matches with the centre bore of semiconductor element, externally is provided with a fastening screw via hole at least on the conductive connection plates.
Positioning element on the described heat pipe radiator base plate is the shop bolt that is located in its centre bore, makes wholely to press-fit location structure and all locate in the center.
Fastening screw via hole on the conductive connection plates can opened slotted hole with the line direction of described centre bore as required.
The substrate of heat-pipe radiator can weld also and can stack with the threaded pin location with external conductive connection plates.
The present invention relies on the fastening screw locate mode of passing it by the substrate with original heat-pipe radiator in press-fiting assembly, change into cancellation and on substrate, open the fastening screw via hole, fastening screw does not pass from it, only utilize the centre bore of semiconductor element and 2 of the fastening screw via holes of external conductive connection plates to position, therefore the size of heat pipe radiator base plate can be significantly reduced, thereby the splendid copper of heat conductivility can be adopted.Two point locations do not have the problem generation of any interference simultaneously, so can not produce the stiction between fastening screw and the substrate, can guarantee that pressure is delivered to contact-making surface fully, thereby reduce contact heat resistance significantly.Because the substrate size of heat-pipe radiator reduces greatly, thus the red copper of electric conductivity excellence adopted, highly beneficial to reducing contact heat resistance, and in the transmission course of pressure, do not have the location and interfere the stiction loss that produces.By this improvement, contact heat resistance is reduced to 0.002K/W by original 0.005K/W (two-sided), has satisfied the demand of practical application.
Further specify technical scheme of the present invention below in conjunction with accompanying drawing,
Description of drawings
Fig. 1 be conventional semiconductor element and heat pipe radiator base plate press-fit the location structure schematic diagram.
Fig. 2 be semiconductor element of the present invention and heat pipe radiator base plate press-fit the location structure schematic diagram.
Fig. 3 is the vertical view of Fig. 1.
Among the figure: 1, silicon rectifier cell, 2, heat pipe radiator base plate, 3, external conductive connection plates, 4, fastening screw, 5, spring plank, 6, the dish spring, 7, steel ball, 8, insulating part, 9, support component, 10, clamp nut, 11, shop bolt, 12, circular heat pipe, 13, radiating fin, 14, the fastening screw via hole.
Embodiment
Fig. 2, Fig. 3 have provided the structural representation of one embodiment of the present of invention, can be applicable to homemade Shaoshan type series electric locomotive and diesel locomotive rectifying device.
This press-fit location structure mainly by heat pipe radiator base plate 2, at 3～5 inches silicon rectifier cells 1 between the substrate 2, be fixed on external conductive connection plates 3 on the substrate 2, substrate 2 and semiconductor element 1 fastening elasticity is press-fited assembly form; Elasticity press-fits assembly and comprises fastening screw 4, clamp nut 10, spring plank 5, dish spring 6, steel ball 7, insulating part 8, shop bolt 11, elasticity press-fits assembly by support component 9 stationary positioned that are located on rectifying device, in the zone that heat pipe radiator base plate 2 forms between the solid screw rod 4 of elastic compression, the location of heat pipe radiator base plate 2 is to utilize the shop bolt 11 that is located on its centre bore to match with the centre bore of silicon rectifier cell 1 and utilize fastening screw 4 to pass the fastening screw via hole realization of external conductive connection plates 3.
Fastening screw via hole on the conductive connection plates can opened slotted hole with the line direction of described centre bore as required.
The substrate of heat-pipe radiator can weld also and can stack with the threaded pin location with external conductive connection plates.
Heat pipe radiator base plate 2 is owing to adopt location, two holes, thereby the substrate size of heat-pipe radiator is reduced greatly, also do not have the loss of stiction between fastening screw and the fastening screw via hole.Cardinal principle is:
Whole element press-fits assembly and locatees on rectifying device with fixing by the support component 9 at two ends, 4 fastening screws 4 are by support component 9 location, spring plank 5 is by fastening screw 4 location, dish spring 6, steel ball 7, insulating part 8 are all by centralized positioning, the location of heat-pipe radiator 2 is to utilize the centre bore of silicon rectifier cell 1 and the fastening screw via hole of external conductive connection plates 3 to realize location, 2 holes, wherein externally is fixed together with the screw location and by pressure assembling force between the substrate of conductive connection plates 3 and heat-pipe radiator 2.When press-fiting, by clamp nut 10 spring plank 5 of exerting pressure, spring plank 5 passes to dish spring 6 and steel ball 7 with pressure, and passes to by insulating part 8 on the substrate of heat-pipe radiator 2, by substrate 2 power is passed to contact-making surface with silicon rectifier cell 1.
Claims (4)
- Improved semiconductor element and heat pipe radiator base plate press-fit location structure, comprise heat pipe radiator base plate, at the semiconductor element between the substrate, be fixed on external conductive connection plates on the substrate, the elasticity that substrate and semiconductor element is fastening press-fits assembly; It is characterized in that described elasticity press-fits assembly and is fixed on the rectifying device by the support component that is located on the rectifying device; In the zone that described heat pipe radiator base plate forms between elasticity press-fits fastening screw in the assembly, the fastening screw via hole is opened in cancellation on substrate, and fastening screw does not pass from it; Heat pipe radiator base plate is provided with positioning element and matches with the centre bore of semiconductor element, externally is provided with a fastening screw via hole at least on the conductive connection plates.
- 2. improved semiconductor element according to claim 1 and heat pipe radiator base plate press-fit location structure, it is characterized in that the positioning element on the described heat pipe radiator base plate is the shop bolt that is located in its centre bore.
- 3. improved semiconductor element according to claim 2 and heat pipe radiator base plate press-fit location structure, it is characterized in that the fastening screw via hole on the external conductive connection plates can opened slotted hole with the line direction of described centre bore as required.
- 4. according to the location structure that press-fits of claim 1 or 2 or 3 described improved semiconductor elements and heat pipe radiator base plate, it is characterized in that the substrate of heat-pipe radiator can weld also and can stack with the threaded pin location with external conductive connection plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100433721A CN101546738B (en) | 2009-05-12 | 2009-05-12 | A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100433721A CN101546738B (en) | 2009-05-12 | 2009-05-12 | A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101546738A CN101546738A (en) | 2009-09-30 |
| CN101546738B true CN101546738B (en) | 2011-07-13 |
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| CN2009100433721A Active CN101546738B (en) | 2009-05-12 | 2009-05-12 | A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6276959B2 (en) * | 2013-10-11 | 2018-02-07 | 株式会社日立製作所 | Phase change module and electronic device equipped with the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1487584A (en) * | 2003-08-21 | 2004-04-07 | 株洲时代集团公司 | Great power device and its heat sink pressure-mounting method |
| CN101154636A (en) * | 2006-09-26 | 2008-04-02 | 宜昌市能达通用电气股份合作公司 | Semiconductor power component radiating by annular heat pipe |
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2009
- 2009-05-12 CN CN2009100433721A patent/CN101546738B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1487584A (en) * | 2003-08-21 | 2004-04-07 | 株洲时代集团公司 | Great power device and its heat sink pressure-mounting method |
| CN101154636A (en) * | 2006-09-26 | 2008-04-02 | 宜昌市能达通用电气股份合作公司 | Semiconductor power component radiating by annular heat pipe |
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| CN101546738A (en) | 2009-09-30 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: 412000 Hunan Province, Zhuzhou Shifeng District Tian Xin North Gate Patentee before: ZHUZH CSR TIMES ELECTRIC Co.,Ltd. |