CN101211905B - Press-loading valve stack for large power all-controlled semiconductor device - Google Patents
Press-loading valve stack for large power all-controlled semiconductor device Download PDFInfo
- Publication number
- CN101211905B CN101211905B CN2007101014618A CN200710101461A CN101211905B CN 101211905 B CN101211905 B CN 101211905B CN 2007101014618 A CN2007101014618 A CN 2007101014618A CN 200710101461 A CN200710101461 A CN 200710101461A CN 101211905 B CN101211905 B CN 101211905B
- Authority
- CN
- China
- Prior art keywords
- press
- loading valve
- valve stack
- power device
- igct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 230000013011 mating Effects 0.000 claims description 7
- 230000006835 compression Effects 0.000 abstract 3
- 238000007906 compression Methods 0.000 abstract 3
- 235000014676 Phragmites communis Nutrition 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Power Conversion In General (AREA)
Abstract
The invention relates to a compression charging valve pile of a semiconductor apparatus with high power and full control. Two same IGCT elements of power apparatus are arranged in the middle of the compression charging valve pile; two radiators are arranged in the middle of the two IGCT elements of power apparatus, and another two radiators are respectively arranged in the outboard of the two IGCT elements of power apparatus; coaxial lines of every apparatuses are overlapping installed together; outside of the two radiators of two sides, a corresponding insulation washer, a supporting part and a spring plate are overlapping installed separately in the outside of the coaxial lines; at least three screws are arranged as a string evenly surrounding the axes between two spring plates; every apparatus and element are fixed together through every screw. By adopting the coordination of two supporting parts and the spring plate through the surrounded screws to fix the apparatuses, the invention has the electrical equipment capability of simple compression charging, even force for apparatuses and capability to ensure performance of components. The application of the supporting part of universal coordination component ensures a pressing force applied on the surface of apparatuses, avoiding the full parallel of the upper and lower surface and full vertical between the upper and lower surface as well as the axes of apparatuses. The application of the supporting part of the spring component ensures that the source of the pressing force after the pressure is unloaded by the forcing press.
Description
Technical field
The present invention relates to a kind of press-loading valve stack of large power all-controlled semiconductor device, belong to electric and electronic technical field.
Background technology
Along with the development of power electronic technology, power semiconductor is to more high voltage and Geng Gao current class development, and the thing followed promptly is that the fastening of supporting with it radiator performance and semiconductor device had higher requirement.In the high-voltage applications field, flat high power device is (as GTO, IGCT, integrated gate commutated thyristor IGCT, it is a kind of novel high power device, this product is to the improvement of gate level turn-off thyristor GTO and perfect) application in electric electronic current change technology has been very general, but the when mounted modes that adopt stay bolts with all devices overall fixed together of traditional flat high power device and radiating element (refering in particular to water-filled radiator) more.It is better that this mounting means employing special equipment press-fits concentricity, but process also bothers, press-fits complexity, is difficult to guarantee the stressed size of requirement on devices and the consistency (parallel, concentric, the direction consistency of holding element) of uniformity and related elements.In the high-power single-phase inverter circuit of using the IGCT power device, satisfy the requirement of power device IGCT in order to guarantee some implicit parameters in the circuit, must adopt exclusive components and parts arrangement mode to realize.Because the requirement that semiconductor power device IGCT will lead to big electric current must reach the desired thrust of this components and parts, traditional press-fit approach is difficult to accomplish.
Summary of the invention
The objective of the invention is to propose a kind of press-loading valve stack of large power all-controlled semiconductor device, install simply, can guarantee well that device reaches stressed standard simultaneously so that reach.
For achieving the above object, technical scheme of the present invention is: a kind of press-loading valve stack of large power all-controlled semiconductor device, this press-loading valve stack middle part is two same power device IGCT elements, in the middle of two power device IGCT elements is two radiators, two power device IGCT element outsides also respectively are provided with a radiator, each device coaxial line is stacked, two radiators of both sides outer also separately laterally the coaxial line closed assembly corresponding insulation cushion is arranged, strutting piece and spring plank, evenly go here and there around axis between two spring planks and be provided with at least three screw rods, each components and parts tightens together by each screw rod.
In described two strutting pieces, one is elastic component, and another is universal mating component.
Two radiator directions in the middle of described two power device IGCT elements are opposite.
Outwards also each is provided with a diode and a radiator in turn between the radiator in described two power device IGCT elements outside and the insulation cushion.
Described each diode is identical with the polar orientation of power device IGCT element.
Described universal mating component strutting piece is a cylindrical component, and cylindrical component is provided with ball head structure with corresponding spring plank abutting end, the corresponding universal cooperation of spherical groove on this bulb and spring plank surface.
Described elastic component strutting piece is a flat head screw structure that contains disk spring pad and plain cushion, and the flat head screw screw rod outwards passes corresponding spring plank, and loads onto screwed retaining ring.
Pass through the alignment pin orientation between adjacent each parts of described axial closed assembly.
Around axis, evenly go here and there between described two spring planks and be provided with four double threaded screws, four double threaded screw two ends pass the perforation of correspondence position spring plank respectively, the termination is all fastening by nut, is fixed with mounting panel at four screw end heads of press-loading valve stack one end with other nut.
It is fastening that the present invention uses two strutting pieces and spring plank cooperation to be undertaken by screw rod all around, press-fits simply, and device is stressed evenly, can guarantee the electric property of member.Use universal mating component strutting piece to guarantee that thrust puts on the surface of device, it is fully parallel and vertical fully with the axle center of device to have avoided leaveing no choice but upper and lower surface.Use elastic component strutting piece has guaranteed the thrust source after forcing press is laid down pressure.Use around the device four long bolts be for allow device around can well expose, be convenient to outer draw cooling water pipe and be electrically connected.The purpose of using insulation cushion is in order to improve the insulating capacity of device, and last lower reed plate is a frame part, is complete electric insulation with the device of centre.Establish two radiators in the middle of two power device IGCT elements, two radiator directions are opposite, can guarantee better heat dispersion.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the vertical view of Fig. 1.
Embodiment
Site requirements will satisfy condition, earlier the framework of device is in the same place bottom and screw combinations in order, again power device and radiator tandem are arranged, in the middle of two devices, be located by connecting mutually (it self subsidiary alignment pin being arranged), but in the middle of two power devices of centre, be the opposite radiator of both direction in a side of radiator with alignment pin.Respectively there is an insulation cushion (its insulation degree has determined the voltage insulation degree of whole device) at the two ends of arranging at device, in the bottom is a following arrangement that two plane relations are variable, and on top is a upper supporting piece (being the purpose that reaches the element thrust by the stress that it produces after compressing) that contains the multilayer disk spring.In the outside of lower support element and upper supporting piece is respectively lower reed plate and last spring plank, also has an alignment pin to connect between lower support element and lower reed plate.Last spring plank then is to have a hole to allow upper supporting piece pass the purpose that reaches the location simultaneously in the centre.Make the radiator of the same side remain on unified position, allow power component also will be consistent up and down simultaneously, then four bolts of pretension.Whole device is put on the forcing press, unclamps bolt, adjusts device direction stress-free the time once more, and the afterburning then device rated value that arrives four bolted, unclamps forcing press again, takes out press-loading valve stack, installation.
Concrete way is as follows: the assembly yard must be cleaned, and the facility of dustproof and antistatic is arranged.Before the prepackage beginning, the surface that water-cooling sheet 7, diode 8 and power device IGCT element 9 are connected must use napped cotton fabric to be stained with the correct cleaning of alcohol (or ethanol).Fin and semi-conductive surface should handled, avoid scratching or other damage.In two strutting pieces, upper supporting piece is an elastic component, and lower support element is universal mating component.Universal mating component strutting piece is a cylindrical component, and cylindrical component is provided with ball head structure with corresponding lower reed plate abutting end, the corresponding universal cooperation of spherical groove on this bulb and spring plank surface.The elastic component strutting piece is a flat head screw structure that contains disk spring pad and plain cushion, and the flat head screw screw rod outwards passes corresponding spring plank, and loads onto screwed retaining ring.On double threaded screw, add insulating sleeve.After treating that fin and device dry, carry out in proper order by following closed assembly:
As Fig. 1, Fig. 2, shown in Figure 3, double threaded screw 3 one ends install mounting panel 1 usefulness M12 nut additional and add bullet pad and fastening, and---------------------------------------------------------------insulation cushion 5---adds upper supporting piece 10---double threaded screw is inserted in spring plank 11 and adds M12 nut 12 alignment pin 6 radiator 7 diode 8 alignment pin 6 radiator 7 IGCT power device 9 radiator 7 alignment pin 6 radiator 7 IGCT power device 9 alignment pin 6 radiator 7 diode 8 radiator 7 alignment pin 6 insulation cushion 5 alignment pin 6 alignment pin 6 to add lower support element 4 to insert the lower reed plate 2 that is placed on the platform.Steadily contact is good must to make the device side face when mounted.Make the center and the last lower reed plate center of each assembly will be on a line.When closed assembly IGCT power device, must the special messenger buttress the keeping parallelism placement.The IGCT valve heap that precompressed is dressed up is seen Fig. 1.Note during installation: the polar orientation unanimity of diode and IGCT.
Use the spanner screw rod at fastening diagonal angle earlier, tight again another diagonal angle guarantees when fastening that diagonal angle screw rod Tightening moment is identical, and the nut that guarantees four screw rods is near same horizontal level.Before pretension, should make the radiator of the same side remain on unified position, allow the IGCT power device also will be consistent up and down simultaneously.Use fastening four screw rods of spanner, when fastening when painstaking, can think that prepackage work finishes.
After above step is finished, unified working pressure machine, before forcing press presses down, bottom pad one plain cushion at the valve heap makes the base steel disc of valve heap unsettled, the frock briquetting that press-fits is put on top at the valve heap, prevent the last arrangement (butterfly bullet bolt) of forcing press contact valve heap, guarantee that the pressure of forcing press is to be added on the lower reed plate fully.
Before reinforcing, valve heap nut is unclamped, and allow the pressure reading of forcing press be 0.Make the radiator of the same side remain on unified position once more, allow the IGCT power device also will be consistent up and down simultaneously.The lower reed plate two sides applies the pressure of 40kN on valve heap then, and the nut on 4 double-screw bolts of fastening valve heap, fastening method are the same during with pretension.In order to prevent bias voltage, use the spanner screw rod at fastening diagonal angle earlier, tight again another diagonal angle guarantees when fastening that diagonal angle screw rod Tightening moment is identical, the nut that guarantees four screw rods is at same horizontal level.Possible words, four whiles are fastening.When using spanner fastening when painstaking, can think that the work of press-fiting finishes.Forcing press is unclamped, take out the valve heap.
Claims (7)
1. the press-loading valve stack of a large power all-controlled semiconductor device, this press-loading valve stack middle part is two same power device IGCT elements, in the middle of two power device IGCT elements is two radiators, two power device IGCT element outsides also respectively are provided with a radiator, each device coaxial line is stacked, two radiators of both sides outer also separately laterally the coaxial line order stack corresponding insulation cushion is housed, strutting piece and spring plank, it is characterized in that: around axis, evenly go here and there between two spring planks and be provided with at least three screw rods, each components and parts tightens together by each screw rod, in two strutting pieces, one is elastic component, another is universal mating component, and two radiator directions of two power device IGCT element centres are opposite.
2. press-loading valve stack according to claim 1 is characterized in that: outwards also each is provided with a diode and a radiator in turn between the radiator in described two power device IGCT elements outside and the insulation cushion.
3. press-loading valve stack according to claim 2 is characterized in that: described each diode is identical with the polar orientation of power device IGCT element.
4. press-loading valve stack according to claim 3 is characterized in that: described universal mating component strutting piece is a cylindrical component, and cylindrical component is provided with ball head structure with corresponding spring plank abutting end, the corresponding universal cooperation of spherical groove on this bulb and spring plank surface.
5. press-loading valve stack according to claim 4 is characterized in that: described elastic component strutting piece is a flat head screw structure that contains disk spring pad and plain cushion, and the flat head screw screw rod outwards passes corresponding spring plank, and loads onto screwed retaining ring.
6. according to claim 1,2,3,4 or 5 described press-loading valve stacks, it is characterized in that: pass through the alignment pin orientation between adjacent each parts of described axial closed assembly.
7. press-loading valve stack according to claim 6, it is characterized in that: around axis, evenly go here and there between described two spring planks and be provided with four double threaded screws, four double threaded screw two ends pass the perforation of correspondence position spring plank respectively, the termination is all fastening by nut, is fixed with mounting panel at four screw end heads of press-loading valve stack one end with other nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101014618A CN101211905B (en) | 2006-12-30 | 2007-04-18 | Press-loading valve stack for large power all-controlled semiconductor device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610160028.7 | 2006-12-30 | ||
| CN200610160028 | 2006-12-30 | ||
| CN2007101014618A CN101211905B (en) | 2006-12-30 | 2007-04-18 | Press-loading valve stack for large power all-controlled semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101211905A CN101211905A (en) | 2008-07-02 |
| CN101211905B true CN101211905B (en) | 2010-04-14 |
Family
ID=39611748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101014618A Expired - Fee Related CN101211905B (en) | 2006-12-30 | 2007-04-18 | Press-loading valve stack for large power all-controlled semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101211905B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794767A (en) * | 2010-03-19 | 2010-08-04 | 天津电气传动设计研究所 | Mechanical press mounting structure of group large-power flat-plate power electronic device |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066065B (en) * | 2012-12-26 | 2016-02-17 | 天津电气传动设计研究所有限公司 | A kind of power device series vertically places mechanical press mounting structure |
| CN104392987B (en) * | 2014-10-22 | 2019-04-05 | 中国船舶重工集团公司第七一二研究所 | A kind of pressing mounting tool of integrated form high-power semiconductor component |
| CN104538342B (en) * | 2014-12-04 | 2018-01-09 | 株洲南车时代电气股份有限公司 | For clamping the device of semiconductor devices |
| CN104883077B (en) * | 2015-06-02 | 2018-03-09 | 南车株洲电力机车研究所有限公司 | The level IGCT phase modules of compact three |
| CN105450044B (en) * | 2015-06-08 | 2017-03-29 | 南车株洲电力机车研究所有限公司 | Three symmetrical three level IGCT phase modules |
| CN106385163A (en) * | 2015-07-21 | 2017-02-08 | 特变电工新疆新能源股份有限公司 | Phase power unit based on asymmetric IGCT and H bridge chain link structure |
| CN105355603B (en) * | 2015-09-25 | 2018-10-23 | 全球能源互联网研究院 | A kind of big component IGBT press fittings unit |
| CN105489570B (en) * | 2016-01-19 | 2019-02-19 | 中国船舶重工集团公司第七0四研究所 | A kind of large power semiconductor device press-loading apparatus |
| CN106351923B (en) * | 2016-11-01 | 2018-11-30 | 中车株洲电力机车研究所有限公司 | Location structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2529387B1 (en) * | 1982-06-29 | 1985-09-06 | Jeumont Schneider | ASSEMBLY OF SEMICONDUCTOR POWER PADS |
| CN1487584A (en) * | 2003-08-21 | 2004-04-07 | 株洲时代集团公司 | Great power device and its heat sink pressure-mounting method |
| CN1688023A (en) * | 2005-04-30 | 2005-10-26 | 株洲变流技术国家工程研究中心 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
-
2007
- 2007-04-18 CN CN2007101014618A patent/CN101211905B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2529387B1 (en) * | 1982-06-29 | 1985-09-06 | Jeumont Schneider | ASSEMBLY OF SEMICONDUCTOR POWER PADS |
| CN1487584A (en) * | 2003-08-21 | 2004-04-07 | 株洲时代集团公司 | Great power device and its heat sink pressure-mounting method |
| CN1688023A (en) * | 2005-04-30 | 2005-10-26 | 株洲变流技术国家工程研究中心 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平10-191644A 1998.07.21 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794767A (en) * | 2010-03-19 | 2010-08-04 | 天津电气传动设计研究所 | Mechanical press mounting structure of group large-power flat-plate power electronic device |
| CN101794767B (en) * | 2010-03-19 | 2011-09-14 | 天津电气传动设计研究所 | Mechanical press mounting structure of group large-power flat-plate power electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101211905A (en) | 2008-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101211905B (en) | Press-loading valve stack for large power all-controlled semiconductor device | |
| CN103354234B (en) | A kind of thyristor converter valve module | |
| US8189324B2 (en) | Power electronic assembly with slotted heatsink | |
| CN102097809B (en) | Thyristor valve block of static var compensator (SVC) | |
| CN2809871Y (en) | Disk spring clamping mechanism for thyristor installation | |
| US20140313642A1 (en) | Power stack structure and method | |
| CN108428677A (en) | A kind of crimp type IGBT elasticity press mounting structure and crimp type IGBT encapsulating structures | |
| CA2848802A1 (en) | Clamping mechanism and method for applying rated force to power conversion apparatus | |
| JP7095070B2 (en) | Fuel cell stack compression system and method | |
| CN202178240U (en) | Semiconductor assembly press mounting apparatus | |
| CN104392987B (en) | A kind of pressing mounting tool of integrated form high-power semiconductor component | |
| CN208062590U (en) | A kind of anti-impacting with high pressure power distribution cabinet | |
| CN207588445U (en) | A kind of superhigh voltage DC breaker power electronics bypass valve segment structure | |
| CN204696102U (en) | A kind of heat radiating installation construction of power device | |
| CN111585254A (en) | Direct current breaker shifts branch road unit based on IEGT | |
| CN202034499U (en) | Clamping mechanism for connecting plates on quick wiring device | |
| CN214479522U (en) | High-voltage duplex cable head wiring device | |
| CN101546738B (en) | A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate | |
| CN214627470U (en) | High-efficient heat dissipation circuit board of multilayer | |
| CN216216826U (en) | High-power three-phase solid-state switch structure with device series-parallel connection application | |
| CN213844988U (en) | Transformer coil pressing structure | |
| CN212486117U (en) | Direct current breaker shifts branch road unit based on IEGT | |
| CN219891803U (en) | Singlechip development experiment board | |
| CN220068095U (en) | Electrical board mounting structure | |
| CN210778558U (en) | Series-parallel connection silicon controlled rectifier press mounting device and valve group structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XUJI ELECTRIC POWER CO., LTD. STATE GRID CORPORATI Free format text: FORMER OWNER: XUJI ELECTRIC POWER CO., LTD. Effective date: 20121231 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121231 Address after: No. 1298 Xuchang City, Henan province 461000 XJ Avenue Patentee after: Xuji Group Co., Ltd. Patentee after: Xuji Electric Power Co., Ltd. Patentee after: State Grid Corporation of China Address before: 461000 No. 178, Jianshe Road, Henan, Xuchang Patentee before: Xuji Group Co., Ltd. Patentee before: Xuji Electric Power Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100414 Termination date: 20200418 |