CN1688023A - Flat power semiconductor device, its radiator pressure mounting method and apparatus - Google Patents
Flat power semiconductor device, its radiator pressure mounting method and apparatus Download PDFInfo
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- CN1688023A CN1688023A CN 200510031500 CN200510031500A CN1688023A CN 1688023 A CN1688023 A CN 1688023A CN 200510031500 CN200510031500 CN 200510031500 CN 200510031500 A CN200510031500 A CN 200510031500A CN 1688023 A CN1688023 A CN 1688023A
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- radiator
- power semiconductor
- semiconductor device
- insulating element
- flat power
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Abstract
This invention discloses a packaging method for a plate power semiconductor device and its radiator and its device, in which, the power semiconductor device and its radiator are serial and packaged in a frame and an insulation part is set between them, the three are serially connected in the frame, then a packaging force in a same direction with the serial direction is generated by a clamping device connected with the insulation part to fix the serial connected parts. Said device includes an outer frame, a clamping device and an insulation part. The clamping device and the insulation part are set in the frame and between the semiconductor device, its radiator and the frame.
Description
Technical field
The present invention is mainly concerned with the radiator field of flat power semiconductor device, refers in particular to the pressing method and the device thereof of a kind of flat power semiconductor device and radiator thereof.
Background technology
Development along with power electronic technology, power semiconductor is to more high voltage and Geng Gao current class development, the thing followed, promptly be that supporting with it radiator performance is had higher requirement, at this wherein, except the thermal resistance to radiator had higher requirement, also press-fit approach, press-loading apparatus and the insulation system thereof etc. to radiator had all proposed new, higher requirement.
In the prior art, for flat power semiconductor device, no matter be air-cooled radiator or water-filled radiator, traditional press-fit approach all is directly to produce thrust to power semiconductor two ends radiator by fastening tightening bolt, and the insulation at its two poles of the earth realizes by the insulating sleeve that is enclosed within on the tightening bolt.But, when in the high-voltage applications field, often require a plurality of heat radiation elements to be connected in series, like this, press-fit approach commonly used just is difficult to for air-cooled radiator realize that directly string is pressed; And for water-filled radiator, though can realize the direct string of a plurality of heat radiation elements presses, but press the increase of parts number along with direct string, the electric pressure at its series element two ends also can raise greatly, and the insulation system of this traditional press-fit approach, promptly insulating sleeve also is difficult to satisfy the insulating requirements that the direct string of a plurality of heat dissipation elements is pressed.
Summary of the invention
The technical problem to be solved in the present invention just is: at the technical problem of prior art existence, the invention provides a kind of highly versatile, go for various flat power devices and radiator thereof, can solve the flat power semiconductor device of each electric pressure insulation system problem and the pressing method and the device thereof of radiator thereof preferably simultaneously, be particularly useful for the high pressure unsteady flow field that the series connection of high-voltage power semiconductor device is used.
In order to solve the problems of the technologies described above, the solution that the present invention proposes is: the pressing method of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: flat power semiconductor device and radiator serial connection are packaged in the framework, between the good flat power semiconductor device of serial connection and radiator and framework, be provided with insulating element, flat power semiconductor device and radiator thereof and insulating element are serially connected in the framework, produce the pressure assembling force identical by the hold down gag that links to each other with insulating element again and each is connected in series part fixes with being connected in series direction.
The press-loading apparatus of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: it comprises housing, hold down gag and insulating element, and hold down gag and insulating element all are arranged in the housing and are located between flat power semiconductor device and radiator and the housing.
Described insulating element is two, and wherein first insulating element links to each other with hold down gag and is located on the side of housing, and second insulating element then is directly connected on the housing side with side, first insulating element place symmetry.
Described hold down gag comprises puller bolt, guide pillar, platen and disk spring group, and guide pillar and puller bolt run through platen and be arranged on the platen, and the disk spring group is arranged between guide pillar and the platen.
Described first insulating element is located between hold down gag and flat power semiconductor device and the radiator thereof, and the puller bolt of described hold down gag directly links to each other with housing.Perhaps, an end of described first insulating element directly links to each other with housing, and the other end then links to each other with puller bolt on the hold down gag by a big platen.
Described insulating element adopts insulator.
Compared with prior art, the invention has the advantages that:
1, the pressing method of flat power semiconductor device of the present invention and radiator thereof and device thereof, adopt the frame-type encapsulating structure, parts and overall structure thereof are simple, dismounting simple and convenient, applied widely, applicable to multiple flat power semiconductor device, both can be used for vertical installation, also applicable to various installation methods such as horizontal installations;
2, the pressing method of flat power semiconductor device of the present invention and radiator thereof and device thereof, utilize housing to bear pressure, cooperate hold down gag, a plurality of flat power semiconductor devices and radiator thereof directly can be connected into one, realize the direct string pressure of a plurality of elements, and utilize the insulating element that is connected the housing two ends to make it can be good at satisfying the insulating requirements of high pressure.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention 1;
Fig. 2 is the structural representation of the embodiment of the invention 2;
Fig. 3 is the structural representation of the embodiment of the invention 3;
Fig. 4 is the structural representation of hold down gag of the present invention.
Marginal data
1, housing 2, hold down gag
21, puller bolt 22, guide pillar
23, platen 24, disk spring group
31, first insulating element 32, second insulating element
4, flat power semiconductor device 5, big platen
6, radiator
Embodiment
Below with reference to accompanying drawing invention is described in further details.
The pressing method of a kind of flat power semiconductor device of the present invention and radiator thereof, this method is that flat power semiconductor device 4 and radiator 6 serial connections are packaged in the framework, and between the good flat power semiconductor device 4 of serial connection and radiator 6 and framework, be provided with insulating element, then flat power semiconductor device 4 and radiator 6 thereof are serially connected in the framework with insulating element, produce the pressure assembling force identical by the hold down gag 2 that links to each other with insulating element again each serial connection part is fixed with being connected in series direction.
Embodiment 1: as shown in Figure 1, the press-loading apparatus of flat power semiconductor device of the present invention and radiator thereof, it mainly comprises housing 1, hold down gag 2 and insulating element, hold down gag 2 and insulating element all are arranged in the housing 1, and are located between the serial connection good flat power semiconductor device 4 and radiator 6 and housing 1.Wherein housing 1 is a carrier bar, part as the support frame of whole unit, housing 1 need bear that hold down gag 2 produced press-fits the required stress of flat power semiconductor device 4 and radiator thereof 6, flat power semiconductor device 4 and radiator 6 thereof for different size, its required pressure assembling force difference, the mechanical strength of housing 1 just need to do corresponding the adjustment.As shown in Figure 4, this hold down gag 2 comprises puller bolt 21, guide pillar 22, platen 23 and disk spring group 24, guide pillar 22 and puller bolt 21 run through platen 23 and are arranged on the platen 23, and guide pillar 22 is positioned at the central authorities of platen 23, then are provided with a plurality of puller bolts 21 around the platen 23; Disk spring group 24 is arranged between guide pillar 22 and the platen 23.In the present embodiment, described insulating element is two, and wherein first insulating element 31 links to each other with hold down gag 2 and is located on the side of housing 1, and second insulating element 32 then is directly connected on housing 1 side with first insulating element, 31 symmetries.Wherein, a plurality of puller bolts on the hold down gag 2 21 directly and housing 1 be fastenedly connected, the other end of hold down gag 2 links to each other with insulating element.Be folded with many group flat power semiconductor devices 4 and radiator 6 thereof between first insulating element 31 and second insulating element 32, realization many groups flat power semiconductor devices 4 and radiator 6 thereof are well connected.The pressure that utilizes puller bolt 21 tops on the hold down gag 2 to be produced to the dish-shaped groups of springs 24 of housing 1 compression, obtain required pressure assembling force with this, and disk spring group 24 that can be by using different size and adjust decrement and just can obtain the required pressure assembling force of various flat power semiconductor devices 4 and radiator thereof 6.Insulating element can insulate and transmits pressure assembling force flat power semiconductor device 4 and radiator 6 thereof, this insulating element can adopt the insulator of various standards, and the 3kV of choice criteria, 6kV, 10kV and 35kV insulator just can satisfy the insulating requirements of different electric pressures.
Operation principle: screw a plurality of puller bolts 21 on the hold down gag 2, itself and housing 1 are compressed, the pressure on the puller bolt 21 has then passed on the platen 23 by the torsion distance; Regulate a plurality of puller bolts 21 then respectively and make that the plane of platen 23 is definitely vertical with the thrust direction of flat power semiconductor device 4 and radiator 6 thereof, and platen 23 and 22 placements of guide pillar with require pressure assembling force and the corresponding disk spring group 24 of decrement, the deflection of disk spring group 24 can embody intuitively with the change in displacement of platen 23 and guide pillar 22, when guide pillar 22 ecks of design flush with platen 23, promptly reach the thrust of expectation.The thrust difference that different heat dissipation elements require realizes by disk spring group 24 and the adjustment decrement of using different size.
Embodiment 2: as shown in Figure 2, the press-loading apparatus of flat power semiconductor device of the present invention and radiator thereof, it mainly comprises housing 1, hold down gag 2 and insulating element, hold down gag 2 and insulating element all are arranged in the housing 1, and are located between flat power semiconductor device 4 and radiator 6 and the housing 1.Wherein housing 1 is a carrier bar, part as the support frame of whole unit, housing 1 need bear that hold down gag 2 produced press-fits the required stress of flat power semiconductor device 4 and radiator thereof 6, flat power semiconductor device 4 and radiator 6 thereof for different size, its required pressure assembling force difference, the mechanical strength of housing 1 just need to do corresponding the adjustment.As shown in Figure 4, this hold down gag 2 comprises puller bolt 21, guide pillar 22, platen 23 and disk spring group 24, guide pillar 22 and puller bolt 21 run through platen 23 and are arranged on the platen 23, guide pillar 22 is positioned at the central authorities of platen 23, then be provided with a plurality of puller bolts 21 around the platen 23, disk spring group 24 is arranged between guide pillar 22 and the platen 23.In the present embodiment, described insulating element is two, and wherein first insulating element 31 links to each other with hold down gag 2 and is located on the side of housing 1, and second insulating element 32 then is directly connected on housing 1 side with first insulating element, 31 symmetries.Wherein, one end of first insulating element 31 directly is connected with housing 1, the other end is connected with a big platen 5, puller bolt 21 on the hold down gag 2 is anchored on the big platen 5, this big platen 5 links to each other with hold down gag 2 by puller bolt 21, the tail end of hold down gag 2 directly with press-fit flat power semiconductor device 4 and radiator 6 links to each other.Be folded with many group flat power semiconductor devices 4 and radiator 6 thereof between first insulating element 31 and second insulating element 32, realization many groups flat power semiconductor devices 4 and radiator 6 thereof are well connected.Utilize the puller bolt 21 on the hold down gag 2 to push up to big platen 23, and be passed to the pressure of housing 1 by insulating element, compress dish-shaped groups of springs 24 and produce pressure and obtain required pressure assembling force with this, and disk spring group 24 that can be by using different size and adjust decrement and just can obtain the required pressure assembling force of various flat power semiconductor devices 4 and radiator thereof 6.Insulating element can insulate and transmits pressure assembling force flat power semiconductor device 4 and radiator 6 thereof, this insulating element can adopt the insulator of various standards, and the 3kV of choice criteria, 6kV, 10kV and 35kV insulator just can satisfy the insulating requirements of different electric pressures.
Operation principle: screw a plurality of puller bolts 21 on the hold down gag 2, itself and big platen 5 are compressed, big platen 5 transfers the pressure on the insulating element, makes it and is compacted on the housing 1, and the pressure on the puller bolt 21 has then passed on the platen 23 by the torsion distance; Regulate a plurality of puller bolts 21 then respectively and make that the plane of platen 23 is definitely vertical with the thrust direction of flat power semiconductor device 4 and radiator 6 elements thereof, and platen 23 and 22 placements of guide pillar with require pressure assembling force and the corresponding disk spring group 24 of decrement, the deflection of disk spring group 24 just can embody intuitively with the change in displacement of platen 23 and guide pillar 22, when guide pillar 22 ecks of design flush with platen 23, promptly reach the thrust of expectation.The thrust difference that different heat dissipation elements require realizes by disk spring group 24 and the adjustment decrement of using different size.
Embodiment 3: as shown in Figure 3, the method of the press-loading apparatus of flat power semiconductor device of the present invention and radiator thereof vertical installation in can taking embodiment 1 and embodiment 2, can also take horizontal installation, the installation site of each parts is substantially the same manner as Example 1 among this embodiment 3, just mounting means by vertical change into horizontal.
Claims (7)
1, the pressing method of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: flat power semiconductor device and radiator serial connection are packaged in the framework, between the good flat power semiconductor device of serial connection and radiator and framework, be provided with insulating element, flat power semiconductor device, radiator and insulating element are serially connected in the framework, produce the pressure assembling force identical by the hold down gag that links to each other with insulating element again each serial connection part is fixed with being connected in series direction.
2, the press-loading apparatus of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: it comprises housing (1), hold down gag (2) and insulating element, and hold down gag (1) and insulating element all are arranged in the housing (1) and are located between flat power semiconductor device (4) and radiator (6) and the housing (1).
3, the press-loading apparatus of flat power semiconductor device according to claim 2 and radiator thereof, it is characterized in that: described hold down gag (2) comprises puller bolt (21), guide pillar (22), platen (23) and disk spring group (24), guide pillar (22) and puller bolt (21) run through platen (23) and are arranged on the platen (23), and disk spring group (24) is arranged between guide pillar (22) and the platen (23).
4, according to the press-loading apparatus of claim 2 or 3 described flat power semiconductor devices and radiator thereof, it is characterized in that: described insulating element is two, wherein first insulating element (31) links to each other with hold down gag (2) and is located on the side of housing (1), and second insulating element (32) then is directly connected on housing (1) side with first insulating element (31) side, place symmetry.
5, the press-loading apparatus of flat power semiconductor device according to claim 4 and radiator thereof, it is characterized in that: described first insulating element (31) is located at hold down gag (2) and is connected in series between the good flat power semiconductor device (4) and radiator (6) thereof, and the puller bolt (21) of described hold down gag (2) directly links to each other with housing (1).
6, the press-loading apparatus of flat power semiconductor device according to claim 4 and radiator thereof, it is characterized in that: an end of described first insulating element (31) directly links to each other with housing (1), and the other end then links to each other with puller bolt (21) on the hold down gag (2) by a big platen (5).
7, according to the press-loading apparatus of any described flat power semiconductor device and radiator thereof in claim 2 or 3 or 5 or 6, it is characterized in that: described insulating element adopts insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100315002A CN100352043C (en) | 2005-04-30 | 2005-04-30 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100315002A CN100352043C (en) | 2005-04-30 | 2005-04-30 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1688023A true CN1688023A (en) | 2005-10-26 |
| CN100352043C CN100352043C (en) | 2007-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100315002A Active CN100352043C (en) | 2005-04-30 | 2005-04-30 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
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| CN (1) | CN100352043C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211905B (en) * | 2006-12-30 | 2010-04-14 | 许继集团有限公司 | Press-loading valve stack for large power all-controlled semiconductor device |
| CN102005394A (en) * | 2010-09-21 | 2011-04-06 | 中国电力科学研究院 | TCA draw bar type rigid fastening bearing press mounting device |
| CN103066065A (en) * | 2012-12-26 | 2013-04-24 | 天津电气传动设计研究所有限公司 | Vertically placing mechanical press fitting structure of power device clusters |
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177293A (en) * | 1992-12-04 | 1994-06-24 | Mitsubishi Electric Corp | Semiconductor stack |
| JPH10154789A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Semiconductor stack |
| JP4620910B2 (en) * | 2001-08-09 | 2011-01-26 | 東芝三菱電機産業システム株式会社 | Stack for flat semiconductor devices |
| CN2812295Y (en) * | 2005-04-22 | 2006-08-30 | 株洲变流技术国家工程研究中心 | Flat panel power semiconductor device and press-loading device for its radiator |
-
2005
- 2005-04-30 CN CNB2005100315002A patent/CN100352043C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211905B (en) * | 2006-12-30 | 2010-04-14 | 许继集团有限公司 | Press-loading valve stack for large power all-controlled semiconductor device |
| CN102005394A (en) * | 2010-09-21 | 2011-04-06 | 中国电力科学研究院 | TCA draw bar type rigid fastening bearing press mounting device |
| CN102005394B (en) * | 2010-09-21 | 2013-07-17 | 中国电力科学研究院 | TCA draw bar type rigid fastening bearing press mounting device |
| CN103066065A (en) * | 2012-12-26 | 2013-04-24 | 天津电气传动设计研究所有限公司 | Vertically placing mechanical press fitting structure of power device clusters |
| CN103066065B (en) * | 2012-12-26 | 2016-02-17 | 天津电气传动设计研究所有限公司 | A kind of power device series vertically places mechanical press mounting structure |
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100352043C (en) | 2007-11-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhuzhou Times Thermal Technologies Co.,Ltd. Assignor: State Engineering Research Centre of Zhuzhou Inversion Technology Contract fulfillment period: 2007.12.2 to 2013.12.1 contract change Contract record no.: 2009430000047 Denomination of invention: Flat panel power semiconductor device and press-loading device for its radiator Granted publication date: 20071128 License type: Exclusive license Record date: 2009.6.24 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.12.2 TO 2013.12.1; CHANGE OF CONTRACT Name of requester: ZHUZHOU SHIDAI COOLING TECHNOLOGY CO., LTD. Effective date: 20090624 |
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| EM01 | Change of recordation of patent licensing contract |
Change date: 20120702 Contract record no.: 2009430000047 Assignee after: Zhuzhou CSR Qihong Heat Dissipation Technology Co., Ltd. Assignee before: Zhuzhou Times Thermal Technologies Co.,Ltd. |