CN2812295Y - Flat panel power semiconductor device and press-loading device for its radiator - Google Patents
Flat panel power semiconductor device and press-loading device for its radiator Download PDFInfo
- Publication number
- CN2812295Y CN2812295Y CN 200520049847 CN200520049847U CN2812295Y CN 2812295 Y CN2812295 Y CN 2812295Y CN 200520049847 CN200520049847 CN 200520049847 CN 200520049847 U CN200520049847 U CN 200520049847U CN 2812295 Y CN2812295 Y CN 2812295Y
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- radiator
- power semiconductor
- semiconductor device
- insulating element
- housing
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Abstract
The utility model discloses a flat-plate power semiconductor device and a press-loading device for the radiator thereof, which comprises an outer frame, a pressing device and insulating components, wherein the pressing device and the insulating components are respectively arranged in the outer frame and are arranged between the flat-plate power semiconductor device and the radiator thereof and the outer frame. The pressing device comprises a puller bolt, a guide column, a pressing plate and a disc-shaped spring group; the guide column and the puller bolt penetrate through the pressing plate and are arranged o the pressing plate; the disc-shaped spring group is arranged between the guide column and the pressing disc. The quantity of the insulating components is two, wherein a first insulating component is connected with the pressing device and is arranged on one side surface of the outer frame; a second insulating component is directly connected to the side surface of the outer frame, and the side surface of the outer frame is symmetrical with the side surface where the first insulating component is arranged. The utility model has the advantage of strong versatility and is capable of being suitable for various flat-plate power devices and the radiators thereof, and simultaneously, the problem of an insulating structure of each voltage level can be better solved; the utility model is particularly suitable for the field of high-voltage variable current for high-voltage power semiconductor devices to connect in series.
Description
Technical field
The utility model is mainly concerned with the radiator field of flat power semiconductor device, refers in particular to the press-loading apparatus of a kind of flat power semiconductor device and radiator thereof.
Background technology
Development along with power electronic technology, power semiconductor is to more high voltage and Geng Gao current class development, the thing followed, promptly be that supporting with it radiator performance is had higher requirement, at this wherein, except the thermal resistance to radiator had higher requirement, also press-fit approach, press-loading apparatus and the insulation system thereof etc. to radiator had all proposed new, higher requirement.
In the prior art, for flat power semiconductor device, no matter be air-cooled radiator or water-filled radiator, traditional press-fit approach all is directly to produce thrust to power semiconductor two ends radiator by fastening tightening bolt, and the insulation at its two poles of the earth realizes by the insulating sleeve that is enclosed within on the tightening bolt.But, when in the high-voltage applications field, often require a plurality of heat radiation elements to be connected in series, like this, press-fit approach commonly used just is difficult to for air-cooled radiator realize that directly string is pressed; And for water-filled radiator, though can realize the direct string of a plurality of heat radiation elements presses, but press the increase of parts number along with direct string, the electric pressure at its series element two ends also can raise greatly, and the insulation system of this traditional press-fit approach, promptly insulating sleeve also is difficult to satisfy the insulating requirements that the direct string of a plurality of heat dissipation elements is pressed.
The utility model content
The technical problems to be solved in the utility model just is: at the technical problem of prior art existence, the utility model provides a kind of highly versatile, gone for various flat power devices and radiator thereof, can solve the flat power semiconductor device of each electric pressure insulation system problem and the press-loading apparatus of radiator thereof preferably simultaneously, is particularly useful for the high pressure unsteady flow field that the series connection of high-voltage power semiconductor device is used.
In order to solve the problems of the technologies described above, the solution that the utility model proposes is: the press-loading apparatus of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: it comprises housing, hold down gag and insulating element, and hold down gag and insulating element all are arranged in the housing and are located between flat power semiconductor device and radiator and the housing.
Described insulating element is two, and wherein first insulating element links to each other with hold down gag and is located on the side of housing, and second insulating element then is directly connected on the housing side with side, first insulating element place symmetry.
Described hold down gag comprises puller bolt, guide pillar, platen and disk spring group, and guide pillar and puller bolt run through platen and be arranged on the platen, and the disk spring group is arranged between guide pillar and the platen.
Described first insulating element is located between hold down gag and flat power semiconductor device and the radiator thereof, and the puller bolt of described hold down gag directly links to each other with housing.Perhaps, an end of described first insulating element directly links to each other with housing, and the other end then links to each other with puller bolt on the hold down gag by a big platen.
Described insulating element adopts insulator.
Compared with prior art, advantage of the present utility model is:
1, the press-loading apparatus of flat power semiconductor device of the present utility model and radiator thereof, adopt the frame-type encapsulating structure, parts and overall structure thereof are simple, dismounting simple and convenient, applied widely, applicable to multiple flat power semiconductor device, both can be used for vertical installation, also applicable to various installation methods such as horizontal installations;
2, the press-loading apparatus of flat power semiconductor device of the present utility model and radiator thereof, utilize housing to bear pressure, cooperate hold down gag, a plurality of flat power semiconductor devices and radiator thereof directly can be connected into one, realize the direct string pressure of a plurality of elements, and utilize the insulating element that is connected the housing two ends to make it can be good at satisfying the insulating requirements of high pressure.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of the utility model embodiment 2;
Fig. 3 is the structural representation of the utility model hold down gag;
Marginal data
1, housing 2, hold down gag
21, puller bolt 22, guide pillar
23, platen 24, disk spring group
31, first insulating element 32, second insulating element
4, flat power semiconductor device and radiator thereof
5, big platen
Embodiment
Below with reference to accompanying drawing utility model is described in further details.
Embodiment 1: as shown in Figure 1, the press-loading apparatus of flat power semiconductor device of the present utility model and radiator thereof, it mainly comprises housing 1, hold down gag 2 and insulating element, hold down gag 2 and insulating element all are arranged in the housing 1, and are located between flat power semiconductor device and radiator 4 and the housing 1.Wherein housing 1 is a carrier bar, part as the support frame of whole unit, housing 1 need bear that hold down gag 2 produced press-fits the required stress of flat power semiconductor device and radiator thereof 4, flat power semiconductor device and radiator 4 thereof for different size, its required pressure assembling force difference, the mechanical strength of housing 1 just need to do corresponding the adjustment.As shown in Figure 3, this hold down gag 2 comprises puller bolt 21, guide pillar 22, platen 23 and disk spring group 24, guide pillar 22 and puller bolt 21 run through platen 23 and are arranged on the platen 23, and guide pillar 22 is positioned at the central authorities of platen 23, then are provided with a plurality of puller bolts 21 around the platen 23; Disk spring group 24 is arranged between guide pillar 22 and the platen 23.In the present embodiment, described insulating element is two, and wherein first insulating element 31 links to each other with hold down gag 2 and is located on the side of housing 1, and second insulating element 32 then is directly connected on housing 1 side with first insulating element, 31 symmetries.Wherein, a plurality of puller bolts on the hold down gag 2 21 directly and housing 1 be fastenedly connected, the other end of hold down gag 2 links to each other with insulating element.Between first insulating element 31 and second insulating element 32, be folded with many group flat power semiconductor devices and radiators 4 thereof, realize that a plurality of many group flat power semiconductor devices and radiator 4 thereof well connect.The pressure that utilizes puller bolt 21 tops on the hold down gag 2 to be produced to the dish-shaped groups of springs 24 of housing 1 compression, obtain required pressure assembling force with this, and disk spring group 24 that can be by using different size and adjust decrement and just can obtain the required pressure assembling force of various flat power semiconductor devices and radiator thereof 4.Insulating element can insulate and transmits pressure assembling force flat power semiconductor device and radiator 4 thereof, this insulating element can adopt the insulator of various standards, and the 3kV of choice criteria, 6kV, 10kV and 35kV insulator just can satisfy the insulating requirements of different electric pressures.
Operation principle: screw a plurality of puller bolts 21 on the hold down gag 2, itself and housing 1 are compressed, the pressure on the puller bolt 21 has then passed on the platen 23 by the torsion distance; Regulate a plurality of puller bolts 21 then respectively and make that the plane of platen 23 is definitely vertical with the thrust direction of flat power semiconductor device and radiator 4 thereof, and platen 23 and 22 placements of guide pillar with require pressure assembling force and the corresponding disk spring group 24 of decrement, the deflection of disk spring group 24 can embody intuitively with the change in displacement of platen 23 and guide pillar 22, when guide pillar 22 ecks of design flush with platen 23, promptly reach the thrust of expectation.The thrust difference that different heat dissipation elements require realizes by disk spring group 24 and the adjustment decrement of using different size.
Embodiment 2: as shown in Figure 2, the press-loading apparatus of flat power semiconductor device of the present utility model and radiator thereof, it mainly comprises housing 1, hold down gag 2 and insulating element, hold down gag 2 and insulating element all are arranged in the housing 1, and are located between flat power semiconductor device and radiator 4 and the housing 1.Wherein housing 1 is a carrier bar, part as the support frame of whole unit, housing 1 need bear that hold down gag 2 produced press-fits the required stress of flat power semiconductor device and radiator thereof 4, flat power semiconductor device and radiator 4 thereof for different size, its required pressure assembling force difference, the mechanical strength of housing 1 just need to do corresponding the adjustment.As shown in Figure 3, this hold down gag 2 comprises puller bolt 21, guide pillar 22, platen 23 and disk spring group 24, guide pillar 22 and puller bolt 21 run through platen 23 and are arranged on the platen 23, guide pillar 22 is positioned at the central authorities of platen 23, then be provided with a plurality of puller bolts 21 around the platen 23, disk spring group 24 is arranged between guide pillar 22 and the platen 23.In the present embodiment, described insulating element is two, and wherein first insulating element 31 links to each other with hold down gag 2 and is located on the side of housing 1, and second insulating element 32 then is directly connected on housing 1 side with first insulating element, 31 symmetries.Wherein, one end of first insulating element 31 directly is connected with housing 1, the other end is connected with a big platen 5, puller bolt 21 on the hold down gag 2 is anchored on the big platen 5, this big platen 5 links to each other with hold down gag 2 by puller bolt 21, the tail end of hold down gag 2 directly with press-fit flat power semiconductor device and radiator 4 links to each other.Between first insulating element 31 and second insulating element 32, be folded with many group flat power semiconductor devices and radiators 4 thereof, realize that a plurality of many group flat power semiconductor devices and radiator 4 thereof well connect.Utilize the puller bolt 21 on the hold down gag 2 to push up to big platen 5, and be passed to the pressure of housing 1 by insulating element, compress dish-shaped groups of springs 24 and produce pressure and obtain required pressure assembling force with this, and disk spring group 24 that can be by using different size and adjust decrement and just can obtain the required pressure assembling force of various flat power semiconductor devices and radiator thereof 4.Insulating element can insulate and transmits pressure assembling force flat power semiconductor device and radiator 4 thereof, this insulating element can adopt the insulator of various standards, and the 3kV of choice criteria, 6kV, 10kV and 35kV insulator just can satisfy the insulating requirements of different electric pressures.
Operation principle: screw a plurality of puller bolts 21 on the hold down gag 2, itself and big platen 5 are compressed, big platen 5 transfers the pressure on the insulating element, makes it and is compacted on the housing 1, and the pressure on the puller bolt 21 has then passed on the platen 23 by the torsion distance; Regulate a plurality of puller bolts 21 then respectively and make that the plane of platen 23 is definitely vertical with the thrust direction of flat power semiconductor device and radiator 4 elements thereof, and platen 23 and 22 placements of guide pillar with require pressure assembling force and the corresponding disk spring group 24 of decrement, the deflection of disk spring group 24 just can embody intuitively with the change in displacement of platen 23 and guide pillar 22, when guide pillar 22 ecks of design flush with platen 23, promptly reach the thrust of expectation.The thrust difference that different heat dissipation elements require realizes by disk spring group 24 and the adjustment decrement of using different size.
Claims (6)
1, the press-loading apparatus of a kind of flat power semiconductor device and radiator thereof, it is characterized in that: it comprises housing (1), hold down gag (2) and insulating element, and hold down gag (2) and insulating element all are arranged in the housing (1) and are located between flat power semiconductor device and radiator (4) and the housing (1).
2, the press-loading apparatus of flat power semiconductor device according to claim 1 and radiator thereof, it is characterized in that: described hold down gag (2) comprises puller bolt (21), guide pillar (22), platen (23) and disk spring group (24), guide pillar (22) and puller bolt (21) run through platen (23) and are arranged on the platen (23), and disk spring group (24) is arranged between guide pillar (22) and the platen (23).
3, the press-loading apparatus of flat power semiconductor device according to claim 1 and 2 and radiator thereof, it is characterized in that: described insulating element is two, wherein first insulating element (31) links to each other with hold down gag (2) and is located on the side of housing (1), and second insulating element (32) then is directly connected on housing (1) side with first insulating element (31) side, place symmetry.
4, the press-loading apparatus of flat power semiconductor device according to claim 3 and radiator thereof, it is characterized in that: described first insulating element (31) is located between hold down gag (2) and flat power semiconductor device and the radiator (4) thereof, and the puller bolt (21) of described hold down gag (2) directly links to each other with housing (1).
5, the press-loading apparatus of flat power semiconductor device according to claim 3 and radiator thereof, it is characterized in that: an end of described first insulating element (31) directly links to each other with housing (1), and the other end then links to each other with puller bolt (21) on the hold down gag (2) by a big platen (23).
6, according to the press-loading apparatus of any described flat power semiconductor device and radiator thereof in claim 1 or 2 or 3 or 4, it is characterized in that: described insulating element adopts insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520049847 CN2812295Y (en) | 2005-04-22 | 2005-04-22 | Flat panel power semiconductor device and press-loading device for its radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520049847 CN2812295Y (en) | 2005-04-22 | 2005-04-22 | Flat panel power semiconductor device and press-loading device for its radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2812295Y true CN2812295Y (en) | 2006-08-30 |
Family
ID=36938684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520049847 Expired - Lifetime CN2812295Y (en) | 2005-04-22 | 2005-04-22 | Flat panel power semiconductor device and press-loading device for its radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2812295Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352043C (en) * | 2005-04-30 | 2007-11-28 | 株洲变流技术国家工程研究中心 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
-
2005
- 2005-04-22 CN CN 200520049847 patent/CN2812295Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352043C (en) * | 2005-04-30 | 2007-11-28 | 株洲变流技术国家工程研究中心 | Flat power semiconductor device, its radiator pressure mounting method and apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20071128 |
|
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20071128 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhuzhou Times Thermal Technologies Co.,Ltd. Assignor: State Engineering Research Centre of Zhuzhou Inversion Technology Contract fulfillment period: 2006.12.1 to 2012.11.30 Contract record no.: 2009430000048 Denomination of utility model: Flat panel power semiconductor device and press-loading device for its radiator Granted publication date: 20060830 License type: Exclusive license Record date: 20090624 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2006.12.1 TO 2012.11.30; CHANGE OF CONTRACT Name of requester: ZHUZHOU SHIDAI COOLING TECHNOLOGY CO., LTD. Effective date: 20090624 |