CN2648597Y - Plate type electronic power semiconductor device assembly - Google Patents
Plate type electronic power semiconductor device assembly Download PDFInfo
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- CN2648597Y CN2648597Y CN 03276679 CN03276679U CN2648597Y CN 2648597 Y CN2648597 Y CN 2648597Y CN 03276679 CN03276679 CN 03276679 CN 03276679 U CN03276679 U CN 03276679U CN 2648597 Y CN2648597 Y CN 2648597Y
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- semiconductor device
- radiator
- power electronics
- electric
- plate power
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Abstract
Utility model relates to an electric-power electron semiconductor device assembly of a flat plate type, which belongs to the field of the application technique of an electric-power electron semiconducThe utility model relates to a component for a flat plate power and electric semiconductor device, pertaining to the application technology of the power and electric semiconductor device. The componentor device, and the assembly comprises a screw rod, nuts, electric-power electron semiconductor devices of a flat plate type, heat radiators, insulating pads, pressing blocks, pressing frames and prest comprises a screw, a nut, a plate power and electric semiconductor device, a radiator, an insulating gasket, a press piece, a hold-down stand and a housing pin. The screw is in series connected withsing screws, wherein the two pressing frames are connected in series by the screw rod, the heat radiators are arranged between the two pressing frames, and the electric-power electron semiconductor de the two hold-down stands, the radiator is positioned between the two hold-down stands, the plate power and electric semiconductor device is positioned between every two radiators, and the insulating vices of a flat plate type are arranged between every two heat radiators. The insulating pads are arranged between the heat radiators and the pressing frames, wherein the pressing blocks are arranged gasket is positioned between the radiator and the hold-down stand. One press piece is positioned between one end of the insulating gasket and the hold-down press, and the housing pin is tightly pressebetween the insulating pads at one end and the pressing frames, and the pressing screws are pressed on the pressing blocks through the pressing frames. A disk-shaped spring group is arranged between td on the press piece through the hold-down stand. A belleville spring group is positioned between the hold-down stand at the other end of the hold-down stand that corresponds to the press piece. A sprhe insulating pads and the pressing frames which are arranged at the other end and are corresponding to the pressing blocks, and spring pins pass through the disk-shaped spring group and extend out thing cotter runs through the belleville spring group and stretches out the hold-down stand. The adoption of the belleville spring group leads the plate power and electric semiconductor device and the re pressing blocks. The stable voltage according with the work requirements is arranged between the electric-power electronic semi-conductor devices of a flat plate type and the heat radiators by adoptadiator to have the pressure that is stable and meet the working requirement, thereby prolonging the service life of the plate power and electric semiconductor device. ing the disk-shaped spring group, and the service life of the electric-power electronic semi-conductor devices of a flat plate type is prolonged.
Description
Technical field:
The utility model relates to a kind of plate power electronics semiconductor device assembly, belongs to the power electronics semiconductor device application technology, is particularly suitable for using in unsteady flow power device and reactive power compensator in the heavy-duty motor frequency control.
Background technology:
Plate power electronics semiconductor device is meant that shell is plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors power electronics semiconductor device such as (triode thyristors).
In the prior art, plate power electronics semiconductor device assembly is divided into air-cooled cooling and water-cooled is cooled off two kinds.Among the Chinese patent ZL00234403.3 " a kind of thyristor unsteady flow power device that adopts air-cooled cooling ", disclose a kind of thyristor power component assembly, the thyristor of employing is plate shell.The screw rod that is with insulating case on it is connected in series radiator mutually with the briquetting that is positioned at the radiator two ends, and thyristor is installed between the radiator in twos, between radiator and the briquetting insulation cushion is installed.Thyristor power component assembly is installed in this device cabinet in the air channel, offers air inlet on the cabinet, and the blower fan that is installed in the cabinet top communicates on the air channel in wind collecting unit and cabinet.During work, the heat that thyristor produces reaches radiator, and the high wind that is produced by blower fan is taken away the heat on the radiator again, so that thyristor remains on the normal working temperature below 100 ℃.
For some high-power electric and electronic semiconductor apparatus assembly, job requirement can not be satisfied the time, need to adopt the water-cooled cooling when air-cooled.The plate power electronics semiconductor device assembly of water-cooled, its modular construction and air-cooled power electronics semiconductor device assembly are basic identical, just replace air-cooled radiator with water-filled radiator.Plate power electronics semiconductor device assembly is installed in the cabinet, cooling water recirculation system is responsible for by plumbing recirculated cooling water is introduced in the cabinet, link to each other with the distributive pipe that is positioned at plate power electronics semiconductor device assembly both sides respectively, distributive pipe links to each other with the intake-outlet of each radiator through each arm.The plate power electronics semiconductor device assembly of water-cooled intensity of cooling is big, is specially adapted to the above heavy-duty motor frequency control of voltage 3Kv-10Kv, power 500kVA with using in unsteady flow power device and the reactive power compensator.
No matter plate power electronics semiconductor device assembly is to adopt air-cooled cooling or water-cooled cooling, and the heat-transfer effect between plate power electronics semiconductor device and the radiator directly influences its useful life.Keep better heat radiating effect, must keep pressure stable between plate power electronics semiconductor device and the radiator.Existing plate power electronics semiconductor device assembly in use can change the pressure between plate power electronics semiconductor device and the radiator because of the distortion of individual part.In addition, during assembling, pressure between plate power electronics semiconductor device and the radiator is realized by tighten housing pin with torque-indicating wrencg, because the accuracy of manufacture difference of housing pin, the frictional force difference that screw produces in the process of tightening through screwed hole, cause the dynamometry error of torque-indicating wrencg, make that pressure and the job requirement between plate power electronics semiconductor device and the radiator is not inconsistent, influence radiating effect.If will make the pressure between plate power electronics semiconductor device and the radiator meet job requirement, will in plate power electronics semiconductor device assembly, increase device for measuring force, make complex structure, manufacturing cost rises.
Summary of the invention:
The purpose of this utility model provides a kind of plate power electronics semiconductor device assembly, can make between plate power electronics semiconductor device and the radiator and have the pressure stable that conforms to its job requirement, improving the useful life of plate power electronics semiconductor device and even whole assembly, and simple and reliable for structure.
The purpose of this utility model realizes by following technical solution.
A kind of plate power electronics semiconductor device assembly, comprise screw rod, nut, plate power electronics semiconductor device, radiator, insulation cushion, briquetting, clamping frame and housing pin, screw rod is contacted two clamping frames, between two clamping frames radiator is installed, plate power electronics semiconductor device is installed between the radiator in twos, between radiator and the clamping frame insulation cushion is installed, one briquetting is wherein arranged between the insulation cushion of an end and the clamping frame, and housing pin is pressed on the briquetting through clamping frame.One dish-shaped groups of springs is arranged between the clamping frame of the other end relative with briquetting and the insulation cushion, and spring catch passes the disk spring group and stretches out clamping frame.
Be processed with screw thread on the described spring catch, the position-arresting disk with internal thread is installed on the spring catch, and by holding screw locking, the locating pad that the surface is parallel to position-arresting disk is installed in the outside of clamping frame.
Described radiator can be a water-filled radiator, also can be air-cooled radiator.
Described plate power electronics semiconductor device is that shell is any one in the power electronics semiconductor device such as plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors.
The advantage that the present invention is compared with prior art had is:
The employing of disk spring group simple in structure, can be when Installation and Debugging, guarantee that plate power electronics semiconductor device conforms to job requirement with pressure between the radiator, in use play the pressure compensation effect again during part deformation, guarantee to have pressure stable between plate power electronics semiconductor device and the radiator, avoided changing the thermal resistance that increases between plate power electronics semiconductor device and the radiator because of pressure, and cause plate power electronics semiconductor device to be damaged, thereby the useful life of improving plate power electronics semiconductor device and even whole assembly.Particularly being used of position-arresting disk and locating pad played the effect of nominal pressure more exactly, and the functional reliability height.
Description of drawings:
Fig. 1 is the structural representation of the plate power electronics semiconductor device assembly of the utility model.
Fig. 2 is the right view of Fig. 1.
Embodiment:
Below in conjunction with accompanying drawing embodiment of the present utility model is described in detail.
The plate power electronics semiconductor device assembly of the utility model mainly is made up of housing pin 1, nut 2, screw rod 3, clamping frame 4,9, briquetting 5, insulation cushion 6,16, radiator 7, plate power electronics semiconductor device 8, spring base 10, holding screw 11, spring catch 12, position-arresting disk 13, disk spring group 14 and locating pad 15 as shown in Figure 1 and Figure 2.Screw rod 3 is equipped with radiator 7 with two clamping frames, 4,9 polyphones between two clamping frames 4,9, and plate power electronics semiconductor device 8 is installed between the radiator 7 in twos, and insulation cushion 6,16 is installed between radiator 7 and the clamping frame 4,9.One briquetting 5 is arranged between insulation cushion 6 and the clamping frame 4, and housing pin 1 is pressed on the briquetting 5 through clamping frame 4.There is a spring base 10 clamping frame 9 inboards, and a dish-shaped groups of springs 14 is installed on the spring base 10, and spring catch 12 passes disk spring group 14 and stretches out clamping frame 9, and disk spring group 14 is pressed on the insulation cushion 16.Be processed with screw thread on the spring catch 12, the position-arresting disk 13 with internal thread is installed on the spring catch 12, and by holding screw 11 locking, the locating pad 15 that the surface is parallel to position-arresting disk 13 is installed in the outside of clamping frame 9.
When the plate power electronics semiconductor device assembly of the utility model is installed, earlier locating pad 15 is installed in clamping frame 9 outsides, disk spring group 14 is sleeved on the spring catch 12, be contained in the spring base 10 of clamping frame 9, position-arresting disk 13 is spun on the spring catch 12.Then, press disk spring group 14 to the operating pressure that requires with forcing press, because groups of springs 14 pressurizeds, spring catch 12 moves a certain distance to clamping frame 9 outsides.Position-arresting disk 13 is threaded to its surface and parallel position, locating pad 15 surfaces, by holding screw 11 lockings.After the unloading, because of the effect of spring force, spring catch 12 moves inward, and position-arresting disk 13 is pressed on the surface of clamping frame 9.At last whole plate power electronics semiconductor device assembly is installed, tighten housing pin 1, disk spring group 14 is compressed, spring catch 12 outwards moves, parallel until position-arresting disk 13 surfaces with locating pad 15 surfaces, at this moment, meet the requirements of operating pressure between plate power electronics semiconductor device 8 and the radiator 7.As long as position-arresting disk reaches the position parallel with locating pad, just to have finished simultaneously and installed and demarcate, Installation and Debugging are convenient, the reliability height.
During work, plate power electronics semiconductor device assembly is installed in the cabinet, constitutes heavy-duty motor frequency control unsteady flow power device or reactive power compensator.The employing of disk spring group, make to have between plate power electronics semiconductor device and the radiator and meet its job requirement and pressure stable, can not increase thermal resistance because of the variation of pressure and cause plate power electronics semiconductor device to be damaged, thus the useful life of having improved plate power electronics semiconductor device.
In the present embodiment, plate power electronics semiconductor device can be that shell is any one in plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors etc.The radiator that is adopted both can be an air-cooled radiator, also can be water-filled radiator.
Claims (4)
1. plate power electronics semiconductor device assembly, comprise screw rod, nut, plate power electronics semiconductor device, radiator, insulation cushion, briquetting, clamping frame and housing pin, screw rod is contacted two clamping frames, between two clamping frames radiator is installed, plate power electronics semiconductor device is installed between the radiator in twos, between radiator and the clamping frame insulation cushion is installed, one briquetting is wherein arranged between the insulation cushion of an end and the clamping frame, housing pin is pressed on the briquetting through clamping frame, it is characterized in that: between the clamping frame (9) of the described other end relative with briquetting (5) and the insulation cushion (16) a dish-shaped groups of springs (14) is arranged, spring catch (12) passes disk spring group (14) and stretches out clamping frame (9).
2. plate power electronics semiconductor device assembly according to claim 1, it is characterized in that: described spring catch is processed with screw thread on (12), position-arresting disk (13) with internal thread is installed on the spring catch (12), by holding screw (11) locking, the locating pad (15) that the surface is parallel to position-arresting disk (13) is installed in the outside of clamping frame (9).
3. plate power electronics semiconductor device assembly according to claim 1 is characterized in that: described radiator (7) can be a water-filled radiator, also can be air-cooled radiator.
4. the plate power electronics semiconductor device assembly of water-cooled according to claim 1 is characterized in that: described plate power electronics semiconductor device (8) is that shell is any one in the power electronics semiconductor device such as plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03276679 CN2648597Y (en) | 2003-08-22 | 2003-08-22 | Plate type electronic power semiconductor device assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03276679 CN2648597Y (en) | 2003-08-22 | 2003-08-22 | Plate type electronic power semiconductor device assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2648597Y true CN2648597Y (en) | 2004-10-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03276679 Expired - Fee Related CN2648597Y (en) | 2003-08-22 | 2003-08-22 | Plate type electronic power semiconductor device assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2648597Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334717C (en) * | 2005-05-14 | 2007-08-29 | 河北华整实业有限公司 | Power electronic power device module |
| CN101026953B (en) * | 2007-03-29 | 2010-07-28 | 杭州华三通信技术有限公司 | Pressure mounting device and pressure mounting method |
| CN103456700A (en) * | 2013-04-27 | 2013-12-18 | 昆山良昕环保节能有限公司 | Quick-change cooling and fixing device for thyristors |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN108809119A (en) * | 2018-08-23 | 2018-11-13 | 上海旭禾汽车电子科技有限公司 | A kind of three level large capacity water cooling unsteady flow device assemblies based on compression joint type IEGT |
| CN111128923A (en) * | 2019-11-26 | 2020-05-08 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
-
2003
- 2003-08-22 CN CN 03276679 patent/CN2648597Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334717C (en) * | 2005-05-14 | 2007-08-29 | 河北华整实业有限公司 | Power electronic power device module |
| CN101026953B (en) * | 2007-03-29 | 2010-07-28 | 杭州华三通信技术有限公司 | Pressure mounting device and pressure mounting method |
| CN103456700A (en) * | 2013-04-27 | 2013-12-18 | 昆山良昕环保节能有限公司 | Quick-change cooling and fixing device for thyristors |
| CN103456700B (en) * | 2013-04-27 | 2016-04-06 | 昆山良昕环保节能有限公司 | A kind of thyristor quick change cooling fixture |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN108809119A (en) * | 2018-08-23 | 2018-11-13 | 上海旭禾汽车电子科技有限公司 | A kind of three level large capacity water cooling unsteady flow device assemblies based on compression joint type IEGT |
| CN111128923A (en) * | 2019-11-26 | 2020-05-08 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
| CN111128923B (en) * | 2019-11-26 | 2021-04-30 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041013 Termination date: 20120822 |