CN2617036Y - Heat-tube radiator for high-power electric-power semiconductor device - Google Patents
Heat-tube radiator for high-power electric-power semiconductor device Download PDFInfo
- Publication number
- CN2617036Y CN2617036Y CN 03212415 CN03212415U CN2617036Y CN 2617036 Y CN2617036 Y CN 2617036Y CN 03212415 CN03212415 CN 03212415 CN 03212415 U CN03212415 U CN 03212415U CN 2617036 Y CN2617036 Y CN 2617036Y
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- heat
- heat pipe
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Abstract
The utility model relates to the technical field of the heat dissipation of the high power electronic semiconductor, the heat pipe radiator used in the high power electronic semiconductor. The utility model is characterized in that the front end of the substrate is fixedly connected with the conductive bars by screws, with the heat pipe inserted in; the heat pipe is provided with a radiating bar, the insulated plate is arranged between the two heat pipes, the substrate is connected and fixed by screws and hot-end stent, the cone end of the cooling section of the heat pipe is inserted in the cone cavity comprising a cooling end stent and a stent cover, screw down the cooling end stent and the stent cover to press tightly the heat pipe, the power electronic semiconductor is positioned in between the two heat dissipation substrates of the heat pipes, and using the fastener to press tightly and through the pressure plate to connect together as a whole. The utility model has the advantages of no noise, no wear, and no pollution, belonging to the green environmental protection type product. In the service life the utility model has no accidental mechanical damage, and is without maintenance, belonging to maintenance-free products, therefore providing consumers great convenience, reliable performance and safe operation.
Description
Technical field
The utility model relates to high-power electric semiconductor device heat dissipation technology field, especially a kind of high-power electric semiconductor device heat-pipe radiator.
Background technology
The radiating mode of the various power electronic equipment components and parts of domestic production at present generally is divided into two kinds, promptly forced air-cooled heat radiation and water-cooled heat radiation, and all there is very big shortcoming in these two kinds of heat dissipating methods.
Compressed air cooler is a kind of heat dissipating method that comparatively generally adopts at present, element is installed on the entity radiator, cool off with the blower fan forced air supply, this cooling means must dispose a cover blower fan cabinet, comprises cabinet, air channel, motor, not only increase equipment cost, and the blower fan that is in operation sends very big noise, and the people can't be born, and in a single day blower fan breaks down simultaneously, equipment have to be out of service, otherwise equipment will damage.
The water-cooled heat radiation is to adopt water-filled radiator to dispel the heat to components and parts in the circuit, this kind radiating mode need dispose auxiliary facilities such as cover water treatment facilities and a cooling water pipeline, water pump, apparatus expensive not only, and take up an area of huge, need the special messenger to safeguard, and in equipment running process, galvano-cautery and condensation phenomenon very easily take place in cooling system, the cooling water run, drip, leak take place, not only make cooling water loss and the as easy as rolling off a log circuit that soaks, to make equipment badly damaged, the equipment operation reliability is low.
So above-mentioned two kinds of heat dissipating methods are all undesirable, especially device for high-power power electronic not only had serious defective, and as easy as rolling off a log damage equipment, so make equipment dependability relatively poor.
The utility model content
The purpose of this utility model is the defective that overcomes prior art, and a kind of good heat dissipation effect of conducting heat, simple in structure, high-power electric semiconductor device heat-pipe radiator that reliability is high are provided.
The utility model high-power electric semiconductor device is described below with the structure content of heat-pipe radiator:
A kind of high-power electric semiconductor device heat-pipe radiator, it is characterized in that: form by two heat-pipe radiators and annex thereof, the substrate front end is fixedly connected with busbar with bolt, heat pipe inserts in the substrate, fin is installed on the heat pipe, shading ring is arranged between fin, between two heat pipes, be provided with insulation board, insulation board on substrate, is with dead ring in insulation screw outside with the insulation screw; Substrate is connected and fixed with screw and hot junction support, the end cone of the cooling section of heat pipe is inserted in the circular cone cavity of cold junction support and bracket cover composition, with screw cold junction support and bracket cover are tightened and to be compressed heat pipe, the cold junction support is fixed on the carrier base by screw, nut.
Power semiconductor device (thyristor) is installed between two heat pipe radiator base plates, and the securing member of forming with nut, bolt, butterfly spring, insulating sleeve compresses and connects as a wholely by pressing plate, insulate by cross-over block between pressing plate and the substrate.
The beneficial effects of the utility model are: the utility model can solve the heat dissipation problem of high-power electric semiconductor device reliably, owing to be silent oscillation mechanical structure, no relative motion part does not have noise, not wearing and tearing, does not pollute, and belongs to the environmental type product.Zero accident mechanical damage in life period can not damaged, and need not safeguard, belongs to non-maintaining product, therefore brings great convenience dependable performance, security of operation to the user.
Description of drawings
Fig. 1 is the structural front view of high-power electric semiconductor device with heat-pipe radiator.
Fig. 2 is the structure vertical view of high-power electric semiconductor device with heat-pipe radiator.
Embodiment
See Fig. 2, a kind of high-power electric semiconductor device heat-pipe radiator, form by two heat-pipe radiators and annex thereof, substrate 6 front ends are fixedly connected with busbar 2 with bolt 7, and heat pipe 15 inserts in the substrate 6, and fin 16 is installed on the heat pipe 15, shading ring 24 is arranged between fin 16, be provided with insulation board 18 between two heat pipes 15, insulation board 18 usefulness insulation screw 14 is fixed on the substrate 6, is with dead ring 13 in insulation screw 14 outsides; Substrate 6 usefulness screws 11 are connected and fixed with hot junction support 12, the end cone of the cooling section of heat pipe 15 is inserted in the circular cone cavity of cold junction support 21 and bracket cover 22 compositions, with screw 20 cold junction support 21 and bracket cover 22 are tightened and to be compressed heat pipe 15, cold junction support 21 is fixed on the carrier base 19 by screw 17 (Fig. 1), nut 23.
Power semiconductor device (thyristor) 5 is installed between two heat pipe radiator base plates 6, the securing member of forming with nut 9, bolt 4, butterfly spring 8, insulating sleeve 1 compress the back connect by pressing plate 10 (Fig. 1) as a whole, between pressing plate 10 and the substrate 6 by cross-over block 3 insulation.
Substrate 6 is radiator parts of heat pipe heating end, be generally the plate-shape metal entity, one side is a table top for smooth flat, and power semiconductor device (thyristor) is installed, and there is the through hole that heat pipe is installed the centre, adopt the heat expansion method to assemble with heat pipe, substrate 6 heating back heat pipes 15 are penetrated in the substrate through-hole, and after the cooling, substrate and heat pipe become an integral body, keep certain magnitude of interference, to reduce the two contact heat resistance.Fin 16 is the radiator parts that connect the heat pipe cooling section, is generally sheet metal, mainly is environment heat radiation towards periphery.Shading ring 24 guarantees the spacing of fin, and can play the stable Desing of Interference Joint of protection fin and heat pipe, and for reducing the contact heat resistance of fin 16 and heat pipe 15 tube walls, fin 16, shading ring 24 are interference fit joint with the shell outer surface.In order to guarantee area of dissipation, to reduce volume, the fin outer edge portion can be suppressed the wrinkle groove.
Substrate and heat pipe also can adopt the cold-extruded platen press to assemble, and heat pipe is put into substrate aperture push substrate, and the hole is dwindled, and substrate becomes really up to the mark the cooperation with heat pipe.Can also adopt pouring procedure,, make substrate become as a whole with heat pipe at heat pipe heating section cast aluminum alloy.
Claims (1)
1. high-power electric semiconductor device heat-pipe radiator, it is characterized in that: form by two heat-pipe radiators and annex thereof, the substrate front end is fixedly connected with busbar with bolt, in the heat pipe insertion substrate, fin is installed on the heat pipe, shading ring is arranged between fin, between two heat pipes, be provided with insulation board, insulation board on substrate, is with dead ring in insulation screw outside with the insulation screw; Substrate is connected and fixed with screw and hot junction support, the end cone of the cooling section of heat pipe is inserted in the circular cone cavity of cold junction support and bracket cover composition, with screw cold junction support and bracket cover are tightened and to be compressed heat pipe, the cold junction support is fixed on the carrier base by screw, nut;
Power semiconductor device is installed between two heat pipe radiator base plates, and the securing member of forming with nut, bolt, butterfly spring, insulating sleeve compresses and connects as a wholely by pressing plate, insulate by cross-over block between pressing plate and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03212415 CN2617036Y (en) | 2003-04-03 | 2003-04-03 | Heat-tube radiator for high-power electric-power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03212415 CN2617036Y (en) | 2003-04-03 | 2003-04-03 | Heat-tube radiator for high-power electric-power semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2617036Y true CN2617036Y (en) | 2004-05-19 |
Family
ID=34241859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03212415 Expired - Fee Related CN2617036Y (en) | 2003-04-03 | 2003-04-03 | Heat-tube radiator for high-power electric-power semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2617036Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334717C (en) * | 2005-05-14 | 2007-08-29 | 河北华整实业有限公司 | Power electronic power device module |
| CN104036069A (en) * | 2014-05-16 | 2014-09-10 | 国电南瑞吉电新能源（南京）有限公司 | Method for obtaining heat resistance of forced air cooling heat dissipation device for power semiconductor device |
| CN106102403A (en) * | 2016-07-25 | 2016-11-09 | 东泽节能技术（苏州）有限公司 | A kind of busbar group and the mounting assembly of power semiconductor |
-
2003
- 2003-04-03 CN CN 03212415 patent/CN2617036Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334717C (en) * | 2005-05-14 | 2007-08-29 | 河北华整实业有限公司 | Power electronic power device module |
| CN104036069A (en) * | 2014-05-16 | 2014-09-10 | 国电南瑞吉电新能源（南京）有限公司 | Method for obtaining heat resistance of forced air cooling heat dissipation device for power semiconductor device |
| CN106102403A (en) * | 2016-07-25 | 2016-11-09 | 东泽节能技术（苏州）有限公司 | A kind of busbar group and the mounting assembly of power semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040519 |