CN221240539U

CN221240539U - Heat dissipation type microelectronic assembly

Info

Publication number: CN221240539U
Application number: CN202322733822.8U
Authority: CN
Inventors: 边武斌; 刘宝春; 边武晶
Original assignee: Shenzhen Meilianhui Technology Co ltd
Current assignee: Shenzhen Meilianhui Technology Co ltd
Priority date: 2023-10-12
Filing date: 2023-10-12
Publication date: 2024-06-28
Anticipated expiration: 2033-10-12

Abstract

The utility model discloses a heat dissipation type microelectronic assembly, which relates to the field of electronic assemblies, and comprises a main board and a plurality of MOS (metal oxide semiconductor) tubes arranged on the surface of the main board, wherein the MOS tubes are arranged in parallel in a transverse straight line, and the same heat dissipation strip is arranged outside the MOS tubes; the lateral wall of heat dissipation strip has seted up the draw-in groove that sets up with a plurality of MOS pipe joint, and fixed connection between the both ends of heat dissipation strip and the surface of mainboard. The utility model has the advantages that the heat dissipation structure wrapping the MOS tube is adopted, the heat dissipation efficiency of the MOS tube is improved, and the service life of the microelectronic assembly is prolonged.

Description

Heat dissipation type microelectronic assembly

Technical Field

The utility model relates to the field of electronic components, in particular to a heat dissipation type microelectronic component.

Background

PCBA is commonly referred to as a circuit board assembly, or in the past, a microelectronic assembly that carries a plurality of electronic components.

The electronic components on the existing microelectronic assembly inevitably generate heat during operation, wherein the heating value of the MOS tube is a main component of the heat. For example, patent No. CN218103648U discloses a microelectronic assembly with heat dissipation function, which includes a heat dissipation plate and an insulating spacer clamped between the MOS tube and the heat dissipation plate, where the heat dissipation plate is detachably connected with the insulating spacer.

In this scheme utilize heating panel and insulating pad to carry out the heat dissipation operation to the MOS pipe, but the heat dissipation plate of single structure is relatively poor to the parcel nature of MOS pipe, leads to the unable quick effluvium of heat on MOS pipe surface to influence the life of MOS pipe. For this purpose, a heat-dissipating microelectronic assembly is proposed.

Disclosure of utility model

The present utility model has been made in view of the above-mentioned problems with the conventional heat dissipation type microelectronic assemblies.

Therefore, an objective of the present utility model is to provide a heat dissipation type microelectronic assembly, which solves the problems set forth in the background art.

In order to achieve the above object, the present utility model provides the following technical solutions:

The heat dissipation type microelectronic assembly comprises a main board and a plurality of MOS (metal oxide semiconductor) tubes arranged on the surface of the main board, wherein the MOS tubes are arranged side by side in a transverse straight line, and the same heat dissipation strip is arranged outside the MOS tubes; the lateral wall of heat dissipation strip has seted up the draw-in groove that sets up with a plurality of MOS pipe joint, and fixed connection between the both ends of heat dissipation strip and the surface of mainboard.

Preferably, the both ends of heat dissipation strip all are fixed and are equipped with the installation piece, and be equipped with the fixing bolt who is connected with the mainboard on the installation piece.

Preferably, threaded holes are formed in two sides of the surface of the main board, and the end portions of the fixing bolts are in threaded connection with the threaded holes.

Preferably, a plurality of evenly distributed heat dissipation strip openings are formed in one side, far away from the MOS tube, of the heat dissipation strip, a plurality of evenly distributed heat dissipation holes are formed in the side wall of the heat dissipation strip, and the heat dissipation holes are communicated with the heat dissipation strip openings.

Further, a heat dissipation silica gel pad is arranged between the inside of the clamping groove and the MOS tube.

Preferably, the heat dissipation strip adopts aluminum alloy strip.

In the technical scheme, the utility model has the technical effects and advantages that:

1. According to the utility model, the heat dissipation strips are arranged, and the clamping grooves on the heat dissipation strips can wrap and clamp the outer side wall of the MOS tube, so that the temperature on the surface of the MOS tube is rapidly led out, and the heat dissipation efficiency of the MOS tube is improved.

2. According to the utility model, after the plurality of MOS pipes are clamped by the heat dissipation strip through the mounting blocks and the fixing bolts, the mounting blocks and the main board can be fixed through the matching of the fixing bolts and the threaded holes, so that the heat dissipation strip can be stably mounted.

3. According to the utility model, through the heat radiation strip openings and the heat radiation holes arranged on the heat radiation strips, the contact area between the heat radiation strips and air can be increased, and the heat conduction efficiency of the heat radiation strips to the MOS tube is accelerated.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG.1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the heat dissipating strip of FIG. 1 according to the present utility model;

Fig. 3 is a schematic structural diagram of the motherboard in fig. 1 according to the present utility model.

Reference numerals illustrate:

1. A main board; 2. a MOS tube; 3. a heat dissipation strip; 4. a clamping groove; 5. a mounting block; 6. a fixing bolt; 7. a threaded hole; 8. a heat dissipation strip-shaped opening; 9. a heat radiation hole; 10. and the heat dissipation silica gel pad.

Detailed Description

In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.

The embodiment of the utility model discloses a heat dissipation type microelectronic assembly.

The utility model provides a heat dissipation type microelectronic assembly as shown in fig. 1-2, which comprises a main board 1 and a plurality of MOS tubes 2 arranged on the surface of the main board 1, wherein the MOS tubes 2 are arranged side by side in a transverse straight line, the same heat dissipation strip 3 is arranged outside the MOS tubes 2, the heat dissipation strip 3 is an aluminum alloy strip, and the aluminum alloy material has good heat conduction performance, is easy to process and form and has light weight; the draw-in groove 4 that sets up with 2 joint of a plurality of MOS pipes is offered to the lateral wall of radiating strip 3, and fixed connection between the both ends of radiating strip 3 and the surface of mainboard 1, and radiating strip 3 can block the lateral wall parcel of MOS pipe 2 for the temperature on MOS pipe 2 surface is derived fast, has improved the radiating efficiency to MOS pipe 2.

In order to stably mount the heat dissipation strip 3, as shown in fig. 1-3, both ends of the heat dissipation strip 3 are fixedly provided with mounting blocks 5, the mounting blocks 5 are provided with fixing bolts 6 connected with the main board 1, both sides of the surface of the main board 1 are provided with threaded holes 7, the end parts of the fixing bolts 6 are in threaded connection with the threaded holes 7, and the fixing bolts 6 are inserted into the mounting blocks 5 and rotated, so that the fixing bolts 6 are screwed into the threaded holes 7, and the positions of the heat dissipation strip 3 are fixed.

In order to improve the heat dissipation effect of the heat dissipation strip 3 on the MOS tube 2, as shown in fig. 1-2, a plurality of heat dissipation strip openings 8 are uniformly distributed on one side of the heat dissipation strip 3 away from the MOS tube 2, a plurality of heat dissipation holes 9 are uniformly distributed on the side wall of the heat dissipation strip 3, and the heat dissipation holes 9 are communicated with the heat dissipation strip openings 8.

Finally, in order to accelerate the heat transfer efficiency to the MOS tube 2, as shown in fig. 2, a heat dissipation silica gel pad 10 is disposed between the inside of the clamping groove 4 and the MOS tube 2, and the heat dissipation silica gel pad 10 can rapidly transfer the temperature of the surface of the MOS tube 2 to the surface of the heat dissipation strip 3.

While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims

1. The utility model provides a heat dissipation type microelectronic assembly, includes mainboard (1) and sets up in a plurality of MOS pipes (2) on mainboard (1) surface, its characterized in that: the MOS tubes (2) are arranged side by side in a transverse straight line, and the same radiating strip (3) is arranged outside the MOS tubes (2);

The side wall of the heat dissipation strip (3) is provided with a clamping groove (4) which is clamped with the MOS tubes (2), and two ends of the heat dissipation strip (3) are fixedly connected with the surface of the main board (1).

2. The heat dissipation type microelectronic assembly according to claim 1, wherein: the two ends of the radiating strip (3) are fixedly provided with mounting blocks (5), and the mounting blocks (5) are provided with fixing bolts (6) connected with the main board (1).

3. The heat dissipating microelectronic assembly of claim 2, wherein: screw holes (7) are formed in two sides of the surface of the main board (1), and the end portions of the fixing bolts (6) are in threaded connection with the screw holes (7).

4. The heat dissipation type microelectronic assembly according to claim 1, wherein: a plurality of evenly distributed heat dissipation strip-shaped openings (8) are formed in one side, far away from the MOS tube (2), of the heat dissipation strip (3), a plurality of evenly distributed heat dissipation holes (9) are formed in the side wall of the heat dissipation strip (3), and the heat dissipation holes (9) are communicated with the heat dissipation strip-shaped openings (8).

5. The heat dissipation type microelectronic assembly according to claim 1, wherein: a heat dissipation silica gel pad (10) is arranged between the inside of the clamping groove (4) and the MOS tube (2).

6. The heat dissipation type microelectronic assembly according to claim 1, wherein: the heat dissipation strip (3) is an aluminum alloy strip.