CN219248426U - High-efficient heat transfer's circuit board heat radiation structure - Google Patents

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board heat dissipation structure capable of efficiently transferring heat, which comprises a heat dissipation shell 1, wherein a circuit board 3 is welded on the bottom surface of an inner cavity of the heat dissipation shell; a plurality of cooling fans 6 are uniformly arranged on the left side surface of the cooling shell 1, a U-shaped through groove 4,U is formed in the top surface of the cooling shell 1, and a heat conduction copper pipe 5 is welded and embedded in the through groove 4, so that the problems that the existing circuit board cooling device is low in cooling speed and easy to cause local overhigh temperature of a circuit board are solved.

Description

A circuit board heat dissipation structure with high heat transfer

technical field

The utility model belongs to the technical field of circuit boards, and in particular relates to a circuit board cooling structure with high heat transfer efficiency.

Background technique

As the electronic components on the circuit board generate more and more heat when used, if the heat dissipation of the circuit board is not handled well, it will affect the use effect of the components installed on the circuit board, and it is easy to cause the temperature of the circuit board to be too high and affect the circuit. board life or cause damage to the board. The existing heat dissipation structure of the circuit board conducts the heat from the heating chip to the surface of the heat dissipation structure and takes away the heat through the fan, but the fan can only take away the heat in a local area, and cannot quickly take away the heat in other areas, and the heat dissipation speed is relatively slow.

Utility model content

The purpose of the utility model is to provide a circuit board heat dissipation structure with high heat transfer efficiency, which solves the problem that the existing circuit board heat dissipation device has a slow heat dissipation speed and easily causes the local temperature of the circuit board to be too high.

In order to achieve the above object, the utility model provides the following technical solutions:

A circuit board heat dissipation structure with high heat transfer, including a circuit board inside the heat dissipation shell; several heat dissipation fans are uniformly arranged on the left side of the heat dissipation shell, and U-shaped through grooves are arranged on the top surface of the heat dissipation shell, and soldered heat-conducting copper is embedded in the U-shaped through grooves Tube.

Further, the U-shaped channel is arranged laterally, and the left side of the U-shaped channel is the closed side of the U-shaped channel.

Further, the distance between the top surface of the circuit board and the top surface of the heat dissipation housing is 0.1-0.5 cm.

Further, the cooling fan is connected with the power supply through wires.

Further, wiring ports are provided in the middle of the upper side and the lower side of the heat dissipation housing.

Further, the heat dissipation shell is made of aluminum alloy.

Further, the heat dissipation housing is composed of a top plate and a bottom plate connected by bolts.

Compared with the prior art, the beneficial effects of the decompression device used in the coal gasification black water treatment system provided by the utility model are as follows:

1. The utility model provides a high-efficiency heat-transfer circuit board heat dissipation structure. A heat-conducting copper tube is embedded in the heat-dissipating shell. The heat-conducting copper tube has a high thermal conductivity, which can quickly absorb the heat of the circuit board and make the circuit board cool down faster. .

2. The utility model provides an efficient heat transfer circuit board heat dissipation structure. A through groove is arranged on the heat dissipation shell, and a heat conduction copper tube is embedded in the through groove, which does not occupy additional space and has a simple structure, and is suitable for various circuit boards .

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a three-dimensional structural schematic diagram of a circuit board heat dissipation structure with high heat transfer efficiency of the present invention;

In the accompanying drawings, the list of parts represented by each label is as follows:

1-heat dissipation shell; 2-wiring port; 3-circuit board; 4-U-shaped slot; 5-heat-conducting copper tube; 6-cooling fan; 7-top plate; 8-bottom plate.

Detailed ways

The technical solution of the utility model will be clearly and completely described below through specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

As shown in Figure 1, the embodiment of the present application provides a circuit board heat dissipation structure with high heat transfer efficiency, including welding the circuit board 3 on the bottom surface of the inner cavity of the heat dissipation shell 1, so as to prevent the circuit board 3 from moving in the heat dissipation shell 1 and damage the circuit board 3 A plurality of cooling fans 6 are evenly arranged on the left side of the cooling shell 1, and the cooling fans 6 are connected to the power supply through wires. When the cooling fans 6 are turned on, the gas between the cooling shell 1 and the circuit board 3 can be evacuated, and the circuit board 3 is cooled. ; The top surface of the heat dissipation shell 1 is provided with a U-shaped through groove 4, and the heat-conducting copper pipe 5 is welded and embedded in the U-shaped through-groove 4. The heat-conducting copper pipe 5 has a high thermal conductivity and has a good heat-conducting effect. The heat-conducting copper pipe 5 can quickly dissipate The heat absorption generated by the circuit board 3; the U-shaped through groove 4 is arranged horizontally, the left side of the U-shaped through groove 4 is the U-shaped closed side, and the left side is the side where the cooling fan 6 is set. Under the action of the cooling fan 6, The temperature on the left side of the heat-conducting copper tube 5 is lower, and the temperature on the right side is higher. The heat on the right side of the heat-conducting copper tube 5 can be quickly transferred to the left side through the heat-conducting copper tube 5, and the heat is taken away by the cooling fan 6 to achieve rapid heat dissipation the goal of.

The distance between the top surface of the circuit board 3 and the top surface of the heat dissipation shell 1 is 0.1-0.5 cm. The closer the distance between the circuit board 3 and the top surface of the heat dissipation shell 1 and the heat-conducting copper pipe 5 is, the faster the heat-conducting copper pipe 5 absorbs heat and dissipates heat. ; The middle part of the upper side and the lower side of the heat dissipation shell 1 is provided with a wiring port 2 to facilitate wiring of the circuit board 3; the material of the heat dissipation shell 1 is aluminum alloy, which is light and suitable for various circuit boards 3; the top plate 7 and the bottom plate 8 pass through Bolt connection forms the heat dissipation shell 1, which is convenient for disassembly and maintenance of the circuit board 3. An efficient heat transfer circuit board heat dissipation structure provided in the embodiment of the present application, installs a heat conduction copper tube 5 on the top of the heat dissipation shell 1 to increase the heat transfer speed, and avoid the circuit board 3 being too high in temperature to affect the service life of the circuit board or cause the circuit board to damage.

The above-mentioned embodiments are only described to the preferred implementation of the utility model, and are not limited to the scope of the utility model. Various modifications and improvements made should fall within the scope of protection determined by the claims of the device of the present invention.

Claims (7)

1. A circuit board heat dissipation structure for efficient heat transfer, characterized in that: the circuit board (3) is welded on the bottom surface of the inner cavity of the heat dissipation shell (1); several heat dissipation fans ( 6), the top surface of the heat dissipation shell (1) is provided with a U-shaped through groove (4), and the heat-conducting copper pipe (5) is welded and embedded in the U-shaped through groove (4). 2. A circuit board cooling structure with high heat transfer efficiency according to claim 1, characterized in that: the U-shaped through groove (4) is arranged horizontally, and the left side of the U-shaped through groove (4) is U-shaped Closed side. 3. A circuit board heat dissipation structure with high heat transfer efficiency according to claim 1, characterized in that: the distance between the top surface of the circuit board (3) and the top surface of the heat dissipation shell (1) is 0.1-0.5cm . 4. A circuit board cooling structure with high heat transfer efficiency according to claim 1, characterized in that: the cooling fan (6) is connected to a power supply through wires. 5. A circuit board heat dissipation structure with high heat transfer efficiency according to claim 1, characterized in that: the middle part of the upper side and the lower side of the heat dissipation housing (1) is provided with a connection port (2). 6. A circuit board heat dissipation structure with high heat transfer efficiency according to claim 1, characterized in that: the material of the heat dissipation shell (1) is aluminum alloy. 7. A circuit board heat dissipation structure with high heat transfer efficiency according to claim 1, characterized in that: the heat dissipation housing (1) is composed of a top plate (7) and a bottom plate (8) connected by bolts.

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