CN111128923B - Diode module - Google Patents
Diode module Download PDFInfo
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- CN111128923B CN111128923B CN201911176386.0A CN201911176386A CN111128923B CN 111128923 B CN111128923 B CN 111128923B CN 201911176386 A CN201911176386 A CN 201911176386A CN 111128923 B CN111128923 B CN 111128923B
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- supporting upright
- cross beam
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- 239000000498 cooling water Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 29
- 239000004033 plastic Substances 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000003825 pressing Methods 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 description 8
- 230000010354 integration Effects 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
- B63H—MARINE PROPULSION OR STEERING
- B63H21/00—Use of propulsion power plant or units on vessels
- B63H21/12—Use of propulsion power plant or units on vessels the vessels being motor-driven
- B63H21/17—Use of propulsion power plant or units on vessels the vessels being motor-driven by electric motor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Ocean & Marine Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a diode module, which comprises a left supporting column, a right supporting column, a lower pressing beam and an upper pressing beam, wherein a plurality of cooling water bags and diode valve banks formed by connecting diodes in series are arranged between the lower pressing beam and the upper pressing beam; according to the invention, the diode belleville spring assembly is only placed on the press-mounting machine to be pressed and pressure-maintaining, and then the pressure is transmitted to the diode valve group during tool assembly, so that integral press-mounting is not required, the press-mounting and mounting process is simple and easy to operate, and the production efficiency is greatly improved.
Description
Technical Field
The invention belongs to the technical field of manufacturing of high-power electric propulsion devices, and particularly relates to a high-power press-fitting type diode module.
Background
With the development of society, the life of people is more and more seriously affected by ecological destruction and environmental pollution, and the attention of governments on environmental protection is gradually drawn.
The pollution of modern ships, particularly ocean ships, is very serious due to the traditional fossil fuel because of large tonnage, large propelling power and the like. The data show that the air pollution and the water pollution caused by the traditional diesel engine ship in the sailing process are extremely remarkable, and more than three tons of carbon dioxide and carbon monoxide can be generated by burning one ton of diesel oil. The design index of ship Energy Efficiency (EEDI) is the main means for controlling the emission of greenhouse gases of ships by the current International Maritime Organization (IMO), and the lower the value of the EEDI represents the lower the carbon emission of the ships, and by 2025, the IMO requires that the EEDI index of the ships be 30% lower than the baseline. Therefore, the traditional propulsion system is gradually replaced by a variable-frequency electric propulsion system, and a large amount of high-power diodes are applied to the system, so that a high-efficiency and reliable high-power diode module is favored by the market.
The high-power diode module in the current market mainly faces the complex press-mounting process, needs to be pressed and mounted on a press-mounting machine together with an array of diode valve groups and a tool, and has high production difficulty and low efficiency; the press fitting tool does not usually contain a water collector, the integration level is not high, and the power density is low.
Disclosure of Invention
The invention aims to design a high-power press-fitting type diode module according to the defects of the prior art, and aims to solve the problems of high production difficulty, low integration level, poor appearance attractiveness and the like of the conventional press-fitting tool.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problem is as follows: a diode module comprises a left supporting column, a right supporting column, a lower cross beam and an upper cross beam which are connected between the left supporting column and the right supporting column, wherein a flow passage is arranged in the left supporting column and the right supporting column, a pagoda joint and a plastic water nozzle are arranged at the opening of the flow passage, a plurality of cooling water bags and diode valve banks which are formed by connecting diodes in series are arranged between the lower cross beam and the upper cross beam, the water inlet and outlet nozzles of the cooling water bags are connected with the plastic water nozzles on the left supporting column and the right supporting column through plastic hoses, a pressed cone is arranged between the bottom of the diode valve bank and the lower cross beam, a diode butterfly spring assembly and a driving gear transmission assembly are arranged on the upper cross beam in parallel, the diode butterfly spring assembly is used for conducting and maintaining the pressure of the diode valve bank, and comprises a force transmission pressure rod and a driven gear pressure rod arranged on the force transmission pressure rod, the driving gear transmission assembly comprises a rotary rod and a driving gear arranged on the rotary rod, and the driving gear is meshed with the transmission gear and the number of teeth of the driving gear is less than that of the transmission gear.
The diode module further comprises a self-locking nut arranged on a threaded column at the lower end of the driven gear pressing rod and a butterfly spring arranged below the transmission teeth, wherein the butterfly spring is arranged on the force transmission pressing rod, and a locknut and a flat cushion which are positioned above the driven gear pressing rod are arranged on the threaded column at the upper end of the force transmission pressing rod.
A diode module, its driving gear passes through the key and is connected with the rotary rod, still be provided with on the rotary rod and be used for the axle circlip spacing to driving gear, thereby can use box spanner to drive the rotary rod and make circular motion and drive the coaxial rotation of driving gear.
A rotating limiter with holes is arranged on a right supporting upright post of the diode module, and the rotating rod penetrates through the holes.
The diode valve group of the diode module further comprises an insulation grid and a copper bar.
According to the diode module, the gear ratio of the transmission gear to the driving gear is 5:1, the driving gear rotates 360 degrees to drive the driven gear pressure rod to rotate 72 degrees, so that the pressure transmission precision can be improved, and the diode valve bank is not overpressured.
The invention has the beneficial effects that:
1, the left supporting upright post and the right supporting upright post of the invention contain cooling water flow passages, so that the press fitting tool has higher integration level and more concise and beautiful appearance.
2, the diode butterfly spring assembly is placed on the press-mounting machine to be pressed and pressure-maintaining, and then pressure is transmitted to the diode valve group during tool assembly, integral press-mounting is not needed, the press-mounting and mounting process is simple and easy to operate, and production efficiency is greatly improved.
3, the invention adopts the mode of axial single-point transmission press-mounting force, uniformly applies force on the diode valve group by uniformly pressing the cone, and simultaneously uses a gear mechanism for transmission, the gear ratio of the driving gear to the transmission gear is 1:5, thus improving the precision of the press-mounting force applied on the diode valve group and enhancing the reliability of the diode in working.
4, the invention can customize the corresponding diode valve bank according to different electrical topologies, thereby customizing the module meeting the requirements of the diode valve bank and having wide applicability.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a front view of the diode pack of the present invention;
FIG. 3 is a front view of the diode belleville spring assembly of the present invention;
FIG. 4 is a front view of the motive gear assembly of the present invention.
The figures are numbered: 1-pressing-down beam, 2-left supporting column, 3-pagoda joint, 4-pressure equalizing upper cone, 5-pressing-up beam, 6-diode belleville spring component, 7-driving gear transmission component, 8-right supporting column, 9-rotation limiter, 10-plastic water nozzle, 11-plastic hose, 12-diode valve bank, 13-pressed cone, 14-insulating grid, 16-diode, 17-copper bar, 18-cooling water drum, 20-force transmission pressure bar, 21-locknut, 22-flat pad, 23-driven gear pressure bar, 24-self-locking nut, 25-belleville spring, 26-rotating bar, 27-driving gear, 28-key and 29-elastic retainer ring for shaft.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 to 4, the invention provides a diode module with high integration level, high reliability and simple installation process aiming at the problems of the traditional press-fitting diode module, which comprises a lower pressing beam 1 arranged at the bottom of the module and an upper pressing beam 5 arranged at the top of the module, wherein the left side and the right side of the module are respectively provided with a left supporting upright post 2 and a right supporting upright post 8 which are respectively connected with the upper pressing beam 5 and the lower pressing beam 1 through four bolts M12; the diode butterfly spring assembly 6 is arranged in the center of the upper pressing beam 5 and connected through threads, a driving gear transmission assembly 7 is arranged on the right of the diode butterfly spring assembly and used for driving the diode butterfly spring assembly 6 to rotate, a pressure-equalizing upper cone 4 is arranged below the diode butterfly spring assembly 6, a pressed cone 13 is arranged in the center of the lower pressing beam 1, and a diode valve group 12 formed by connecting a plurality of cooling water bags 18 and diodes 16 in series is arranged between the pressure-equalizing upper cone 4 and the pressed lower cone 13. Runners are processed inside the left supporting upright post 2 and the right supporting upright post 8, a pagoda joint 3 and a plastic water nozzle 10 are installed at the opening of the runners, the pagoda joint 3 is connected with a rubber hose, and the rubber hose is used for bearing the total water inlet and outlet required by the cooling of the diode 16; the plastic water nozzle 10 is connected to the plastic water nozzle 10 of the cooling water bag 18 through a plastic hose 11, and the plastic water nozzle plays a role in cooling the heating diode 16. The pagoda joint 3 has three specifications and can be connected with rubber hoses of DN10, DN12 and DN 16; the plastic water nozzle 10 has two specifications, can be connected with plastic hoses 11 of DN6 and DN8, can meet the requirements of different cooling water flows, and further cools diode combinations with different losses.
The diode valve group 12 consists of diodes 16, a cooling water drum 18, an insulation grid 14 and copper bars 17, wherein the diodes 16, the cooling water drum 18, the insulation grid 14 and the copper bars 17 can be arranged and combined in different ways to meet different electrical topological requirements, and different voltage and current values can be met by adjusting the sizes of the insulation grid 14 and the copper bars 17; the height dimensions of the left supporting upright post 2 and the right supporting upright post 8 and the positions and the number of the plastic water nozzle mounting holes are customized according to different diode valve groups 12.
In the embodiment shown in fig. 2, the diode valve set 12 is formed by sequentially arranging an insulation grid 14, a cooling water drum 18, a diode 16 and an insulation grid 14, wherein the diode 16, the cooling water drum 18, the insulation grid 14 and the copper bar 17 can be arranged and combined differently to meet different electrical topological requirements, and different voltage and current values can be met by adjusting the sizes of the insulation grid 14 and the copper bar 17; the height dimensions of the left support upright post 2 and the right support upright post 8 and the positions and the number of the mounting holes of the plastic water nozzle 10 are customized according to different diode valve groups 12.
The diode butterfly spring assembly 6 consists of a driven gear pressure rod 23, a self-locking nut 24, a butterfly spring 25, a force transmission pressure rod 20, a locknut 21 and a flat cushion 22, after the assembly is assembled, a proper press-fitting force is applied to the press-fitting machine in advance to enable the belleville spring 25 to generate deformation and store pressure, the locknut 21 is then tightened to immobilize the flat gasket 22 and removed from the press, so that the pressure required by the diode 16 is stored by the deformation of the belleville spring 25, then the upper pressing beam 5 is arranged on the upper pressing beam, the upper pressing beam 5 is in threaded connection with the diode belleville spring component 6, by rotating the diode belleville spring assembly 6 so that its axial single point conducts and holds the pressure to the diode valve block 12, when the flat cushion 22 can move, the pressure conduction is finished, and finally the self-locking nut 24 is screwed to prevent the diode belleville spring 6 from being loosened due to vibration in the using process.
The driving gear transmission assembly 7 consists of a rotating rod 26, a driving gear 27, a key 28 and a shaft elastic retainer ring 29, and a socket wrench is used for driving the rotating rod 26 to do circular motion so as to drive the driving gear 27 to rotate coaxially.
The gear ratio of the transmission gear on the driven gear pressure lever 23 to the driving gear 27 is 5:1, the driving gear 27 rotates for 360 degrees to drive the driven gear pressure lever 23 to rotate for 72 degrees, and therefore the pressure transmission precision can be improved, and overpressure cannot be caused to the diode valve bank 12. The belleville springs 25 may be sized, numbered and stacked to meet the press fit requirements of different types of diodes 16.
The assembly process of the press fitting tool comprises the following steps:
1, assembling a diode belleville spring assembly 6, placing a belleville spring 25 at the lower part of a driven gear pressure rod 23 as shown in fig. 3, sequentially penetrating the belleville spring 25, a transmission gear and the driven gear pressure rod 23 from bottom to top through a force transmission pressure rod 20, and mounting a flat cushion 22 and a locknut 21 on a threaded column at the upper end of the force transmission pressure rod 20; at the moment, the lower annular surface of the force transmission pressure rod 20 is attached to a press machine base, the press machine applies pressure to the upper surface of a driven gear pressure rod 23 gear until a pressure threshold value is reached, the machine is stopped, the locknut 21 is screwed, and the flat cushion 22 is continuously moved in the period until the flat cushion 22 cannot move; finally, the self-locking nut 24, the elastic cushion and the flat cushion 22 are arranged on the threaded column of the driven gear pressure lever 23.
2, as shown in the general assembly of fig. 1, the lower pressing beam 1, the upper pressing beam 5, the left supporting upright 2 and the right supporting upright 8 are connected through M12 bolts; the diode belleville spring assembly 6 and the rotating rod 26 are arranged on the upper pressure beam 5, a key 28, a driving gear 27 and a shaft elastic retainer ring 29 are arranged on the rotating rod 26, so that the driving gear 27 is meshed with the driving teeth of the force transmission pressing rod 20, the rotating stopper 9 is arranged on the right support upright 8, and the rotating rod 26 passes through the hole of the rotating stopper 9; stacking the pressed cone 13, the diode valve group 12 and the voltage-sharing upper cone 4 at the central position of the pressing beam 1 from bottom to top in sequence, and rotating the rotating rod 26 counterclockwise by using a socket wrench to press the diode belleville spring assembly 6 on the voltage-sharing upper cone 4; a pagoda joint 3 and plastic water nozzles 10 are arranged on the left supporting upright post 2 and the right supporting upright post 8, the plastic water nozzles 10 are arranged on the two cooling water bags 18, and the two plastic water nozzles 10 are connected by a plastic hose 11; the rotating rod 26 is rotated counterclockwise until the flat pad 22 under the locknut 21 is loosened, and finally the self-locking nut 24 is tightened.
The above-described embodiments are merely illustrative of the principles and effects of the present invention and some embodiments of the invention, and it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept of the present invention, and these embodiments are within the scope of the present invention.
Claims (6)
1. A diode module, characterized by: comprises a left supporting upright post (2), a right supporting upright post (8), and a lower cross beam (1) and an upper cross beam (5) which are connected between the left supporting upright post (2) and the right supporting upright post (8), wherein runners are arranged in the left supporting upright post (2) and the right supporting upright post (8), a pagoda joint (3) and a plastic water nozzle (10) are arranged at the opening of the runners, a plurality of diode valve banks (12) formed by connecting cooling water bags (18) and diodes (16) in series are arranged between the lower cross beam (1) and the upper cross beam (5), the water inlet and outlet nozzles of the cooling water bags (18) are connected with the plastic water nozzle (10) through plastic hoses (11), a lower cone (13) is arranged between the diode valve banks (12) at the bottom and the lower cross beam (1), and a diode butterfly spring assembly (6) and a gear transmission assembly (7) are arranged on the upper cross beam (5) in parallel, diode belleville spring subassembly (6) including biography power depression bar (20) and driven gear depression bar (23) of setting on biography power depression bar (20), driven gear depression bar (23) outer circumference be provided with the driving tooth, driven gear depression bar (23) pass through threaded connection and go up pressure crossbeam (5) center department, biography power depression bar (20) downside have with the equal pressure cone (4) that the pressurized cone (13) correspond, former driving gear drive subassembly (7) include rotary rod (26) and set up former driving gear (27) on rotary rod (26), former driving gear (27) and driving tooth meshing and the number of teeth be less than the driving tooth.
2. The diode module as claimed in claim 1, wherein the diode belleville spring assembly (6) further comprises a self-locking nut (24) mounted on a threaded post at the lower end of the driven gear strut (23) and a belleville spring (25) disposed below the driving teeth, and the threaded post at the upper end of the force transmission strut (20) is mounted with a locknut (21) and a flat pad (22) above the driven gear strut (23).
3. The diode module as claimed in claim 1, wherein the driving gear (27) is connected to the rotating rod (26) through a key (28), and the rotating rod (26) is further provided with a shaft circlip (29) for limiting the driving gear (27).
4. A diode module according to claim 1, characterised in that said right support pillar (8) is provided with a perforated rotation limiter (9), said rotation rod (26) passing through said hole.
5. A diode module according to claim 1, characterized in that said diode pack (12) further comprises an insulating grid (14) and copper bars (17).
6. A diode module according to claim 1, characterised in that the gear ratio of the transmission teeth and the motive gear (27) is 5: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911176386.0A CN111128923B (en) | 2019-11-26 | 2019-11-26 | Diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911176386.0A CN111128923B (en) | 2019-11-26 | 2019-11-26 | Diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111128923A CN111128923A (en) | 2020-05-08 |
| CN111128923B true CN111128923B (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911176386.0A Active CN111128923B (en) | 2019-11-26 | 2019-11-26 | Diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128923B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635413B (en) * | 2020-12-03 | 2024-11-19 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | A flat-plate IGBT power module press-fit device and press-fit method |
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| JPH0758284A (en) * | 1993-06-30 | 1995-03-03 | Toshiba Corp | Semiconductor stack |
| CN2648597Y (en) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | Plate type electronic power semiconductor device assembly |
| CN2676412Y (en) * | 2003-10-14 | 2005-02-02 | 湖北省襄樊市仪表元件厂 | High voltage silicon stack assembly |
| JP2007088007A (en) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | Semiconductor stack |
| CN201829479U (en) * | 2009-12-30 | 2011-05-11 | 株洲变流技术国家工程研究中心有限公司 | Pressing component of semiconductor element |
| CN102184899A (en) * | 2011-04-14 | 2011-09-14 | 北京荣科恒阳整流技术有限公司 | Two-point form clamping device for high-power thyristor |
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN104333237A (en) * | 2014-11-13 | 2015-02-04 | 北京荣信慧科科技有限公司 | Rectifying unit structure |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN204878202U (en) * | 2015-08-14 | 2015-12-16 | 广达电脑股份有限公司 | Portable electronic device and fixing pin module thereof |
-
2019
- 2019-11-26 CN CN201911176386.0A patent/CN111128923B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758284A (en) * | 1993-06-30 | 1995-03-03 | Toshiba Corp | Semiconductor stack |
| CN2648597Y (en) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | Plate type electronic power semiconductor device assembly |
| CN2676412Y (en) * | 2003-10-14 | 2005-02-02 | 湖北省襄樊市仪表元件厂 | High voltage silicon stack assembly |
| JP2007088007A (en) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | Semiconductor stack |
| CN201829479U (en) * | 2009-12-30 | 2011-05-11 | 株洲变流技术国家工程研究中心有限公司 | Pressing component of semiconductor element |
| CN102184899A (en) * | 2011-04-14 | 2011-09-14 | 北京荣科恒阳整流技术有限公司 | Two-point form clamping device for high-power thyristor |
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN104333237A (en) * | 2014-11-13 | 2015-02-04 | 北京荣信慧科科技有限公司 | Rectifying unit structure |
| CN204878202U (en) * | 2015-08-14 | 2015-12-16 | 广达电脑股份有限公司 | Portable electronic device and fixing pin module thereof |
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| Publication number | Publication date |
|---|---|
| CN111128923A (en) | 2020-05-08 |
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