CN103367276A - Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment - Google Patents
Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment Download PDFInfo
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- CN103367276A CN103367276A CN2013102707582A CN201310270758A CN103367276A CN 103367276 A CN103367276 A CN 103367276A CN 2013102707582 A CN2013102707582 A CN 2013102707582A CN 201310270758 A CN201310270758 A CN 201310270758A CN 103367276 A CN103367276 A CN 103367276A
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Abstract
The invention provides a device for press-fitting a flat plate type semiconductor element on press-fitting equipment. The device comprises a pressing plate, a pressing mechanism which is arranged on the pressing plate and comprises a central column body provided with an end flange, and an elastic element which is arranged between the end flange and the pressing plate, wherein the central column body can move along the direction vertical to the pressing plate by means of an adjusting element so that the elastic element remains under a preset pretightening force; the device is connected with the press-fitting equipment through the pressing plate so that the surface of the pressing mechanism is contacted with the surface of the flat plate type semiconductor element to be press-fitted; and the pretightening force of the elastic element is transferred onto the flat plate type semiconductor element through the pressing mechanism by releasing the adjusting element. The invention also provides a corresponding method. According to the method and the device disclosed by the invention, the accuracy of press-fitting force is ensured; and when the semiconductor element works normally, the influence on the press-fitting force caused by strong external vibration is prevented.
Description
Technical field
The present invention relates to a kind of press-loading apparatus, relate in particular to a kind of device for press-fit the plate type semiconductor element at press-loading device.
The invention still further relates to a kind of method be used to press-fiting the plate type semiconductor element.
The invention still further relates to a kind of method for when press-fiting operation, changing the plate type semiconductor element.
Background technology
In plate type semiconductor element when normal operation, must apply at its two ends certain pressure assembling force, and the value of pressure assembling force must remain in certain scope constantly, and the guarantee element is passed away because of the heat that power consumption produces.
When pressure assembling force is lower than the minimum regulatory value of plate type semiconductor element, can cause contact heat resistance between element and the radiator and the increase of contact resistance, and the on-state voltage drop that may cause element rises and the on state current of permission descends, this especially may cause the degradation of element under large electric current operating mode, or even damages.
If pressure assembling force surpasses the highest setting of semiconductor element, the mechanical stress on the silicon wafer will be increased, particularly in thermal cycle frequently under the condition of work, this can reduce the useful life of device greatly, even causes the short circuit of anode and cathode.
From the application point of plate type semiconductor element, to guarantee that pressure assembling force remains in certain scope constantly on the one hand, to be convenient to as far as possible on the other hand safeguard, make it possible to finish quickly replacing and the assembling of semiconductor element.
Especially when having the parts such as radiator, water pipe, they can form power device series with semiconductor element, change element such as need, whole power device series certainly will be removed, again stack the parts such as semiconductor element and radiator, may also will again check pressure assembling force, this uses for the engineering of plate type semiconductor element and has brought very large inconvenience.
Summary of the invention
Press-loading apparatus of the prior art is difficult to take into account simultaneously uniformity, persistence and the ease for maintenance of pressure assembling force.
The present invention proposes a kind of device for press-fit the plate type semiconductor element at press-loading device, purpose be fast, the size of the pressure assembling force of control element accurately, be convenient to the engineering maintenance of using in batches.Reduced as far as possible with the plate type semiconductor element simultaneously and press-fited relevant harm, improved the reliability of plate type semiconductor element work.
The present invention proposes for the device that press-fits the plate type semiconductor element at press-loading device, comprise: pressing plate, be arranged on the hold-down mechanism on the described pressing plate, described hold-down mechanism comprises the center column with end flange, and be arranged on elastic component between end flange and the pressing plate, described newel physical efficiency is moved perpendicular to the direction of described pressing plate on the edge by means of regulating part, thereby elastic component is remained under the pretightning force of setting, wherein, described device is connected on the press-loading device by pressing plate, so that the Surface Contact of the surface of described hold-down mechanism and plate type semiconductor element to be press-fited, and by discharging described regulating part the pretightning force of described elastic component is delivered on the plate type semiconductor element through described hold-down mechanism.
In one embodiment, described elastic component is that an end engages with described flange, and the other end is fixed to the butterfly spring of close described center column one side of described pressing plate by spring plank.
In one embodiment, described regulating part comprises bolt, described center column has shrinkage pool at the end near described pressing plate, described shrinkage pool has helicitic texture at inwall, the opening that described bolt penetrates on the described pressing plate is engaged in the described shrinkage pool, so that described center column is fixed with respect to described pressing plate.
In one embodiment, have additional annular element at the gusset away from described center column of described pressing plate around described bolt, the through hole that described bolt penetrates on the described annular element joins in the shrinkage pool of described center column.
In one embodiment, described hold-down mechanism also comprise close described semiconductor element one side that is positioned at described center column and by the coupled transmission cushion block of steel ball.
In one embodiment, also comprise the detection cushion block, its be arranged in described hold-down mechanism and the semiconductor element that will press-fit between, be used for surveying the tightness bonded to each other of described hold-down mechanism and described semiconductor element and carry out electricity and isolate.
In one embodiment, have the indent spherical pore on the described transmission cushion block, be used for cooperating with described steel ball.
In one embodiment, described steel ball has the alignment pin that penetrates described transmission cushion block, and described detection cushion block has the groove that extends to the edge from its inside, and the groove of described alignment pin and described detection cushion block is suitable.
The invention allows for by said apparatus the method that semiconductor element press-fits, comprising:
Step 1: the plate type semiconductor element is placed press-loading device;
Step 2: press-fit in advance, by pressing machine the deformation quantity of described elastic component is controlled to desirable value, by described regulating part described center column is fixed with respect to described pressing plate, thereby maintain the deformation quantity of described elastic component, press-loading apparatus is moved apart pressing machine;
Step 3: press-loading apparatus is positioned over semiconductor element top and is connected on the press-loading device by described pressing plate, so that described detection cushion block can just touch the power device series that is positioned under it;
Step 4: discharge described regulating part, until the deformation pressure of described elastic component all is applied on the described semiconductor element.
The invention allows for the method for in press-fiting operation, the semiconductor element that press-fits being changed, comprising:
Step 1: operate described regulating part, the pressure of described elastic component is all transferred on the described regulating part;
Step 2: when described detection cushion block can freely be twitched, the described regulating part of shut-down operation was changed semiconductor element;
Step 3: after replacing is finished, again described detection cushion block is inserted between described hold-down mechanism and the described semiconductor element, described regulating part is discharged, until described regulating part is no longer stressed.
According to device of the present invention, the setting by steel ball makes the power homogenizing of transmitting effectively; Arranging of annular element increased the application of force area of bolt to pressing plate, is conducive to the life-span of device and press-fits effect; By regulating part and the center column fixation to the elastic component deformation quantity, can accurately control the size of plate type semiconductor element pressure assembling force, avoided the impact of people for misoperation; The whole mechanical realization of device is beneficial to maintenance, especially in the situation that has the peripheral components such as radiator and water pipe; Semiconductor element press-fit the impact that no longer is subject to its whole height, can arbitrarily carry out press-fiting in advance of elastic component, guarantee the precision of pressure assembling force; During the semiconductor element normal operation, bolt does not stress, and has avoided extraneous fierce vibration on the impact of pressure assembling force.
Above-mentioned technical characterictic can various technical feasible modes make up to produce new embodiment, as long as can realize purpose of the present invention.
Description of drawings
Hereinafter will be based on only being the embodiment of indefiniteness and coming with reference to the accompanying drawings the present invention is described in more detail.Wherein:
Fig. 1 has shown the press-loading device that is equipped with according to the device 3 for press-fit the plate type semiconductor element at press-loading device of the present invention;
Fig. 2 has shown according to the device 3 for press-fit the plate type semiconductor element at press-loading device of the present invention;
Fig. 3 has shown the transmission cushion block 10 that is used for device 3;
Fig. 4 has shown the detection cushion block 11 that is used for device 3.
In the drawings, identical member is indicated by identical Reference numeral.Accompanying drawing is not according to the scale of reality.
Embodiment
Come below with reference to accompanying drawings at length to introduce the present invention.
Fig. 1 schematically illustrates the press-loading device that is equipped with according to device 3 of the present invention.
Wherein install 3 and arrange the in the drawings top of equipment, device 3 is fixing with respect to lower platen 53 by screw rod 7.The power device series of the plate type semiconductor element 52 that press-fits places between press-loading apparatus 3 and the lower platen 53, and device 3 is used for semiconductor element 52 is applied pressure assembling force.
Fig. 2 has at length shown press-loading apparatus 3.
Be furnished with butterfly spring 6 around guide pillar 8.The effect of butterfly spring 6 is to utilize self deformation transmission of pressure to semiconductor element 52, it has certain retractility to eliminate ambient temperature variation and vibration to the impact of pressure assembling force simultaneously, continues to remain on unvaryingly in the desired particular range with further assurance pressure assembling force.
When choosing the concrete model of butterfly spring 5, can calculate the deflection of required disk spring 5 according to the size of the pressure assembling force of semiconductor element 52, also will take into full account simultaneously deflection to the impact of press-loading apparatus 3 miscellaneous part sizes.
In the embodiment shown in Figure 2, guide pillar 8 has the flange that radially outward protrudes at the end away from pressing plate 4, and an end of spring 6 engages with flange, and the other end is fixed to the bottom surface of pressing plate 4 by spring plank 5.
Similarly, when press-fiting in advance and change the power device series associated component of plate type semiconductor element 52, the internal thread of guide pillar 8 will be able to bear the transfer of the pressure assembling force of semiconductor element 52, need choose suitable guide pillar 8 materials, material therefor quenching degree will be got well, the heat treatment deformation amount is little, and through guaranteeing after certain heat treatment that hardness will reach HRC38-42, the while can be born the pressure assembling force of semiconductor element 52 and do not occurred losing efficacy.
The side away from guide pillar 8 at pressing plate 4 is furnished with annular element 2, and bolt 1 penetrates the through hole on the annular element 2 and joins in the shrinkage pool of guide pillar 8.The effect of annular element 2 is the application of force areas that increase 1 pair of pressing plate 4 of bolt, reduces as far as possible pressing plate 4 and is press-fiting in advance and is changing deformation quantity in the process of power device series, in order to avoid affect press-fiting effect and installing life-span of 3 of semiconductor element.Can be optimized annular element 2, select as the case may be suitable size.
Be furnished with steel ball 9 under the bottom surface of guide pillar 8, it is between the bottom surface and transmission cushion block 10 of guide pillar 8.The effect of steel ball 9 comprises the power homogenizing of transmitting between guide pillar 8 and transmission cushion block 10, so that press-fit more stable and even.In one embodiment, transmit cushion block 10 tops and be processed with the indent spherical pore, be used for cooperating with steel ball 9.
In a preferred embodiment, device 3 also comprises surveys cushion block 11, and it is arranged between the semiconductor element 52 that transmits cushion block 10 and will press-fit, and is used for surveying the tightness bonded to each other that transmits cushion block 10 and semiconductor element 52.
Fig. 3 has shown the transmission cushion block 10 that is used for device 3.
Fig. 4 has shown the detection cushion block 11 that is used for device 3.
The invention allows for a kind of method that press-fits by 3 pairs of semiconductor elements of device according to the present invention, it comprises the steps:
Step 1: according to interlock circuit figure plate type semiconductor element 52 is stacked up, places lower platen 53(Fig. 1 of press-loading device) on;
Step 2: press-fit in advance, accurately control the deformation quantity of disk spring 6 by the pressing machine (not shown), then bolt 1 is screwed in the shrinkage pool of guide pillar 8, press-loading apparatus 3 is moved apart pressing machine, maintain simultaneously the deformation quantity of disk spring 6 by guide pillar 8, the corresponding pressure of this deformation quantity namely is the pressure assembling force that will be delivered on the semiconductor element 52;
Step 3: press-loading apparatus 3 is positioned over the power device series top of semiconductor element 52 and is fixed on the press-loading device, control the total height of power device series well by positioner, can just touch the power device series that is positioned under it so that survey cushion block 11;
Step 4: bolt 1 is unscrewed, until bolt 1 do not stress fully, finish and press-fit process.The butterfly spring 6 of deformation this moment is delivered to pressure assembling force on the power device series of semiconductor element 52 by guide pillar 8, steel ball 9, transmission cushion block 10 and detection cushion block 11.
Press-loading apparatus 3 has been controlled the uniformity that pressure assembling force transmits by steel ball 9 simultaneously by press-fiting in advance the accurate size of controlling pressure assembling force.
The invention allows for a kind of method of in press-fiting operation, semiconductor element 52 being changed by device 3 according to the present invention:
Step 1: bolt 1 is screwed in the shrinkage pool of guide pillar 8, until the deformation pressure of disk spring 5 is all transferred on the bolt 1 by spanner;
Step 2: when detection cushion block 11 can freely be twitched, stop the screw-in to bolt 1, can carry out the replacing of parts this moment;
Step 3: after replacing is finished, reinsert between the power device series assembly that transmits cushion block 10 and semiconductor element 52 surveying cushion block 11, bolt 1 is unscrewed, until bolt 1 is no longer stressed, precompression is applied on the semiconductor element again.So far namely finished more and changed jobs.
See figures.1.and.2, bolt 1 does not stress during the semiconductor element normal operation, and pressure assembling force is distributed in power device series and press-fits screw rod 7.Upper lower platen (3,53) is undertaken fastening by bolt 1 and the location, even fierce vibration can not exert an influence to pressure assembling force yet.
Although invention has been described with reference to preferred embodiment, without departing from the scope of the invention, can carry out various improvement and can replace wherein parts with equivalent it.The present invention is not limited to disclosed specific embodiment in the literary composition, but comprises all technical schemes in the scope that falls into claim.
Claims (10)
1. be used for press-fiting at press-loading device the device of plate type semiconductor element, comprise:
Pressing plate,
Be arranged on the hold-down mechanism on the described pressing plate, described hold-down mechanism comprises the center column with end flange, and be arranged on elastic component between end flange and the pressing plate, described newel physical efficiency is moved perpendicular to the direction of described pressing plate on the edge by means of regulating part, thereby elastic component is remained under the pretightning force of setting
Wherein, described device is connected on the press-loading device by pressing plate, so that the Surface Contact of the surface of described hold-down mechanism and plate type semiconductor element to be press-fited, and by discharging described regulating part the pretightning force of described elastic component is delivered on the plate type semiconductor element through described hold-down mechanism.
2. device according to claim 1 is characterized in that, described elastic component is that an end engages with described flange, and the other end is fixed to the butterfly spring of close described center column one side of described pressing plate by spring plank.
3. device according to claim 1 and 2, it is characterized in that, described regulating part comprises bolt, described center column has shrinkage pool at the end near described pressing plate, described shrinkage pool has helicitic texture at inwall, the opening that described bolt penetrates on the described pressing plate is engaged in the described shrinkage pool, so that described center column is fixed with respect to described pressing plate.
4. device according to claim 3 is characterized in that, has additional annular element at the gusset away from described center column of described pressing plate around described bolt, and the through hole that described bolt penetrates on the described annular element joins in the shrinkage pool of described center column.
5. each described device in 4 according to claim 1 is characterized in that, described hold-down mechanism also comprise close described semiconductor element one side that is positioned at described center column and by the coupled transmission cushion block of steel ball.
6. device according to claim 5, it is characterized in that, also comprise the detection cushion block, its be arranged in described hold-down mechanism and the semiconductor element that will press-fit between, be used for surveying the tightness bonded to each other of described hold-down mechanism and described semiconductor element and carry out electricity and isolate.
7. device according to claim 5 is characterized in that, has the indent spherical pore on the described transmission cushion block, is used for cooperating with described steel ball.
8. device according to claim 6 is characterized in that, described steel ball has the alignment pin that penetrates described transmission cushion block, and described detection cushion block has the groove that extends to the edge from its inside, and the groove of described alignment pin and described detection cushion block is suitable.
By device according to claim 6 to the method that semiconductor element press-fits, comprising:
Step 1: the plate type semiconductor element is placed press-loading device;
Step 2: press-fit in advance, by pressing machine the deformation quantity of described elastic component is controlled to desirable value, by described regulating part described center column is fixed with respect to described pressing plate, thereby maintain the deformation quantity of described elastic component, press-loading apparatus is moved apart pressing machine;
Step 3: press-loading apparatus is positioned over semiconductor element top and is connected on the press-loading device by described pressing plate, so that described detection cushion block can just touch the power device series that is positioned under it;
Step 4: discharge described regulating part, until the deformation pressure of described elastic component all is applied on the described semiconductor element.
10. the method for the semiconductor element that press-fits being changed in press-fiting operation by device according to claim 6 comprises:
Step 1: operate described regulating part, the pressure of described elastic component is all transferred on the described regulating part;
Step 2: when described detection cushion block can freely be twitched, the described regulating part of shut-down operation was changed semiconductor element;
Step 3: after replacing is finished, again described detection cushion block is inserted between described hold-down mechanism and the described semiconductor element, described regulating part is discharged, until described regulating part is no longer stressed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310270758.2A CN103367276B (en) | 2013-06-28 | 2013-06-28 | For press-fiting the device and method of plate type semiconductor element on press-loading device |
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| CN201310270758.2A CN103367276B (en) | 2013-06-28 | 2013-06-28 | For press-fiting the device and method of plate type semiconductor element on press-loading device |
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| CN103367276B CN103367276B (en) | 2016-06-08 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883077A (en) * | 2015-06-02 | 2015-09-02 | 南车株洲电力机车研究所有限公司 | Compact three-level IGCT phase module |
| CN105450044A (en) * | 2015-06-08 | 2016-03-30 | 南车株洲电力机车研究所有限公司 | Triple-symmetry three-level IGCT phase module |
| CN105489570A (en) * | 2016-01-19 | 2016-04-13 | 中国船舶重工集团公司第七0四研究所 | High-power semiconductor device pressing and assembling device |
| CN105515404A (en) * | 2016-01-19 | 2016-04-20 | 中国船舶重工集团公司第七0四研究所 | Medium-voltage rectifying device |
| CN109585432A (en) * | 2017-09-28 | 2019-04-05 | 株洲中车时代电气股份有限公司 | A kind of IGBT power module |
| CN109585435A (en) * | 2017-09-28 | 2019-04-05 | 株洲中车时代电气股份有限公司 | A kind of power device |
| CN111128923A (en) * | 2019-11-26 | 2020-05-08 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
| CN112635413A (en) * | 2020-12-03 | 2021-04-09 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Flat-plate IGBT power module press-fitting device and press-fitting method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883077A (en) * | 2015-06-02 | 2015-09-02 | 南车株洲电力机车研究所有限公司 | Compact three-level IGCT phase module |
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| CN105489570A (en) * | 2016-01-19 | 2016-04-13 | 中国船舶重工集团公司第七0四研究所 | High-power semiconductor device pressing and assembling device |
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| CN109585435B (en) * | 2017-09-28 | 2020-07-03 | 株洲中车时代电气股份有限公司 | Power device |
| CN109585432B (en) * | 2017-09-28 | 2020-07-14 | 株洲中车时代电气股份有限公司 | IGBT power module |
| CN111128923A (en) * | 2019-11-26 | 2020-05-08 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
| CN111128923B (en) * | 2019-11-26 | 2021-04-30 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Diode module |
| CN112635413A (en) * | 2020-12-03 | 2021-04-09 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Flat-plate IGBT power module press-fitting device and press-fitting method |
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