CN101872731B - Lifting device and plasma processing equipment applying same - Google Patents
Lifting device and plasma processing equipment applying same Download PDFInfo
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- CN101872731B CN101872731B CN2009100826190A CN200910082619A CN101872731B CN 101872731 B CN101872731 B CN 101872731B CN 2009100826190 A CN2009100826190 A CN 2009100826190A CN 200910082619 A CN200910082619 A CN 200910082619A CN 101872731 B CN101872731 B CN 101872731B
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Abstract
The invention provides a lifting device, which is used for carrying semiconductor devices to move in the process of machining/processing of semiconductors, and comprises a pressure cylinder, a power transfer part, a lifting part, a horizontal adjusting part which is arranged between the lifting part and the power transfer part or between the power transfer part and the pressure cylinder. The horizontal adjusting part can quickly adjust the horizontality of the existing lifting device through an elastic component and an adjusting part. In addition, the invention also provides plasma processing equipment applying the lifting device. The lifting device and the plasma processing equipment have the advantages of simple structure, convenient and fast operation and the like.
Description
Technical field
The present invention relates to microelectronics technology, particularly, the apparatus for processing plasma that relates to a kind of lifting device and use this lifting device.
Background technology
Along with scientific and technological progress, Cement Composite Treated by Plasma enterprise is faced with new technological challenge, and therefore, enterprise must constantly carry out technological innovation to adapt to the new market demand.
Plasma etching technology is a kind of Cement Composite Treated by Plasma technology that produces fine pattern at the semiconductor device surface such as wafer etc.In etching technics, the stability that between transmission platform and technique platform, keeps wafer transmission is the basis that guarantees that product lot quantity is produced.For this reason, the technical staff accomplishes the loading and unloading to wafer by a kind of transmission system of being made up of chip lifting apparatus and manipulator.The structure that is a kind of chip lifting apparatus shown in Figure 1.This lifting device comprises four pins 1, bellows component 2, cylinder frame 3, lifting column 4, air cylinder fixed plate 5 and the cylinder 8 that connects successively and keep level relatively from top to bottom.Wherein, cylinder frame 3 is fixed together by air cylinder fixed plate 5, bolt 6 and bolt 7 with cylinder 8.Bellows component 2 comprises bellows interior axle (figure does not show) and bellows flange, and the upper end of bellows interior axle connects four pins 1, and the lower end links to each other through the inner shaft (figure does not show) of lifting column 4 and cylinder 8.Like this, can drive four pins 1 through control cylinder 8 and accomplish corresponding lifting action.
In practical application; Lifting device often is set in the apparatus for processing plasma in the electrode screening box below the static device for clamping; And the length of four pins is traditionally arranged to be the thickness greater than the static device for clamping, so that its through hole that can pass on the electrostatic clamping device to be offered.Its course of work is following: the manipulator bearing wafer gets in the processing chamber of apparatus for processing plasma; Four pins of lifting device rising simultaneously makes its top be higher than the electrostatic clamping device upper surface; Manipulator is placed on four pin tops with wafer; Four pins are return original position, wafer are placed on the electrostatic chuck and accomplish the process of taking a seat, to carry out corresponding processing technology; After technology was accomplished, four pins rose and with wafer jack-up and by manipulator it are taken out, and accomplish the process that disseats.
In the above-mentioned transmission course, if the levelness between lifting device and the manipulator is inconsistent, will causes getting the sheet failure or the problem of sheet etc. occur falling, this not only causes wastage of material and cost is increased, but also will have a strong impact on production efficiency.Therefore, the levelness of lifting device is an important indicator in the plasma-treating technology, and require in actual process can actual needs and it is adjusted.Yet; In lifting device shown in Figure 1; Each assembly fixes relative position through bolt, though can make each assembly keep level relatively like this, when causing four pin tops not measure up because of pedestal injustice or other reasons; Can't adjust the levelness at four pin tops quickly and easily, thereby make troubles to maintenance work.
Therefore, the technical staff has carried out some improvement to lifting device shown in Figure 1, and obtains lifting device shown in Figure 2.Among Fig. 2, on air cylinder fixed plate 5, be provided with horizontal adjustment plate 9, and the two be fixed together through fastening bolt 10.Cylinder frame 3 is fixedly connected with horizontal adjustment plate 9 through bolt 6.Centre position on horizontal adjustment plate 9 four limits is provided with and is used to carry out the leveling assembly 12 of regulating bolt and lock nut including of horizontal adjustment.Through screwing or unscrewing the adjusting bolt relative distance between air cylinder fixed plate 5 and the horizontal adjustment plate 9 is changed, thereby realized the adjusting of lifting device and top four pin levelness thereof.
In practical application, although lifting device shown in Figure 2 can be adjusted its levelness within the specific limits, still there is following deficiency in it:
One of which, in this lifting device, horizontal adjustment plate 9 keeps relative position relation with air cylinder fixed plate 5 through fastening bolt 10 and is fixed together, and this just makes that effective adjustable range of leveling assembly 12 is very little, and regulating effect is not obvious.And if when practical operation; Earlier fastening bolt 10 is unscrewed, leveling assembly 12 is regulated making it to reach the appropriate location then, again fastening bolt 10 is tightened to fix at last; Certainly will cause operation comparatively complicated like this; And, tend to when tightening fastening bolt 10 at last the levelness that has mixed up is exerted an influence, so that need carry out secondary again or repeatedly regulate the levelness that just can reach expectation repeatedly.Therefore, the precision of this lifting device single horizontal adjustment is lower, can waste the plenty of time and repeatedly regulate, and then influence production efficiency.
Its two, not only be provided with the fastening bolt 10 of fixed connection effect between the horizontal adjustment plate 9 of this lifting device and the air cylinder fixed plate 5, but also leveling assembly 12 will be set.This just need correspondingly process a plurality of through holes or screwed hole on horizontal adjustment plate 9 and air cylinder fixed plate 5, in order to above-mentioned fastening bolt 10 and leveling assembly 12 to be installed, thereby increased the complexity of processing.
Its three, the adjustable side of above-mentioned leveling assembly 12 is arranged on the top of horizontal adjustment plate 9, that is to say; The adjustable side of above-mentioned leveling assembly 12 is between air cylinder fixed plate 5 and electrostatic clamping device; Yet in practical application, it is very narrow and small that electrostatic clamping device below is used to install the space of lifting device, and the operating space when so just making the above-mentioned leveling assembly 12 of adjusting is less; Thereby make troubles for adjusting work, increased the adjusting difficulty.
Summary of the invention
Thereby the distance between adjustment adjustable plate and the substrate, and then regulate the level of lifting the part top.For solving the problems of the technologies described above, the invention provides a kind of lifting device and use the apparatus for processing plasma of this lifting device, it can carry out horizontal adjustment quickly and easily, and have simple in structure, be convenient to characteristics such as processing.
For this reason; The invention provides a kind of lifting device, be used for carrying the semiconductor device motion in semiconductor machining/processing procedure, it comprises pressure cylinder, power transfer part and lifts part; Wherein: pressure cylinder connects the power transfer part, is used for to power transfer part output movement mechanical energy; The power transfer part is arranged on pressure cylinder and lifts between the part, is used for the motion mechanical energy from pressure cylinder is delivered to and lifts part; Lift part and under effect, carry the semiconductor device motion from the motion mechanical energy of power transfer part; In addition; Above-mentioned lifting device also comprises being arranged on lifts partly and perhaps is arranged between the power transfer part level adjustment part between power transfer part and the pressure cylinder; The level adjustment part comprises substrate and the adjustable plate that is arranged close to each other, and on substrate and adjustable plate, sets three adjusting positions at least, and the adjusting portion installing hole that connects substrate and adjustable plate all is set at each adjusting position; And close on adjusting portion installing hole and elastomeric element is set between adjustable plate and substrate; Adjusting portion runs through adjusting portion installing hole and adjustable plate is linked together via elastomeric element and substrate, elastomeric element is stretched or compression through regulating adjusting portion
Wherein, the position near the two critical surface on substrate and/or adjustable plate is provided with the elastomeric element mounting groove around adjusting portion installing hole, and elastomeric element is arranged between substrate and the adjustable plate through being embedded in the elastomeric element mounting groove.Wherein, elastomeric element comprises spring and/or spring shim.
Wherein, adjusting portion comprises the screw bolt and nut that cooperatively interacts.Bolt is a countersunk head outer-hexagonal bolt; Correspondingly; The top of the adjusting portion installing hole in the adjustable plate is set to and the suitable interior hex-shaped recess of the outer-hexagonal shape and size of bolt head; In the head of countersunk head outer-hexagonal bolt is embedded in the hexagonal groove, and its afterbody passes adjustable plate and substrate and arrive the opposite side of substrate, and is connected at this and nut.
Wherein, pressure cylinder is cylinder or hydraulic cylinder.
Wherein, the power transfer part comprises lifting column and support, and one of them is connected substrate and adjustable plate and is fixed on the support.
Wherein, lift part and comprise bellows with interior axle and/or the lifting yoke that has column lifting portion, the top of bellows and interior axle are fixed together, and the quantity of column lifting portion is at least three.
In addition, the present invention also provides a kind of apparatus for processing plasma, comprises reaction chamber and the electrostatic clamping device that places in the reaction chamber, below electrostatic clamping device, is provided with lifting device provided by the present invention.
The present invention has following beneficial effect:
One of which; In the lifting device provided by the invention; The level adjustment part comprises runs through substrate and adjustable plate and with the two adjusting portion that tightens together and close on adjusting portion and be arranged on the elastomeric element between adjustable plate and the substrate; Elastomeric element is stretched or compression through regulating said adjusting portion, thereby distance between adjustable plate and the substrate is increased or dwindle, and then regulate said level of lifting the part top.That is to say; In the lifting device provided by the invention; Only the fixing of the adjusting that can realize levelness and substrate and adjustable plate operated by adjusting portion, and realize above-mentioned adjusting by means of fastening bolt and leveling assembly need not described in background technology and fix, thereby; Lifting device provided by the invention is not only easy to adjust, but also has characteristics such as saving time, regulate the efficient height.
They are two years old; In the lifting device provided by the invention, regulate and fastening function, thereby need not to be provided with in addition again the securing member such as fastening bolt/screw because adjusting portion itself just has concurrently; And also need not to offer through hole or screwed hole separately for these securing members are set in addition; Therefore, lifting device provided by the invention is simple in structure, and is easy to processing.
They are three years old; In a preferred embodiment of the invention; The adjustable side (for example with countersunk head outer-hexagonal bolt nut engaged) of adjusting portion is arranged at the below of adjustable plate; Walk around substrate need not like this in background technology and adjustable plate is regulated again, thereby meet the operating habit of Field adjustment, and easy to operate.
Similarly, because apparatus for processing plasma provided by the invention is provided with above-mentioned lifting device provided by the invention, thereby it is simple in structure, be easy to processing, and its also have simple to operately save time, and characteristics such as can enhance productivity.
Description of drawings
Fig. 1 is the structural representation of existing a kind of lifting device;
Fig. 2 is the structural representation of existing another kind of lifting device;
Fig. 3 a is the structural representation of lifting device provided by the invention;
Fig. 3 b is the partial enlarged drawing of A portion among Fig. 3 a; And
Fig. 4 is the schematic perspective view of lifting device provided by the invention.
Embodiment
Core of the present invention has provided a kind of like this lifting device that is used for carrying in semiconductor machining/processing procedure the semiconductor device motion; It comprises pressure cylinder, power transfer part, lifts part and be arranged on and lift partly and perhaps be arranged between the power transfer part level adjustment part between power transfer part and the pressure cylinder; Wherein, The level adjustment part comprises substrate and the adjustable plate that is arranged close to each other; On said substrate and adjustable plate, set three adjusting positions at least, the adjusting portion installing hole that connects said substrate and adjustable plate all is set, and close on said adjusting portion's installing hole and elastomeric element is set between said adjustable plate and substrate at each adjusting position; Adjusting portion runs through said installing hole and said adjustable plate is linked together via elastomeric element and said substrate; Elastomeric element is stretched or compression through regulating said adjusting portion, thus the distance between adjustment adjustable plate and the substrate, and then regulate said level of lifting the part top.
In order to make those skilled in the art person understand technical scheme of the present invention better, lifting device provided by the invention and the apparatus for processing plasma of using this lifting device are described in detail below in conjunction with accompanying drawing.
Please consult Fig. 3 a and 3b in the lump, wherein show lifting device that embodiment provided of the present invention.This lifting device comprise from top to bottom connect successively lift part, power transfer part, level adjustment part and pressure cylinder.
Wherein, pressure cylinder is used for to said power transfer part output movement mechanical energy as power source.It can be cylinder or hydraulic cylinder, selects cylinder 8 in the present embodiment for use.
The power transfer part is arranged on pressure cylinder and lifts between the part, comprises lifting column 4 and support 3.Wherein, the top of lifting column 4 can be connected to the interior axle of the bellows 2 of lifting part, and the bottom of lifting column 4 can be connected with the interior axle (figure does not show) of cylinder 8, lifts part in order to being delivered to from the motion mechanical energy of cylinder 8.
Lift part and comprise bellows 2 with interior axle and the lifting yoke 1 that has column lifting portion; Wherein, The top of bellows 2 and its interior axle (figure does not show) are fixed together; And should in axle be connected to top of lifting column 4, column lifting portion is used for semiconductor device such as bearing wafer, so that under the effect from the motion mechanical energy of said power transfer part, carry the semiconductor device motion such as wafer etc.In practical application, the quantity of this column lifting portion is at least three, is four in the present embodiment, just said four pins in the background technology.
The level adjustment part is arranged between power transfer part and the pressure cylinder, comprises the substrate 5 and adjustable plate 9 that are arranged close to each other.The substrate 5 of level adjustment part is connected with cylinder 8 through screw 7, and adjustable plate 9 is connected with the support 3 of power transfer part through screw 6.On substrate 5 and adjustable plate 9, set three adjusting positions at least, in this execution mode, be provided with four adjusting positions.Above-mentioned four adjusting positions roughly distribute along the marginal position of substrate 5 and adjustable plate 9 equably; And each adjusting position wherein is provided with the installing hole that is used for install adjustment portion 13 that connects said substrate 5 and adjustable plate 9; And close on this installing hole and elastomeric element 14 is set between substrate 5 and adjustable plate 9, adjusting portion 13 runs through its installing hole and adjustable plate 9 is linked together via elastomeric element 14 and substrate 5.In addition, between substrate 5 and adjustable plate 9, also be provided with alignment pin 11.
Said elastomeric element 14 can be through bonding and/or be spirally connected and/or the mode of riveted joint etc. is arranged between substrate 5 and the adjustable plate 9 around adjusting portion; Preferably; Position near the two critical surface on substrate 5 and/or adjustable plate 9 is provided with elastomeric element 14 mounting grooves around adjusting portion 13 installing holes; So that elastomeric element 14 is embedded in its mounting groove, thereby both can be implemented in the purpose that elastomeric element 14 is set between substrate 5 and the adjustable plate 9, can carry out position constraint to elastomeric element 14 by means of this mounting groove again; Avoiding this elastomeric element 14 problems such as inclinations to occur, thereby influence the adjusting of levelness.In the present embodiment, be employed in the mode that elastomeric element 14 mounting grooves are set on substrate 5 and the adjustable plate 9 simultaneously, and this elastomeric element 14 is embedded and is fixed in these two corresponding mounting grooves.
Said adjusting portion 13 comprises the screw bolt and nut that cooperatively interacts; Its bolt can be countersunk head outer-hexagonal bolt; Preferably; The top of the adjusting portion installing hole in adjustable plate 9 is set to and the suitable interior hex-shaped recess of the outer-hexagonal shape and size of above-mentioned bolt head; The head of countersunk head outer-hexagonal bolt is embedded into it can not freely be rotated in the hexagonal groove in said, and its afterbody passes adjustable plate 9 and substrate 5 and the opposite side of arrival substrate 5, and be connected at the nut of this and adjusting portion.Like this, elastomeric element 14 is stretched or compression, can adjust the distance between adjustable plate 9 and the substrate 5, and then regulate the level of lifting the part top through rotating this nut.Certainly, in practical application, the screw bolt and nut shape of adjusting portion 13 can need not be confined to the form described in the present embodiment; Can certainly not be provided with and the suitable groove of bolt head profile, but in adjustment process by means of instruments such as pliers or spanners and bolt head is fixed.
It is pointed out that so-called adjustable plate refers to that flat board that links to each other with bolt head in the level adjustment part, so-called substrate refers to that flat board that links to each other with bolt tail in the level adjustment part.In practical application, can be that adjustable plate connects the power transfer part, substrate connects pressure cylinder, that is to say that the bolt head of adjusting portion is positioned at the top of adjustable plate and substrate, and bolt tail reaches the below that nut engaged with it is positioned at adjustable plate and substrate; Also can be that adjustable plate connects pressure cylinder, substrate connects the power transfer part, that is to say that the bolt head of adjusting portion is positioned at the below of adjustable plate and substrate, and bolt tail reaches the top that nut engaged with it is positioned at adjustable plate and substrate.Certainly, for ease of regulating, preferably adopt the former (mode shown in Fig. 3 a and the 3b just).
In addition; Although the level adjustment part in the present embodiment is set between pressure cylinder and the power transfer part, in practical application, be not limited thereto, lift between part and the power transfer part but also can the level adjustment part be arranged on; Promptly; Make substrate and lift part or the power transfer part is connected and fixing, correspondingly, make adjustable plate with the power transfer part or lift that part is connected and fix.
See also Fig. 4, be the schematic perspective view of lifting device provided by the invention.By means of such as the elastic reaction of the elastomeric element of hard spring and make and maintain a relatively stable state between adjustable plate and the substrate; And when the levelness of lifting yoke in this lifting device does not reach technological requirement; Only the adjusting portion of need adjusting corresponding position (for example; The nut or the bolt head of screw/unscrew adjusting portion), can realize quick adjustment to its levelness.
In addition; The present invention also provides a kind of apparatus for processing plasma; Comprise reaction chamber and the electrostatic clamping device that places in the reaction chamber; Below electrostatic clamping device, be provided with above-mentioned lifting device provided by the invention, in order to carry such as operation such as take a seat/disseat such as the semiconductor device of wafer etc.
It is understandable that above execution mode only is the illustrative embodiments that adopts for principle of the present invention is described, yet the present invention is not limited thereto.For the one of ordinary skilled in the art, under the situation that does not break away from spirit of the present invention and essence, can make various modification and improvement, these modification also are regarded as protection scope of the present invention with improving.
Claims (12)
1. lifting device is used for carrying the semiconductor device motion in semiconductor machining/processing procedure, and it comprises pressure cylinder, power transfer part and lift part, wherein
Said pressure cylinder connects said power transfer part, is used for to said power transfer part output movement mechanical energy;
Said power transfer part is arranged on said pressure cylinder and lifts between the part, is used for the motion mechanical energy from said pressure cylinder is delivered to the said part of lifting;
The said part of lifting is carried the semiconductor device motion under the effect from the motion mechanical energy of said power transfer part;
It is characterized in that: said lifting device comprises that also being arranged on said lifting perhaps is arranged on the level adjustment part between said power transfer part and the pressure cylinder between part and the power transfer part; Said level adjustment part comprises substrate and the adjustable plate that is arranged close to each other; On said substrate and adjustable plate, set three adjusting positions at least; The adjusting portion installing hole that connects said substrate and adjustable plate all is set at each adjusting position; And close on said adjusting portion's installing hole and elastomeric element is set between said adjustable plate and substrate; Adjusting portion runs through said adjusting portion's installing hole and said adjustable plate is linked together via elastomeric element and said substrate; Elastomeric element is stretched or compression through regulating said adjusting portion, thus the distance between adjustment adjustable plate and the substrate, and then regulate said level of lifting the part top.
2. lifting device according to claim 1 is characterized in that, said elastomeric element is through bonding and/or be spirally connected and/or riveted way is arranged between said substrate and the adjustable plate.
3. lifting device according to claim 2 is characterized in that, said elastomeric element is arranged between said substrate and the adjustable plate around said adjusting portion.
4. lifting device according to claim 3; It is characterized in that; Position near the two critical surface on said substrate and/or adjustable plate is provided with the elastomeric element mounting groove around said adjusting portion's installing hole, and said elastomeric element is arranged between said substrate and the adjustable plate through being embedded in the said elastomeric element mounting groove.
5. lifting device according to claim 1 is characterized in that said elastomeric element comprises spring and/or spring shim.
6. lifting device according to claim 2 is characterized in that, said adjusting portion comprises the screw bolt and nut that cooperatively interacts.
7. lifting device according to claim 6; It is characterized in that said bolt is a countersunk head outer-hexagonal bolt, correspondingly; The top of the adjusting portion installing hole in the said adjustable plate is set to and the suitable interior hex-shaped recess of the outer-hexagonal shape and size of said bolt head; The head of said countersunk head outer-hexagonal bolt be embedded into said in the hexagonal groove, and its afterbody passes said adjustable plate and substrate and arrive the opposite side of said substrate, and is connected at this and said nut.
8. lifting device according to claim 2 is characterized in that, said substrate is lifted part or the power transfer part is connected and fixing with said, and correspondingly, said adjustable plate is with said power transfer part or lift that part is connected and fix; Perhaps
Said substrate and said power transfer part or pressure cylinder is connected and fixing, correspondingly, said adjustable plate and said pressure cylinder or the power transfer part is connected and fix.
9. lifting device according to claim 1; It is characterized in that; Said lift part comprise have in axle bellows and/or have the lifting yoke of column lifting portion, the top of said bellows with said in spool be fixed together, the quantity of said column lifting portion is at least three.
10. lifting device according to claim 1 is characterized in that, said pressure cylinder is cylinder or hydraulic cylinder.
11. lifting device according to claim 1 is characterized in that, said power transfer part comprises lifting column and support, and one of them is connected said substrate and adjustable plate and is fixed on the said support.
12. an apparatus for processing plasma comprises reaction chamber and the electrostatic clamping device that places in the reaction chamber, it is characterized in that, below said electrostatic clamping device, is provided with any described lifting device in the claim 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100826190A CN101872731B (en) | 2009-04-21 | 2009-04-21 | Lifting device and plasma processing equipment applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100826190A CN101872731B (en) | 2009-04-21 | 2009-04-21 | Lifting device and plasma processing equipment applying same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101872731A CN101872731A (en) | 2010-10-27 |
| CN101872731B true CN101872731B (en) | 2012-03-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100826190A Active CN101872731B (en) | 2009-04-21 | 2009-04-21 | Lifting device and plasma processing equipment applying same |
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| CN (1) | CN101872731B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839859A (en) * | 2012-11-20 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and semiconductor device having the same |
| CN108728827B (en) * | 2017-04-25 | 2020-03-31 | 北京北方华创微电子装备有限公司 | Leveling device and plasma equipment |
| CN107314934B (en) * | 2017-06-06 | 2019-07-02 | 西北工业大学 | Stress measurement device based on flexibility method |
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- 2009-04-21 CN CN2009100826190A patent/CN101872731B/en active Active
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100016 Beijing, Jiuxianqiao, East Road, No. 1, M5 floor, South floor, floor, layer two Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |