CN103839859A - Lifting device and semiconductor device having the same - Google Patents
Lifting device and semiconductor device having the same Download PDFInfo
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- CN103839859A CN103839859A CN201210472425.3A CN201210472425A CN103839859A CN 103839859 A CN103839859 A CN 103839859A CN 201210472425 A CN201210472425 A CN 201210472425A CN 103839859 A CN103839859 A CN 103839859A
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- lowering
- hoisting gear
- push
- release lever
- carriage release
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a lifting device and a semiconductor device having the same. The lifting device comprises a rack, a push-rod motor, a welding bellows, and a moving rod. The push-rod motor is arranged in the rack and is connected with the bottom wall of the rack; the welding bellows is fixed at the top wall of the rack; the lower end of the moving rod is connected with a push rod of the push-rod motor; and the upper end of the moving rod passes through the top wall of the rack and extends into the welding bellows, and is connected with the welding bellows. According to the lifting device provided by the embodiment of the invention, because the push-rod motor is used for driving the moving rod to move up and down, the whole structure of the lifting device becomes simple, the assembling becomes convenient, the size is small, the precision is high, the combination is high, the maintenance is convenient, and the cost is lowered.
Description
Technical field
The present invention relates to semiconductor applications, especially relate to a kind of lowering or hoisting gear and there is its semiconductor equipment.
Background technology
Common stepping motor or the servomotor of the many employings of silicon chip elevator system in existing semiconductor equipment drives, by structures such as ball-screws by the rotatablely move rectilinear motion of the demand that is converted to of motor, adopt the complicated structure of silicon chip elevator system in this way, part processing precision and assembly precision are had relatively high expectations, volume is larger, and assembling process is loaded down with trivial details.
Summary of the invention
The present invention is intended at least solve one of technical problem existing in prior art.
For this reason, one object of the present invention is to propose a kind of lowering or hoisting gear simple in structure and easy to assembly.
Another object of the present invention is to propose a kind of semiconductor equipment with above-mentioned lowering or hoisting gear.
According to the lowering or hoisting gear of the embodiment of the present invention, comprising: frame; Push-rod electric machine, described push-rod electric machine is located in described frame and is connected with the diapire of described frame; Welding bellows, described welding bellows is fixed on the roof of described frame; And carriage release lever, the lower end of described carriage release lever is connected with the push rod of described push-rod electric machine, and the upper end of described carriage release lever is stretched in described welding bellows and is connected with described welding bellows through the roof of described frame.
According to the lowering or hoisting gear of the embodiment of the present invention, by being provided with push-rod electric machine to drive moving up and down of carriage release lever, make lowering or hoisting gear overall structure simple, easy to assembly, volume is little, and precision is high, and strong modularity is easy to maintenance, and has reduced cost.
In addition, also there is following additional technical feature according to lowering or hoisting gear of the present invention:
According to some embodiments of the present invention, lowering or hoisting gear also comprises linear bearing, and described linear bearing is located in described frame and the upper end of described linear bearing and the roof of described frame are connected, and described linear bearing is passed in the upper end of described carriage release lever.Thereby by being provided with linear bearing, formation linear slide coordinates, not only can ensure the rectilinear motion of carriage release lever, thereby ensure the rectilinear motion of welding bellows, also can be in the time that welding bellows be positioned at the chamber body of semiconductor equipment, ensured in welding bellows and chamber body for the axiality between the installing hole of welding bellows is installed.
In further embodiment of the present invention, lowering or hoisting gear also comprises: cradle head, described carriage release lever is connected by described cradle head with the push rod of described push-rod electric machine, wherein said carriage release lever is connected pivotly with described cradle head, and the push rod of described push-rod electric machine is connected pivotly with described cradle head.By cradle head is set, avoid in lowering or hoisting gear running the problem such as push rod unbalance stress, fragile motor that push rod and carriage release lever disalignment cause.
Further, the push rod of described carriage release lever and described push-rod electric machine is connected with described cradle head pivotly by bearing pin parallel to each other respectively.Thereby being convenient to carriage release lever is connected with cradle head pivotly with push rod.
Particularly, described frame comprises: top board and base plate, and described top board and base plate vertically interval arrange; Multiple connecting rods, the upper end of each described connecting rod is connected with described top board and the lower end of each described connecting rod is connected with described base plate, and described multiple connecting rod is arranged along the circumferential interval of described base plate and top board.Thereby rack construction is simple, be convenient to assembling.
Further, described top board comprises: connecting plate, and described connecting plate is connected with the upper end of described connecting rod, on described connecting plate, is formed with opening; Insulation board, described insulation board cooperation is arranged in described opening, and described welding bellows is fixed on described insulation board and the through hole on described insulation board is passed in the upper end of described carriage release lever.Thereby the insulating properties that has ensured welding bellows, has improved security performance.
Preferably, described multiple connecting rod is circumferentially uniformly distributed along described.
Alternatively, described base plate is respectively circular slab with described top board and described connecting rod is connected with base plate with described top board by screw.Thereby, be convenient to the machine-shaping of base plate and top board, and be convenient to the installation of connecting rod.
According to the semiconductor equipment of the embodiment of the present invention, comprising: chamber body; Lowering or hoisting gear, described lowering or hoisting gear is lowering or hoisting gear according to the above embodiment of the present invention, described lowering or hoisting gear is fixed in described chamber body and the welding bellows of described lowering or hoisting gear is positioned at described chamber body; And bracket, the top of described welding bellows is connected to drive described bracket lifting with described bracket.
According to the semiconductor equipment of the embodiment of the present invention, be provided with lowering or hoisting gear according to the above embodiment of the present invention, push-rod electric machine in this lowering or hoisting gear is as the lifting of driving element driven bracket, make semiconductor equipment overall structure simple, easy to assembly, volume is little, precision is high, strong modularity, easy to maintenance, and reduced cost.
Additional aspect of the present invention and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Brief description of the drawings
Above-mentioned and/or additional aspect of the present invention and advantage accompanying drawing below combination is understood becoming the description of embodiment obviously and easily, wherein:
Fig. 1 is according to the schematic diagram of the lowering or hoisting gear of the embodiment of the present invention;
Fig. 2 is the profile of the lowering or hoisting gear shown in Fig. 1;
Fig. 3 is according to the schematic diagram of the semiconductor equipment of the embodiment of the present invention.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Be exemplary below by the embodiment being described with reference to the drawings, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of instructions such as " outward " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of device or the element of instruction or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second " be only for describing object, and can not be interpreted as instruction or hint relative importance.
In description of the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be also electrical connection; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can concrete condition understand above-mentioned term concrete meaning in the present invention.In addition,, in description of the invention, except as otherwise noted, the implication of " multiple " is two or more.
Describe according to a kind of lowering or hoisting gear 100 of the embodiment of the present invention below with reference to Fig. 1-Fig. 3, this lowering or hoisting gear 100 can be applicable in semiconductor equipment 200, for driving the lifting of the bracket in semiconductor equipment 200.
According to the lowering or hoisting gear 100 of the embodiment of the present invention, as shown in Figure 1, comprising: frame 1, push-rod electric machine 2, welding bellows 3 and carriage release lever 4, wherein, push-rod electric machine 2 is located in frame 1 and is connected with the diapire of frame 1.Welding bellows 3 is fixed on the roof of frame 1.The lower end of carriage release lever 4 is connected with the push rod 20 of push-rod electric machine 2, and the upper end of carriage release lever 4 is stretched in welding bellows 3 and is connected with welding bellows 3 through the roof of frame 1.Wherein, the upper end of carriage release lever 4 can be welded on the roof of welding bellows 3.
Wherein, the straight line execution architecture that push-rod electric machine 2 is made up of motor, push rod and control device etc., push-rod electric machine 2 can change rotatablely moving of motor into the straight reciprocating motion of push rod, can be used for using as carrying out machinery in various simple or complicated technological processes, to realize far distance controlled, centralized control or automatically to control, be well known for ordinary skill in the art, be not just described in detail here.
The control device control push rod 20 of push-rod electric machine 2 moves up and down, and push rod 20 is connected to drive carriage release lever 4 to move up and down with the lower end of carriage release lever 4, and carriage release lever 4 drives welding bellows 3 to move while moving up and down.Wherein, the push rod 20 of push-rod electric machine 2 can be used in conjunction with potentiometer, encoder etc.Potentiometer can pass through the size of feedback motor resistance, thereby the travel position at reflection push rod 20 places finally reaches and controls push rod 20 object that arbitrary position stops in the middle of stroke.Encoder can be realized the Position Control of lowering or hoisting gear 100 accurately, reliably.
According to the lowering or hoisting gear 100 of the embodiment of the present invention, by being provided with push-rod electric machine 2 to drive moving up and down of carriage release lever 4, make lowering or hoisting gear 100 overall structures simple, easy to assembly, volume is little, and precision is high, and strong modularity is easy to maintenance, and has reduced cost.
In some embodiments of the invention, lowering or hoisting gear 100 also comprises linear bearing 5, and linear bearing 5 is located in frame 1 and linear bearing 5 is passed in the upper end of carriage release lever 4.In the process moving up and down at carriage release lever 4, between carriage release lever 4 and linear bearing 5 for being slidably matched, thereby by being provided with linear bearing 5, formation linear slide coordinates, not only can ensure the rectilinear motion of carriage release lever 4, thereby ensure the rectilinear motion of welding bellows 3, also can be in the time that welding bellows 3 be positioned at the chamber body 8 of semiconductor equipment 200, ensured in welding bellows 3 and chamber body 8 for the axiality between the installing hole of welding bellows 3 is installed, ensured to be placed on the levelness of the wafer on the bracket in chamber body 8.
Further, as shown in Figure 2, linear bearing 5 is located in frame 1 and the upper end of linear bearing 5 is connected with the roof of frame 1.Thereby be convenient to the installation of linear bearing 5.
In some embodiments of the invention, lowering or hoisting gear 100 also comprises cradle head 6, carriage release lever 4 is connected by cradle head 6 with the push rod 20 of push-rod electric machine 2, and wherein carriage release lever 4 is connected pivotly with cradle head 6, and the push rod 20 of push-rod electric machine 2 is connected pivotly with cradle head 6.By cradle head 6 is set, avoid in lowering or hoisting gear 100 runnings the problem such as push rod 20 unbalance stress, fragile motor that push rod 20 and carriage release lever 4 disalignments cause.
Further, the push rod 20 of carriage release lever 4 and push-rod electric machine 2 is connected with cradle head 6 pivotly by bearing pin parallel to each other 7 respectively.Thereby being convenient to carriage release lever 4 is connected with cradle head 6 pivotly with push rod 20.
As shown in Figure 2, the upper surface of cradle head 6 is formed with the first mating holes 60, the lower surface of cradle head 6 is formed with the second mating holes (scheming not shown), the bottom of carriage release lever 4 is connected in the first mating holes 60 pivotly by the first bearing pin 7a, and the top of the push rod 20 of push-rod electric machine 2 is connected in the second mating holes pivotly by the second bearing pin 7b parallel with the first bearing pin 7a.
In some embodiments of the invention, as depicted in figs. 1 and 2, frame 1 comprises: top board 10, base plate 11 and multiple connecting rod 12, wherein, top board 10 and base plate 11 vertically interval arrange.The upper end of each connecting rod 12 is connected with top board 10 and the lower end of each connecting rod 12 is connected with base plate 11, and multiple connecting rod 12 is arranged along the circumferential interval of base plate 11 and top board 10.Thereby frame 1 is simple in structure, be convenient to assembling.Preferably, multiple connecting rods 12 are circumferentially uniformly distributed along described, i.e. circumferentially evenly spaced apart along base plate 11 and top board 10 of multiple connecting rods 12.In example of the present invention, multiple connecting rods 12 are three, and three connecting rods 12 are circumferentially evenly spaced apart along base plate 11 and top board 10.
Further, as depicted in figs. 1 and 2, top board 10 comprises: connecting plate 101 and insulation board 102, wherein, connecting plate 101 is connected with the upper end of connecting rod 12, is formed with opening 103 on connecting plate 101.Insulation board 102 cooperations are arranged in opening 103, and welding bellows 3 is fixed on insulation board 102 and the through hole (scheming not shown) on insulation board 102 is passed in the upper end of carriage release lever 4.Alternatively, insulation board 102 is resin piece.Thereby the insulating properties that has ensured welding bellows 3, has improved security performance.Particularly, welding bellows 3 can be fixed by screws on insulation board 102.
In some embodiments of the invention, base plate 11 is respectively circular slab with top board 10 and connecting rod 12 is connected with base plate 11 with top board 10 by screw.Thereby, be convenient to the machine-shaping of base plate 11 and top board 10, and be convenient to the installation of connecting rod 12.
Describe according to the semiconductor equipment 200 of the embodiment of the present invention below with reference to Fig. 1-Fig. 3.
According to the semiconductor equipment 200 of the embodiment of the present invention, as shown in Figure 3, comprise: chamber body 8, lowering or hoisting gear 100 and bracket 9, lowering or hoisting gear 100 is lowering or hoisting gear 100 according to the above embodiment of the present invention, and lowering or hoisting gear 100 is fixed in chamber body 8 and the welding bellows 3 of lowering or hoisting gear 100 is positioned at chamber body 8.The top of welding bellows 3 is connected with driven bracket 9 liftings with bracket 9, and wherein wafer 13 can be carried on bracket 9.
The push rod 20 of the push-rod electric machine 2 in lowering or hoisting gear 100 drives moving up and down of carriage release lever 4 while moving up and down, carriage release lever 4 drives the motion of welding bellows 3 while moving up and down, thereby welding bellows 3 drives bracket 9 liftings.
According to the semiconductor equipment 200 of the embodiment of the present invention, be provided with lowering or hoisting gear 100 according to the above embodiment of the present invention, push-rod electric machine 2 in this lowering or hoisting gear 100 is as the lifting of driving element driven bracket 9, make semiconductor equipment 200 overall structures simple, easy to assembly, volume is little, precision is high, strong modularity, easy to maintenance, and reduced cost.
As shown in Figure 3, three thimbles 14 are circumferentially evenly spaced apart along bracket 9, can be provided with the pallet 15 for placing wafer 13 on the top of three thimbles 14.Wherein, between welding bellows 3 and the diapire of chamber body 8, can be threaded connection.
According to other configuration examples of the semiconductor equipment of the embodiment of the present invention as technical process and control procedure etc. and operation be all known for those of ordinary skills, be not described in detail here.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: in the situation that not departing from principle of the present invention and aim, can carry out multiple variation, amendment, replacement and modification to these embodiment, scope of the present invention is limited by claim and equivalent thereof.
Claims (9)
1. a lowering or hoisting gear, is characterized in that, comprising:
Frame;
Push-rod electric machine, described push-rod electric machine is located in described frame and is connected with the diapire of described frame;
Welding bellows, described welding bellows is fixed on the roof of described frame; With
Carriage release lever, the lower end of described carriage release lever is connected with the push rod of described push-rod electric machine, and the upper end of described carriage release lever is stretched in described welding bellows and is connected with described welding bellows through the roof of described frame.
2. lowering or hoisting gear according to claim 1, is characterized in that, also comprises linear bearing, and described linear bearing is located in described frame and the upper end of described linear bearing and the roof of described frame are connected, and described linear bearing is passed in the upper end of described carriage release lever.
3. lowering or hoisting gear according to claim 1, it is characterized in that, also comprise: cradle head, described carriage release lever is connected by described cradle head with the push rod of described push-rod electric machine, wherein said carriage release lever is connected pivotly with described cradle head, and the push rod of described push-rod electric machine is connected pivotly with described cradle head.
4. lowering or hoisting gear according to claim 3, is characterized in that, the push rod of described carriage release lever and described push-rod electric machine is connected with described cradle head pivotly by bearing pin parallel to each other respectively.
5. lowering or hoisting gear according to claim 1, is characterized in that, described frame comprises:
Top board and base plate, described top board and base plate vertically interval arrange;
Multiple connecting rods, the upper end of each described connecting rod is connected with described top board and the lower end of each described connecting rod is connected with described base plate, and described multiple connecting rod is arranged along the circumferential interval of described base plate and top board.
6. lowering or hoisting gear according to claim 5, is characterized in that, described top board comprises:
Connecting plate, described connecting plate is connected with the upper end of described connecting rod, on described connecting plate, is formed with opening;
Insulation board, described insulation board cooperation is arranged in described opening, and described welding bellows is fixed on described insulation board and the through hole on described insulation board is passed in the upper end of described carriage release lever.
7. lowering or hoisting gear according to claim 5, is characterized in that, described multiple connecting rods are circumferentially uniformly distributed along described.
8. lowering or hoisting gear according to claim 5, is characterized in that, described base plate is respectively circular slab with described top board and described connecting rod is connected with base plate with described top board by screw.
9. a semiconductor equipment, is characterized in that, comprising:
Chamber body;
Lowering or hoisting gear, described lowering or hoisting gear is according to the lowering or hoisting gear described in any one in claim 1-8, described lowering or hoisting gear is fixed in described chamber body and the welding bellows of described lowering or hoisting gear is positioned at described chamber body; With
Bracket, the top of described welding bellows is connected to drive described bracket lifting with described bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210472425.3A CN103839859A (en) | 2012-11-20 | 2012-11-20 | Lifting device and semiconductor device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210472425.3A CN103839859A (en) | 2012-11-20 | 2012-11-20 | Lifting device and semiconductor device having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103839859A true CN103839859A (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210472425.3A Pending CN103839859A (en) | 2012-11-20 | 2012-11-20 | Lifting device and semiconductor device having the same |
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| Country | Link |
|---|---|
| CN (1) | CN103839859A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461435A (en) * | 2017-02-17 | 2018-08-28 | 北京北方华创微电子装备有限公司 | It is oriented to lifting structure and chamber piece sending mechanism |
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| JP2003249543A (en) * | 2002-02-26 | 2003-09-05 | Tokyo Ohka Kogyo Co Ltd | Electrostatic chuck device and method of removing from the electrostatic chuck device |
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| CN101872731A (en) * | 2009-04-21 | 2010-10-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and plasma processing equipment applying same |
| CN101944498A (en) * | 2009-07-10 | 2011-01-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate processing equipment and thimble lifting device thereof |
| CN102464278A (en) * | 2010-10-29 | 2012-05-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Linear drive device and semiconductor processing device with linear drive device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249543A (en) * | 2002-02-26 | 2003-09-05 | Tokyo Ohka Kogyo Co Ltd | Electrostatic chuck device and method of removing from the electrostatic chuck device |
| CN101393884A (en) * | 2007-09-17 | 2009-03-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device |
| CN101872731A (en) * | 2009-04-21 | 2010-10-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and plasma processing equipment applying same |
| CN101944498A (en) * | 2009-07-10 | 2011-01-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate processing equipment and thimble lifting device thereof |
| CN102464278A (en) * | 2010-10-29 | 2012-05-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Linear drive device and semiconductor processing device with linear drive device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461435A (en) * | 2017-02-17 | 2018-08-28 | 北京北方华创微电子装备有限公司 | It is oriented to lifting structure and chamber piece sending mechanism |
| CN108461435B (en) * | 2017-02-17 | 2022-01-11 | 北京北方华创微电子装备有限公司 | Guide lifting structure and chamber sheet conveying mechanism |
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Application publication date: 20140604 |