CN108461435B - Guide lifting structure and chamber sheet conveying mechanism - Google Patents
Guide lifting structure and chamber sheet conveying mechanism Download PDFInfo
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- CN108461435B CN108461435B CN201710087272.3A CN201710087272A CN108461435B CN 108461435 B CN108461435 B CN 108461435B CN 201710087272 A CN201710087272 A CN 201710087272A CN 108461435 B CN108461435 B CN 108461435B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of processing, and particularly relates to a guide lifting structure and a chamber sheet conveying mechanism. The guide lifting structure is used for completing lifting action of a wafer in a cavity and comprises a lifting unit, a sealing unit, a bearing unit and a holding unit, wherein the bearing unit comprises an upper end bearing and a lower end bearing, and the upper end bearing and the lower end bearing are coaxially arranged and are respectively and correspondingly arranged on the periphery of the upper end and the periphery of the lower end of the lifting unit. The guide lifting structure with the double bearings can greatly improve the repeatability of lifting motion; correspondingly, the chamber sheet conveying mechanism is more stable in the movement process, the shaking amount of the lifting spindle in the chamber sheet conveying lifting movement is reduced, the repeatability of the mechanical arm for taking and placing the sheets is improved, and the equipment performance is improved.
Description
Technical Field
The invention belongs to the technical field of processing, and particularly relates to a guide lifting structure and a chamber sheet conveying mechanism.
Background
Degas (Degas) equipment, Anneal (Anneal) equipment, etc. used in integrated circuit fabrication require the use of a robot and a process chamber lift structure to complete the Wafer (Wafer) Transfer (Transfer) before performing the corresponding processes.
Fig. 1 is a schematic diagram of a chamber sheet conveying mechanism in the prior art, which adopts a single-bearing guide lifting structure to convey sheets. Specifically, the chamber wafer transfer mechanism mainly comprises a wafer carrier structure 100, a single-bearing guide lifting structure 200 and a cylinder structure 300. In fig. 1, the wafer carrier structure 100 is bolted to the single-bearing guided lift structure 200 and is cooperatively connected to the cylinder structure 300. The wafer carrier structure 100 is disposed inside the chamber, the single-bearing guide lifting structure 200 and the cylinder structure 300 are disposed outside the chamber, and the chamber is a sealed space inside.
Fig. 2 is a schematic diagram of a prior art single-bearing guide lifting structure 200, which includes a lifting spindle 201, a sealing ring 202, a sealing flange 203, a retainer 204, a bellows 205, a linear bearing 206, and a linear bearing retainer 207. Wherein: the lifting spindle 201 is connected to the wafer carrier structure 100 by bolts, and the cylinder structure 300 is connected to the lower end of the lifting spindle 201. In the interior, the upper end of the sealing flange 203 is provided with a through hole, is connected with the chamber by using bolts and is sealed with the chamber by using a sealing ring 202; the bellows 205 is respectively welded with the lifting main shaft 201 and the sealing flange 203, so that the upper side of the enclosed interior and the chamber are in the same sealing environment; the linear bearing 206 guides the lifting main shaft 201 and is positioned in an atmospheric environment; the linear bearing 206 and the seal flange 203 are fixed by the retainer 204, and the linear bearing retainer ring 207 restricts the linear bearing 206 on one side. The cylinder structure 300 is used as a power source to drive the single-bearing guide lifting structure 200 to move, and then the single-bearing guide lifting structure 200 drives the wafer bracket structure 100 to move, so that the lifting of the wafer in the chamber is completed.
Fig. 3 is a schematic diagram of a linear bearing 206 in a single-bearing guide lifting structure in the prior art, which includes a linear bearing main body 2061, a linear bearing ball 2062, a linear bearing holder 2063, and other components. The linear bearing ball 2062 is fixed by the linear bearing holder 2063 and then sleeved outside the linear bearing body 2061. Since the linear bearing retainer 2063 is made of plastic, it has a certain deformation amount and is not tightly fitted to other parts, and the linear bearing balls 2062 cannot be tightly fixed. Therefore, a large gap exists between the linear bearing ball 2062 and the linear bearing main body 2061, the linear bearing ball 2062 is not tightly attached to the lifting spindle 201, and a certain shaking amount exists in the lifting motion process of the lifting spindle 201. In the process of moving the chamber wafer, the single-bearing guide lifting structure has a certain shaking amount due to the lifting spindle 201, the single-bearing guide lifting structure 200 will shake in a small amplitude in the lifting and lowering processes, the wafer carrier structure 100 will shake and impact with the wafer in a small amplitude, so that the wafer will shake in a large amplitude in the lifting and lowering processes, and particles (particles) appear on the surface of the wafer; also, the motion repeatability of the wafer carrier structure 100 is low due to the non-unique spatial locations of the highest point of ascent and the lowest point of descent.
With the rapid development of the integrated circuit market, the demand for expanding the chip capacity brings new market opportunities to equipment manufacturers on one hand, and also puts higher requirements on the existing and prospective technical capabilities of the equipment manufacturers on the other hand, and the equipment capacity of the yield of good products in unit working time of the equipment becomes an important technical parameter reflecting the processing capability of the equipment. Therefore, for the chamber wafer conveying mechanism, how to ensure the repeatability of the wafer conveying lifting motion, reduce the shaking amount of the lifting spindle and avoid the influence of the non-technological process on the processing capacity of the equipment becomes a great problem to be solved by equipment manufacturers.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a guide lifting structure and a chamber wafer conveying mechanism aiming at the defects in the prior art, wherein the guide lifting structure at least solves the problem of shaking amount of a lifting spindle, ensures the repeatability of wafer conveying lifting motion and avoids the influence of non-technological processes on the processing capacity of equipment.
The technical scheme adopted for solving the technical problem is to provide a guide lifting structure, which is used for completing the lifting action of a wafer in a chamber and comprises a lifting unit, a sealing unit, a bearing unit and a holding unit, wherein the bearing unit comprises an upper end bearing and a lower end bearing, and the upper end bearing and the lower end bearing are coaxially arranged and are respectively and correspondingly arranged on the periphery of the upper end and the periphery of the lower end of the lifting unit.
Preferably, a plurality of annular oil storage grooves are formed in the upper side and the lower side of the inner surface layer of the lower end bearing respectively, and lubricating oil is arranged in the oil storage grooves.
Preferably, the inner surface layer of the lower end bearing is positioned at the symmetrical positions of the upper side and the lower side, the oil storage grooves are respectively provided, and the diameter of each oil storage groove is larger than the inner diameter of the lower end bearing.
Preferably, ventilation grooves are formed in the inner surface layer of the upper bearing at opposite sides in the axial direction.
Preferably, the upper end bearing and the lower end bearing are both formed of a copper material.
Preferably, the lifting unit comprises a lifting main shaft, the sealing unit comprises a sealing ring and a sealing flange, and the sealing ring and the sealing flange are arranged on the periphery of the lifting main shaft; the upper end bearing is nested between the lifting main shaft and the sealing flange, and the upper end bearing and the sealing flange are fixedly connected with the lifting main shaft through corrugated pipes.
Preferably, the upper end bearing, the bellows, the sealing flange and the lifting spindle are welded together.
Preferably, the holding unit includes a retainer and a bearing retainer ring, the lower end bearing and the sealing flange are partially nested between the lifting spindle and the retainer, the bearing retainer ring is disposed on the lower side of the lower end bearing, the retainer is used for fixing the lower end bearing and the sealing flange, and the bearing retainer ring is used for performing unilateral limitation on the lower end bearing.
The utility model provides a chamber passes piece mechanism, includes wafer carrier structure, direction elevation structure and power structure, direction elevation structure adopts foretell direction elevation structure, the lower extreme of lift main shaft is connected the output of power structure, wafer carrier structure with the upper end bearing is inside the chamber, the lower extreme bearing with the power structure is outside the chamber.
Preferably, the wafer bracket structure is detachably connected with the guide lifting structure, and the guide lifting structure is detachably matched and connected with the output part of the power structure; the guide lifting structure is communicated with the cavity through the sealing ring.
The invention has the beneficial effects that:
the guide lifting structure with the double bearings can be tightly matched with the lifting main shaft, so that the repeatability of lifting motion can be greatly improved; the wear resistance is good, and the lifting main shaft is not easy to scratch;
correspondingly, the chamber sheet conveying mechanism adopting the guide lifting structure is more stable in the lifting motion process, the shaking amount of the chamber sheet conveying lifting motion is reduced, the repeatability of the mechanical arm to take and place the sheets is improved, the equipment performance is improved, and the process performance is improved.
Drawings
FIG. 1 is a schematic diagram of a chamber wafer transfer mechanism in the prior art;
FIG. 2 is a schematic view of a single bearing guided lift arrangement of FIG. 1;
FIG. 3 is a schematic view of the linear bearing of FIG. 2;
fig. 4 is a schematic view of a guided lifting structure in embodiment 1 of the present invention;
FIG. 5 is a schematic view of the lower bearing of FIG. 4;
FIG. 6 is a schematic view of the upper end bearing of FIG. 4;
FIG. 7 is a schematic view of a chamber sheet transfer mechanism in embodiment 2 of the present invention;
fig. 8 is a schematic view of the wafer carrier structure of fig. 7.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the following describes the guiding elevating structure and the chamber sheet conveying mechanism of the present invention in further detail with reference to the accompanying drawings and the detailed description.
Example 1:
the embodiment provides a guide Lifting structure (Lifting Mechanism) for completing the Lifting action of a wafer in a chamber, which realizes the Double-bearing guide Lifting process, has good stability, can reduce the shaking amount of a Lifting spindle in the Lifting motion of wafer transfer in the chamber, and ensures the repeatability of the Lifting motion of the wafer transfer.
As shown in fig. 4, the guiding elevating structure in this embodiment includes an elevating unit, a sealing unit, a bearing unit and a holding unit, wherein the bearing unit includes an upper end bearing and a lower end bearing, and the upper end bearing and the lower end bearing are coaxially disposed and respectively disposed at an upper end periphery and a lower end periphery of the elevating unit. The upper end bearing and the lower end bearing are both used for guiding, the repeated positioning precision is improved by adopting higher coaxiality for limitation, the length of the guiding part can be increased by using the two bearings one above the other, and the local stress at the end of the guiding part is reduced.
The lifting unit comprises a lifting main shaft, the sealing unit comprises a sealing ring and a sealing flange, and the sealing ring and the sealing flange are arranged on the periphery of the lifting main shaft; the upper end bearing is nested between the lifting main shaft and the sealing flange, and the upper end bearing and the sealing flange are fixedly connected with the lifting main shaft through the corrugated pipe. The corrugated pipe is a typical structure of a cavity structure in the field of microelectronics, one side of the corrugated pipe is in an atmospheric state, and the other side of the corrugated pipe is in a vacuum state, so that the requirement of isolating gas is met, and the corrugated pipe is particularly suitable for guiding lifting of a cavity transfer piece and can be used for sealing to form vacuum.
The holding unit comprises a retainer and a bearing retainer ring, the lower end bearing and the sealing flange are partially nested between the lifting main shaft and the retainer, the bearing retainer ring is arranged on the lower side of the lower end bearing, the retainer is used for fixing the lower end bearing and the sealing flange, and the bearing retainer ring is used for performing unilateral limitation on the lower end bearing.
Specifically, in the schematic view of the guiding elevating structure 400 shown in fig. 4, the guiding elevating structure 400 includes an elevating main shaft 401, a sealing ring 402, a sealing flange 403, an upper end bearing 404, a bellows 405, a retainer 406, a lower end bearing 407, and a bearing retainer 408. Preferably, the upper bearing 404, the sealing flange 403, the bellows 405 and the lifting spindle 401 are welded together, and the enclosed inner upper portion is connected to the inside of the chamber, so as to form a sealed environment. The upper bearing 404 is nested inside the sealing flange 403, within the sealing environment. The lower end bearing 407 guides the lifting main shaft 401 together with the upper end bearing 404, and the lower end bearing 407 and the seal flange 403 are fixed by a holder 406. The guiding lifting structure with double bearings guides the lifting main shaft 401 by using double bearings of an upper end bearing 404 and a lower end bearing 407, wherein the upper end bearing 404 is positioned in a sealed environment, and the lower end bearing 407 is positioned in an atmospheric environment, and is particularly suitable for application of chamber sheet transmission.
Wherein, the upper and lower both sides at lower extreme bearing inner surface layer are seted up multichannel annular oil storage tank respectively, are provided with lubricating oil in the oil storage tank. Preferably, the inner surface layer of the lower end bearing is positioned at the symmetrical positions of the upper side and the lower side, the oil storage grooves are respectively formed, the diameter of each oil storage groove is larger than the inner diameter of the lower end bearing, the oil storage grooves are symmetrically arranged on the side of the lower end bearing, and a uniform lubricating effect can be obtained. The width of the oil storage tank ranges from 1 mm to 3mm according to the application environment.
Fig. 5 is a schematic view of the lower end bearing 407 of the present embodiment, and an example is that an oil reservoir is provided at each of the upper and lower sides of the inner surface layer of the lower end bearing 407. The lower bearing 407 includes a bearing main body 4071, and an upper oil storage groove 4072 and a lower oil storage groove 4073, which are respectively formed on the upper and lower sides of the bearing main body 4071, and have a width of 2mm and a diameter slightly larger than the inner diameter of the lower bearing 407. Like this, because lower extreme bearing 407 contains upper and lower twice oil storage tank to make the oil storage tank be located the upper and lower bilateral symmetry position of lower extreme bearing 407's inner surface layer, pour into lubricating oil in advance before installing lower extreme bearing like this, can form a self-lubricating bearing structure with lubrication action, can take out a small amount of lubricating oil lubrication naturally at the in-process of the elevating movement of lift main shaft 401, reduce the motion frictional force.
Similarly, the upper end bearing is respectively provided with vent grooves at two opposite sides of the inner surface layer in the axial direction. That is, the vent groove is provided at a position opposite to the inner wall of the upper end bearing, and the vent groove may completely penetrate the bearing body in the axial direction.
Fig. 6 is a schematic view of the upper bearing 404 in the present embodiment, and the vent grooves are provided on the opposite left and right sides as an example. The upper bearing 404 includes an upper bearing main body 4043, and a left air passage 4041 and a right air passage 4042 provided on each of the left and right sides of the upper bearing main body 4043. Because the airtight structure is formed between upper end bearing 404, bellows 405, sealing flange 403 and lift main shaft 401 and inside the cavity, in order to guarantee the inside air current circulation nature of structure in the lift main shaft 401 motion process, seted up left air channel 4041 and right air channel 4042 in upper end bearing main part 4043, but form a ventilative bearing structure with the air permeability through seting up the air channel, this structure is arranged in the sealed environment, is convenient for to seal the interior evacuation of environment.
Preferably, the material of the main body of the upper end bearing 404 and the lower end bearing 407 is copper. The copper material is soft, the wear resistance is good, the lifting main shaft 401 is not easy to scratch, and the lifting main shaft is suitable for low-speed movement. Compared with the prior art in fig. 3 in which a single linear bearing 206 is limited on one side by using a linear bearing retainer ring 207, the common linear bearing is suitable for high-speed operation, has a small friction coefficient and a small friction force, but the balls and the lifting spindle are in point contact, and are concentrated in stress and large in stress, so that the lifting spindle is easily damaged; meanwhile, the inherent gap between the balls of the linear bearing 206 and the lifting spindle is large, which directly results in an increase in the shaking range. Because the operating speed of chamber biography piece in-process is lower, the duplex bearing of direction elevation structure leads the axiality height, lift good reproducibility in this embodiment to and the copper matter of duplex bearing is soft wear-resisting, therefore comparatively speaking, the chamber passes the piece specially adapted to adopt the direction elevation structure in this embodiment.
The embodiment provides a direction elevation structure for chamber passes piece, has following advantage:
1) the bearing unit adopts the specially designed upper end bearing and lower end bearing to realize double-bearing guiding, and the upper end bearing and the lower end bearing have high coaxiality and can be tightly matched with the lifting main shaft, so that the repeatability of lifting motion can be greatly improved;
2) the bearing unit is different from a linear bearing used in the prior art, but is a double bearing formed by copper materials, so that the bearing unit is good in wear resistance, not easy to scratch a lifting main shaft, and particularly suitable for being applied to chamber film transfer application due to the fact that balls of the linear bearing are not contained.
Example 2:
the embodiment provides a chamber film conveying mechanism, which adopts a guide lifting structure with Double bearings (Double-bearing) in embodiment 1, so that in the chamber film conveying process, the shaking amount of the lifting motion of the chamber film conveying is reduced, the repeatability of taking and placing the wafer by a manipulator is improved, the equipment performance is improved, and the process performance is improved.
This cavity passes piece mechanism, includes wafer carrier structure, direction elevation structure and power structure, adopts the direction elevation structure of embodiment 1 to elevation structure, and the output portion of power structure is connected to the lower extreme of lift main shaft, and wafer carrier structure and upper end bearing are inside the cavity, and lower extreme bearing and power structure are outside the cavity, are applied to passing the piece in the microelectronics field usually.
The wafer bracket structure is detachably connected with the guide lifting structure, and the guide lifting structure is detachably matched and connected with the output part of the power structure; the guide lifting structure is communicated with the cavity through a sealing ring. The power structure can be a cylinder structure or a power source such as a motor.
Fig. 7 is a schematic diagram of a chamber wafer transfer mechanism, which includes a wafer carrier structure 100, a guiding and lifting structure 400, and a cylinder structure 300. Fig. 8 is a schematic diagram of a wafer carrier structure 100, which includes a bolt 101, a lock bolt 102, a robot finger 103, and a carrier 104. The wafer carrier structure 100 is disposed inside the chamber, and the guide lifting structure 400 and the cylinder structure 300 are disposed outside the chamber. The upper end of the guide lifting structure 400 is provided with four through holes which are connected with the chamber through a sealing ring 402, and the lower end of a lifting main shaft 401 is connected with the cylinder structure 300; the cylinder structure 300 is used as a power source to drive the guiding lifting structure 400 to move, and then the guiding lifting structure 400 drives the wafer carrier structure 100 to move, so as to complete the lifting action of the wafer in the chamber.
Wherein, four through holes are processed on the mechanical finger 103 and are fixed on the bracket 104 through the locking bolt 102; the wafer carrier structure 100 is connected with the guide lifting structure 400 through a bolt 101; the sealing flange 403 and the chamber are sealed by a sealing ring 402; the guiding lifting structure 400 and the cylinder structure 300 are connected in a mutually matched manner by using a front end connecting joint and a rear end connecting joint (the front end connecting joint and the rear end connecting joint are detachable and are cylinder accessory standard parts similar to quick connectors).
The chamber film transmission mechanism in the embodiment adopts the guide lifting structure with double bearings and better stability, so that the movement process of the lifting main shaft driven by the power structure is more stable than the lifting process of the conventional single-bearing guide lifting structure, the shaking amount of the chamber film transmission lifting movement is reduced, the repeatability of the mechanical arm for taking and placing the film is improved, the equipment performance is improved, and the process performance is improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A guide lifting structure is used for completing lifting action of a wafer in a chamber and comprises a lifting unit, a sealing unit, a bearing unit and a holding unit, and is characterized in that the lifting unit comprises a lifting spindle, the sealing unit comprises a sealing ring and a sealing flange, and the sealing ring and the sealing flange are arranged on the periphery of the lifting spindle; the bearing unit comprises an upper end bearing and a lower end bearing, and the upper end bearing and the lower end bearing are coaxially arranged and are respectively and correspondingly arranged on the periphery of the upper end and the periphery of the lower end of the lifting unit; the upper end bearing is nested between the lifting main shaft and the sealing flange, the upper end bearing and the sealing flange are fixedly connected with the lifting main shaft through corrugated pipes, so that the upper end bearing is located in a sealing environment, and the lower end bearing is located in an atmospheric environment.
2. The guiding lifting structure of claim 1, wherein a plurality of annular oil storage grooves are formed in the upper side and the lower side of the inner surface layer of the lower end bearing, and lubricating oil is arranged in the oil storage grooves.
3. The guiding lifting structure of claim 2, wherein the inner surface of the lower bearing is provided with two oil storage grooves at symmetrical positions of the upper and lower sides, and the diameter of each oil storage groove is larger than the inner diameter of the lower bearing.
4. The guide lifting structure according to claim 1, wherein ventilation grooves are formed in opposite sides of the inner surface layer of the upper bearing in the axial direction.
5. The guided riser structure of claim 1, wherein the upper end bearing and the lower end bearing are each formed of a copper material.
6. The guided lift structure of claim 1, wherein the upper end bearing, the bellows, the sealing flange, and the lift spindle are welded together.
7. The guided lifting structure of claim 1, wherein the retaining unit comprises a retainer and a retainer ring, the lower end bearing and the sealing flange are partially nested between the lifting spindle and the retainer, the retainer ring is disposed at a lower side of the lower end bearing, the retainer is used for fixing the lower end bearing and the sealing flange, and the retainer ring is used for performing unilateral limitation on the lower end bearing.
8. A chamber wafer conveying mechanism comprises a wafer bracket structure, a guide lifting structure and a power structure, and is characterized in that the guide lifting structure adopts the guide lifting structure of any one of claims 1 to 7, the lower end of a lifting spindle is connected with an output part of the power structure, the wafer bracket structure and an upper end bearing are positioned inside a chamber, and the lower end bearing and the power structure are positioned outside the chamber.
9. A chamber wafer transfer mechanism as claimed in claim 8 wherein the wafer carrier structure is removably connected to the guide elevator structure, the guide elevator structure being removably coupled to the output of the power structure; the guide lifting structure is communicated with the cavity through the sealing ring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710087272.3A CN108461435B (en) | 2017-02-17 | 2017-02-17 | Guide lifting structure and chamber sheet conveying mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710087272.3A CN108461435B (en) | 2017-02-17 | 2017-02-17 | Guide lifting structure and chamber sheet conveying mechanism |
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| CN108461435A CN108461435A (en) | 2018-08-28 |
| CN108461435B true CN108461435B (en) | 2022-01-11 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201842291U (en) * | 2010-09-27 | 2011-05-25 | 楚天科技股份有限公司 | Lifting mechanism with rotating preventing function for big infusion bag production line |
| CN203473933U (en) * | 2013-08-06 | 2014-03-12 | 中国电子科技集团公司第四十八研究所 | Vacuum conveying system for glass substrates |
| CN103839859A (en) * | 2012-11-20 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and semiconductor device having the same |
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2017
- 2017-02-17 CN CN201710087272.3A patent/CN108461435B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201842291U (en) * | 2010-09-27 | 2011-05-25 | 楚天科技股份有限公司 | Lifting mechanism with rotating preventing function for big infusion bag production line |
| CN103839859A (en) * | 2012-11-20 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and semiconductor device having the same |
| CN203473933U (en) * | 2013-08-06 | 2014-03-12 | 中国电子科技集团公司第四十八研究所 | Vacuum conveying system for glass substrates |
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