CN109585432B - IGBT power module - Google Patents
IGBT power module Download PDFInfo
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- CN109585432B CN109585432B CN201710898035.5A CN201710898035A CN109585432B CN 109585432 B CN109585432 B CN 109585432B CN 201710898035 A CN201710898035 A CN 201710898035A CN 109585432 B CN109585432 B CN 109585432B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Power Conversion In General (AREA)
- Dc-Dc Converters (AREA)
Abstract
The invention provides an IGBT power module, which comprises an upper end plate; a lower end plate; the IGBT assembly is arranged between the upper end plate and the lower end plate and is provided with an even number of IGBT subunits which are connected in series, a first electric connecting piece which is arranged between the adjacent IGBT subunits in a contact mode, a second electric connecting piece which is arranged on the upper surface of the IGBT subunit at the uppermost end in a contact mode and a third electric connecting piece which is arranged on the lower surface of the IGBT subunit at the lowermost end in a contact mode; an upper insulating plate disposed between the upper end plate and the second electrical connector; a lower insulating plate disposed between the lower end plate and the third electrical connector; the IGBT power module adopts a press-fitting design and has higher voltage resistance and current capacity.
Description
Technical Field
The invention relates to the technical field of power electronic devices, in particular to an IGBT power module.
Background
With the continuous expansion of the application field of the IGBT, the performance requirement on the IGBT device is higher and higher. Higher power grade and high reliability of the IGBT device are the development trend of the IGBT device.
However, in the prior art, the IGBT device structure is mainly solder-encapsulated. The design structure has limited through-current capacity and pressure resistance, and limits the application expansion of the design structure in the engineering field.
From this, it is better to need a withstand voltage performance's IGBT power module for be used in the technical problem who awaits the solution.
Disclosure of Invention
The invention provides an IGBT power module aiming at part or all of the technical problems in the prior art. The IGBT power module adopts a press-fitting design and has high voltage resistance and high current capacity.
According to the present invention, an IGBT power module is provided, comprising:
an upper end plate is arranged on the upper side of the main body,
a lower end plate is arranged at the lower end of the lower end plate,
an IGBT assembly disposed between the upper end plate and the lower end plate, the IGBT assembly having an even number of IGBT subunits connected in series, a first electrical connection member contactingly disposed between adjacent IGBT subunits, a second electrical connection member contactingly disposed on an upper surface of an uppermost IGBT subunit, and a third electrical connection member contactingly disposed on a lower surface of a lowermost IGBT subunit,
an upper insulating plate disposed between the upper end plate and the second electrical connector,
a lower insulating plate disposed between the lower end plate and the third electrical connector,
a connecting rod for connecting the upper end plate and the lower end plate.
In one embodiment, an upper bearing assembly is disposed between the upper insulating plate and the upper end plate, the upper bearing assembly having a first bearing disk,
and a lower bearing disc is arranged between the lower insulating plate and the lower end plate.
In one embodiment, the upper bearing assembly further comprises a second bearing disc disposed opposite to the first bearing disc and a ball member embedded between the first bearing disc and the second bearing disc.
In one embodiment, a cushion is disposed between the upper bearing assembly and the upper end plate.
In one embodiment, the upper insulating plate is configured with a first circumferentially extending groove on its outer circumferential surface,
and/or a second groove extending along the circumferential direction is formed on the outer circumferential surface of the lower insulating plate.
In one embodiment, the upper end surface of the upper insulating plate is configured with a first groove for embedding the first bearing assembly,
and/or the lower end face of the lower insulating plate is configured with a second groove for embedding the lower bearing disc.
In one embodiment, at least one of the first electrical connector, the second electrical connector, and the third electrical connector is configured as a case, and an inlet and an outlet are configured on a sidewall of the case, and a flow passage for communicating the inlet and the outlet is configured inside the case.
In one embodiment, a plate-shaped connection portion is provided on a side wall of the case, and a connection hole is configured on the connection portion.
In one embodiment, a pin for positioning is provided between the second electrical connector and the upper insulating plate.
In one embodiment, an insulating sleeve is sleeved on the outer wall of the connecting rod.
Compared with the prior art, the IGBT power module has the advantages that the upper end plate and the lower end plate are arranged in a press-mounting mode, so that the IGBT power module has high voltage resistance and high current capacity.
Drawings
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawing figures, wherein:
fig. 1 shows a cross-sectional view of an IGBT power module according to an embodiment of the invention;
fig. 2 shows a perspective view of an IGBT power module according to an embodiment of the invention;
in the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.
Detailed Description
The invention will be further explained with reference to the drawings.
Fig. 1 shows an IGBT power module 100 according to the invention. As shown in fig. 1, the IGBT power module 100 includes an upper end plate 2, a lower end plate 3, an IGBT module 20, an upper insulating plate 11, a lower insulating plate 12, and a connection rod 1. Wherein the upper end plate 2 and the lower end plate 3 are each constructed in a plate-like structure for fixing and connecting the respective components or parts therein. The IGBT module 20 is disposed between the upper end plate 2 and the lower end plate 3. The IGBT assembly 20 has an even number of IGBT sub-units 14 connected in series, a first electrical connection 13 arranged in contact between adjacent IGBT sub-units 14, a second electrical connection 13' arranged in contact on the upper surface of the uppermost IGBT sub-unit 14, and a third electrical connection 13 "arranged in contact on the lower surface of the lowermost IGBT sub-unit 14. The upper insulating plate 11 is arranged between the upper end plate 2 and the second electrical connector 13' for insulating isolation. The lower insulating plate 12 is arranged between the lower end plate 3 and the third electrical connector 13 "and also provides an insulating and isolating effect. The connecting rods connect the upper end plate 2 and the lower end plate 3 to press-fit the IGBT module 20, the upper insulating plate 11, and the lower insulating plate 12, etc., between the upper end plate 2 and the lower end plate 3.
In the production process, the IGBT power module 100 applied with pretightening force is placed on a press machine, the upper end plate 2 and the lower end plate 3 are sequentially aligned to upper and lower pressure columns of the press machine, required pressure values are set, and the IGBT power module 100 is pressed in place at one time. Thus, the IGBT power module 100 has very good withstand voltage and current capability.
In one embodiment, an upper pressure bearing assembly 30 is disposed between upper insulating plate 11 and upper end plate 2. The upper bearing assembly 30 has a first bearing disc 7. In addition, a lower pressure bearing disk 8 is disposed between the lower insulation plate 12 and the lower end plate 3. Preferably, the first pressure bearing disk 7 and the lower pressure bearing disk 8 are made of a high-strength carbon steel material, for example, 1Cr18Ni9 Ti. The structure is not easy to deform under the action of pressure, and is beneficial to ensuring the uniform pressure distribution of the whole IGBT power module 100.
In a preferred embodiment, the upper bearing assembly 30 further comprises a second bearing disc 6 and a spherical member 9. Wherein, the second bearing plate 6 is arranged opposite to the first bearing plate 7 and is positioned at the upper end of the first bearing plate 7. The ball 9 is embedded between the first pressure bearing disk 7 and the second pressure bearing disk 6 for equalizing pressure. Thus, the upper pressure bearing assembly 30 functions to equalize pressure during pressure transmission. In particular, the ball members 9 provide a transition between the first pressure bearing disk 7 and the second pressure bearing disk 6, thereby improving the pressure balance transmission effect of the upper pressure bearing assembly 30.
In a particular embodiment, a buffer 10 is provided between the upper bearing assembly 30 and the upper end plate 2. Preferably, the buffer member 10 may be a disc spring, and the number of the disc springs may be selected to be one or more according to specific needs. The cushion member 10 plays a role of pressure holding and deformation adjustment by its own elasticity. It should be noted that if the upper bearing assembly 30 includes only the first bearing disk 7, the buffer 10 is disposed between the upper end plate 2 and the first bearing disk 7. And when the upper bearing assembly 30 includes the second bearing disc 6, the buffer 10 is disposed between the upper end plate 2 and the second bearing disc 6.
In addition, in a specific embodiment, the upper end face of the second pressure bearing disc 6 is configured with two steps, i.e., a first step 32 and a second step 33. Wherein the upper end of the first step 32 is embedded in the lower end face of the upper end plate 2 to form a concavo-convex fit with the upper end plate 2. The matching mode is convenient to install and is beneficial to the pressure balance transmission between the upper end plate 2 and the second pressure bearing disc 6. In addition, the disc spring is sleeved on the outer wall of the second pressure bearing disc 6 between the first step 32 and the second step 33, the upper end face of the disc spring is abutted with the upper end plate 2, and the lower end face of the disc spring is abutted with the second pressure bearing disc 6, so that the effect of buffering the uniform pressure is achieved. The structure is convenient to position and simplifies installation.
In one embodiment, the upper insulating plate 11 is configured with a circumferentially extending first groove 34 on its outer circumferential surface. Similarly, a second groove 35 extending in the circumferential direction is formed on the outer circumferential surface of the lower insulating plate 12. Also, a plurality of first grooves 34 and second grooves 35 may be provided on the outer circumferential surface of the upper insulating plate 11 and the outer circumferential surface of the lower insulating plate 12, respectively. The above arrangement ensures creepage distance requirements between different potentials. In addition, the upper end surface of the upper insulating plate 11 is configured with a first groove 36 for embedding the first pressure bearing assembly 30 to form a male-female fit. Similarly, the lower end surface of the lower insulating plate 12 is configured with a second groove 37 for embedding the lower bearing disk 8 and forming a concave-convex fit. The concave-convex arrangement helps to improve the uniformity of pressure distribution and is convenient to position. Preferably, the ratio of the depth of the first groove 34 to the radius of the first groove 36 is 1.5-4, for example a ratio of 2. The structure of the IGBT power module 100 can be optimized through the arrangement, and the pressure transmission uniformity is improved while the creepage distance requirements among different electric potentials are ensured. Similarly, the relationship between the second groove 35 and the second groove 37 can also refer to the above arrangement.
In one embodiment, as shown in fig. 2, at least one of the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 "is configured as a box. And an inlet 16 and an outlet 18 are formed on a side wall of the case, and a flow passage (not shown) for communicating the inlet 16 and the outlet 18 is formed inside the case, so that the case functions as a cooling. Specifically, a cooling medium (which may be a liquid, such as water, or a gas) may be supplied into the box through the inlet 16, and the cooling medium circulates in the flow channel to cool the IGBT subunit 14 disposed outside the box. Preferably, the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 ″ are all configured as a box body, and the upper and lower surfaces of any IGBT subunit 14 are abutted against the box body, so as to achieve the effect of double-sided heat dissipation. In addition, a plate-shaped connecting portion 17 is provided on the side wall of the case to protrude outward. Meanwhile, a connection hole 19 is formed on the connection portion 17 to facilitate electrical connection. The structure of the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 ″ described above realizes dual functions of heat dissipation and electrical connection, simplifies the design, and has a very good heat dissipation effect at the same time.
In one embodiment, in order to ensure accurate centering of the devices of the IGBT power module 100 and to ensure structural stability during long-term operation of the IGBT power module 100, pins 15 may be used to position the devices. For example, as shown in fig. 1, a pin 15 for positioning is provided between the second electrical connector 13' and the upper insulating plate 11. As another example, a pin 15 may also be provided between the IGBT subunit 14 and the second electrical connection 13', as desired. So that the pins 15 can be arranged between different devices according to different needs. The arrangement structure can maintain the long-term operation stability of the IGBT power module 100, and can effectively protect the IGBT subunits 14 to meet various operating conditions of the IGBT subunits.
In one embodiment, as shown in fig. 2, an insulating sleeve 5 is sleeved on the outer wall of the connecting rod 1 for high potential isolation between the connecting rod 1 and the IGBT subunit 14, so as to ensure the safety of the IGBT power module 100. In addition, the connecting rod 1 can be a screw, and in the assembling process, after the press machine presses the IGBT power module 100 in place, the IGBT power module is locked by the locking nut 4, and the pressing is completed.
The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily make changes or variations within the technical scope of the present invention disclosed, and such changes or variations should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. An IGBT power module, comprising:
an upper end plate is arranged on the upper side of the main body,
a lower end plate is arranged at the lower end of the lower end plate,
an IGBT assembly disposed between the upper end plate and the lower end plate, the IGBT assembly having an even number of series-connected IGBT subcells, a first electrical connection disposed in contact between adjacent IGBT subcells, a second electrical connection disposed in contact with an upper surface of the uppermost IGBT subcell, and a third electrical connection disposed in contact with a lower surface of the lowermost IGBT subcell,
an upper insulating plate disposed between the upper end plate and the second electrical connector,
a lower insulating plate disposed between the lower end plate and the third electrical connector,
a connecting rod for connecting the upper end plate and the lower end plate,
an upper bearing assembly disposed between the upper insulating plate and the upper end plate, the upper bearing assembly having a first bearing disk,
a lower bearing disc disposed between the lower insulating plate and the lower end plate,
wherein the upper end surface of the upper insulation plate is configured with a first groove such that the lower end of the first pressure bearing disk is inserted into the first groove, the lower end surface of the lower insulation plate is configured with a second groove, and simultaneously, an abutment surface that reduces the radial sectional area of the upper end of the lower pressure bearing disk is configured on the outer wall of the lower pressure bearing disk such that the upper end of the lower pressure bearing disk can be inserted into the second groove and the abutment surface abuts the lower end surface of the lower insulation plate.
2. The IGBT power module according to claim 1, wherein the upper bearing assembly further comprises a second bearing disk disposed opposite the first bearing disk and a ball member embedded between the first bearing disk and the second bearing disk.
3. The IGBT power module of claim 1, wherein a buffer is disposed between the upper bearing assembly and the upper end plate.
4. The IGBT power module according to any one of claims 1 to 3, characterized in that the upper insulating plate is configured on its outer circumferential surface with a circumferentially extending first groove,
and/or a second groove extending along the circumferential direction is formed on the outer circumferential surface of the lower insulating plate.
5. The IGBT power module according to any one of claims 1 to 3, characterized in that at least one of the first electrical connection, the second electrical connection, and the third electrical connection is configured as a case, and an inlet and an outlet are configured on a side wall of the case, and a flow passage for communicating the inlet and the outlet is configured inside the case.
6. The IGBT power module according to claim 5, wherein a plate-shaped connection part is provided on a side wall of the case, and a connection hole is configured on the connection part.
7. The IGBT power module according to any one of claims 1 to 3, characterized in that a pin for positioning is provided between the second electrical connector and the upper insulating plate.
8. The IGBT power module according to any one of claims 1 to 3, wherein an insulating sleeve is sleeved on an outer wall of the connection rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710898035.5A CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710898035.5A CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
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| Publication Number | Publication Date |
|---|---|
| CN109585432A CN109585432A (en) | 2019-04-05 |
| CN109585432B true CN109585432B (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710898035.5A Active CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN105244346A (en) * | 2015-08-31 | 2016-01-13 | 特变电工新疆新能源股份有限公司 | IGBT pressure welding component used for flexible direct-current power transmission converter valve power unit |
| CN106712459A (en) * | 2015-11-13 | 2017-05-24 | 国网智能电网研究院 | Full-bridge IGBT assembly |
| CN106298756B (en) * | 2016-08-18 | 2019-05-10 | 平高集团有限公司 | A kind of IGBT series connection crimping encapsulation unit and the dc circuit breaker using the encapsulation unit |
-
2017
- 2017-09-28 CN CN201710898035.5A patent/CN109585432B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN105244346A (en) * | 2015-08-31 | 2016-01-13 | 特变电工新疆新能源股份有限公司 | IGBT pressure welding component used for flexible direct-current power transmission converter valve power unit |
| CN106712459A (en) * | 2015-11-13 | 2017-05-24 | 国网智能电网研究院 | Full-bridge IGBT assembly |
| CN106298756B (en) * | 2016-08-18 | 2019-05-10 | 平高集团有限公司 | A kind of IGBT series connection crimping encapsulation unit and the dc circuit breaker using the encapsulation unit |
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| Publication number | Publication date |
|---|---|
| CN109585432A (en) | 2019-04-05 |
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Effective date of registration: 20200930 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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