CN109585432A - A kind of IGBT power module - Google Patents
A kind of IGBT power module Download PDFInfo
- Publication number
- CN109585432A CN109585432A CN201710898035.5A CN201710898035A CN109585432A CN 109585432 A CN109585432 A CN 109585432A CN 201710898035 A CN201710898035 A CN 201710898035A CN 109585432 A CN109585432 A CN 109585432A
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- igbt
- plate
- power module
- igbt power
- bearing disc
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
Abstract
The invention proposes a kind of IGBT power module, which includes upper head plate；Bottom plate；IGBT component between upper head plate and bottom plate is set, IGBT component have the concatenated IGBT subelement of even number, contact be arranged in the first electrical fitting, contact between adjacent IGBT subelement be arranged in the top IGBT subelement upper surface the second electrical fitting and contact be arranged in the lowermost IGBT subelement lower surface third electrical fitting；Upper insulation plate between upper head plate and the second electrical fitting is set；Lower insulation plate between bottom plate and third electrical fitting is set；For connecting the connecting rod of upper head plate and bottom plate, the IGBT power module is using press fitting design, pressure resistance with higher and through-current capability.
Description
Technical field
The present invention relates to power power technical field of electronic devices, and in particular to a kind of IGBT power module.
Background technique
It is also higher and higher to the performance requirement of IGBT device with the continuous expansion of IGBT application field.Higher IGBT
Device power grade and very high reliability are the development trends of IGBT device.
But in the prior art, IGBT device structure predominantly welds encapsulation type.Such design structure through-current capability and resistance to
It is pressed with limit, limits it in the application extension of engineering field.
Thus, it is desirable to which a kind of pressure resistance better IGBT power module of performance is assistant officer's technical problem to be solved.
Summary of the invention
For some or all of of the above-mentioned technical problem in the presence of the prior art, the invention proposes a kind of IGBT
Power module.The IGBT power module is using press fitting design, pressure resistance with higher and through-current capability.
A kind of IGBT power module is proposed according to the present invention, comprising:
Upper head plate,
Bottom plate,
IGBT component between upper head plate and bottom plate is set, and IGBT component has concatenated IGBT of even number single
IGBT that the top is arranged in the first electrical fitting, contact between adjacent IGBT subelement is arranged in member, contact
The third electricity of the lower surface of the lowermost IGBT subelement is arranged in the second electrical fitting and contact of the upper surface of unit
Gas connector,
Upper insulation plate between upper head plate and the second electrical fitting is set,
Lower insulation plate between bottom plate and third electrical fitting is set,
For connecting the connecting rod of upper head plate and bottom plate.
In one embodiment, upper press assembly is set between upper insulation plate and upper head plate, and upper press assembly has the
One bearing disc,
Bearing disc under being arranged between lower insulation plate and bottom plate.
In one embodiment, upper press assembly further includes the second bearing disc and embedding with the setting of the first bearing disc relative type motor
Enter the ball part that formula is arranged between the first bearing disc and the second bearing disc.
In one embodiment, bolster is set between upper press assembly and upper head plate.
In one embodiment, the first slot of circumferentially extending is configured on the outer peripheral surface of upper insulation plate,
And/or the second slot of circumferentially extending is configured on the outer peripheral surface of lower insulation plate.
In one embodiment, the upper surface of upper insulation plate is configured with the first groove for being embedded in the first press assembly,
And/or the lower end surface of lower insulation plate is configured with the second groove for being embedded in lower bearing disc.
In one embodiment, in the first electrical fitting, the second electrical fitting and third electrical fitting at least
One is configured to cabinet, and is configured with entrance and exit on the side wall of the box body, and has in the internal structure of cabinet for being connected to
The runner of entrance and exit.
In one embodiment, it is provided with the interconnecting piece of plate, and the company of being configured on interconnecting piece on the side wall of the box body
Connect hole.
In one embodiment, pin used for positioning is set between the second electrical fitting and upper insulation plate.
In one embodiment, insulation sleeve is arranged on the outer wall of connecting rod.
Compared with the prior art, the advantages of the present invention are as follows the IGBT power module is pressed using upper head plate and bottom plate
Formula setting, so that IGBT power module pressure resistance with higher and through-current capability.
Detailed description of the invention
The preferred embodiment of the present invention is described in detail below in conjunction with attached drawing, in figure:
Fig. 1 shows the sectional view of IGBT power module according to an embodiment of the invention；
Fig. 2 shows the perspective view of IGBT power module according to an embodiment of the invention；
In the accompanying drawings, identical component uses identical appended drawing reference.The attached drawing is not drawn according to the actual ratio.
Specific embodiment
Below in conjunction with attached drawing, the present invention will be further described.
Fig. 1 shows IGBT power module 100 according to the present invention.As shown in Figure 1, the IGBT power module 100 is wrapped
Include upper head plate 2, bottom plate 3, IGBT component 20, upper insulation plate 11, lower insulation plate 12 and connecting rod 1.Wherein, upper head plate 2 is under
End plate 3 is configured to plate structure, for fixing and connecting various components therein or component.IGBT component 20 is arranged in upper end
Between plate 2 and bottom plate 3.It is adjacent that there is IGBT component 20 the concatenated IGBT subelement 14 of even number, contact to be arranged in
The of the upper surface of the IGBT subelement 14 of the top is arranged in first electrical fitting 13, contact between IGBT subelement 14
The third electrical fitting 13 " of the lower surface of the lowermost IGBT subelement 14 is arranged in two electrical fittings 13 ' and contact.
Upper insulation plate 11 is arranged between upper head plate 2 and the second electrical fitting 13 ', for being dielectrically separated from.The setting of lower insulation plate 12 exists
Between bottom plate 3 and third electrical fitting 13 ", equally plays and be dielectrically separated from effect.Connecting rod connects upper head plate 2 and bottom plate
3, the components such as IGBT component 20, upper insulation plate 11 and lower insulation plate 12 are fitted between upper head plate 2 and bottom plate 3.
In process of production, the IGBT power module 100 for being applied with pretightning force is put on press machine, 2 He of upper head plate
Bottom plate 3 is successively directed at the two-way pressure column of press machine, and required pressure value is arranged, and IGBT power module 100 is primary
Property is press-fit into place.To which the IGBT power module 100 has extraordinary pressure resistance and through-current capability.
In one embodiment, upper press assembly 30 is set between upper insulation plate 11 and upper head plate 2.Upper press assembly 30
With the first bearing disc 7.In addition, bearing disc 8 under being arranged between lower insulation plate 12 and bottom plate 3.Preferably, the first bearing disc
7 and lower bearing disc 8 be all made of high strength carbon Steel material and be made, for example, 1Cr18Ni9Ti.Above structure is not easy under pressure
Deformation helps to ensure that the whole pressure of the IGBT power module 100 is uniformly distributed.
In a preferred embodiment, upper press assembly 30 further includes the second bearing disc 6 and ball part 9.Wherein, second
Bearing disc 6 and 7 relative type motor of the first bearing disc are arranged, and are located at the upper end of the first bearing disc 7.The embedded setting of ball part 9 is the
Between one bearing disc 7 and the second bearing disc 6, it to be used for counterpressure.To which in pressure transfer process, upper press assembly 30 is risen
The effect of uniform pressure is arrived.Especially, ball part 9 plays transition work between the first bearing disc 7 and the second bearing disc 6
With, improve press assembly 30 pressure equilibrium transmitting effect.
In one specifically embodiment, bolster 10 is set between upper press assembly 30 and upper head plate 2.Preferably,
The bolster 10 can be disc spring, and the quantity of disc spring can select one or more according to specifically needing.This is slow
Stamping 10 plays the role of pressure by the elasticity of itself and keeps adjusting with deformation.It should be noted that if upper pressure-bearing group
Part 30 only includes the first bearing disc 7, then bolster 10 is arranged between upper head plate 2 and the first bearing disc 7.And work as upper pressure-bearing group
When part 30 includes the second bearing disc 6, bolster 10 is arranged between upper head plate 2 and the second bearing disc 6.
In addition, the upper surface of the second bearing disc 6 is configured with two-stage step, i.e. First in one specifically embodiment
Rank 32 and second step 33.Wherein, the upper end of first step 32 is embedded into the lower end surface of upper head plate 2, to be formed with upper head plate 2
Male-female engagement.While this fit system can facilitate installation, the pressure be conducive between upper head plate 2 and the second bearing disc 6 is equal
Weighing apparatus transmitting.In addition, disc spring is socketed on the outer wall of the second bearing disc 6 between first step 32 and second step 33, disc spring
Upper surface is abutted with upper head plate 2, and lower end surface is abutted with the second bearing disc 6, to play the role of buffering counterpressure.It is above-mentioned
Structure positioning is convenient, simplifies installation.
In one embodiment, the first slot 34 of circumferentially extending is configured on the outer peripheral surface of upper insulation plate 11.Similarly, under
The second slot 35 of circumferentially extending is configured on the outer peripheral surface of insulation board 12.And it is possible to respectively in the outer peripheral surface of upper insulation plate 11
Multiple first slots 34 and the second slot 35 are set on the outer peripheral surface of upper and lower insulation board 12.Above-mentioned setting ensure that between different potentials
Creepage distance demand.In addition, the upper surface of upper insulation plate 11 is configured with the first groove for being embedded in the first press assembly 30
36, to form male-female engagement.Similarly, the lower end surface of lower insulation plate 12 is configured with the second groove for being embedded in lower bearing disc 8
37 and form male-female engagement.Above-mentioned concave-convex setting helps to improve the uniformity of pressure distribution, while facilitating positioning.Preferably,
The ratio of the radius of the depth of first slot 34 and the first groove 36 is 1.5-4, such as ratio is 2.Above-mentioned setting can optimize IGBT
The structure of power module 100 improves pressure and transmits uniformity while guaranteeing the creepage distance demand between different potentials.
Similarly, the relationship of the second slot 35 and the second groove 37 is also referred to above-mentioned setting.
In one embodiment, as shown in Fig. 2, the first electrical fitting 13, the second electrical fitting 13 ' and third are electrical
At least one of connector 13 " is configured to cabinet.And it is configured with entrance 16 and outlet 18 on the side wall of the box body, and in cabinet
Internal structure have for be connected to entrance 16 and outlet 18 runner (not shown) so that the cabinet plays cooling work
With.Specifically, cooling medium (can be liquid, such as water, or gas), matchmaker can be conveyed into cabinet by entrance 16
Matter recycles in runner, and the cooling of IGBT subelement 14 outside the enclosure is arranged to play the role of.Preferably, first electrically connects
Fitting 13, the second electrical fitting 13 ' and third electrical fitting 13 " be configured to cabinet, then any IGBT subelement 14
Upper and lower surface is abutted with cabinet, achievees the effect that two-side radiation.In addition, being provided with the interconnecting piece of plate on the side wall of the box body
17, extended outwardly with protruding-type.Meanwhile and be configured with connecting hole 19 on interconnecting piece 17, to facilitate electrical connection.Above-mentioned first
The structure of electrical fitting 13, the second electrical fitting 13 ' and third electrical fitting 13 " realizes heat dissipation and electrical connection
Dual function simplifies design, while having extraordinary heat dissipation effect.
In one embodiment, in order to guarantee the accurate centering of each device of IGBT power module 100, to ensure IGBT power
Structural stability in 100 During Process of Long-term Operation of module can be positioned between device using pin 15.For example, such as Fig. 1
It is shown, pin 15 used for positioning is set between the second electrical fitting 13 ' and upper insulation plate 11.For another example as needed
Pin 15 can also be also provided between IGBT subelement 14 and the second electrical fitting 13 '.So as to according to different need
Pin 15 is set between different devices.This set structure can maintain 100 longtime running stability of IGBT power module,
And energy effective protection IGBT subelement 14, meet the various operating conditions of its operation.
In one embodiment, as shown in Fig. 2, being arranged with insulation sleeve 5 on the outer wall of connecting rod 1, for connecting rod 1 with
High potential isolation between IGBT subelement 14, guarantees the safety in utilization of IGBT power module 100.In addition, the connecting rod 1 can
Think screw rod, in an assembling process, after press machine is press-fit into place to IGBT power module 100, locked using locking nut 4, is pressed
It installs into.
The above is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, any this field
Technical staff in technical scope disclosed by the invention, can be easy to carry out and be altered or varied, and this be altered or varied all
It is covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection scope of claims
It is quasi-.
Claims (10)
1. a kind of IGBT power module characterized by comprising
Upper head plate,
Bottom plate,
IGBT component between the upper head plate and the bottom plate is set, and the IGBT component has even number concatenated
The first electrical fitting between the adjacent IGBT subelement is arranged in IGBT subelement, contact, contact is arranged most
The second electrical fitting and contact setting of the IGBT described in the lowermost of the upper surface of the IGBT subelement of upper end
The third electrical fitting of the lower surface of unit,
Upper insulation plate between the upper head plate and second electrical fitting is set,
Lower insulation plate between the bottom plate and the third electrical fitting is set,
For connecting the connecting rod of the upper head plate and the bottom plate.
2. IGBT power module according to claim 1, which is characterized in that the upper insulation plate and the upper head plate it
Between upper press assembly is set, the upper press assembly has the first bearing disc,
Bearing disc under being arranged between the lower insulation plate and the bottom plate.
3. IGBT power module according to claim 2, which is characterized in that the upper press assembly further includes and described
Second bearing disc of one bearing disc relative type motor setting and embedded setting first bearing disc and second bearing disc it
Between ball part.
4. IGBT power module according to claim 2 or 3, which is characterized in that the upper press assembly and it is described on
Bolster is set between end plate.
5. the IGBT power module according to any one of claim 2 to 4, which is characterized in that outside the upper insulation plate
The first slot of circumferentially extending is configured on circumferential surface,
And/or the second slot of circumferentially extending is configured on the outer peripheral surface of the lower insulation plate.
6. the IGBT power module according to any one of claim 2 to 5, which is characterized in that the upper insulation plate it is upper
Edge face structure has the first groove for being embedded in first press assembly,
And/or the lower end surface of the lower insulation plate is configured with the second groove for being embedded in the lower bearing disc.
7. according to claim 1 to IGBT power module described in any one of 6, which is characterized in that first electrical connection
At least one of part, second electrical fitting and described third electrical fitting are configured to cabinet, and in the cabinet
Side wall on be configured with entrance and exit, and have in the internal structure of the cabinet for being connected to the entrance and the outlet
Runner.
8. IGBT power module according to claim 7, which is characterized in that be provided with plate on the side wall of the cabinet
Interconnecting piece, and connecting hole is configured on interconnecting piece.
9. according to claim 1 to IGBT power module described in any one of 8, which is characterized in that electrical described second
Pin used for positioning is set between connector and the upper insulation plate.
10. according to claim 1 to IGBT power module described in any one of 9, which is characterized in that in the connecting rod
Insulation sleeve is arranged on outer wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710898035.5A CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710898035.5A CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109585432A true CN109585432A (en) | 2019-04-05 |
| CN109585432B CN109585432B (en) | 2020-07-14 |
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ID=65913133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710898035.5A Active CN109585432B (en) | 2017-09-28 | 2017-09-28 | IGBT power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109585432B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN105244346A (en) * | 2015-08-31 | 2016-01-13 | 特变电工新疆新能源股份有限公司 | IGBT pressure welding component used for flexible direct-current power transmission converter valve power unit |
| CN106712459A (en) * | 2015-11-13 | 2017-05-24 | 国网智能电网研究院 | Full-bridge IGBT assembly |
| CN106298756B (en) * | 2016-08-18 | 2019-05-10 | 平高集团有限公司 | A kind of IGBT series connection crimping encapsulation unit and the dc circuit breaker using the encapsulation unit |
-
2017
- 2017-09-28 CN CN201710898035.5A patent/CN109585432B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367276A (en) * | 2013-06-28 | 2013-10-23 | 南车株洲电力机车研究所有限公司 | Device and method for press-fitting flat plate type semiconductor element on press-fitting equipment |
| CN105244346A (en) * | 2015-08-31 | 2016-01-13 | 特变电工新疆新能源股份有限公司 | IGBT pressure welding component used for flexible direct-current power transmission converter valve power unit |
| CN106712459A (en) * | 2015-11-13 | 2017-05-24 | 国网智能电网研究院 | Full-bridge IGBT assembly |
| CN106298756B (en) * | 2016-08-18 | 2019-05-10 | 平高集团有限公司 | A kind of IGBT series connection crimping encapsulation unit and the dc circuit breaker using the encapsulation unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109585432B (en) | 2020-07-14 |
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Effective date of registration: 20200930 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |