CN220856571U - IGBT module connection structure of high-pressure liquid heater - Google Patents
IGBT module connection structure of high-pressure liquid heater Download PDFInfo
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- CN220856571U CN220856571U CN202322126631.5U CN202322126631U CN220856571U CN 220856571 U CN220856571 U CN 220856571U CN 202322126631 U CN202322126631 U CN 202322126631U CN 220856571 U CN220856571 U CN 220856571U
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- igbt module
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- circuit board
- ceramic plate
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- 239000007788 liquid Substances 0.000 title claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 56
- 239000003292 glue Substances 0.000 claims description 21
- 230000035515 penetration Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of high-pressure liquid heaters, in particular to an IGBT (insulated Gate Bipolar transistor) connecting structure of a high-pressure liquid heater, which comprises a shell, an IGBT module, a circuit board, a ceramic plate and a fixed connecting piece, wherein the shell is provided with a plurality of grooves; the IGBT module is arranged at the bottom of the circuit board, the circuit board is arranged above the shell, and the IGBT module is positioned between the shell and the circuit board; the ceramic chip is arranged between the IGBT module and the shell; the fixed connection piece is used for fixedly connecting the shell, the IGBT module, the circuit board and the ceramic plate together and mutually clinging. The utility model has the advantages that the structure is based on the fixed connection of the PCB and the shell, and the PCB, the IGBT module, the ceramic plate and the shell are fixedly connected through the fixed connecting piece, and the parts are mutually clung, so that the heat of the IGBT module is conveniently dissipated, and the stable operation of the IGBT module is ensured.
Description
Technical Field
The utility model relates to the technical field of high-pressure liquid heaters, in particular to an IGBT module connecting structure of a high-pressure liquid heater.
Background
As shown in fig. 1, the existing IGBT module connection structure sequentially comprises a PCB board, an IGBT module, a ceramic plate and a casing from top to bottom, the IGBT module is fixed on the PCB board, the PCB board and the casing are directly fixed by screws, the ceramic plate is used for isolating the IGBT module and the casing, and the ceramic plate is not directly fixed with the IGBT module and the casing, so that a certain gap exists between the ceramic plate and the IGBT module and between the ceramic plate and the casing, and further, the phenomenon of unstable heat dissipation of the IGBT module is caused due to larger gap fluctuation between parts during operation, and the IGBT module is finally caused to burn out easily.
Disclosure of utility model
The utility model aims to solve the technical problems that the IGBT module is unstable in heat dissipation and easy to burn out due to a certain gap between the IGBT module, the ceramic plate and the shell, and provides a method for fixedly connecting the PCB, the IGBT module, the ceramic plate and the shell through the fixed connecting piece on the basis of fixedly connecting the PCB and the shell, and mutually clinging parts, so that the heat of the IGBT module is conveniently dissipated, and the stable operation of the IGBT module is ensured.
The utility model aims at realizing the following technical scheme:
An IGBT module connecting structure of a high-pressure liquid heater comprises a shell, an IGBT module, a circuit board, a ceramic plate and a fixed connecting piece; the IGBT module is arranged at the bottom of the circuit board, the circuit board is arranged above the shell, and the IGBT module is positioned between the shell and the circuit board; the ceramic chip is arranged between the IGBT module and the shell; the fixed connection piece is used for fixedly connecting the shell, the IGBT module, the circuit board and the ceramic plate together and mutually clinging. According to the structure, on the basis of fixed connection of the PCB and the shell, the PCB, the IGBT module, the ceramic plate and the shell are fixedly connected through the fixed connection piece, parts are mutually clung, heat of the IGBT module is conveniently dissipated, and stable operation of the IGBT module is ensured.
Preferably, the fixed connecting piece is a screw; the shell, the IGBT module, the circuit board and the ceramic plate are connected together through screws, and insulating layers are arranged on screw rod parts of the screws; the insulating layer is used for isolating the IGBT module and the screw, and the upper end of the insulating layer is positioned between the circuit board and the ceramic plate; the lower end of the insulating layer is positioned between the ceramic plate and the shell. The shell, the IGBT module, the circuit board and the ceramic plate are conveniently connected together in the form of the bolts, and the insulation between the IGBT module and the shell can be ensured through the position of the insulating layer.
Preferably, the insulating layer is made of PBT material. A circle of insulating sleeve is formed on the screw rod part by coating PBT material on the screw rod part of the screw rod in the form of insulating glue, so that the IGBT module is isolated from being directly connected with the shell.
Preferably, the circuit board is provided with a first screw perforation; the IGBT module is provided with a second screw perforation aligned with the first screw perforation; a third screw through hole aligned with the second screw through hole is formed in the ceramic plate; a screw connection hole aligned with the third screw through hole is formed in the shell; the threaded portion is threaded into the screw connection hole through the first screw penetration hole, the second screw penetration hole and the third screw penetration hole in sequence. Through the cooperation between screw, screw perforation and the screw connecting hole, conveniently make casing, IGBT module, circuit board and ceramic wafer fixed connection hug closely each other and cooperate.
Preferably, a first heat-conducting glue is arranged between the ceramic plate and the shell. The IGBT module heat is conveniently transferred to the shell from the ceramic plate through the first heat-conducting glue, and the heat-conducting glue is also prevented from forming a gap inside the first heat-conducting glue through the press fit of the ceramic plate and the shell, so that the heat dissipation effect is further improved, and the stable operation of the IGBT module is ensured.
Preferably, a second heat-conducting glue is arranged between the ceramic chip and the IGBT module. The IGBT module heat is conveniently transferred to the ceramic plate through the second heat-conducting glue, and the second heat-conducting glue is also prevented from forming gaps through the press fit of the ceramic plate and the IGBT module, so that the heat dissipation effect is further improved, and the stable operation of the IGBT module is ensured.
In summary, the utility model has the advantages that the IGBT module, the ceramic plate and the shell are connected through the fixed connecting piece, so that the compression among the IGBT module, the ceramic plate and the shell is ensured, meanwhile, the occurrence of gaps in the heat conducting glue is avoided, the heat dissipation effect is further improved, meanwhile, the heat dissipation of the IGBT module is further stable, abnormal temperature fluctuation is avoided, and the stable work can be realized within the service life range.
Drawings
Fig. 1 is a schematic structural view of an IGBT module connection structure of a high-pressure liquid heater of the present utility model.
Fig. 2 is an enlarged partial schematic view of the screw of fig. 1 in accordance with the present utility model.
Wherein: 1. a housing; 11. a screw connection hole; 2. an IGBT module; 21. a second screw hole; 3. a circuit board; 31. a first screw penetration; 4. a ceramic sheet; 41. a third screw hole; 42. a first heat-conducting gel; 43. a second heat-conducting glue; 5. a screw; 51. a screw portion; 52. a threaded portion; 6. an insulating layer.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
As shown in fig. 1 to 2, an IGBT module connection structure of a high-pressure liquid heater is characterized by comprising a case 1, an IGBT module 2, a circuit board 3, a ceramic sheet 4, and a fixed connection member; the IGBT module 2 is fixedly arranged at the bottom of the circuit board 3, the circuit board 3 is fixedly connected above the shell 1, and the IGBT module 2 is positioned between the shell 1 and the circuit board 3; the ceramic wafer 4 is arranged between the IGBT module 2 and the shell 1; the fixed connecting piece is used for fixedly connecting the shell 1, the IGBT module 2, the circuit board 3 and the ceramic chip 4 together and mutually clinging. On the basis of the fixed connection of the circuit board 3 and the shell 1, the structure is used for fixedly connecting the circuit board 3, the IGBT module 2, the ceramic plate 4 and the shell 1 through the fixed connecting piece, and parts are mutually clung, so that heat of the IGBT module 2 is conveniently dissipated, and stable operation of the IGBT module 2 is ensured.
As shown in fig. 1 to 2, the fixed connection is a screw 5; the circuit board 3 is provided with a first screw through hole 31; the IGBT module 2 is provided with second screw penetration holes 21 aligned with the first screw penetration holes 31; the ceramic sheet 4 is provided with a third screw penetration hole 41 aligned with the second screw penetration hole 21; the housing 1 is provided with screw connection holes 11 aligned with the third screw penetration holes 41; the threaded portion 52 of the screw 5 is screwed into the screw connection hole 11 through the first screw penetration hole 31, the second screw penetration hole 21, and the third screw penetration hole 41 in this order. Through the cooperation between screw 5, screw perforation and the screw connecting hole 11, conveniently make casing 1, IGBT module 2, circuit board 3 and ceramic wafer 4 fixed connection hug closely each other and cooperate simultaneously. The shell 1, the IGBT module 2, the circuit board 3 and the ceramic plate 4 are connected together through the screw 5, and an insulating layer 6 is arranged on a screw rod part 51 of the screw 5; the insulating layer 6 is used for isolating the IGBT module 2 and the screw 5, and the upper end of the insulating layer 6 is positioned between the circuit board 3 and the ceramic plate 4; the lower end of the insulating layer 6 is located between the ceramic plate 4 and the housing 1. By conveniently connecting the housing 1, the IGBT module 2, the circuit board 3, the ceramic plate 4 together in the form of screws 5, and also by the position of the insulating layer 6, the insulation of the IGBT module 2 from the housing 1 can be ensured. The insulating layer 6 is made of PBT material. By applying PBT material to the screw portion 51 of the screw 5 in the form of insulating glue, a circle of insulating sleeve is formed on the screw portion 51, thereby isolating the IGBT module 2 from direct connection with the housing 1.
As shown in fig. 2, a first heat-conducting glue 42 is provided between the ceramic sheet 4 and the housing 1. The heat of the IGBT module 2 is conveniently transferred from the ceramic plate 4 to the shell 1 through the first heat-conducting glue 42, and the heat is also prevented from being in clearance inside the first heat-conducting glue 42 through the press fit of the ceramic plate 4 and the shell 1, so that the heat dissipation effect is further improved, and the stable operation of the IGBT module 2 is ensured.
As shown in fig. 2, a second heat-conducting glue 43 is provided between the ceramic sheet 4 and the IGBT module 2. The heat of the IGBT module 2 is conveniently transferred to the ceramic plate 4 through the second heat-conducting glue 43, and the heat-conducting glue is also prevented from forming gaps inside the second heat-conducting glue 43 through the press fit of the ceramic plate 4 and the IGBT module 2, so that the heat dissipation effect is further improved, and the stable operation of the IGBT module 2 is ensured.
In summary, the utility model has the advantages that the IGBT module 2, the ceramic plate 4 and the shell 1 are tightly pressed through the fixed connecting piece, meanwhile, the gap inside the heat conducting glue is avoided, the heat dissipation effect is further improved, meanwhile, the heat dissipation of the IGBT module 2 is more stable, abnormal temperature fluctuation is avoided, and the service life range can be ensured to work stably.
Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the utility model.
Claims (6)
1. The IGBT module connecting structure of the high-pressure liquid heater is characterized by comprising a shell (1), an IGBT module (2), a circuit board (3), a ceramic sheet (4) and a fixed connecting piece; the IGBT module (2) is arranged at the bottom of the circuit board (3), the circuit board (3) is arranged above the shell (1), and the IGBT module (2) is arranged between the shell (1) and the circuit board (3); the ceramic sheet (4) is arranged between the IGBT module (2) and the shell (1); the fixed connecting piece is used for fixedly connecting the shell (1), the IGBT module (2), the circuit board (3) and the ceramic plate (4) together and mutually clinging.
2. The IGBT module connection structure of a high pressure liquid heater according to claim 1, characterized in that the fixed connection is a screw (5); the shell (1), the IGBT module (2), the circuit board (3) and the ceramic plate (4) are connected together through the screw (5), and an insulating layer (6) is arranged on a screw rod part (51) of the screw (5); the insulation layer (6) is used for isolating the IGBT module (2) and the screw (5), and the upper end of the insulation layer (6) is positioned between the circuit board (3) and the ceramic sheet (4); the lower end of the insulating layer (6) is positioned between the ceramic plate (4) and the shell (1).
3. IGBT module connection structure for high-pressure liquid heaters according to claim 2, characterized in that the insulating layer (6) is made of PBT material.
4. IGBT module connection structure for high-pressure liquid heaters according to claim 2, characterized in that the circuit board (3) is provided with first screw perforations (31); the IGBT module (2) is provided with a second screw perforation (21) aligned with the first screw perforation (31); a third screw through hole (41) aligned with the second screw through hole (21) is arranged on the ceramic plate (4); a screw connection hole (11) aligned with the third screw through hole (41) is formed in the shell (1); a threaded portion (52) of the screw (5) is threaded into the screw connection hole (11) through the first screw penetration hole (31), the second screw penetration hole (21), and the third screw penetration hole (41) in this order.
5. The IGBT module connection structure of a high pressure liquid heater according to claim 1, characterized in that a first heat conductive glue (42) is provided between the ceramic sheet (4) and the housing (1).
6. IGBT module connection structure for high pressure liquid heaters according to claim 1 or 5, characterized in that a second heat conducting glue (43) is arranged between the ceramic wafer (4) and the IGBT module (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322126631.5U CN220856571U (en) | 2023-08-08 | 2023-08-08 | IGBT module connection structure of high-pressure liquid heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322126631.5U CN220856571U (en) | 2023-08-08 | 2023-08-08 | IGBT module connection structure of high-pressure liquid heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856571U true CN220856571U (en) | 2024-04-26 |
Family
ID=90747414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322126631.5U Active CN220856571U (en) | 2023-08-08 | 2023-08-08 | IGBT module connection structure of high-pressure liquid heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856571U (en) |
-
2023
- 2023-08-08 CN CN202322126631.5U patent/CN220856571U/en active Active
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